WO2002005328A3 - Pod load interface equipment adapted for implementation in a fims system - Google Patents
Pod load interface equipment adapted for implementation in a fims system Download PDFInfo
- Publication number
- WO2002005328A3 WO2002005328A3 PCT/US2001/021804 US0121804W WO0205328A3 WO 2002005328 A3 WO2002005328 A3 WO 2002005328A3 US 0121804 W US0121804 W US 0121804W WO 0205328 A3 WO0205328 A3 WO 0205328A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- box
- transport box
- assembly
- door
- move
- Prior art date
Links
- 238000002397 field ionisation mass spectrometry Methods 0.000 abstract 1
- 230000003287 optical effect Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67373—Closed carriers characterised by locking systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J61/00—Gas-discharge or vapour-discharge lamps
- H01J61/02—Details
- H01J61/30—Vessels; Containers
- H01J61/35—Vessels; Containers provided with coatings on the walls thereof; Selection of materials for the coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J65/00—Lamps without any electrode inside the vessel; Lamps with at least one main electrode outside the vessel
- H01J65/04—Lamps in which a gas filling is excited to luminesce by an external electromagnetic field or by external corpuscular radiation, e.g. for indicating plasma display panels
- H01J65/042—Lamps in which a gas filling is excited to luminesce by an external electromagnetic field or by external corpuscular radiation, e.g. for indicating plasma display panels by an external electromagnetic field
- H01J65/046—Lamps in which a gas filling is excited to luminesce by an external electromagnetic field or by external corpuscular radiation, e.g. for indicating plasma display panels by an external electromagnetic field the field being produced by using capacitive means around the vessel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/127—Multistep manufacturing methods with a particular formation, treatment or patterning of the active layer specially adapted to the circuit arrangement
- H01L27/1274—Multistep manufacturing methods with a particular formation, treatment or patterning of the active layer specially adapted to the circuit arrangement using crystallisation of amorphous semiconductor or recrystallisation of crystalline semiconductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/1296—Multistep manufacturing methods adapted to increase the uniformity of device parameters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66742—Thin film unipolar transistors
- H01L29/6675—Amorphous silicon or polysilicon transistors
- H01L29/66757—Lateral single gate single channel transistors with non-inverted structure, i.e. the channel layer is formed before the gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66742—Thin film unipolar transistors
- H01L29/66772—Monocristalline silicon transistors on insulating substrates, e.g. quartz substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78651—Silicon transistors
- H01L29/78654—Monocrystalline silicon transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78651—Silicon transistors
- H01L29/7866—Non-monocrystalline silicon transistors
- H01L29/78672—Polycrystalline or microcrystalline silicon transistor
- H01L29/78675—Polycrystalline or microcrystalline silicon transistor with normal-type structure, e.g. with top gate
Abstract
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002509093A JP2004509454A (en) | 2000-07-10 | 2001-07-10 | Pod load interface device implemented in FIMS system |
