WO2001097226A3 - Semiconductor memory having segmented row repair - Google Patents

Semiconductor memory having segmented row repair Download PDF

Info

Publication number
WO2001097226A3
WO2001097226A3 PCT/US2001/018388 US0118388W WO0197226A3 WO 2001097226 A3 WO2001097226 A3 WO 2001097226A3 US 0118388 W US0118388 W US 0118388W WO 0197226 A3 WO0197226 A3 WO 0197226A3
Authority
WO
WIPO (PCT)
Prior art keywords
redundant
row
memory device
segmented
repair
Prior art date
Application number
PCT/US2001/018388
Other languages
French (fr)
Other versions
WO2001097226A2 (en
Inventor
Brent Keeth
Original Assignee
Micron Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micron Technology Inc filed Critical Micron Technology Inc
Priority to DE60138283T priority Critical patent/DE60138283D1/en
Priority to KR1020027017053A priority patent/KR100595813B1/en
Priority to JP2002511339A priority patent/JP2004503897A/en
Priority to AU2001275334A priority patent/AU2001275334A1/en
Priority to EP01942036A priority patent/EP1292952B8/en
Publication of WO2001097226A2 publication Critical patent/WO2001097226A2/en
Publication of WO2001097226A3 publication Critical patent/WO2001097226A3/en

Links

Classifications

    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C29/00Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/70Masking faults in memories by using spares or by reconfiguring
    • G11C29/78Masking faults in memories by using spares or by reconfiguring using programmable devices
    • G11C29/80Masking faults in memories by using spares or by reconfiguring using programmable devices with improved layout
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C29/00Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation

Abstract

A memory device having a segmented row repair architecture that provides the benefits of single bit repair, thereby efficiently utilizing redundant rows of the memory device, is disclosed. The rows of a memory device are segmented into four segments and segmented row repair is provided by selectively disabling a wordline driver for only one segment of the primary row in which a defective memory cell is located and enabling a redundant wordline driver with a redundant term signal provided by the redundancy matching circuit, thereby substituting a redundant row segment for only a specific segment of the entire row length. By selectively disabling only the wordline driver associated with the defective memory cell and dividing the primary and redundant rows into four segments, localized or single bit repair can be performed, thereby efficiently utilizing the redundant rows of the memory device.
PCT/US2001/018388 2000-06-14 2001-06-07 Semiconductor memory having segmented row repair WO2001097226A2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
DE60138283T DE60138283D1 (en) 2000-06-14 2001-06-07 SEMICONDUCTOR MEMORY WITH SEGMENTED RARE REPAIR
KR1020027017053A KR100595813B1 (en) 2000-06-14 2001-06-07 Semiconductor memory, memory device, memory circuit and processor system having segmented row repair and method for repairing out a defective memory cell
JP2002511339A JP2004503897A (en) 2000-06-14 2001-06-07 Semiconductor memory with segmented line repair
AU2001275334A AU2001275334A1 (en) 2000-06-14 2001-06-07 Semiconductor memory having segmented row repair
EP01942036A EP1292952B8 (en) 2000-06-14 2001-06-07 Semiconductor memory having segmented row repair

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/594,442 US6314030B1 (en) 2000-06-14 2000-06-14 Semiconductor memory having segmented row repair
US09/594,442 2000-06-14

Publications (2)

Publication Number Publication Date
WO2001097226A2 WO2001097226A2 (en) 2001-12-20
WO2001097226A3 true WO2001097226A3 (en) 2002-05-10

Family

ID=24378869

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/018388 WO2001097226A2 (en) 2000-06-14 2001-06-07 Semiconductor memory having segmented row repair

Country Status (10)

