WO2001069680A3 - Electronic module having a three dimensional array of carrier-mounted integrated circuit packages - Google Patents

Electronic module having a three dimensional array of carrier-mounted integrated circuit packages Download PDF

Info

Publication number
WO2001069680A3
WO2001069680A3 PCT/US2001/007926 US0107926W WO0169680A3 WO 2001069680 A3 WO2001069680 A3 WO 2001069680A3 US 0107926 W US0107926 W US 0107926W WO 0169680 A3 WO0169680 A3 WO 0169680A3
Authority
WO
WIPO (PCT)
Prior art keywords
carrier
package
integrated circuit
printed circuit
circuit board
Prior art date
Application number
PCT/US2001/007926
Other languages
French (fr)
Other versions
WO2001069680A2 (en
Inventor
Kenneth J Kledzik
Jason C Engle
Original Assignee
Legacy Electronics Inc
Kenneth J Kledzik
Jason C Engle
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Legacy Electronics Inc, Kenneth J Kledzik, Jason C Engle filed Critical Legacy Electronics Inc
Priority to EP01922355A priority Critical patent/EP1264347B1/en
Priority to JP2001567042A priority patent/JP2003526946A/en
Priority to AU2001249169A priority patent/AU2001249169A1/en
Priority to DE60123762T priority patent/DE60123762T2/en
Publication of WO2001069680A2 publication Critical patent/WO2001069680A2/en
Publication of WO2001069680A3 publication Critical patent/WO2001069680A3/en
Priority to HK03107291A priority patent/HK1055015A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/105—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
    • H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
    • H01L2225/1017—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement the lowermost container comprising a device support
    • H01L2225/1029—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement the lowermost container comprising a device support the support being a lead frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
    • H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
    • H01L2225/1047—Details of electrical connections between containers
    • H01L2225/107—Indirect electrical connections, e.g. via an interposer, a flexible substrate, using TAB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
    • H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
    • H01L2225/1094—Thermal management, e.g. cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231—Capacitors or dielectric substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/049—PCB for one component, e.g. for mounting onto mother PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1034—Edge terminals, i.e. separate pieces of metal attached to the edge of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10515—Stacked components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10659—Different types of terminals for the same component, e.g. solder balls combined with leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10924—Leads formed from a punched metal foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other

Abstract

A package carrier (100) for increasing the circuit density on printed circuit boards (503). The package carrier (100) mounts on a printed circuit board (503) on top of a first integrated circuit package (507) that is also mounted on the printed circuit board (503). The carrier (100) has an upper major surface (102U) having a pad array on which a second integrated circuit package (501) is mountable. The carrier (100) has a plurality of leads by means of which the carrier (100) is surface mounted to the printed circuit board (503). Each carrier lead is also electrically connected to a single pad of the pad array on the upper surface (102U). The integrated circuit package (507) beneath the carrier (100) shares all or most printed circuit board (503) connections in common with the carrier (100) and consequently the integrated ciurcut package (501) mounted upon the carrier (100). The carrier (100) also includes heat sink or heat disipation structures.
PCT/US2001/007926 2000-03-13 2001-03-13 Electronic module having a three dimensional array of carrier-mounted integrated circuit packages WO2001069680A2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
EP01922355A EP1264347B1 (en) 2000-03-13 2001-03-13 Electronic module having a three dimensional array of carrier-mounted integrated circuit packages
JP2001567042A JP2003526946A (en) 2000-03-13 2001-03-13 Electronic module with a three-dimensional array of integrated circuit packages provided with a carrier
AU2001249169A AU2001249169A1 (en) 2000-03-13 2001-03-13 Electronic module having a three dimensional array of carrier-mounted integratedcircuit packages
DE60123762T DE60123762T2 (en) 2000-03-13 2001-03-13 ELECTRONIC MODULE WITH CARRIER MOUNTED IC HOUSING IN 3D ARRANGEMENT
HK03107291A HK1055015A1 (en) 2000-03-13 2003-10-10 Electronic module having a three dimensional arrayof carrier-mounted integrated circuit packages

