WO2002022321A3 - Multiple blade robot adjustment apparatus and associated method - Google Patents

Multiple blade robot adjustment apparatus and associated method Download PDF

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Publication number
WO2002022321A3
WO2002022321A3 PCT/US2001/029004 US0129004W WO0222321A3 WO 2002022321 A3 WO2002022321 A3 WO 2002022321A3 US 0129004 W US0129004 W US 0129004W WO 0222321 A3 WO0222321 A3 WO 0222321A3
Authority
WO
WIPO (PCT)
Prior art keywords
multiple blade
associated method
adjustment apparatus
blade robot
robot
Prior art date
Application number
PCT/US2001/029004
Other languages
French (fr)
Other versions
WO2002022321A2 (en
Inventor
Donald J K Olgado
Avi Tepman
Timothy J Franklin
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of WO2002022321A2 publication Critical patent/WO2002022321A2/en
Publication of WO2002022321A3 publication Critical patent/WO2002022321A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/16—Programme controls
    • B25J9/1628—Programme controls characterised by the control loop
    • B25J9/1638—Programme controls characterised by the control loop compensation for arm bending/inertia, pay load weight/inertia
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/40—Robotics, robotics mapping to robotics vision
    • G05B2219/40351—Cooperation of hand arm, break down into two subsystems
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/41—Servomotor, servo controller till figures
    • G05B2219/41457—Superposition of movement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
    • H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T74/00—Machine element or mechanism
    • Y10T74/20—Control lever and linkage systems
    • Y10T74/20207—Multiple controlling elements for single controlled element
    • Y10T74/20305—Robotic arm
    • Y10T74/20311—Robotic arm including power cable or connector

Abstract

The present invention provides an apparatus and associated method in which the apparatus comprises a multiple blade robot and a compensating device. The multiple blade robot includes at least one set of robot blades. The compensating device adjusts for differences in spacing between the set of robot blades and spacing between two or more cells. In different embodiments, the compensating device may be coupled to one or more of the process cells, one or more of the substrate holder systems, or one or more of the robot blades.
PCT/US2001/029004 2000-09-18 2001-09-17 Multiple blade robot adjustment apparatus and associated method WO2002022321A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/664,607 US6571657B1 (en) 1999-04-08 2000-09-18 Multiple blade robot adjustment apparatus and associated method
US09/664,607 2000-09-18

Publications (2)

Publication Number Publication Date
WO2002022321A2 WO2002022321A2 (en) 2002-03-21
WO2002022321A3 true WO2002022321A3 (en) 2002-12-27

Family

ID=24666681

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/029004 WO2002022321A2 (en) 2000-09-18 2001-09-17 Multiple blade robot adjustment apparatus and associated method

Country Status (2)

Country Link
US (1) US6571657B1 (en)
WO (1) WO2002022321A2 (en)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1470268A2 (en) * 2000-10-03 2004-10-27 Applied Materials, Inc. Method and associated apparatus for tilting a substrate upon entry for metal deposition
US6823278B1 (en) * 2001-01-26 2004-11-23 Ta Instruments-Waters, Llc Method and apparatus for positional calibration of a thermal analysis instrument
JP4183124B2 (en) * 2002-08-21 2008-11-19 タカタ株式会社 Seat load measuring device
US20050092602A1 (en) * 2003-10-29 2005-05-05 Harald Herchen Electrochemical plating cell having a membrane stack
US20050092601A1 (en) * 2003-10-29 2005-05-05 Harald Herchen Electrochemical plating cell having a diffusion member
US20050115492A1 (en) * 2003-11-28 2005-06-02 Chia-Cheng Liu Method and apparatus of the chemical metal organic vapor epitaxy for the multi-chamber epitaxy layer deposition
JP4192118B2 (en) * 2004-05-31 2008-12-03 株式会社日立ハイテクノロジーズ Defect inspection apparatus and defect inspection system
US7345736B2 (en) 2004-06-21 2008-03-18 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US20060102467A1 (en) * 2004-11-15 2006-05-18 Harald Herchen Current collimation for thin seed and direct plating
US20060175201A1 (en) * 2005-02-07 2006-08-10 Hooman Hafezi Immersion process for electroplating applications
WO2007061603A2 (en) * 2005-11-21 2007-05-31 Applied Materials, Inc. Methods and apparatus for transferring substrates during electronic device manufacturing
WO2014197537A1 (en) * 2013-06-05 2014-12-11 Persimmon Technologies, Corp. Robot and adaptive placement system and method
JP6754771B2 (en) * 2014-11-18 2020-09-16 パーシモン テクノロジーズ コーポレイションＰｅｒｓｉｍｍｏｎ Ｔｅｃｈｎｏｌｏｇｉｅｓ， Ｃｏｒｐ． Robot adaptive placement system that performs end effector position estimation
US9520312B2 (en) * 2014-12-19 2016-12-13 Varian Semiconductor Equipment Associates, Inc. System and method for moving workpieces between multiple vacuum environments
US10580681B2 (en) * 2016-07-10 2020-03-03 Yaskawa America Inc. Robotic apparatus and method for transport of a workpiece
CN109037101A (en) * 2018-07-13 2018-12-18 清华大学 Wafer processing
CN111283657B (en) * 2018-12-06 2021-12-24 台达电子工业股份有限公司 Robot mechanism
US11110606B2 (en) * 2019-01-02 2021-09-07 The Boeing Company Coordinating work within a multi-robot cell

