WO2001071815A3 - High voltage semiconductor device having a field plate arrangement - Google Patents

High voltage semiconductor device having a field plate arrangement Download PDF

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Publication number
WO2001071815A3
WO2001071815A3 PCT/EP2001/002821 EP0102821W WO0171815A3 WO 2001071815 A3 WO2001071815 A3 WO 2001071815A3 EP 0102821 W EP0102821 W EP 0102821W WO 0171815 A3 WO0171815 A3 WO 0171815A3
Authority
WO
WIPO (PCT)
Prior art keywords
voltage
regions
semiconductor device
high voltage
sustaining zone
Prior art date
Application number
PCT/EP2001/002821
Other languages
French (fr)
Other versions
WO2001071815A2 (en
Inventor
Dalen Rob Van
Original Assignee
Koninkl Philips Electronics Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Electronics Nv filed Critical Koninkl Philips Electronics Nv
Priority to DE60132158T priority Critical patent/DE60132158T2/en
Priority to EP01915329A priority patent/EP1208600B1/en
Priority to JP2001569895A priority patent/JP2003528471A/en
Publication of WO2001071815A2 publication Critical patent/WO2001071815A2/en
Publication of WO2001071815A3 publication Critical patent/WO2001071815A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/40—Electrodes ; Multistep manufacturing processes therefor
    • H01L29/402—Field plates
    • H01L29/404—Multiple field plate structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/40—Electrodes ; Multistep manufacturing processes therefor
    • H01L29/402—Field plates
    • H01L29/405—Resistive arrangements, e.g. resistive or semi-insulating field plates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/40—Electrodes ; Multistep manufacturing processes therefor
    • H01L29/402—Field plates
    • H01L29/407—Recessed field plates, e.g. trench field plates, buried field plates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
    • H01L29/7816—Lateral DMOS transistors, i.e. LDMOS transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
    • H01L29/7816—Lateral DMOS transistors, i.e. LDMOS transistors
    • H01L29/7817—Lateral DMOS transistors, i.e. LDMOS transistors structurally associated with at least one other device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
    • H01L29/861—Diodes
    • H01L29/8611—Planar PN junction diodes

Abstract

A semiconductor body (11) has first and second opposed major surfaces (11a and 11b). First and second main regions (13 and 14) meet the second major surface (11b) and a voltage-sustaining zone is provided between the first and second regions (13 and 14). The voltage-sustaining zone has a semiconductor region (11) of one conductivity type forming a rectifying junction (J) with a region (15) of the device such that, when the rectifying junction is reverse-biased in one mode of operation, a depletion region extends in the semiconductor region of the voltage-sustaining zone. A number of conductive regions (22) are isolated from and extend through the semiconductor region (11) in a direction transverse to the first and second major surfaces (11a and 11b) so as to be spaced apart in a direction between first and second main regions. A voltage regulator (20; 20'; 20a and 20b) is provided for setting the voltage at each conductive regions (22) so as to control the voltage distribution, and thus the electrical field profile, in the voltage- sustaining zone when the rectifying junction is reverse-biased in said one mode of operation.
PCT/EP2001/002821 2000-03-23 2001-03-13 High voltage semiconductor device having a field plate arrangement WO2001071815A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
DE60132158T DE60132158T2 (en) 2000-03-23 2001-03-13 HIGH VOLTAGE SEMICONDUCTOR ARRANGEMENT WITH A FIELD PLATE STRUCTURE
EP01915329A EP1208600B1 (en) 2000-03-23 2001-03-13 High voltage semiconductor device having a field plate structure
JP2001569895A JP2003528471A (en) 2000-03-23 2001-03-13 Semiconductor device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GBGB0006957.5A GB0006957D0 (en) 2000-03-23 2000-03-23 A semiconductor device
GB0006957.5 2000-03-23

Publications (2)

Publication Number Publication Date
WO2001071815A2 WO2001071815A2 (en) 2001-09-27
WO2001071815A3 true WO2001071815A3 (en) 2002-03-28

Family

ID=9888203

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2001/002821 WO2001071815A2 (en) 2000-03-23 2001-03-13 High voltage semiconductor device having a field plate arrangement