AU2001280508A AU2001280508A1 (en) | 2000-07-10 | 2001-07-10 | Pod load interface equipment adapted for implementation in a fims system |
DE60131895T DE60131895T2 (en) | 2000-07-10 | 2001-07-10 | DEVICE FOR LOADING A CONTAINER USING A FIMS SYSTEM |
CNB018147496A CN1249775C (en) | 2000-07-10 | 2001-07-10 | Thin film semiconductor device and its production method |
EP01958901A EP1356500B1 (en) | 2000-07-10 | 2001-07-10 | Pod load interface equipment adapted for implementation in a fims system |
KR1020037000304A KR101163216B1 (en) | 2000-07-10 | 2001-07-10 | Pod load interface equipment adapted for implementation in a fims system |
HK04103060A HK1060215A1 (en) | 2000-07-10 | 2004-04-30 | Pod load interface equipment adapted for implementation in a front-opening interface mechanical standard (films) system |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/612,757 US6501070B1 (en) | 1998-07-13 | 2000-07-10 | Pod load interface equipment adapted for implementation in a fims system |
US09/612,757 | 2000-07-10 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2002005328A2 WO2002005328A2 (en) | 2002-01-17 |
WO2002005328A3 true WO2002005328A3 (en) | 2003-08-28 |
Family
ID=24454532
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2001/021804 WO2002005328A2 (en) | 2000-07-10 | 2001-07-10 | Pod load interface equipment adapted for implementation in a fims system |
Country Status (10)
Country | Link |
---|---|
US (5) | US6501070B1 (en) |
EP (1) | EP1356500B1 (en) |
JP (3) | JP2004509454A (en) |
KR (1) | KR101163216B1 (en) |
CN (1) | CN1249775C (en) |
AT (1) | ATE381115T1 (en) |
AU (1) | AU2001280508A1 (en) |
DE (1) | DE60131895T2 (en) |
HK (1) | HK1060215A1 (en) |
WO (1) | WO2002005328A2 (en) |
Families Citing this family (77)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6501070B1 (en) * | 1998-07-13 | 2002-12-31 | Newport Corporation | Pod load interface equipment adapted for implementation in a fims system |
US6652212B2 (en) * | 2000-05-02 | 2003-11-25 | Ckd Corporation | Cylinder, load port using it, and production system |
JP4691281B2 (en) * | 2001-09-03 | 2011-06-01 | ローツェ株式会社 | Cylinder, load port using the same, and production method |
WO2002004774A2 (en) * | 2000-07-07 | 2002-01-17 | Applied Materials, Inc. | Automatic door opener |
US6676356B2 (en) * | 2000-09-18 | 2004-01-13 | Tokyo Electron Limited | Device for attaching target substrate transfer container to semiconductor processing apparatus |
US6581986B2 (en) * | 2000-11-21 | 2003-06-24 | Tri Teq Lock And Security, L.L.C. | Bayonet locking system and method for vending machines and the like |
US6789328B2 (en) * | 2001-04-17 | 2004-09-14 | Brooks Automation, Inc. | Semiconductor load port alignment device |
WO2003009347A2 (en) * | 2001-07-16 | 2003-01-30 | Asyst Technologies, Inc. | Integrated system for tool front-end workpiece handling |
US6621694B2 (en) * | 2001-09-07 | 2003-09-16 | Harris Corporation | Vibration tolerant electronic assembly and related methods |
US20080206028A1 (en) * | 2001-11-30 | 2008-08-28 | Tatsuhiko Nagata | Pod cover removing-installing apparatus |
US7344349B2 (en) * | 2001-11-30 | 2008-03-18 | Right Mfg. Co., Ltd. | Pod cover removing-installing apparatus |
JP2003303869A (en) * | 2002-04-05 | 2003-10-24 | Sankyo Seiki Mfg Co Ltd | Lid member close/open device in substrate conveying apparatus |
KR100922051B1 (en) * | 2002-04-12 | 2009-10-19 | 도쿄엘렉트론가부시키가이샤 | Port structure in semiconductor processing device |