Country Link
US (2) US6314030B1 (en)
EP (2) EP1292952B8 (en)
JP (1) JP2004503897A (en)
KR (1) KR100595813B1 (en)
CN (2) CN100442434C (en)
AT (1) ATE428175T1 (en)
AU (1) AU2001275334A1 (en)
DE (1) DE60138283D1 (en)
ES (1) ES2325056T3 (en)
WO (1) WO2001097226A2 (en)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6163489A (en) 1999-07-16 2000-12-19 Micron Technology Inc. Semiconductor memory having multiple redundant columns with offset segmentation boundaries
KR20020002133A (en) * 2000-06-29 2002-01-09 박종섭 Column redundancy circuit
US6625081B2 (en) 2001-08-13 2003-09-23 Micron Technology, Inc. Synchronous flash memory with virtual segment architecture
US6687171B2 (en) * 2002-04-26 2004-02-03 Infineon Technologies Aktiengesellschaft Flexible redundancy for memories
US6621751B1 (en) 2002-06-04 2003-09-16 Micron Technology, Inc. Method and apparatus for programming row redundancy fuses so decoding matches internal pattern of a memory array
KR100468315B1 (en) * 2002-07-15 2005-01-27 주식회사 하이닉스반도체 Repair circuit
US6807114B2 (en) 2003-01-17 2004-10-19 Micron Technology, Inc. Method and system for selecting redundant rows and columns of memory cells
US7509543B2 (en) 2003-06-17 2009-03-24 Micron Technology, Inc. Circuit and method for error test, recordation, and repair
US6868019B2 (en) * 2003-07-02 2005-03-15 Micron Technology, Inc. Reduced power redundancy address decoder and comparison circuit
US6992937B2 (en) * 2003-07-28 2006-01-31 Silicon Storage Technology, Inc. Column redundancy for digital multilevel nonvolatile memory
US7061815B2 (en) * 2003-08-05 2006-06-13 Stmicroelectronics Pvt. Ltd. Semiconductor memory device providing redundancy
DE102004036545B3 (en) 2004-07-28 2006-03-16 Infineon Technologies Ag Integrated semiconductor memory with redundant memory cells
US20080291760A1 (en) * 2007-05-23 2008-11-27 Micron Technology, Inc. Sub-array architecture memory devices and related systems and methods
US7885128B2 (en) * 2008-10-21 2011-02-08 Micron Technology, Inc. Redundant memory array for replacing memory sections of main memory
US8331126B2 (en) 2010-06-28 2012-12-11 Qualcomm Incorporated Non-volatile memory with split write and read bitlines
CN102456414B (en) * 2010-10-20 2014-11-26 旺宏电子股份有限公司 Memory storage with backup row and restoration method thereof
JP6083576B2 (en) 2011-12-23 2017-02-22 インテル・コーポレーション Memory device, method and system
CN105513647A (en) * 2011-12-23 2016-04-20 英特尔公司 Self-repair logic for stacked storage device structure
TWI497517B (en) * 2012-11-02 2015-08-21 Elite Semiconductor Esmt Repairing circuit for memory circuit and method thereof and memory circuit using the same
US9601189B2 (en) * 2013-04-24 2017-03-21 Hewlett Packard Enterprise Development Lp Representing data using a group of multilevel memory cells
KR102204390B1 (en) 2014-09-12 2021-01-18 삼성전자주식회사 Memory device with fast fail cell repair
KR20160120006A (en) * 2015-04-07 2016-10-17 에스케이하이닉스 주식회사 Semiconductor memory device
US11164610B1 (en) 2020-06-05 2021-11-02 Qualcomm Incorporated Memory device with built-in flexible double redundancy
US11177010B1 (en) 2020-07-13 2021-11-16 Qualcomm Incorporated Bitcell for data redundancy
US11114181B1 (en) * 2020-08-03 2021-09-07 Micron Technology, Inc. Memory devices with redundant memory cells for replacing defective memory cells, and related systems and methods

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5528539A (en) * 1994-09-29 1996-06-18 Micron Semiconductor, Inc. High speed global row redundancy system
US6005813A (en) * 1997-11-12 1999-12-21 Micron Technology, Inc. Device and method for repairing a semiconductor memory
US6011735A (en) * 1998-05-27 2000-01-04 Mitsubishi Denki Kabushiki Kaisha Synchronous semiconductor memory device with redundancy determination unit that can set replacement of redundant memory array provided in row and column directions

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4918622A (en) 1988-11-16 1990-04-17 Eastman Kodak Company Electronic graphic arts screener
US5126973A (en) * 1990-02-14 1992-06-30 Texas Instruments Incorporated Redundancy scheme for eliminating defects in a memory device
KR960002777B1 (en) 1992-07-13 1996-02-26 삼성전자주식회사 Row redundancy device for a semiconductor device
DE59310168D1 (en) * 1993-02-19 2001-06-07 Infineon Technologies Ag Column redundancy circuitry for a memory
JP3077868B2 (en) * 1993-12-27 2000-08-21 日本電気株式会社 Semiconductor storage circuit device
US5625725A (en) 1993-12-28 1997-04-29 Sony Corporation Magneto-optical pickup device having phase compensating circuitry
JP3386547B2 (en) * 1994-01-26 2003-03-17 株式会社東芝 Redundancy circuit device
US5446698A (en) * 1994-06-30 1995-08-29 Sgs-Thomson Microelectronics, Inc. Block decoded redundant master wordline
JPH08227597A (en) * 1995-02-21 1996-09-03 Mitsubishi Electric Corp Semiconductor storage device
JP3774500B2 (en) 1995-05-12 2006-05-17 株式会社ルネサステクノロジ Semiconductor memory device
US5532966A (en) * 1995-06-13 1996-07-02 Alliance Semiconductor Corporation Random access memory redundancy circuit employing fusible links
JP3710002B2 (en) * 1995-08-23 2005-10-26 株式会社日立製作所 Semiconductor memory device
US5808945A (en) * 1996-02-21 1998-09-15 Sony Corporation Semiconductor memory having redundant memory array
JPH09231789A (en) * 1996-02-21 1997-09-05 Sony Corp Semiconductor memory device
DE69618928D1 (en) 1996-04-18 2002-03-14 St Microelectronics Srl Semiconductor memory device with line redundancy
US5706292A (en) 1996-04-25 1998-01-06 Micron Technology, Inc. Layout for a semiconductor memory device having redundant elements
US5732030A (en) * 1996-06-25 1998-03-24 Texas Instruments Incorporated Method and system for reduced column redundancy using a dual column select
US5815447A (en) 1996-08-08 1998-09-29 Micron Technology, Inc. Memory device having complete row redundancy
US5774471A (en) * 1996-12-17 1998-06-30 Integrated Silicon Solution Inc. Multiple location repair word line redundancy circuit
DE19729579C2 (en) * 1997-07-10 2000-12-07 Siemens Ag Method for activating a redundant word line with inter-segment redundancy in a semiconductor memory with word lines organized in segments
JP3204190B2 (en) * 1997-12-26 2001-09-04 日本電気株式会社 Semiconductor storage device
JP3908392B2 (en) * 1998-07-31 2007-04-25 エルピーダメモリ株式会社 Semiconductor integrated circuit device
US6157584A (en) * 1999-05-20 2000-12-05 Advanced Micro Devices, Inc. Redundancy circuit and method for semiconductor memory
US6163489A (en) * 1999-07-16 2000-12-19 Micron Technology Inc. Semiconductor memory having multiple redundant columns with offset segmentation boundaries