Country Status (7)

Country Link
US (1) US6445019B2 (en)
EP (1) EP1208600B1 (en)
JP (1) JP2003528471A (en)
AT (1) ATE382956T1 (en)
DE (1) DE60132158T2 (en)
GB (1) GB0006957D0 (en)
WO (1) WO2001071815A2 (en)

Cited By (3)

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US8084327B2 (en) 2005-04-06 2011-12-27 Fairchild Semiconductor Corporation Method for forming trench gate field effect transistor with recessed mesas using spacers
US8836028B2 (en) 2011-04-27 2014-09-16 Fairchild Semiconductor Corporation Superjunction structures for power devices and methods of manufacture
US8928077B2 (en) 2007-09-21 2015-01-06 Fairchild Semiconductor Corporation Superjunction structures for power devices

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US7745289B2 (en) 2000-08-16 2010-06-29 Fairchild Semiconductor Corporation Method of forming a FET having ultra-low on-resistance and low gate charge
US6916745B2 (en) 2003-05-20 2005-07-12 Fairchild Semiconductor Corporation Structure and method for forming a trench MOSFET having self-aligned features
US6713813B2 (en) 2001-01-30 2004-03-30 Fairchild Semiconductor Corporation Field effect transistor having a lateral depletion structure
US6911079B2 (en) * 2002-04-19 2005-06-28 Kopin Corporation Method for reducing the resistivity of p-type II-VI and III-V semiconductors
DE10226028A1 (en) * 2002-06-12 2003-12-24 Bosch Gmbh Robert Component and method for its production
WO2003107444A2 (en) 2002-06-17 2003-12-24 Kopin Corporation Light-emitting diode device geometry
US20040000672A1 (en) * 2002-06-28 2004-01-01 Kopin Corporation High-power light-emitting diode structures
US7002180B2 (en) * 2002-06-28 2006-02-21 Kopin Corporation Bonding pad for gallium nitride-based light-emitting device
US6955985B2 (en) 2002-06-28 2005-10-18 Kopin Corporation Domain epitaxy for thin film growth
US7576388B1 (en) 2002-10-03 2009-08-18 Fairchild Semiconductor Corporation Trench-gate LDMOS structures
DE10313712B4 (en) * 2003-03-27 2008-04-03 Infineon Technologies Ag Lateral field-controllable semiconductor device for RF applications
US7652326B2 (en) 2003-05-20 2010-01-26 Fairchild Semiconductor Corporation Power semiconductor devices and methods of manufacture
US7122841B2 (en) 2003-06-04 2006-10-17 Kopin Corporation Bonding pad for gallium nitride-based light-emitting devices
US7005703B2 (en) * 2003-10-17 2006-02-28 Agere Systems Inc. Metal-oxide-semiconductor device having improved performance and reliability
US7368777B2 (en) 2003-12-30 2008-05-06 Fairchild Semiconductor Corporation Accumulation device with charge balance structure and method of forming the same
US7352036B2 (en) 2004-08-03 2008-04-01 Fairchild Semiconductor Corporation Semiconductor power device having a top-side drain using a sinker trench
US7087959B2 (en) * 2004-08-18 2006-08-08 Agere Systems Inc. Metal-oxide-semiconductor device having an enhanced shielding structure
US7465964B2 (en) * 2005-12-30 2008-12-16 Cambridge Semiconductor Limited Semiconductor device in which an injector region is isolated from a substrate
US7473976B2 (en) * 2006-02-16 2009-01-06 Fairchild Semiconductor Corporation Lateral power transistor with self-biasing electrodes
CN101385151B (en) * 2006-02-16 2013-07-24 飞兆半导体公司 Lateral power transistor with self-biasing electrodes
JP5479915B2 (en) * 2007-01-09 2014-04-23 マックスパワー・セミコンダクター・インコーポレイテッド Semiconductor device
US7956412B2 (en) * 2007-12-04 2011-06-07 International Business Machines Corporation Lateral diffusion field effect transistor with a trench field plate
US7772668B2 (en) 2007-12-26 2010-08-10 Fairchild Semiconductor Corporation Shielded gate trench FET with multiple channels
JP5280056B2 (en) * 2008-01-10 2013-09-04 シャープ株式会社 MOS field effect transistor
US20120273916A1 (en) 2011-04-27 2012-11-01 Yedinak Joseph A Superjunction Structures for Power Devices and Methods of Manufacture
US8232516B2 (en) 2009-07-31 2012-07-31 International Business Machines Corporation Avalanche impact ionization amplification devices
US8319290B2 (en) 2010-06-18 2012-11-27 Fairchild Semiconductor Corporation Trench MOS barrier schottky rectifier with a planar surface using CMP techniques
US8487371B2 (en) 2011-03-29 2013-07-16 Fairchild Semiconductor Corporation Vertical MOSFET transistor having source/drain contacts disposed on the same side and method for manufacturing the same
US8466492B1 (en) * 2012-01-31 2013-06-18 Infineon Technologies Austria Ag Semiconductor device with edge termination structure
US9520367B2 (en) * 2014-08-20 2016-12-13 Freescale Semiconductor, Inc. Trenched Faraday shielding
CN106549052B (en) * 2015-09-17 2021-05-25 联华电子股份有限公司 Lateral diffusion metal oxide semiconductor transistor and manufacturing method thereof
CN105529369B (en) * 2016-03-08 2019-05-14 中国电子科技集团公司第二十四研究所 A kind of semiconductor structure cell and power semiconductor
FR3050573B1 (en) * 2016-04-22 2019-10-18 Exagan DEVICE WITH SEGMENTED FIELD PLATES
CN110518056B (en) * 2019-08-02 2021-06-01 无锡华润上华科技有限公司 Lateral diffusion metal oxide semiconductor device and manufacturing method thereof
CN113130632B (en) * 2019-12-31 2022-08-12 无锡华润上华科技有限公司 Lateral diffusion metal oxide semiconductor device and preparation method thereof

