WO2002021607A3 - Thermoelectric module with integrated heat exchanger and method of use - Google Patents

Thermoelectric module with integrated heat exchanger and method of use Download PDF

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Publication number
WO2002021607A3
WO2002021607A3 PCT/US2001/028244 US0128244W WO0221607A3 WO 2002021607 A3 WO2002021607 A3 WO 2002021607A3 US 0128244 W US0128244 W US 0128244W WO 0221607 A3 WO0221607 A3 WO 0221607A3
Authority
WO
WIPO (PCT)
Prior art keywords
cooled
heated
conductive
thermoelectric module
conduit
Prior art date
Application number
PCT/US2001/028244
Other languages
French (fr)
Other versions
WO2002021607A2 (en
Inventor
Akira Yamamura
Robert W Otey
Original Assignee
Ferrotec Usa Corp
Akira Yamamura
Robert W Otey
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ferrotec Usa Corp, Akira Yamamura, Robert W Otey filed Critical Ferrotec Usa Corp
Priority to EP01972972A priority Critical patent/EP1336204B1/en
Priority to JP2002525922A priority patent/JP4781606B2/en
Priority to AU2001292599A priority patent/AU2001292599A1/en
Priority to DE60134882T priority patent/DE60134882D1/en
Publication of WO2002021607A2 publication Critical patent/WO2002021607A2/en
Publication of WO2002021607A3 publication Critical patent/WO2002021607A3/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction

Abstract

The electrical junctions of either or both sides of a thermoelectric module are placed in direct thermal contact with a heat source or sink or a material to be thermally modified (that is, heated or cooled), thereby eliminating the conventional substrate typically found in such modules and its associated thermal resistance. In one embodiment, the conductive junction passes through a conduit carrying a material to be heated or cooled. In the conduit, the conductive material can be configured into an effective heat transfer shape such as a vane which extends through non-conducting conduit walls. In another embodiment, the geometry of the conductor forming the electrical junction forms a pipe or tube through which material to be heated or cooled is passed. A protection layer of high thermal conductivity can be applied to the conductive surfaces in order to prevent corrosion or short-circuiting of the device in applications where an electrolytic or ionic fluid is passed by the junction.
PCT/US2001/028244 2000-09-08 2001-09-07 Thermoelectric module with integrated heat exchanger and method of use WO2002021607A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP01972972A EP1336204B1 (en) 2000-09-08 2001-09-07 Thermoelectric module with integrated heat exchanger and method of use
JP2002525922A JP4781606B2 (en) 2000-09-08 2001-09-07 Thermoelectric module, method of thermally changing material in thermoelectric module, and method of manufacturing thermoelectric module
AU2001292599A AU2001292599A1 (en) 2000-09-08 2001-09-07 Thermoelectric module with integrated heat exchanger and method of use
DE60134882T DE60134882D1 (en) 2000-09-08 2001-09-07 THERMOELECTRIC MODULE WITH INTEGRATED HEAT EXCHANGER AND METHOD OF USE

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/657,426 2000-09-08
US09/657,426 US6385976B1 (en) 2000-09-08 2000-09-08 Thermoelectric module with integrated heat exchanger and method of use

Publications (2)

Publication Number Publication Date
WO2002021607A2 WO2002021607A2 (en) 2002-03-14
WO2002021607A3 true WO2002021607A3 (en) 2003-04-24

Family

ID=24637139

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/028244 WO2002021607A2 (en) 2000-09-08 2001-09-07 Thermoelectric module with integrated heat exchanger and method of use

Country Status (7)

Country Link
US (1) US6385976B1 (en)
EP (2) EP1775779A3 (en)
JP (2) JP2002084007A (en)
CN (2) CN101114691A (en)
AU (1) AU2001292599A1 (en)
DE (1) DE60134882D1 (en)
WO (1) WO2002021607A2 (en)

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EP0924481A1 (en) * 1997-07-02 1999-06-23 Sel.Application Co., Ltd. Thermoelectric element and thermoelectric cooling or heating device provided with the same

Also Published As

Publication number Publication date
WO2002021607A2 (en) 2002-03-14
JP4781606B2 (en) 2011-09-28
JP2002084007A (en) 2002-03-22
EP1336204A2 (en) 2003-08-20
CN1454396A (en) 2003-11-05
JP2004508730A (en) 2004-03-18
EP1775779A2 (en) 2007-04-18
US6385976B1 (en) 2002-05-14
EP1775779A3 (en) 2007-12-12
EP1336204B1 (en) 2008-07-16
CN101114691A (en) 2008-01-30
AU2001292599A1 (en) 2002-03-22
CN100346489C (en) 2007-10-31
DE60134882D1 (en) 2008-08-28

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