US6595075B1 (en) * | 2002-05-06 | 2003-07-22 | Taiwan Semiconductor Manufacturing Co., Ltd | Method and apparatus for testing cassette pod door |
US7677859B2 (en) * | 2002-07-22 | 2010-03-16 | Brooks Automation, Inc. | Substrate loading and uploading station with buffer |
JP4091380B2 (en) * | 2002-08-29 | 2008-05-28 | 東京エレクトロン株式会社 | Load port compatible with multiple types of cassettes containing substrates to be processed |
US6984839B2 (en) * | 2002-11-22 | 2006-01-10 | Tdk Corporation | Wafer processing apparatus capable of mapping wafers |
US20050169730A1 (en) * | 2003-04-30 | 2005-08-04 | Ravinder Aggarwal | Semiconductor processing tool front end interface with sealing capability |
US7674083B2 (en) * | 2003-05-15 | 2010-03-09 | Tdk Corporation | Clean device with clean box-opening/closing device |
US7621714B2 (en) * | 2003-10-23 | 2009-11-24 | Tdk Corporation | Pod clamping unit in pod opener, pod corresponding to pod clamping unit, and clamping mechanism and clamping method using pod clamping unit |
US10086511B2 (en) | 2003-11-10 | 2018-10-02 | Brooks Automation, Inc. | Semiconductor manufacturing systems |
SG132670A1 (en) * | 2003-11-10 | 2007-06-28 | Blueshift Technologies Inc | Methods and systems for handling workpieces in a vacuum-based semiconductor handling system |
US20070269297A1 (en) | 2003-11-10 | 2007-11-22 | Meulen Peter V D | Semiconductor wafer handling and transport |
US7458763B2 (en) | 2003-11-10 | 2008-12-02 | Blueshift Technologies, Inc. | Mid-entry load lock for semiconductor handling system |
TWI246109B (en) * | 2004-04-26 | 2005-12-21 | Quanta Display Inc | Apparatus for rotating and positioning a substrate-carrying cassette |
JP2005340614A (en) * | 2004-05-28 | 2005-12-08 | Tdk Corp | Load port for clean system |
US7607879B2 (en) * | 2004-06-15 | 2009-10-27 | Brooks Automation, Inc. | Substrate processing apparatus with removable component module |
FR2874744B1 (en) * | 2004-08-30 | 2006-11-24 | Cit Alcatel | VACUUM INTERFACE BETWEEN A MINI-ENVIRONMENT BOX AND EQUIPMENT |
US7720558B2 (en) * | 2004-09-04 | 2010-05-18 | Applied Materials, Inc. | Methods and apparatus for mapping carrier contents |
TWI251858B (en) * | 2004-09-17 | 2006-03-21 | Ind Tech Res Inst | Six-linkage positioning mechanism |
JP4373316B2 (en) * | 2004-10-14 | 2009-11-25 | ミライアル株式会社 | Clamp device for thin plate support container |
CN100361270C (en) * | 2005-06-17 | 2008-01-09 | 东南大学 | External electrode fluorescent lamp tube with high light optical effect low operating voltage and process for making same |
US8821099B2 (en) * | 2005-07-11 | 2014-09-02 | Brooks Automation, Inc. | Load port module |
DE102006008997A1 (en) | 2006-02-23 | 2007-10-11 | Integrated Dynamics Engineering Inc., Randolph | Method and device for picking up and / or transporting substrates |
JP4338205B2 (en) * | 2006-03-29 | 2009-10-07 | Tdk株式会社 | Pod clamp unit, load port with pod clamp unit, mini environment system with pod and load port |
US7750909B2 (en) * | 2006-05-16 | 2010-07-06 | Sony Corporation | Ordering artists by overall degree of influence |
DE102006029003A1 (en) * | 2006-06-24 | 2008-01-03 | Vistec Semiconductor Systems Gmbh | Wafer e.g. semiconductor wafer, handling device, has tool rack with tool component, base rack and robot for moving wafers, and robot mounted on coupling rack that is mounted directly on base rack independently of tool rack |
US20080041758A1 (en) * | 2006-08-16 | 2008-02-21 | Taiwan Semiconductor Manufacturing Co., Ltd. | Wafer carrier |
JP4713424B2 (en) * | 2006-08-24 | 2011-06-29 | 川崎重工業株式会社 | Opener side door drive mechanism |