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WO1999035695A1 (en) * 1998-01-09 1999-07-15 Infineon Technologies Ag Silicon on insulator high-voltage switch

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US5264719A (en) * 1986-01-07 1993-11-23 Harris Corporation High voltage lateral semiconductor device
US4942445A (en) * 1988-07-05 1990-07-17 General Electric Company Lateral depletion mode tyristor
BE1007283A3 (en) 1993-07-12 1995-05-09 Philips Electronics Nv Semiconductor device with most with an extended drain area high voltage.

Patent Citations (2)

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US4796070A (en) * 1987-01-15 1989-01-03 General Electric Company Lateral charge control semiconductor device and method of fabrication
WO1999035695A1 (en) * 1998-01-09 1999-07-15 Infineon Technologies Ag Silicon on insulator high-voltage switch

Non-Patent Citations (1)

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Title
CHEN X: "THEORY OF A NOVEL VOLTAGE SUSTAINING (CB) LAYER FOR POWER DEVICES", CHINESE JOURNAL OF ELECTRONICS, vol. 7, no. 3, July 1998 (1998-07-01), TECHNOLOGY EXCHANGE LTD, HONG KONG, HK, pages 211 - 216, XP000900759, ISSN: 1022-4653 *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8084327B2 (en) 2005-04-06 2011-12-27 Fairchild Semiconductor Corporation Method for forming trench gate field effect transistor with recessed mesas using spacers
US8928077B2 (en) 2007-09-21 2015-01-06 Fairchild Semiconductor Corporation Superjunction structures for power devices
US8836028B2 (en) 2011-04-27 2014-09-16 Fairchild Semiconductor Corporation Superjunction structures for power devices and methods of manufacture

Also Published As

Publication number Publication date
ATE382956T1 (en) 2008-01-15
US6445019B2 (en) 2002-09-03
JP2003528471A (en) 2003-09-24
DE60132158T2 (en) 2009-01-02
WO2001071815A2 (en) 2001-09-27
GB0006957D0 (en) 2000-05-10
EP1208600B1 (en) 2008-01-02
US20010050375A1 (en) 2001-12-13
DE60132158D1 (en) 2008-02-14
EP1208600A2 (en) 2002-05-29

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