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5528539A (en) * 1994-09-29 1996-06-18 Micron Semiconductor, Inc. High speed global row redundancy system
US6005813A (en) * 1997-11-12 1999-12-21 Micron Technology, Inc. Device and method for repairing a semiconductor memory
US6011735A (en) * 1998-05-27 2000-01-04 Mitsubishi Denki Kabushiki Kaisha Synchronous semiconductor memory device with redundancy determination unit that can set replacement of redundant memory array provided in row and column directions

Also Published As

Publication number Publication date
WO2001097226A2 (en) 2001-12-20
EP1292952B1 (en) 2009-04-08
DE60138283D1 (en) 2009-05-20
CN1636260A (en) 2005-07-06
ES2325056T3 (en) 2009-08-25
AU2001275334A1 (en) 2001-12-24
JP2004503897A (en) 2004-02-05
EP2058820A1 (en) 2009-05-13
US6442084B2 (en) 2002-08-27
KR20030009526A (en) 2003-01-29
US20010053101A1 (en) 2001-12-20
US6314030B1 (en) 2001-11-06
EP1292952A2 (en) 2003-03-19
KR100595813B1 (en) 2006-07-03
EP1292952B8 (en) 2009-08-05
CN101471140A (en) 2009-07-01
ATE428175T1 (en) 2009-04-15
CN100442434C (en) 2008-12-10

Similar Documents

Publication Publication Date Title
WO2001097226A3 (en) Semiconductor memory having segmented row repair
TW330265B (en) Semiconductor apparatus
AU2461597A (en) Layout for a semiconductor memory device having redundant elements
WO2002061752A3 (en) Mram architecture and system
ITMI922473A1 (en) LINE REDUNDANCY CIRCUIT FOR A SEMICONDUCTOR MEMORY DEVICE.
EP1069504A3 (en) Semiconductor memory device suitable for merging with logic
DE69330731T2 (en) Redundancy circuit for semiconductor memory devices
GB2266795B (en) Column redundancy circuit for a semiconductor memory device
TW355843B (en) Semiconductor memory device
DE69329220D1 (en) Line redundancy circuit of a semiconductor memory device
WO2002015190A3 (en) Non-volatile memory, method of manufacture and programming
AU6945700A (en) Circuit and method for a multiplexed redundancy scheme in a memory device
WO2008057257A3 (en) One-time-programmable logic bit with multiple logic elements
GB2308693B (en) Flash memory device
EP0847010A3 (en) Row redundancy block architecture
TW200627477A (en) Memory device employing open bit line architecture for providing identical data topology on repaired memory cell block and method thereof
TW364999B (en) Semiconductor memory devices with electrically programmable redundancy
WO2002059899A3 (en) Mram bit line word line architecture
TW200614266A (en) Repair of memory cells
WO2004051669A3 (en) Method and apparatus for replacing defective rows in a semiconductor memory array
EP1184788A3 (en) Nonvolatile semiconductor memory device
TW340219B (en) Semiconductor memory device having redundant memory cell array
TW339438B (en) Memory device and memory control circuit
EP1318522A3 (en) Memory devices
WO2003092012A3 (en) Flexible redundancy for memories

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ PL PT RO RU SD SE SG SI SK SL TJ TM TR TT TZ UA UG UZ VN YU ZA ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR BF BJ CF CG CI CM GA GN GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
WWE Wipo information: entry into national phase

Ref document number: 1020027017053

Country of ref document: KR

ENP Entry into the national phase

Ref country code: JP

Ref document number: 2002 511339

Kind code of ref document: A

Format of ref document f/p: F

WWE Wipo information: entry into national phase

Ref document number: 2001942036

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 018131034

Country of ref document: CN

WWP Wipo information: published in national office

Ref document number: 1020027017053

Country of ref document: KR

WWP Wipo information: published in national office

Ref document number: 2001942036

Country of ref document: EP

REG Reference to national code

Ref country code: DE

Ref legal event code: 8642

WWG Wipo information: grant in national office

Ref document number: 1020027017053

Country of ref document: KR