WO2001088976A3 - Wireless radio frequency testing methode of integrated circuits and wafers - Google Patents

Wireless radio frequency testing methode of integrated circuits and wafers Download PDF

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Publication number
WO2001088976A3
WO2001088976A3 PCT/CA2001/000688 CA0100688W WO0188976A3 WO 2001088976 A3 WO2001088976 A3 WO 2001088976A3 CA 0100688 W CA0100688 W CA 0100688W WO 0188976 A3 WO0188976 A3 WO 0188976A3
Authority
WO
WIPO (PCT)
Prior art keywords
wafers
integrated circuits
test
methode
radio frequency
Prior art date
Application number
PCT/CA2001/000688
Other languages
French (fr)
Other versions
WO2001088976A2 (en
WO2001088976B1 (en
Inventor
Brian Moore
Original Assignee
Univ Alberta
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Univ Alberta filed Critical Univ Alberta
Priority to DE2001613096 priority Critical patent/DE60113096T2/en
Priority to AT01933500T priority patent/ATE303657T1/en
Priority to JP2001584477A priority patent/JP4869535B2/en
Priority to EP20010933500 priority patent/EP1282913B1/en
Priority to CA2409435A priority patent/CA2409435C/en
Publication of WO2001088976A2 publication Critical patent/WO2001088976A2/en
Publication of WO2001088976A3 publication Critical patent/WO2001088976A3/en
Publication of WO2001088976B1 publication Critical patent/WO2001088976B1/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2884—Testing of integrated circuits [IC] using dedicated test connectors, test elements or test circuits on the IC under test
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/3025—Wireless interface with the DUT
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/303—Contactless testing of integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • H01L22/34—Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Abstract

The present invention is for an apparatus and method for the wireless testing of Integrated Circuits and wafers. The apparatus comprises a test unit external from the wafer and at least one test circuit which is fabricated on the wafer which contains the Integrated Circuit. The test unit transmits an RF signal to power the test circuit. The test circuit, comprising a variable ring oscillator, performs a series of parametric tests at the normal operating frequency of the Integrated Circuit and transmits the test results to the test unit for analysis.
PCT/CA2001/000688 2000-05-15 2001-05-15 Wireless radio frequency testing methode of integrated circuits and wafers WO2001088976A2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
DE2001613096 DE60113096T2 (en) 2000-05-15 2001-05-15 WIRELESS HIGH FREQUENCY TEST METHOD FOR INTEGRATED CIRCUITS AND DISCS
AT01933500T ATE303657T1 (en) 2000-05-15 2001-05-15 WIRELESS HIGH FREQUENCY TESTING METHOD FOR INTEGRATED CIRCUITS AND DISCS
JP2001584477A JP4869535B2 (en) 2000-05-15 2001-05-15 Radio frequency technology structure and method for testing integrated circuits and wafers
EP20010933500 EP1282913B1 (en) 2000-05-15 2001-05-15 Wireless radio frequency testing method of integrated circuits and wafers
CA2409435A CA2409435C (en) 2000-05-15 2001-05-15 Wireless radio frequency technique design and method for testing of integrated circuits and wafers

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CA2,308,820 2000-05-15
CA002308820A CA2308820A1 (en) 2000-05-15 2000-05-15 Wireless radio frequency technique design and method for testing of integrated circuits and wafers

Publications (3)

Publication Number Publication Date
WO2001088976A2 WO2001088976A2 (en) 2001-11-22
WO2001088976A3 true WO2001088976A3 (en) 2002-07-18
WO2001088976B1 WO2001088976B1 (en) 2002-08-29

Family

ID=4166180

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CA2001/000688 WO2001088976A2 (en) 2000-05-15 2001-05-15 Wireless radio frequency testing methode of integrated circuits and wafers

Country Status (8)

Country Link
US (3) US6759863B2 (en)
EP (1) EP1282913B1 (en)
JP (2) JP4869535B2 (en)
AT (1) ATE303657T1 (en)
CA (1) CA2308820A1 (en)
DE (1) DE60113096T2 (en)
ES (1) ES2248327T3 (en)
WO (1) WO2001088976A2 (en)

