WO2002013232A3 - Measurement of critical dimensions using x-rays - Google Patents

Measurement of critical dimensions using x-rays Download PDF

Info

Publication number
WO2002013232A3
WO2002013232A3 PCT/IL2001/000734 IL0100734W WO0213232A3 WO 2002013232 A3 WO2002013232 A3 WO 2002013232A3 IL 0100734 W IL0100734 W IL 0100734W WO 0213232 A3 WO0213232 A3 WO 0213232A3
Authority
WO
WIPO (PCT)
Prior art keywords
rays
measurement
critical dimensions
features
analyzed
Prior art date
Application number
PCT/IL2001/000734
Other languages
French (fr)
Other versions
WO2002013232A2 (en
Inventor
Isaac Mazor
Boris Yokhin
Amos Gvirtzman
Original Assignee
Jordan Valley Applied Radiation Ltd
Isaac Mazor
Boris Yokhin
Amos Gvirtzman
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jordan Valley Applied Radiation Ltd, Isaac Mazor, Boris Yokhin, Amos Gvirtzman filed Critical Jordan Valley Applied Radiation Ltd
Priority to AU2001280061A priority Critical patent/AU2001280061A1/en
Priority to TW090121196A priority patent/TW500921B/en
Publication of WO2002013232A2 publication Critical patent/WO2002013232A2/en
Publication of WO2002013232A3 publication Critical patent/WO2002013232A3/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B15/00—Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/20—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by using diffraction of the radiation by the materials, e.g. for investigating crystal structure; by using scattering of the radiation by the materials, e.g. for investigating non-crystalline materials; by using reflection of the radiation by the materials
    • G01N23/201—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by using diffraction of the radiation by the materials, e.g. for investigating crystal structure; by using scattering of the radiation by the materials, e.g. for investigating non-crystalline materials; by using reflection of the radiation by the materials by measuring small-angle scattering

Abstract

A method for measurement of critical dimensions includes irradiating a surface of a substrate (20) with a beam (36) of X-rays. A pattern of the X-rays scattered from the surface due to features formed on the surface is detected and analyzed to measure a dimension of the features in a direction parallel to the surface.
PCT/IL2001/000734 2000-08-09 2001-08-08 Measurement of critical dimensions using x-rays WO2002013232A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
AU2001280061A AU2001280061A1 (en) 2000-08-09 2001-08-08 Measurement of critical dimensions using x-rays
TW090121196A TW500921B (en) 2000-08-09 2001-08-28 Measurement of critical dimensions using X-rays

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/635,212 US6556652B1 (en) 2000-08-09 2000-08-09 Measurement of critical dimensions using X-rays
US09/635,212 2000-08-09

Publications (2)

Publication Number Publication Date
WO2002013232A2 WO2002013232A2 (en) 2002-02-14
WO2002013232A3 true WO2002013232A3 (en) 2003-12-11

Family

ID=24546909

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IL2001/000734 WO2002013232A2 (en) 2000-08-09 2001-08-08 Measurement of critical dimensions using x-rays

Country Status (4)

Country Link
US (1) US6556652B1 (en)
AU (1) AU2001280061A1 (en)
TW (1) TW500921B (en)
WO (1) WO2002013232A2 (en)