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3627560A1 (en) * 1986-08-14 1988-02-18 Audi Ag Program-controlled and sensor-guided production and/or assembly system, in particular industrial robot
US5100502A (en) * 1990-03-19 1992-03-31 Applied Materials, Inc. Semiconductor wafer transfer in processing systems
US5382885A (en) * 1993-08-09 1995-01-17 The University Of British Columbia Motion scaling tele-operating system with force feedback suitable for microsurgery
US5811951A (en) * 1996-10-14 1998-09-22 Regents Of The University Of California High precision redundant robotic manipulator
WO1999016111A1 (en) * 1997-09-22 1999-04-01 Applied Materials, Inc. Substrate clamping apparatus
US5975834A (en) * 1997-07-16 1999-11-02 Daihen Corporation Two-armed transfer robot

Family Cites Families (78)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL170871B (en) 1952-07-05 Nippon Electric Co PROCEDURE FOR THE REMOVAL OF HEAVY AND / OR TOXIC METALS FROM WASTE GAS.
DE932709C (en) 1952-08-31 1955-09-08 W Kampschulte & Cie Dr Process for the deposition of smooth and shiny copper coatings
US2882209A (en) 1957-05-20 1959-04-14 Udylite Res Corp Electrodeposition of copper from an acid bath
SU443108A1 (en) 1968-11-22 1974-09-15 Центральный Научно-Исследовательский Институт Технологии Машиностроения Copper electrolyte
US3649509A (en) 1969-07-08 1972-03-14 Buckbee Mears Co Electrodeposition systems
US3727620A (en) 1970-03-18 1973-04-17 Fluoroware Of California Inc Rinsing and drying device
US3770598A (en) 1972-01-21 1973-11-06 Oxy Metal Finishing Corp Electrodeposition of copper from acid baths
US4027686A (en) 1973-01-02 1977-06-07 Texas Instruments Incorporated Method and apparatus for cleaning the surface of a semiconductor slice with a liquid spray of de-ionized water
BE833384A (en) 1975-03-11 1976-03-12 COPPER ELECTRODEPOSITION
JPS5271871A (en) 1975-12-11 1977-06-15 Nec Corp Washing apparatus
JPS5819350B2 (en) 1976-04-08 1983-04-18 富士写真フイルム株式会社 Spin coating method
US4326940A (en) 1979-05-21 1982-04-27 Rohco Incorporated Automatic analyzer and control system for electroplating baths
US4315059A (en) 1980-07-18 1982-02-09 The United States Of America As Represented By The United States Department Of Energy Molten salt lithium cells
US4405416A (en) 1980-07-18 1983-09-20 Raistrick Ian D Molten salt lithium cells
US4336114A (en) 1981-03-26 1982-06-22 Hooker Chemicals & Plastics Corp. Electrodeposition of bright copper
US4376685A (en) 1981-06-24 1983-03-15 M&T Chemicals Inc. Acid copper electroplating baths containing brightening and leveling additives
EP0076569B1 (en) 1981-10-01 1986-08-27 EMI Limited Electroplating arrangements
JPS58182823A (en) 1982-04-21 1983-10-25 Nec Corp Plating apparatus for semiconductor wafer
US4489740A (en) 1982-12-27 1984-12-25 General Signal Corporation Disc cleaning machine
US4428815A (en) 1983-04-28 1984-01-31 Western Electric Co., Inc. Vacuum-type article holder and methods of supportively retaining articles
US4789445A (en) 1983-05-16 1988-12-06 Asarco Incorporated Method for the electrodeposition of metals
US4510176A (en) 1983-09-26 1985-04-09 At&T Bell Laboratories Removal of coating from periphery of a semiconductor wafer
US4518678A (en) 1983-12-16 1985-05-21 Advanced Micro Devices, Inc. Selective removal of coating material on a coated substrate
US4559717A (en) * 1984-02-21 1985-12-24 The United States Of America As Represented By The Secretary Of Commerce Flexure hinge
US4519846A (en) 1984-03-08 1985-05-28 Seiichiro Aigo Process for washing and drying a semiconductor element
US4653975A (en) * 1985-01-22 1987-03-31 Gmf Robotics Corporation Robot with counterbalance mechanism having multiple attachment locations
US4693805A (en) 1986-02-14 1987-09-15 Boe Limited Method and apparatus for sputtering a dielectric target or for reactive sputtering