US9117859B2 (en) | 2006-08-31 | 2015-08-25 | Brooks Automation, Inc. | Compact processing apparatus |
JP2008060513A (en) * | 2006-09-04 | 2008-03-13 | Tokyo Electron Ltd | Treating device and treating method |
US7740437B2 (en) | 2006-09-22 | 2010-06-22 | Asm International N.V. | Processing system with increased cassette storage capacity |
US7585142B2 (en) | 2007-03-16 | 2009-09-08 | Asm America, Inc. | Substrate handling chamber with movable substrate carrier loading platform |
KR100801631B1 (en) * | 2007-08-29 | 2008-02-11 | (주)메머드 | Mapping apparatus of fims loader |
KR100952183B1 (en) * | 2007-09-28 | 2010-04-09 | 한전원자력연료 주식회사 | Automatic Welding Fixture Loading and Unloading Device |
JP5387412B2 (en) * | 2007-11-21 | 2014-01-15 | 株式会社安川電機 | Transport robot, housing, semiconductor manufacturing equipment and sorter equipment |
JP5532861B2 (en) * | 2008-11-28 | 2014-06-25 | Tdk株式会社 | Closed container lid closing method and sealed container lid opening / closing system |
EP2320454A1 (en) * | 2009-11-05 | 2011-05-11 | S.O.I.Tec Silicon on Insulator Technologies | Substrate holder and clipping device |
DE102009053032B4 (en) * | 2009-11-12 | 2019-07-18 | Kuka Deutschland Gmbh | Manipulator with a self-supporting arms weight compensation device |
JP5952526B2 (en) * | 2011-02-04 | 2016-07-13 | 株式会社ダイヘン | Work transfer system |
CN102299050A (en) * | 2011-08-01 | 2011-12-28 | 上海宏力半导体制造有限公司 | Wafer position detection device |
KR101226746B1 (en) * | 2012-03-06 | 2013-01-25 | 유정호 | Automatic opening and closing device for foup |
CN108630585B (en) | 2013-01-22 | 2022-06-21 | 博鲁可斯自动化美国有限责任公司 | Substrate carrier |
JP6260109B2 (en) * | 2013-05-16 | 2018-01-17 | シンフォニアテクノロジー株式会社 | Load port device |
CN103295946B (en) * | 2013-06-04 | 2016-08-10 | 上海华力微电子有限公司 | The open front Interface Mechanical Standard device of furnace tube device |
JP6119436B2 (en) * | 2013-06-04 | 2017-04-26 | シンフォニアテクノロジー株式会社 | Load port device |
JP2015038944A (en) * | 2013-08-19 | 2015-02-26 | 株式会社ディスコ | Processing device |
JP6455239B2 (en) * | 2015-03-06 | 2019-01-23 | シンフォニアテクノロジー株式会社 | Door opener |
JP6554872B2 (en) * | 2015-03-31 | 2019-08-07 | Tdk株式会社 | GAS PURGE DEVICE, LOAD PORT DEVICE, PURGE CONTAINER CONTAINER STAND, AND GAS PURGE METHOD |
JP6451453B2 (en) * | 2015-03-31 | 2019-01-16 | Tdk株式会社 | GAS PURGE DEVICE, LOAD PORT DEVICE, PURGE CONTAINER CONTAINER STAND, AND GAS PURGE METHOD |
US10515834B2 (en) * | 2015-10-12 | 2019-12-24 | Lam Research Corporation | Multi-station tool with wafer transfer microclimate systems |
WO2017149526A2 (en) | 2016-03-04 | 2017-09-08 | May Patents Ltd. | A method and apparatus for cooperative usage of multiple distance meters |
TWI631644B (en) * | 2017-07-24 | 2018-08-01 | 億力鑫系統科技股份有限公司 | Linkage device and processing equipment having the same |
KR101924185B1 (en) | 2018-06-15 | 2018-11-30 | 주식회사 싸이맥스 | Clamp Mounted Load Port Module |
US11705358B2 (en) * | 2018-10-29 | 2023-07-18 | Taiwan Semiconductor Manufacturing Co., Ltd. | Systems and methods for automated processing ports |
CN109698157B (en) * | 2018-12-27 | 2021-08-24 | 北京半导体专用设备研究所(中国电子科技集团公司第四十五研究所) | Fixing device for wafer box |
TWI705229B (en) * | 2019-01-14 | 2020-09-21 | 亦立科技有限公司 | Wafer thickness detecting device and method thereof |
CN110217741B (en) * | 2019-05-07 | 2020-12-25 | 芯导精密(北京)设备有限公司 | Box opening machine |
JP7419693B2 (en) * | 2019-07-22 | 2024-01-23 | Tdk株式会社 | Wafer mapping equipment and load port equipment |