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/524,324 2000-03-13
US09/524,324 US6487078B2 (en) 2000-03-13 2000-03-13 Electronic module having a three dimensional array of carrier-mounted integrated circuit packages

Publications (2)

Publication Number Publication Date
WO2001069680A2 WO2001069680A2 (en) 2001-09-20
WO2001069680A3 true WO2001069680A3 (en) 2002-03-21

Family

ID=24088706

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/007926 WO2001069680A2 (en) 2000-03-13 2001-03-13 Electronic module having a three dimensional array of carrier-mounted integrated circuit packages

Country Status (10)

Country Link
US (2) US6487078B2 (en)
EP (1) EP1264347B1 (en)
JP (1) JP2003526946A (en)
CN (2) CN100477207C (en)
AT (1) ATE342583T1 (en)
AU (1) AU2001249169A1 (en)
DE (1) DE60123762T2 (en)
ES (1) ES2270996T3 (en)
HK (1) HK1055015A1 (en)
WO (1) WO2001069680A2 (en)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6525414B2 (en) * 1997-09-16 2003-02-25 Matsushita Electric Industrial Co., Ltd. Semiconductor device including a wiring board and semiconductor elements mounted thereon
US7102892B2 (en) 2000-03-13 2006-09-05 Legacy Electronics, Inc. Modular integrated circuit chip carrier
US7656678B2 (en) 2001-10-26 2010-02-02 Entorian Technologies, Lp Stacked module systems
US20060255446A1 (en) 2001-10-26 2006-11-16 Staktek Group, L.P. Stacked modules and method
KR100980356B1 (en) 2002-02-26 2010-09-06 레가시 일렉트로닉스, 인크. Modular integrated circuit chip carrier
US6542393B1 (en) * 2002-04-24 2003-04-01 Ma Laboratories, Inc. Dual-bank memory module with stacked DRAM chips having a concave-shaped re-route PCB in-between
KR100631939B1 (en) * 2002-07-16 2006-10-04 주식회사 하이닉스반도체 A semiconductor device which is formed by stacking a bga package and a tsop package
JP2004222486A (en) * 2002-12-27 2004-08-05 Murata Mfg Co Ltd Switching power supply module
CN1309062C (en) * 2003-05-23 2007-04-04 广达电脑股份有限公司 Functional module with built-in radiating fin
CN1309061C (en) * 2003-05-23 2007-04-04 广达电脑股份有限公司 Functional module with built-in flat plate type radiating element
US7095104B2 (en) * 2003-11-21 2006-08-22 International Business Machines Corporation Overlap stacking of center bus bonded memory chips for double density and method of manufacturing the same
CN100525599C (en) * 2004-03-18 2009-08-05 三菱电机株式会社 Module heat dissipating structure and control device using the same
DE102004036909B4 (en) 2004-07-29 2007-04-05 Infineon Technologies Ag A semiconductor base device with a wiring substrate and an intermediate wiring board for a semiconductor device stack, and a method of manufacturing the same