Families Citing this family (99)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2308820A1 (en) 2000-05-15 2001-11-15 The Governors Of The University Of Alberta Wireless radio frequency technique design and method for testing of integrated circuits and wafers
US6850080B2 (en) * 2001-03-19 2005-02-01 Semiconductor Energy Laboratory Co., Ltd. Inspection method and inspection apparatus
SG117406A1 (en) 2001-03-19 2005-12-29 Miconductor Energy Lab Co Ltd Method of manufacturing a semiconductor device
JP2002340989A (en) * 2001-05-15 2002-11-27 Semiconductor Energy Lab Co Ltd Measuring method, inspection method and inspection apparatus
US20040193977A1 (en) * 2001-12-20 2004-09-30 Cirrus Logic, Inc. Non-invasive, low pin count test circuits and methods utilizing emulated stress conditions
US7289230B2 (en) 2002-02-06 2007-10-30 Cyberoptics Semiconductors, Inc. Wireless substrate-like sensor
CA2404183C (en) * 2002-09-19 2008-09-02 Scanimetrics Inc. Non-contact tester for integrated circuits
GB0222556D0 (en) * 2002-09-28 2002-11-06 Koninkl Philips Electronics Nv RF chip testing method and system
US6865503B2 (en) * 2002-12-24 2005-03-08 Conexant Systems, Inc. Method and apparatus for telemetered probing of integrated circuit operation
US6831494B1 (en) 2003-05-16 2004-12-14 Transmeta Corporation Voltage compensated integrated circuits
US6933739B1 (en) * 2003-05-23 2005-08-23 Marvell Semiconductor Israel Ltd. Ring oscillator system
US7507228B2 (en) * 2003-06-30 2009-03-24 Johnson & Johnson Consumer Companies, Inc. Device containing a light emitting diode for treatment of barrier membranes
WO2005020297A2 (en) * 2003-08-25 2005-03-03 Tau-Metrix, Inc. Technique for evaluating a fabrication of a semiconductor component and wafer
TWI254506B (en) * 2003-09-16 2006-05-01 Samsung Electronics Co Ltd Ring oscillator, memory system comprising the same, and method for generating oscillating signals
US7218094B2 (en) 2003-10-21 2007-05-15 Formfactor, Inc. Wireless test system
US7109734B2 (en) * 2003-12-18 2006-09-19 Xilinx, Inc. Characterizing circuit performance by separating device and interconnect impact on signal delay
US7215133B2 (en) * 2004-01-30 2007-05-08 International Business Machines Corporation Contactless circuit testing for adaptive wafer processing
US7466157B2 (en) * 2004-02-05 2008-12-16 Formfactor, Inc. Contactless interfacing of test signals with a device under test
US7202687B2 (en) * 2004-04-08 2007-04-10 Formfactor, Inc. Systems and methods for wireless semiconductor device testing
US7173455B2 (en) 2004-06-08 2007-02-06 Transmeta Corporation Repeater circuit having different operating and reset voltage ranges, and methods thereof
US7635992B1 (en) 2004-06-08 2009-12-22 Robert Paul Masleid Configurable tapered delay chain with multiple sizes of delay elements
US7304503B2 (en) 2004-06-08 2007-12-04 Transmeta Corporation Repeater circuit with high performance repeater mode and normal repeater mode, wherein high performance repeater mode has fast reset capability
US7405597B1 (en) 2005-06-30 2008-07-29 Transmeta Corporation Advanced repeater with duty cycle adjustment