JP7443885B2 (en) | 2020-03-30 | 2024-03-06 | Tdk株式会社 | Mapping device and load port device |
CN112566435B (en) * | 2020-11-26 | 2022-04-05 | 上海佳堃自动化科技有限公司 | Constant-current direct-drive LED switching power supply |
US20220258363A1 (en) * | 2021-02-12 | 2022-08-18 | Hine Automation, Llc | Devices and Methods for Improved Detection of Anomalous Substrates in Automated Material-Handling Systems |
CN113192872B (en) * | 2021-04-29 | 2022-05-27 | 长鑫存储技术有限公司 | Wafer box, wafer transfer system and wafer transfer method |
KR102372513B1 (en) | 2021-05-10 | 2022-03-10 | 주식회사 위존 | FIMS system |
KR102372514B1 (en) | 2021-05-10 | 2022-03-10 | 주식회사 위존 | Foup fixing device for fims system |
TWI774407B (en) * | 2021-06-03 | 2022-08-11 | 鴻勁精密股份有限公司 | Gate assembly, operating apparatus, and handler |
CN116338264B (en) * | 2023-05-06 | 2024-01-19 | 苏州光宝科技股份有限公司 | Explosion-proof case of battery test |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5443348A (en) * | 1993-07-16 | 1995-08-22 | Semiconductor Systems, Inc. | Cassette input/output unit for semiconductor processing system |
US5772386A (en) * | 1995-03-28 | 1998-06-30 | Jenoptik Ag | Loading and unloading station for semiconductor processing installations |
US5944475A (en) * | 1996-10-11 | 1999-08-31 | Asyst Technologies, Inc. | Rotated, orthogonal load compatible front-opening interface |
US6030208A (en) * | 1998-06-09 | 2000-02-29 | Semitool, Inc. | Thermal processor |
US6082951A (en) * | 1998-01-23 | 2000-07-04 | Applied Materials, Inc. | Wafer cassette load station |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4815912A (en) * | 1984-12-24 | 1989-03-28 | Asyst Technologies, Inc. | Box door actuated retainer |
JPH07115773B2 (en) | 1986-01-29 | 1995-12-13 | 株式会社ニコン | Substrate transfer device |
US4762228A (en) * | 1986-02-10 | 1988-08-09 | Amaray International Corporation | Video tape reel box with self opening top |
US4895357A (en) * | 1989-01-31 | 1990-01-23 | Eastman Kodak Company | Lighttight film-delivery box and actuator apparatus therefor |
US5382806A (en) | 1991-05-07 | 1995-01-17 | Kensington Laboratories, Inc. | Specimen carrier platform and scanning assembly |
JPH0732286A (en) * | 1993-07-20 | 1995-02-03 | Tokico Ltd | Industrial robot |
JPH07153818A (en) | 1993-11-30 | 1995-06-16 | Daihen Corp | Semiconductor wafer recognition equipment |
US5810537A (en) * | 1995-10-18 | 1998-09-22 | Bye/Oasis Engineering Inc. | Isolation chamber transfer apparatus |
JPH09186217A (en) * | 1996-01-05 | 1997-07-15 | Canon Inc | Wafer loading/unloading device |
US5870488A (en) | 1996-05-07 | 1999-02-09 | Fortrend Engineering Corporation | Method and apparatus for prealigning wafers in a wafer sorting system |
US5951770A (en) * | 1997-06-04 | 1999-09-14 | Applied Materials, Inc. | Carousel wafer transfer system |
US6321680B2 (en) * | 1997-08-11 | 2001-11-27 | Torrex Equipment Corporation | Vertical plasma enhanced process apparatus and method |
JPH1187460A (en) * | 1997-09-09 | 1999-03-30 | Dainippon Screen Mfg Co Ltd | Apparatus for feeding substrate-housing vessel |
US6013920A (en) * | 1997-11-28 | 2000-01-11 | Fortrend Engineering Coirporation | Wafer-mapping load post interface having an effector position sensing device |
JPH11354602A (en) * | 1998-06-03 | 1999-12-24 | Mecs Corp | Cover latch device for pod opener |
JPH11354622A (en) * | 1998-06-12 | 1999-12-24 | Matsushita Electric Ind Co Ltd | Cassette box door opening/closing device and method therefor |
JP2000016583A (en) * | 1998-07-03 | 2000-01-18 | Shinko Electric Co Ltd | Semiconductor wafer carrier container installation device |