DE102004049663B3 (en) * 2004-10-11 2006-04-13 Infineon Technologies Ag Plastic housing and semiconductor device with such plastic housing and method for producing the same
US7709943B2 (en) * 2005-02-14 2010-05-04 Daniel Michaels Stacked ball grid array package module utilizing one or more interposer layers
JP4237160B2 (en) * 2005-04-08 2009-03-11 エルピーダメモリ株式会社 Multilayer semiconductor device
US7033861B1 (en) * 2005-05-18 2006-04-25 Staktek Group L.P. Stacked module systems and method
KR20080022452A (en) * 2006-09-06 2008-03-11 삼성전자주식회사 Pop package and method of producing the same
US7417310B2 (en) 2006-11-02 2008-08-26 Entorian Technologies, Lp Circuit module having force resistant construction
US7746654B2 (en) * 2007-06-07 2010-06-29 Hewlett-Packard Development Company, L.P. Adaptable plug-in mezzanine card for blade servers
SG149726A1 (en) 2007-07-24 2009-02-27 Micron Technology Inc Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods
SG150396A1 (en) 2007-08-16 2009-03-30 Micron Technology Inc Microelectronic die packages with leadframes, including leadframe-based interposer for stacked die packages, and associated systems and methods
US20100032820A1 (en) * 2008-08-06 2010-02-11 Michael Bruennert Stacked Memory Module
US20100244276A1 (en) * 2009-03-25 2010-09-30 Lsi Corporation Three-dimensional electronics package
JP4998503B2 (en) * 2009-04-07 2012-08-15 パナソニック株式会社 Electronic component mounting system and electronic component mounting method
CN102157501B (en) * 2011-03-23 2013-01-09 南通富士通微电子股份有限公司 Three-dimensional system level packaging structure
US8669780B2 (en) * 2011-10-31 2014-03-11 Taiwan Semiconductor Manufacturing Company, Ltd. Three dimensional integrated circuit connection structure and method
CN103594442A (en) * 2012-08-16 2014-02-19 鸿富锦精密工业（深圳）有限公司 Chip
US9997434B2 (en) * 2014-05-19 2018-06-12 Hewlett Packard Enterprise Development Lp Substrate sprayer
DE102014107729B4 (en) * 2014-06-02 2022-05-12 Infineon Technologies Ag Three-dimensional stack of a leaded package and an electronic element and method of making such a stack
TW202239275A (en) * 2016-11-11 2022-10-01 日商京瓷股份有限公司 Package for mounting electrical element, array package and electrical device
US11510351B2 (en) 2019-01-04 2022-11-22 Engent, Inc. Systems and methods for precision placement of components
US11177195B2 (en) * 2019-04-25 2021-11-16 Texas Instruments Incorporated Multi-lead adapter
CN114361115B (en) * 2021-12-31 2022-08-23 中山市木林森微电子有限公司 Multi-chip embedded type packaging module structure
CN114698230B (en) * 2022-02-23 2023-05-12 中国电子科技集团公司第二十九研究所 Three-dimensional integrated structure of printed circuit board embedded with micro-channels and preparation method thereof