US7498846B1 (en) 2004-06-08 2009-03-03 Transmeta Corporation Power efficient multiplexer
US7336103B1 (en) * 2004-06-08 2008-02-26 Transmeta Corporation Stacked inverter delay chain
US7142018B2 (en) 2004-06-08 2006-11-28 Transmeta Corporation Circuits and methods for detecting and assisting wire transitions
US7071747B1 (en) 2004-06-15 2006-07-04 Transmeta Corporation Inverting zipper repeater circuit
US7206982B1 (en) * 2004-06-16 2007-04-17 Arm Limited Diagnostic mechanism for an integrated circuit
US7026838B2 (en) * 2004-06-18 2006-04-11 Texas Instruments Incorporated Versatile system for accelerated stress characterization of semiconductor device structures
US7239163B1 (en) * 2004-06-23 2007-07-03 Ridgetop Group, Inc. Die-level process monitor and method
US7291507B2 (en) * 2004-09-23 2007-11-06 Pixim, Inc. Using a time invariant statistical process variable of a semiconductor chip as the chip identifier
US7330080B1 (en) 2004-11-04 2008-02-12 Transmeta Corporation Ring based impedance control of an output driver
US20060109120A1 (en) * 2004-11-19 2006-05-25 Jeremy Burr RFID tag in a substrate
US20060109119A1 (en) * 2004-11-19 2006-05-25 Jeremy Burr RFID tag in a printed circuit board
US20060132167A1 (en) * 2004-12-22 2006-06-22 Jian Chen Contactless wafer level burn-in
US7592842B2 (en) 2004-12-23 2009-09-22 Robert Paul Masleid Configurable delay chain with stacked inverter delay elements
CN102590729B (en) 2005-03-07 2014-10-29 株式会社半导体能源研究所 Element substrate, inspecting method, and manufacturing method of semiconductor device
JP4883679B2 (en) * 2005-03-07 2012-02-22 株式会社半導体エネルギー研究所 Element substrate, inspection method, and manufacturing method of semiconductor device
TWI264551B (en) * 2005-05-04 2006-10-21 Univ Tsinghua System for probing integrated circuit devices
US20060261840A1 (en) * 2005-05-18 2006-11-23 Texas Instruments, Inc. System and method for determining channel mobility
US7663408B2 (en) * 2005-06-30 2010-02-16 Robert Paul Masleid Scannable dynamic circuit latch
US7265639B2 (en) * 2005-08-05 2007-09-04 International Business Machines Corporation Methods and apparatus for ring oscillator based MOSFET gate capacitance measurements
US7883019B2 (en) * 2005-09-02 2011-02-08 Hynix Semiconductor Inc. Integrated circuit with embedded FeRAM-based RFID
JP4701939B2 (en) * 2005-09-12 2011-06-15 横河電機株式会社 Semiconductor integrated circuit and test system thereof
US7394681B1 (en) 2005-11-14 2008-07-01 Transmeta Corporation Column select multiplexer circuit for a domino random access memory array
US7417449B1 (en) * 2005-11-15 2008-08-26 Advanced Micro Devices, Inc. Wafer stage storage structure speed testing
US7414485B1 (en) 2005-12-30 2008-08-19 Transmeta Corporation Circuits, systems and methods relating to dynamic ring oscillators
US7642866B1 (en) 2005-12-30 2010-01-05 Robert Masleid Circuits, systems and methods relating to a dynamic dual domino ring oscillator
US8373429B2 (en) * 2006-03-07 2013-02-12 Steven Slupsky Method and apparatus for interrogating an electronic component
KR101387085B1 (en) * 2006-03-07 2014-04-18 스캐니메트릭스 인크. Method and apparatus for interrogating an electronic component