US6501070B1 (en) * | 1998-07-13 | 2002-12-31 | Newport Corporation | Pod load interface equipment adapted for implementation in a fims system |
US6281516B1 (en) * | 1998-07-13 | 2001-08-28 | Newport Corporation | FIMS transport box load interface |
US6502869B1 (en) | 1998-07-14 | 2003-01-07 | Asyst Technologies, Inc. | Pod door to port door retention system |
US6188323B1 (en) | 1998-10-15 | 2001-02-13 | Asyst Technologies, Inc. | Wafer mapping system |
JP4310556B2 (en) * | 1998-10-23 | 2009-08-12 | ローツェ株式会社 | Wafer recognition device in wafer transfer device |
JP3965809B2 (en) * | 1998-12-01 | 2007-08-29 | 神鋼電機株式会社 | Wafer carrier lid attaching / detaching moving device and moving body horizontal moving device |
KR100741186B1 (en) * | 2000-08-23 | 2007-07-19 | 동경 엘렉트론 주식회사 | A processing system for an object to be processed |
-
2000
- 2000-07-10 US US09/612,757 patent/US6501070B1/en not_active Expired - Lifetime
-
2001
- 2001-07-10 KR KR1020037000304A patent/KR101163216B1/en active IP Right Grant
- 2001-07-10 DE DE60131895T patent/DE60131895T2/en not_active Expired - Lifetime
- 2001-07-10 JP JP2002509093A patent/JP2004509454A/en active Pending
- 2001-07-10 AU AU2001280508A patent/AU2001280508A1/en not_active Abandoned
- 2001-07-10 EP EP01958901A patent/EP1356500B1/en not_active Expired - Lifetime
- 2001-07-10 WO PCT/US2001/021804 patent/WO2002005328A2/en active Search and Examination
- 2001-07-10 AT AT01958901T patent/ATE381115T1/en not_active IP Right Cessation
- 2001-07-10 CN CNB018147496A patent/CN1249775C/en not_active Expired - Lifetime
-
2002
- 2002-12-24 US US10/328,749 patent/US6784418B2/en not_active Expired - Lifetime
- 2002-12-24 US US10/328,853 patent/US6815661B2/en not_active Expired - Lifetime
- 2002-12-30 US US10/335,134 patent/US6765222B2/en not_active Expired - Lifetime
-
2004
- 2004-04-30 HK HK04103060A patent/HK1060215A1/en not_active IP Right Cessation
- 2004-07-20 US US10/895,484 patent/US7102124B2/en not_active Expired - Lifetime
-
2011
- 2011-08-01 JP JP2011168795A patent/JP6109469B2/en not_active Expired - Lifetime
-
2014
- 2014-02-10 JP JP2014023758A patent/JP6170843B2/en not_active Expired - Lifetime
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5443348A (en) * | 1993-07-16 | 1995-08-22 | Semiconductor Systems, Inc. | Cassette input/output unit for semiconductor processing system |
US5772386A (en) * | 1995-03-28 | 1998-06-30 | Jenoptik Ag | Loading and unloading station for semiconductor processing installations |
US5944475A (en) * | 1996-10-11 | 1999-08-31 | Asyst Technologies, Inc. | Rotated, orthogonal load compatible front-opening interface |
US6082951A (en) * | 1998-01-23 | 2000-07-04 | Applied Materials, Inc. | Wafer cassette load station |
US6030208A (en) * | 1998-06-09 | 2000-02-29 | Semitool, Inc. | Thermal processor |
Also Published As
Publication number | Publication date |
---|---|
EP1356500A2 (en) | 2003-10-29 |
DE60131895T2 (en) | 2008-11-27 |
US7102124B2 (en) | 2006-09-05 |
CN1249775C (en) | 2006-04-05 |
US6765222B2 (en) | 2004-07-20 |
JP2014123759A (en) | 2014-07-03 |
JP2012009876A (en) | 2012-01-12 |
KR101163216B1 (en) | 2012-07-06 |
HK1060215A1 (en) | 2004-07-30 |
US20040256547A1 (en) | 2004-12-23 |
ATE381115T1 (en) | 2007-12-15 |
US6815661B2 (en) | 2004-11-09 |
JP6109469B2 (en) | 2017-04-05 |
WO2002005328A2 (en) | 2002-01-17 |
JP6170843B2 (en) | 2017-07-26 |
US20030173511A1 (en) | 2003-09-18 |
JP2004509454A (en) | 2004-03-25 |
KR20030031115A (en) | 2003-04-18 |