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5910885A (en) * 1997-12-03 1999-06-08 White Electronic Designs Corporation Electronic stack module
US6014316A (en) * 1997-06-13 2000-01-11 Irvine Sensors Corporation IC stack utilizing BGA contacts
JP2000031617A (en) * 1998-07-10 2000-01-28 Hitachi Ltd Memory module and its manufacture
US6028352A (en) * 1997-06-13 2000-02-22 Irvine Sensors Corporation IC stack utilizing secondary leadframes
WO2000065652A1 (en) * 1999-04-23 2000-11-02 Dense-Pac Microsystems, Inc. Universal package and method of forming the same

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3665256A (en) * 1968-10-15 1972-05-23 Rca Corp Heat dissipation for power integrated circuits
US4437235A (en) 1980-12-29 1984-03-20 Honeywell Information Systems Inc. Integrated circuit package
US4763188A (en) * 1986-08-08 1988-08-09 Thomas Johnson Packaging system for multiple semiconductor devices
US5138438A (en) * 1987-06-24 1992-08-11 Akita Electronics Co. Ltd. Lead connections means for stacked tab packaged IC chips
US5200362A (en) * 1989-09-06 1993-04-06 Motorola, Inc. Method of attaching conductive traces to an encapsulated semiconductor die using a removable transfer film
US5191404A (en) * 1989-12-20 1993-03-02 Digital Equipment Corporation High density memory array packaging
US5311401A (en) 1991-07-09 1994-05-10 Hughes Aircraft Company Stacked chip assembly and manufacturing method therefor
US5239447A (en) 1991-09-13 1993-08-24 International Business Machines Corporation Stepped electronic device package
US5311407A (en) * 1992-04-30 1994-05-10 Siemens Components, Inc. Printed circuit based for mounted semiconductors and other electronic components
US5313366A (en) * 1992-08-12 1994-05-17 International Business Machines Corporation Direct chip attach module (DCAM)
KR100280762B1 (en) * 1992-11-03 2001-03-02 비센트 비.인그라시아 Thermally Reinforced Semiconductor Devices Having Exposed Backsides and Methods of Manufacturing the Same
US5652462A (en) 1993-04-05 1997-07-29 Matsushita Electric Industrial Co., Ltd. Multilevel semiconductor integrated circuit device
US5498906A (en) * 1993-11-17 1996-03-12 Staktek Corporation Capacitive coupling configuration for an intergrated circuit package
KR0134648B1 (en) * 1994-06-09 1998-04-20 김광호 Multi-chip package
US5783870A (en) * 1995-03-16 1998-07-21 National Semiconductor Corporation Method for connecting packages of a stacked ball grid array structure
US5514907A (en) 1995-03-21 1996-05-07 Simple Technology Incorporated Apparatus for stacking semiconductor chips
US5810609A (en) * 1995-08-28 1998-09-22 Tessera, Inc. Socket for engaging bump leads on a microelectronic device and methods therefor
US5790378A (en) * 1995-09-22 1998-08-04 National Semiconductor Corporation High density integrated circuit package including interposer
KR0184076B1 (en) 1995-11-28 1999-03-20 김광호 Three-dimensional stacked package
US5754408A (en) * 1995-11-29 1998-05-19 Mitsubishi Semiconductor America, Inc. Stackable double-density integrated circuit assemblies
JPH09214097A (en) 1996-02-06 1997-08-15 Toshiba Corp Printed circuit board
TW338180B (en) * 1996-03-29 1998-08-11 Mitsubishi Electric Corp Semiconductor and its manufacturing method
US5729438A (en) * 1996-06-07 1998-03-17 Motorola, Inc. Discrete component pad array carrier
JPH1197619A (en) 1997-07-25 1999-04-09 Oki Electric Ind Co Ltd Semiconductor device, manufacture thereof and mounting thereof
KR100509874B1 (en) * 1998-07-01 2005-08-25 세이코 엡슨 가부시키가이샤 Method of manufacturing semiconductor device
US6160718A (en) * 1998-12-08 2000-12-12 Viking Components Multi-chip package with stacked chips and interconnect bumps
US6388335B1 (en) * 1999-12-14 2002-05-14 Atmel Corporation Integrated circuit package formed at a wafer level

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6014316A (en) * 1997-06-13 2000-01-11 Irvine Sensors Corporation IC stack utilizing BGA contacts
US6028352A (en) * 1997-06-13 2000-02-22 Irvine Sensors Corporation IC stack utilizing secondary leadframes
US5910885A (en) * 1997-12-03 1999-06-08 White Electronic Designs Corporation Electronic stack module
JP2000031617A (en) * 1998-07-10 2000-01-28 Hitachi Ltd Memory module and its manufacture
WO2000065652A1 (en) * 1999-04-23 2000-11-02 Dense-Pac Microsystems, Inc. Universal package and method of forming the same

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 04 31 August 2000 (2000-08-31) *

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CN1941361A (en) 2007-04-04
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WO2001069680A2 (en) 2001-09-20
US6900529B2 (en) 2005-05-31
CN1282244C (en) 2006-10-25
CN100477207C (en) 2009-04-08
DE60123762T2 (en) 2007-08-16
ES2270996T3 (en) 2007-04-16
US20020135982A1 (en) 2002-09-26
EP1264347B1 (en) 2006-10-11
EP1264347A2 (en) 2002-12-11
JP2003526946A (en) 2003-09-09
HK1055015A1 (en) 2003-12-19
CN1428006A (en) 2003-07-02
AU2001249169A1 (en) 2001-09-24
ATE342583T1 (en) 2006-11-15
US6487078B2 (en) 2002-11-26

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