JP4708269B2 (en) * 2006-06-22 2011-06-22 シャープ株式会社 Semiconductor device and inspection method of semiconductor device
US7710153B1 (en) 2006-06-30 2010-05-04 Masleid Robert P Cross point switch
US7495466B1 (en) * 2006-06-30 2009-02-24 Transmeta Corporation Triple latch flip flop system and method
US7675372B2 (en) * 2006-08-09 2010-03-09 Qualcomm Incorporated Circuit simulator parameter extraction using a configurable ring oscillator
US7546501B2 (en) 2006-09-13 2009-06-09 Texas Instruments Incorporated Selecting test circuitry from header signals on power lead
ITMI20070386A1 (en) * 2007-02-28 2008-09-01 St Microelectronics Srl INTERFERENCE SUPPRESSION IN TEST WITHOUT WIRES OF SEMICONDUCTOR DEVICES
KR101499047B1 (en) * 2007-04-03 2015-03-05 스캐니메트릭스 인크. Testing of electronic circuits using an active probe integrated circuit
US8362481B2 (en) 2007-05-08 2013-01-29 Scanimetrics Inc. Ultra high speed signal transmission/reception
GB2463806B (en) 2007-05-08 2012-07-18 Scanimetrics Inc Ultra high speed signal transmission/reception
US20100259107A1 (en) * 2007-11-14 2010-10-14 Peter Kinget Systems and Methods for Providing Power to a Device Under Test
TWI354793B (en) * 2008-01-18 2011-12-21 King Yuan Electronics Co Ltd Ic testing environment investigating device and me
CA2623257A1 (en) * 2008-02-29 2009-08-29 Scanimetrics Inc. Method and apparatus for interrogating an electronic component
JP2009289334A (en) * 2008-05-29 2009-12-10 Toshiba Corp Semiconductor device and test method
US8294483B2 (en) * 2008-05-30 2012-10-23 Freescale Semiconductor, Inc. Testing of multiple integrated circuits
US8032030B2 (en) * 2008-05-30 2011-10-04 Freescale Semiconductor, Inc. Multiple core system
US8717057B2 (en) * 2008-06-27 2014-05-06 Qualcomm Incorporated Integrated tester chip using die packaging technologies
US8643539B2 (en) * 2008-11-19 2014-02-04 Nokomis, Inc. Advance manufacturing monitoring and diagnostic tool
US8255183B1 (en) 2009-06-30 2012-08-28 Qualcomm Atheros, Inc Communication unit with analog test unit
JP2011033488A (en) * 2009-08-03 2011-02-17 Renesas Electronics Corp Semiconductor integrated circuit test device
US8466707B2 (en) * 2010-03-03 2013-06-18 Qualcomm Incorporated Method and apparatus for testing a memory device
IT1399914B1 (en) * 2010-04-29 2013-05-09 St Microelectronics Srl TEST CIRCUIT OF A CIRCUIT INTEGRATED ON THE WAFER OF THE TYPE INCLUDING AT LEAST AN EMBEDDED TYPE ANTENNA AND ITS INTEGRATED CIRCUIT OBTAINED THROUGH A SINGULATION STARTING FROM A WAFER PORTION EQUIPPED WITH SUCH A TEST CIRCUIT.
US9205270B2 (en) 2010-06-28 2015-12-08 Nokomis, Inc Method and apparatus for the diagnosis and prognosis of active implants in or attached to biological hosts or systems
KR101183629B1 (en) * 2010-12-21 2012-09-18 에스케이하이닉스 주식회사 Semiconductor device and semiconductor control system including the same
US8825823B2 (en) 2011-01-06 2014-09-02 Nokomis, Inc System and method for physically detecting, identifying, diagnosing and geolocating electronic devices connectable to a network
US9059189B2 (en) 2011-03-02 2015-06-16 Nokomis, Inc Integrated circuit with electromagnetic energy anomaly detection and processing