DE60131895D1 (en) | 2008-01-24 |
US20030173512A1 (en) | 2003-09-18 |
AU2001280508A1 (en) | 2002-01-21 |
CN1465091A (en) | 2003-12-31 |
US20030173510A1 (en) | 2003-09-18 |
US6501070B1 (en) | 2002-12-31 |
EP1356500B1 (en) | 2007-12-12 |
US6784418B2 (en) | 2004-08-31 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2002005328A3 (en) | Pod load interface equipment adapted for implementation in a fims system | |
US9457480B2 (en) | Transport device | |
TW548762B (en) | SMIF load port interface including smart port door | |
US9457479B2 (en) | Transport device | |
JP2674968B2 (en) | Device that connects the transfer device to the semiconductor processing device | |
EP0565001A1 (en) | Closed container to be used in a clean room | |
JPH08279546A (en) | Station for loading and unloading for semiconductor processing device | |
WO2006015254A3 (en) | Quick swap load port | |
TW200618161A (en) | Substrate transport device, substrate transport method and exposure device | |
CA2369598A1 (en) | Method for holding a part in position in an assembly station | |
JP2003515941A (en) | Wafer transfer device | |
KR100915739B1 (en) | Substrate container opener and opener-side door driver mechanism thereof | |
CN213701068U (en) | Full-automatic plasma cleaning equipment | |
US7670095B2 (en) | Wafer processing apparatus having dust proof function | |
ATE27240T1 (en) | GRIPPER OF A HANDLING DEVICE, IN PARTICULAR AN INDUSTRIAL ROBOT. | |
KR102172473B1 (en) | Jig assembly for mounting power supply cable to overhead hoist transport | |
CA2683543C (en) | Camera module insertion machine with gripper | |
TW200613205A (en) | Device for exchanging and transporting coating-line components | |
US5669508A (en) | Pod carrier function expansion by adding a fixture | |
JPH08181188A (en) | Feed mechanism for semiconductor manufacture device | |
HK1007215A1 (en) | Transport robot for a machining or processing line for lead frames | |
WO2021046264A3 (en) | Tray exchange and dispositioning systems, methods, and apparatuses | |
KR101687734B1 (en) | Chamber apparatus and treatment system | |
WO2022181405A1 (en) | Industrial robot | |
KR970067763A (en) | Reduced Footprint Semiconductor Processing System |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A2 Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ PL PT RO RU SD SE SG SI SK SL TJ TM TR TT TZ UA UG US UZ VN YU ZA ZW |
|
AL | Designated countries for regional patents |
Kind code of ref document: A2 Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR BF BJ CF CG CI CM GA GN GW ML MR NE SN TD TG |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
DFPE | Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101) | ||
REG | Reference to national code |
Ref country code: DE Ref legal event code: 8642 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 1020037000304 Country of ref document: KR |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2001958901 Country of ref document: EP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 018147496 Country of ref document: CN |
|
WWP | Wipo information: published in national office |
Ref document number: 1020037000304 Country of ref document: KR |
|
WWP | Wipo information: published in national office |
Ref document number: 2001958901 Country of ref document: EP |
|
WWG | Wipo information: grant in national office |
Ref document number: 2001958901 Country of ref document: EP |
|
DPE2 | Request for preliminary examination filed before expiration of 19th month from priority date (pct application filed from 20040101) |