Families Citing this family (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6773939B1 (en) * 2001-07-02 2004-08-10 Advanced Micro Devices, Inc. Method and apparatus for determining critical dimension variation in a line structure
TWI291729B (en) * 2001-11-22 2007-12-21 Semiconductor Energy Lab A semiconductor fabricating apparatus
US7133737B2 (en) * 2001-11-30 2006-11-07 Semiconductor Energy Laboratory Co., Ltd. Program for controlling laser apparatus and recording medium for recording program for controlling laser apparatus and capable of being read out by computer
US7214573B2 (en) * 2001-12-11 2007-05-08 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing a semiconductor device that includes patterning sub-islands
US6742168B1 (en) * 2002-03-19 2004-05-25 Advanced Micro Devices, Inc. Method and structure for calibrating scatterometry-based metrology tool used to measure dimensions of features on a semiconductor device
US6967349B2 (en) * 2002-09-20 2005-11-22 Texas Instruments Incorporated Method for fabricating a multi-level integrated circuit having scatterometry test structures stacked over same footprint area
US6927080B1 (en) * 2002-10-28 2005-08-09 Advanced Micro Devices, Inc. Structures for analyzing electromigration, and methods of using same
US7072442B1 (en) * 2002-11-20 2006-07-04 Kla-Tencor Technologies Corporation X-ray metrology using a transmissive x-ray optical element
AU2003292643A1 (en) * 2002-12-27 2004-07-29 Technos Institute Co., Ltd. Equipment for measuring distribution of void or particle size
US7271921B2 (en) * 2003-07-23 2007-09-18 Kla-Tencor Technologies Corporation Method and apparatus for determining surface layer thickness using continuous multi-wavelength surface scanning
DE102004006258B4 (en) * 2004-02-09 2007-08-02 Infineon Technologies Ag Method for matching two measuring methods for the measurement of structure widths on a substrate
US7068753B2 (en) * 2004-07-30 2006-06-27 Jordan Valley Applied Radiation Ltd. Enhancement of X-ray reflectometry by measurement of diffuse reflections
US7120228B2 (en) * 2004-09-21 2006-10-10 Jordan Valley Applied Radiation Ltd. Combined X-ray reflectometer and diffractometer
US7474732B2 (en) 2004-12-01 2009-01-06 Jordan Valley Applied Radiation Ltd. Calibration of X-ray reflectometry system
US7076024B2 (en) * 2004-12-01 2006-07-11 Jordan Valley Applied Radiation, Ltd. X-ray apparatus with dual monochromators
US7600916B2 (en) * 2004-12-01 2009-10-13 Jordan Valley Semiconductors Ltd. Target alignment for X-ray scattering measurements
US7804934B2 (en) 2004-12-22 2010-09-28 Jordan Valley Semiconductors Ltd. Accurate measurement of layer dimensions using XRF
US7110491B2 (en) * 2004-12-22 2006-09-19 Jordan Valley Applied Radiation Ltd. Measurement of critical dimensions using X-ray diffraction in reflection mode
KR101374308B1 (en) * 2005-12-23 2014-03-14 조르단 밸리 세미컨덕터즈 리미티드 Accurate measurement of layer dimensions using xrf
US7481579B2 (en) * 2006-03-27 2009-01-27 Jordan Valley Applied Radiation Ltd. Overlay metrology using X-rays
US20070274447A1 (en) * 2006-05-15 2007-11-29 Isaac Mazor Automated selection of X-ray reflectometry measurement locations
US7406153B2 (en) * 2006-08-15 2008-07-29 Jordan Valley Semiconductors Ltd. Control of X-ray beam spot size
IL180482A0 (en) * 2007-01-01 2007-06-03 Jordan Valley Semiconductors Inspection of small features using x - ray fluorescence
US7920676B2 (en) * 2007-05-04 2011-04-05 Xradia, Inc. CD-GISAXS system and method
US7777184B2 (en) * 2007-08-30 2010-08-17 Taiwan Semiconductor Manufacturing Company, Ltd. Method for photoresist characterization and analysis
US7680243B2 (en) * 2007-09-06 2010-03-16 Jordan Valley Semiconductors Ltd. X-ray measurement of properties of nano-particles
US20090239314A1 (en) * 2008-03-20 2009-09-24 Martin Haberjahn Methods of Manufacturing a Semiconductor Device
JP5700685B2 (en) 2009-04-14 2015-04-15 株式会社リガク Surface fine structure measurement method, surface fine structure measurement data analysis method, and X-ray scattering measurement apparatus
JP5586899B2 (en) * 2009-08-26 2014-09-10 キヤノン株式会社 X-ray phase grating and manufacturing method thereof
US8243878B2 (en) * 2010-01-07 2012-08-14 Jordan Valley Semiconductors Ltd. High-resolution X-ray diffraction measurement with enhanced sensitivity
US8687766B2 (en) 2010-07-13 2014-04-01 Jordan Valley Semiconductors Ltd. Enhancing accuracy of fast high-resolution X-ray diffractometry
US8437450B2 (en) 2010-12-02 2013-05-07 Jordan Valley Semiconductors Ltd. Fast measurement of X-ray diffraction from tilted layers
US8565379B2 (en) 2011-03-14 2013-10-22 Jordan Valley Semiconductors Ltd. Combining X-ray and VUV analysis of thin film layers
US8781070B2 (en) 2011-08-11 2014-07-15 Jordan Valley Semiconductors Ltd. Detection of wafer-edge defects
US9390984B2 (en) 2011-10-11 2016-07-12 Bruker Jv Israel Ltd. X-ray inspection of bumps on a semiconductor substrate
US9068927B2 (en) * 2012-12-21 2015-06-30 General Electric Company Laboratory diffraction-based phase contrast imaging technique
US9389192B2 (en) 2013-03-24 2016-07-12 Bruker Jv Israel Ltd. Estimation of XRF intensity from an array of micro-bumps
US9588066B2 (en) 2014-01-23 2017-03-07 Revera, Incorporated Methods and systems for measuring periodic structures using multi-angle X-ray reflectance scatterometry (XRS)
US9632043B2 (en) 2014-05-13 2017-04-25 Bruker Jv Israel Ltd. Method for accurately determining the thickness and/or elemental composition of small features on thin-substrates using micro-XRF
US9726624B2 (en) 2014-06-18 2017-08-08 Bruker Jv Israel Ltd. Using multiple sources/detectors for high-throughput X-ray topography measurement
US9606073B2 (en) 2014-06-22 2017-03-28 Bruker Jv Israel Ltd. X-ray scatterometry apparatus
US9829448B2 (en) 2014-10-30 2017-11-28 Bruker Jv Israel Ltd. Measurement of small features using XRF
US10060865B2 (en) 2015-03-10 2018-08-28 Lyncean Technologies, Inc. Measurement of critical dimensions of nanostructures using X-ray grazing incidence in-plane diffraction
JP6602388B6 (en) * 2015-03-25 2020-01-15 エーエスエムエル ネザーランズ ビー．ブイ． Metrology method, metrology apparatus, and device manufacturing apparatus
JP6999268B2 (en) 2016-01-11 2022-01-18 ブルカー テクノロジーズ リミテッド Methods and equipment for X-ray scatterometry
US10816487B2 (en) 2018-04-12 2020-10-27 Bruker Technologies Ltd. Image contrast in X-ray topography imaging for defect inspection
JP2019191167A (en) 2018-04-23 2019-10-31 ブルカー ジェイヴィ イスラエル リミテッドＢｒｕｋｅｒ Ｊｖ Ｉｓｒａｅｌ Ｌｔｄ． X ray source optical system for small-angle x-ray scatterometry
WO2020008420A2 (en) 2018-07-05 2020-01-09 Bruker Jv Israel Ltd. Small-angle x-ray scatterometry
KR102418198B1 (en) * 2019-05-15 2022-07-07 전상구 Systems and methods for measuring patterns on a substrate
US11781999B2 (en) 2021-09-05 2023-10-10 Bruker Technologies Ltd. Spot-size control in reflection-based and scatterometry-based X-ray metrology systems