US10475754B2 (en) 2011-03-02 2019-11-12 Nokomis, Inc. System and method for physically detecting counterfeit electronics
JP2012208108A (en) * 2011-03-11 2012-10-25 Denso Corp Semiconductor integrated circuit
US9157954B2 (en) * 2011-06-03 2015-10-13 Apple Inc. Test system with temporary test structures
US9070651B2 (en) 2011-12-02 2015-06-30 International Business Machines Corporation Non-linear kerf monitor and design structure thereof
US9285463B1 (en) 2011-12-12 2016-03-15 Nokomis, Inc. Method and apparatus for battle damage assessment of electric or electronic devices and systems
KR101910933B1 (en) * 2011-12-21 2018-10-24 에스케이하이닉스 주식회사 Semiconductor integrated circuit and control method of testing the same
US9658314B2 (en) 2012-03-02 2017-05-23 Nokomis, Inc. System and method for geo-locating and detecting source of electromagnetic emissions
US9851386B2 (en) 2012-03-02 2017-12-26 Nokomis, Inc. Method and apparatus for detection and identification of counterfeit and substandard electronics
US9134368B2 (en) 2012-05-07 2015-09-15 Taiwan Semiconductor Manufacturing Co., Ltd. Contactless wafer probing with improved power supply
US9599576B1 (en) 2013-03-06 2017-03-21 Nokomis, Inc. Acoustic—RF multi-sensor material characterization system
US9625509B1 (en) 2013-03-06 2017-04-18 Nokomis, Inc. Automated sensor system for RF shielding characterization
US9488572B2 (en) 2013-06-19 2016-11-08 Ohio State Innovation Foundation Non-contact probe measurement test bed for millimeter wave and terahertz circuits, integrated devices/components, systems for spectroscopy using sub-wavelength-size-samples
KR102188060B1 (en) * 2014-02-05 2020-12-07 삼성전자 주식회사 Probe card and Test System including the Probe Card
US9772363B2 (en) 2014-02-26 2017-09-26 Nokomis, Inc. Automated analysis of RF effects on electronic devices through the use of device unintended emissions
WO2015163886A1 (en) * 2014-04-24 2015-10-29 Empire Technology Development, Llc Broadcasting a message using modulated power
US9642014B2 (en) 2014-06-09 2017-05-02 Nokomis, Inc. Non-contact electromagnetic illuminated detection of part anomalies for cyber physical security
US10395032B2 (en) 2014-10-03 2019-08-27 Nokomis, Inc. Detection of malicious software, firmware, IP cores and circuitry via unintended emissions
JP2016180673A (en) * 2015-03-24 2016-10-13 株式会社デンソー Semiconductor integrated circuit and test system therefor
US20170245361A1 (en) * 2016-01-06 2017-08-24 Nokomis, Inc. Electronic device and methods to customize electronic device electromagnetic emissions
GB2559407B (en) * 2017-02-06 2020-06-03 Advanced Risc Mach Ltd Testing integrated circuits
US10448864B1 (en) 2017-02-24 2019-10-22 Nokomis, Inc. Apparatus and method to identify and measure gas concentrations
TWI634339B (en) * 2017-11-21 2018-09-01 興城科技股份有限公司 Method and apparatus for testing a tft panel
US11489847B1 (en) 2018-02-14 2022-11-01 Nokomis, Inc. System and method for physically detecting, identifying, and diagnosing medical electronic devices connectable to a network
KR20230024080A (en) * 2021-08-11 2023-02-20 삼성전자주식회사 Integrated circuit including test circuit and manufacturing the same

