WO2001074536A3 - Carrier head providing uniform upward and downward force on a wafer - Google Patents

Carrier head providing uniform upward and downward force on a wafer Download PDF

Info

Publication number
WO2001074536A3
WO2001074536A3 PCT/US2001/009878 US0109878W WO0174536A3 WO 2001074536 A3 WO2001074536 A3 WO 2001074536A3 US 0109878 W US0109878 W US 0109878W WO 0174536 A3 WO0174536 A3 WO 0174536A3
Authority
WO
WIPO (PCT)
Prior art keywords
wafer
carrier head
downward force
polishing surface
holding mechanism
Prior art date
Application number
PCT/US2001/009878
Other languages
French (fr)
Other versions
WO2001074536A2 (en
Inventor
Glenn W Travis
Original Assignee
Lam Res Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Res Corp filed Critical Lam Res Corp
Priority to AU2001249533A priority Critical patent/AU2001249533A1/en
Priority to JP2001572259A priority patent/JP5072161B2/en
Priority to KR1020027012754A priority patent/KR100841723B1/en
Priority to EP01922768A priority patent/EP1268131A2/en
Publication of WO2001074536A2 publication Critical patent/WO2001074536A2/en
Publication of WO2001074536A3 publication Critical patent/WO2001074536A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

A wafer carrier head assembly (2) for holding a wafer (4) in chemical mechanical planarization applications is disclosed that includes a downwardly protruding wafer retaining ring (62) that moves independent of the wafer carrier head (2) and retains an edge (8, 12) of the wafer (4) on a polishing surface (18). An adjustable wafer holding mechanism (52, 80) that applies one of a uniform downward force and a uniform upward force to the wafer (4) is also included. Application of the upward force allows the wafer holding mechanism (52, 80) to retain and transport the wafer to a polishing surface. Application of the downward force allows the wafer holding mechanism (52, 80) to retain the wafer on the polishing surface (18) and allows the wafer (4) to be uniformly polished. The wafer carrier head assembly (2) herein disclosed is also configured to pivotally accommodate changes in parallelism between the wafer (4) and the polishing surface (18) when the wafer is being polished.
PCT/US2001/009878 2000-03-31 2001-03-28 Carrier head providing uniform upward and downward force on a wafer WO2001074536A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
AU2001249533A AU2001249533A1 (en) 2000-03-31 2001-03-28 Wafer carrier head assembly
JP2001572259A JP5072161B2 (en) 2000-03-31 2001-03-28 Wafer carrier head assembly
KR1020027012754A KR100841723B1 (en) 2000-03-31 2001-03-28 Wafer carrier head assembly
EP01922768A EP1268131A2 (en) 2000-03-31 2001-03-28 Carrier head providing uniform upward and downward force on a wafer

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/540,603 2000-03-31
US09/540,603 US6666756B1 (en) 2000-03-31 2000-03-31 Wafer carrier head assembly

Publications (2)

Publication Number Publication Date
WO2001074536A2 WO2001074536A2 (en) 2001-10-11
WO2001074536A3 true WO2001074536A3 (en) 2002-02-07

Family

ID=24156160

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/009878 WO2001074536A2 (en) 2000-03-31 2001-03-28 Carrier head providing uniform upward and downward force on a wafer

Country Status (7)

Country Link
US (1) US6666756B1 (en)
EP (1) EP1268131A2 (en)
JP (1) JP5072161B2 (en)
KR (1) KR100841723B1 (en)
AU (1) AU2001249533A1 (en)
TW (1) TW480206B (en)
WO (1) WO2001074536A2 (en)

Families Citing this family (24)

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US6666756B1 (en) 2000-03-31 2003-12-23 Lam Research Corporation Wafer carrier head assembly
US7497767B2 (en) * 2000-09-08 2009-03-03 Applied Materials, Inc. Vibration damping during chemical mechanical polishing
US7255637B2 (en) 2000-09-08 2007-08-14 Applied Materials, Inc. Carrier head vibration damping
US6676497B1 (en) * 2000-09-08 2004-01-13 Applied Materials Inc. Vibration damping in a chemical mechanical polishing system
CN100513076C (en) * 2001-05-29 2009-07-15 株式会社荏原制作所 Polishing apparatus and polishing method
KR100416808B1 (en) * 2002-02-04 2004-01-31 삼성전자주식회사 Polishing head of chemical mechanical polishing apparatus for manufacturing semiconductor device and chemical mechanical polishing apparatus having it
US7355641B2 (en) * 2003-01-10 2008-04-08 Matsushita Electric Industrial Co., Ltd. Solid state imaging device reading non-adjacent pixels of the same color
KR20070058445A (en) * 2004-07-02 2007-06-08 스트라스바흐, 인코포레이티드 Method and system for processing wafers
US7101272B2 (en) * 2005-01-15 2006-09-05 Applied Materials, Inc. Carrier head for thermal drift compensation
WO2012142305A2 (en) * 2011-04-13 2012-10-18 Applied Materials, Inc. Carrier head with shims
WO2014078151A1 (en) * 2012-11-16 2014-05-22 Applied Materials, Inc. Recording measurements by sensors for a carrier head
US10532441B2 (en) * 2012-11-30 2020-01-14 Applied Materials, Inc. Three-zone carrier head and flexible membrane
TWI609991B (en) * 2013-06-05 2018-01-01 維克儀器公司 Improved wafer carrier having thermal uniformity-enhancing features
US9662761B2 (en) * 2013-12-02 2017-05-30 Ebara Corporation Polishing apparatus
TWI650832B (en) 2013-12-26 2019-02-11 維克儀器公司 Wafer carrier having thermal cover for chemical vapor deposition systems
KR102173323B1 (en) * 2014-06-23 2020-11-04 삼성전자주식회사 Carrier head, chemical mechanical polishing apparatus and wafer polishing method
USD860146S1 (en) 2017-11-30 2019-09-17 Veeco Instruments Inc. Wafer carrier with a 33-pocket configuration
RU2695956C2 (en) * 2018-01-25 2019-07-29 Общество с ограниченной ответственностью "Спецлак" (ООО "Спецлак") Vegetable oil oxidation control method in drying oil production
USD860147S1 (en) 2018-03-26 2019-09-17 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD858469S1 (en) 2018-03-26 2019-09-03 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD863239S1 (en) 2018-03-26 2019-10-15 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD866491S1 (en) 2018-03-26 2019-11-12 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD854506S1 (en) 2018-03-26 2019-07-23 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
CN109794846A (en) * 2019-01-23 2019-05-24 常德翔宇设备制造有限公司 A kind of polisher lapper

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Also Published As

Publication number Publication date
WO2001074536A2 (en) 2001-10-11
JP2003529457A (en) 2003-10-07
KR20030005242A (en) 2003-01-17
EP1268131A2 (en) 2003-01-02
AU2001249533A1 (en) 2001-10-15
JP5072161B2 (en) 2012-11-14
TW480206B (en) 2002-03-21
KR100841723B1 (en) 2008-06-27
US6666756B1 (en) 2003-12-23

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