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4989226A (en) * 1987-08-21 1991-01-29 Brigham Young University Layered devices having surface curvature
US5619548A (en) * 1995-08-11 1997-04-08 Oryx Instruments And Materials Corp. X-ray thickness gauge

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5740226A (en) 1995-11-30 1998-04-14 Fujitsu Limited Film thickness measuring and film forming method
US6041098A (en) * 1997-02-03 2000-03-21 Touryanski; Alexander G. X-ray reflectometer
DE19833524B4 (en) * 1998-07-25 2004-09-23 Bruker Axs Gmbh X-ray analyzer with gradient multilayer mirror

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4989226A (en) * 1987-08-21 1991-01-29 Brigham Young University Layered devices having surface curvature
US5619548A (en) * 1995-08-11 1997-04-08 Oryx Instruments And Materials Corp. X-ray thickness gauge

Also Published As

Publication number Publication date
AU2001280061A1 (en) 2002-02-18
TW500921B (en) 2002-09-01
US6556652B1 (en) 2003-04-29
WO2002013232A2 (en) 2002-02-14

Similar Documents

Publication Publication Date Title
WO2002013232A3 (en) Measurement of critical dimensions using x-rays
WO2004057266A8 (en) Interferometer system and measuring device
EP0965835A3 (en) Sensor and measuring apparatus using the same
EP0945721A3 (en) Biosensitive element for surface plasmon resonance measurements, and its method of manufacture
TW341719B (en) Surface position detecting method and scanning exposure method using the same
FR2817042B1 (en) METHOD AND DEVICE FOR ANALYZING THE SURFACE OF A SUBSTRATE
WO2000037928A3 (en) Unilateral hand-held x-ray inspection apparatus
CA2341021A1 (en) Method for determining warp potential in wood
AU8041498A (en) Method and apparatus for measuring structures in a fingerprint
WO2005092025A3 (en) Methods and systems for measuring a characteristic of a substrate or preparing a substrate for analysis
TW200633104A (en) Measurement of critical dimensions using X-ray diffraction in reflection mode
EP0929094A3 (en) Method and device for measuring the depth of a buried interface
EP0899557A3 (en) Element and apparatus for attenuated total reflection measurement, and method for measuring specific component using the same
CA2416139A1 (en) Method and device for impingement detection
EP0947802A3 (en) Measurement arrangement for test pieces dimensions detection,preferably hollow bodies,in particular for bores in workpieces,as well as measurement method for such dimensions
WO2003021186A1 (en) Method for measuring dimensions of sample and scanning electron microscope
GB2396408A (en) Utilization of an infrared probe to discriminate between materials
WO2003076871A3 (en) Device and method for measuring geometries of essentially two-dimensional objects
WO2002097878A3 (en) Method and apparatus for determining process layer conformality
EP0947828A3 (en) Method and apparatus for improved inspection measurements
WO2002044412A8 (en) Method and apparatus using a surface-selective nonlinear optical technique for detection of probe-target interactions
WO2003012828A3 (en) Systems and methods for measuring properties of conductive layers
FR2818370B1 (en) METHOD AND DEVICE FOR MEASURING THE PLANEITY OF A SURFACE
FR2829824B1 (en) CAVITY SEALING DEVICE, IN PARTICULAR FOR INCIDENCE MEASURING PROBE USED IN AERONAUTICS
EP0911651A3 (en) Edge registration system

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ PL PT RO RU SD SE SG SI SK SL TJ TM TR TT TZ UA UG UZ VN YU ZA ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
REG Reference to national code

Ref country code: DE

Ref legal event code: 8642

122 Ep: pct application non-entry in european phase
NENP Non-entry into the national phase

Ref country code: JP