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5095267A (en) * 1990-03-19 1992-03-10 National Semiconductor Corporation Method of screening A.C. performance characteristics during D.C. parametric test operation
US5446395A (en) * 1992-09-22 1995-08-29 Nec Corporation Test circuit for large scale integrated circuits on a wafer
WO1999017353A1 (en) * 1997-09-29 1999-04-08 Siemens Aktiengesellschaft Multiplexed test circuit on a semiconductor chip
WO1999032893A1 (en) * 1997-12-22 1999-07-01 Conexant Systems, Inc. Wireless test apparatus for integrated circuit die
US6058497A (en) * 1992-11-20 2000-05-02 Micron Technology, Inc. Testing and burn-in of IC chips using radio frequency transmission

Family Cites Families (87)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3689885A (en) 1970-09-15 1972-09-05 Transitag Corp Inductively coupled passive responder and interrogator unit having multidimension electromagnetic field capabilities
US4002974A (en) 1975-11-13 1977-01-11 Bell Telephone Laboratories, Incorporated Method and apparatus for testing circuits
US4105950A (en) 1976-09-13 1978-08-08 Rca Corporation Voltage controlled oscillator (VCO) employing nested oscillating loops
US4392105A (en) * 1980-12-17 1983-07-05 International Business Machines Corp. Test circuit for delay measurements on a LSI chip
US4587480A (en) * 1982-06-17 1986-05-06 Storage Technology Partners Delay testing method for CMOS LSI and VLSI integrated circuits
US4489272A (en) 1982-07-06 1984-12-18 International Business Machines Corporation Test circuit for turn-on and turn-off delay measurements
US4517532A (en) 1983-07-01 1985-05-14 Motorola, Inc. Programmable ring oscillator
US4985681A (en) 1985-01-18 1991-01-15 Siemens Aktiengesellschaft Particle beam measuring method for non-contact testing of interconnect networks
EP0309201B1 (en) 1987-09-22 1993-05-26 Hitachi Maxell Ltd. Method and system of communication for a non-contact ic card
JPH065691B2 (en) 1987-09-26 1994-01-19 株式会社東芝 Semiconductor element test method and test apparatus
JPH01318262A (en) * 1988-06-20 1989-12-22 Fujitsu Ltd Integrated circuit and method of assessing characteristics thereof
JPH0755593B2 (en) 1989-05-18 1995-06-14 三菱電機株式会社 Non-contact IC card
US5039602A (en) * 1990-03-19 1991-08-13 National Semiconductor Corporation Method of screening A.C. performance characteristics during D.C. parametric test operation
US5252914A (en) 1990-08-06 1993-10-12 Ericsson Ge Mobile Communications Inc. Method of constructing and testing a circuit board designed for early diagnostics
US5059899A (en) 1990-08-16 1991-10-22 Micron Technology, Inc. Semiconductor dies and wafers and methods for making
US5075417A (en) * 1990-08-31 1991-12-24 Cape Industries Polyester polyols from tall oil fatty acid, maleic anhydride, and aromatic polyester polyols
JPH04139850A (en) * 1990-10-01 1992-05-13 Matsushita Electric Ind Co Ltd Semiconductor integrated circuit device and inspecting method thereof
JPH04160377A (en) * 1990-10-23 1992-06-03 Nec Corp Semiconductor integrated circuit
US5192913A (en) 1990-12-20 1993-03-09 Microelectronics And Computer Technology Corporation Segmented charge limiting test algorithm for electrical components
US5204559A (en) * 1991-01-23 1993-04-20 Vitesse Semiconductor Corporation Method and apparatus for controlling clock skew
US5149662A (en) 1991-03-27 1992-09-22 Integrated System Assemblies Corporation Methods for testing and burn-in of integrated circuit chips
US5315241A (en) 1991-09-18 1994-05-24 Sgs-Thomson Microelectronics, Inc. Method for testing integrated circuits
US5279975A (en) 1992-02-07 1994-01-18 Micron Technology, Inc. Method of testing individual dies on semiconductor wafers prior to singulation
JPH05273234A (en) * 1992-03-25 1993-10-22 Mitsubishi Electric Corp Mmic apparatus and rf probe head
US5457400A (en) 1992-04-10 1995-10-10 Micron Technology, Inc. Semiconductor array having built-in test circuit for wafer level testing
US5266890A (en) 1992-06-26 1993-11-30 Unisys Corporation Test wafer for diagnosing flaws in an integrated circuit fabrication process that cause A-C defects
US5473666A (en) * 1992-09-11 1995-12-05 Reliance Comm/Tec Corporation Method and apparatus for digitally controlling gain in a talking path
US5983363A (en) 1992-11-20 1999-11-09 Micron Communications, Inc. In-sheet transceiver testing
JP3250285B2 (en) * 1992-11-26 2002-01-28 セイコーエプソン株式会社 Substrate to be processed provided with information measuring means
US5448395A (en) * 1993-08-03 1995-09-05 Northrop Grumman Corporation Non-mechanical step scanner for electro-optical sensors
US5625288A (en) 1993-10-22 1997-04-29 Sandia Corporation On-clip high frequency reliability and failure test structures
US5365204A (en) 1993-10-29 1994-11-15 International Business Machines Corporation CMOS voltage controlled ring oscillator
US5486786A (en) * 1994-08-09 1996-01-23 Lsi Logic Corporation Process monitor for CMOS integrated circuits
GB9417244D0 (en) 1994-08-26 1994-10-19 Inmos Ltd Integrated circuit device and test method therefor
FR2726409B1 (en) * 1994-10-28 1996-12-13 Suisse Electronique Microtech MULTIPLEXER OF LOGIC VARIABLES
JP3301874B2 (en) 1994-12-19 2002-07-15 松下電器産業株式会社 Semiconductor device and inspection method thereof
JP3523698B2 (en) * 1994-12-21 2004-04-26 光洋精工株式会社 Electric power steering device and preventive safety device
US5905383A (en) 1995-08-29 1999-05-18 Tektronix, Inc. Multi-chip module development substrate
US6005407A (en) 1995-10-23 1999-12-21 Opmax Inc. Oscillation-based test method for testing an at least partially analog circuit
US5714888A (en) 1995-12-26 1998-02-03 Motorola, Inc. Method and apparatus for testing electronic circuitry in a manufacturing environment
US6087842A (en) 1996-04-29 2000-07-11 Agilent Technologies Integrated or intrapackage capability for testing electrical continuity between an integrated circuit and other circuitry
JPH09305252A (en) * 1996-05-17 1997-11-28 Mitsubishi Electric Corp Semiconductor device
US5867033A (en) 1996-05-24 1999-02-02 Lsi Logic Corporation Circuit for testing the operation of a semiconductor device
US5818250A (en) 1996-07-03 1998-10-06 Silicon Graphics, Inc. Apparatus and method for determining the speed of a semiconductor chip
US5811983A (en) * 1996-09-03 1998-09-22 Integrated Device Technology, Inc. Test ring oscillator
US5898186A (en) 1996-09-13 1999-04-27 Micron Technology, Inc. Reduced terminal testing system
US6219305B1 (en) 1996-09-17 2001-04-17 Xilinx, Inc. Method and system for measuring signal propagation delays using ring oscillators
US6466520B1 (en) * 1996-09-17 2002-10-15 Xilinx, Inc. Built-in AC self test using pulse generators
US5790479A (en) 1996-09-17 1998-08-04 Xilinx, Inc. Method for characterizing interconnect timing characteristics using reference ring oscillator circuit
US6233205B1 (en) * 1996-09-17 2001-05-15 Xilinx, Inc. Built-in self test method for measuring clock to out delays
US6069849A (en) * 1996-09-17 2000-05-30 Xilinx, Inc. Method and system for measuring signal propagation delays using the duty cycle of a ring oscillator
JPH10142068A (en) * 1996-11-14 1998-05-29 Sony Corp Temperature-measuring apparatus and method for measuring temperature using the apparatus
US5923676A (en) 1996-12-20 1999-07-13 Logic Vision, Inc. Bist architecture for measurement of integrated circuit delays
US5952840A (en) 1996-12-31 1999-09-14 Micron Technology, Inc. Apparatus for testing semiconductor wafers
JPH10255469A (en) 1997-03-07 1998-09-25 Mitsubishi Electric Corp Semiconductor integrated circuit
FR2764991B1 (en) * 1997-06-24 1999-09-03 Sgs Thomson Microelectronics FUNCTIONAL TEST METHOD AND CIRCUIT COMPRISING MEANS FOR IMPLEMENTING THE METHOD
US5963043A (en) * 1997-09-17 1999-10-05 International Business Machines Corporation Method and apparatus for characterized parasitic capacitance between integrated-circuit interconnects
US6057171A (en) 1997-09-25 2000-05-02 Frequency Technology, Inc. Methods for determining on-chip interconnect process parameters
JP3408408B2 (en) 1997-10-24 2003-05-19 エヌイーシーマイクロシステム株式会社 CR oscillation circuit
TW345685B (en) 1997-11-22 1998-11-21 United Microelectronics Corp Semiconductor device with wafer burn-in and method therefor
US6057699A (en) * 1997-12-11 2000-05-02 Stmicroelectronics, Inc. Built-in frequency test circuit for testing the frequency of the output of a frequency generating circuit
US6223314B1 (en) 1997-12-31 2001-04-24 Karim Arabi Method of dynamic on-chip digital integrated circuit testing
US6075417A (en) 1998-01-05 2000-06-13 Advanced Micro Devices, Inc. Ring oscillator test structure
US6119255A (en) * 1998-01-21 2000-09-12 Micron Technology, Inc. Testing system for evaluating integrated circuits, a burn-in testing system, and a method for testing an integrated circuit
FR2775832B1 (en) * 1998-03-05 2000-05-05 St Microelectronics Sa SEMICONDUCTOR TEST SYSTEM CARRIED OUT IN A CUTTING PATH OF A SEMICONDUCTOR WAFER
US6331782B1 (en) * 1998-03-23 2001-12-18 Conexant Systems, Inc. Method and apparatus for wireless testing of integrated circuits
US6184696B1 (en) 1998-03-23 2001-02-06 Conexant Systems, Inc. Use of converging beams for transmitting electromagnetic energy to power devices for die testing
US6512392B2 (en) * 1998-04-17 2003-01-28 International Business Machines Corporation Method for testing semiconductor devices
US6133582A (en) 1998-05-14 2000-10-17 Lightspeed Semiconductor Corporation Methods and apparatuses for binning partially completed integrated circuits based upon test results
KR100278926B1 (en) 1998-05-25 2001-01-15 김영환 Pulley on-chip wafer level burn-in test circuit and its method
IL124961A (en) 1998-06-16 2006-10-05 Orbotech Ltd Contactless test method and system
JP2000012639A (en) 1998-06-24 2000-01-14 Toshiba Corp Testing circuit of monitor teg
US6236223B1 (en) 1998-11-09 2001-05-22 Intermec Ip Corp. Method and apparatus for wireless radio frequency testing of RFID integrated circuits
US6134191A (en) 1999-02-26 2000-10-17 Xilinx, Inc. Oscillator for measuring on-chip delays
DE19917586C2 (en) * 1999-04-19 2002-01-17 Infineon Technologies Ag Arrangement for carrying out burn-in treatments of semiconductor devices at the wafer level
US6239591B1 (en) 1999-04-29 2001-05-29 International Business Machines Corporation Method and apparatus for monitoring SOI hysterises effects
US6891124B2 (en) * 2000-01-05 2005-05-10 Tokyo Electron Limited Method of wafer band-edge measurement using transmission spectroscopy and a process for controlling the temperature uniformity of a wafer
US6693434B2 (en) * 2000-02-16 2004-02-17 Agere Systems, Inc. Automated system for estimating ring oscillator reliability and testing AC response and method of operation thereof
CA2308820A1 (en) * 2000-05-15 2001-11-15 The Governors Of The University Of Alberta Wireless radio frequency technique design and method for testing of integrated circuits and wafers
US6556938B1 (en) * 2000-08-29 2003-04-29 Agilent Technologies, Inc. Systems and methods for facilitating automated test equipment functionality within integrated circuits
US6544807B1 (en) * 2000-11-03 2003-04-08 Lsi Logic Corporation Process monitor with statistically selected ring oscillator
US6587811B2 (en) * 2000-11-28 2003-07-01 Scientific Technologies Incorporated System and method for delay line testing
JP2002197894A (en) * 2000-12-25 2002-07-12 Mitsubishi Electric Corp Semiconductor integrated circuit
US6882239B2 (en) * 2001-05-08 2005-04-19 Formfactor, Inc. Electromagnetically coupled interconnect system
WO2005020297A2 (en) * 2003-08-25 2005-03-03 Tau-Metrix, Inc. Technique for evaluating a fabrication of a semiconductor component and wafer
US7215133B2 (en) * 2004-01-30 2007-05-08 International Business Machines Corporation Contactless circuit testing for adaptive wafer processing
US7239163B1 (en) * 2004-06-23 2007-07-03 Ridgetop Group, Inc. Die-level process monitor and method

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5095267A (en) * 1990-03-19 1992-03-10 National Semiconductor Corporation Method of screening A.C. performance characteristics during D.C. parametric test operation
US5446395A (en) * 1992-09-22 1995-08-29 Nec Corporation Test circuit for large scale integrated circuits on a wafer
US6058497A (en) * 1992-11-20 2000-05-02 Micron Technology, Inc. Testing and burn-in of IC chips using radio frequency transmission
WO1999017353A1 (en) * 1997-09-29 1999-04-08 Siemens Aktiengesellschaft Multiplexed test circuit on a semiconductor chip
WO1999032893A1 (en) * 1997-12-22 1999-07-01 Conexant Systems, Inc. Wireless test apparatus for integrated circuit die

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