US4732785A (en) 1986-09-26 1988-03-22 Motorola, Inc. Edge bead removal process for spin on films
JPS63118093A (en) 1986-11-05 1988-05-23 Tanaka Electron Ind Co Ltd Method for tinning electronic parts
DE3704505A1 (en) * 1987-02-13 1988-08-25 Leybold Ag INSERT UNIT FOR VACUUM SYSTEMS
US4753128A (en) * 1987-03-09 1988-06-28 Gmf Robotics Corporation Robot with spring pivot balancing mechanism
US5230743A (en) 1988-05-25 1993-07-27 Semitool, Inc. Method for single wafer processing in which a semiconductor wafer is contacted with a fluid
US5235995A (en) 1989-03-27 1993-08-17 Semitool, Inc. Semiconductor processor apparatus with dynamic wafer vapor treatment and particulate volatilization
US5224504A (en) 1988-05-25 1993-07-06 Semitool, Inc. Single wafer processor
US5092975A (en) 1988-06-14 1992-03-03 Yamaha Corporation Metal plating apparatus
US5316974A (en) 1988-12-19 1994-05-31 Texas Instruments Incorporated Integrated circuit copper metallization process using a lift-off seed layer and a thick-plated conductor layer
US5039381A (en) 1989-05-25 1991-08-13 Mullarkey Edward J Method of electroplating a precious metal on a semiconductor device, integrated circuit or the like
US5162260A (en) 1989-06-01 1992-11-10 Hewlett-Packard Company Stacked solid via formation in integrated circuit systems
US5055425A (en) 1989-06-01 1991-10-08 Hewlett-Packard Company Stacked solid via formation in integrated circuit systems
US5155336A (en) 1990-01-19 1992-10-13 Applied Materials, Inc. Rapid thermal heating apparatus and method
US5222310A (en) 1990-05-18 1993-06-29 Semitool, Inc. Single wafer processor with a frame
US5220849A (en) * 1990-06-04 1993-06-22 Akr S.A., A Corp. Of Republic Of France Gravitational torque compensation system for robot arms
US5259407A (en) 1990-06-15 1993-11-09 Matrix Inc. Surface treatment method and apparatus for a semiconductor wafer
US5252807A (en) 1990-07-02 1993-10-12 George Chizinsky Heated plate rapid thermal processor
US5256274A (en) 1990-08-01 1993-10-26 Jaime Poris Selective metal electrodeposition process
US5368711A (en) 1990-08-01 1994-11-29 Poris; Jaime Selective metal electrodeposition process and apparatus
JP2524436B2 (en) 1990-09-18 1996-08-14 インターナショナル・ビジネス・マシーンズ・コーポレイション Surface treatment method
JPH04131395A (en) 1990-09-21 1992-05-06 Toshiba Corp Method and device for plating semiconductor wafer
DE69231971T2 (en) 1991-01-24 2002-04-04 Wako Pure Chem Ind Ltd Solutions for surface treatment of semiconductors
JP2697773B2 (en) 1991-03-11 1998-01-14 日本エレクトロプレイテイング・エンジニヤース 株式会社 Plating method
JPH0544075A (en) 1991-08-15 1993-02-23 Nippon Riironaale Kk Copper striking method substituted for electroless copper plating
JP3200468B2 (en) 1992-05-21 2001-08-20 日本エレクトロプレイテイング・エンジニヤース株式会社 Wafer plating equipment
JP2654314B2 (en) 1992-06-04 1997-09-17 東京応化工業株式会社 Backside cleaning device
JPH0617291A (en) 1992-07-03 1994-01-25 Nec Corp Metal plating device
US5328589A (en) 1992-12-23 1994-07-12 Enthone-Omi, Inc. Functional fluid additives for acid copper electroplating baths
US5718813A (en) 1992-12-30 1998-02-17 Advanced Energy Industries, Inc. Enhanced reactive DC sputtering system
US5608943A (en) 1993-08-23 1997-03-11 Tokyo Electron Limited Apparatus for removing process liquid
US5415890A (en) 1994-01-03 1995-05-16 Eaton Corporation Modular apparatus and method for surface treatment of parts with liquid baths
US5625170A (en) 1994-01-18 1997-04-29 Nanometrics Incorporated Precision weighing to monitor the thickness and uniformity of deposited or etched thin film
JP3377849B2 (en) 1994-02-02 2003-02-17 日本エレクトロプレイテイング・エンジニヤース株式会社 Wafer plating equipment
US5528118A (en) 1994-04-01 1996-06-18 Nikon Precision, Inc. Guideless stage with isolated reaction stage
US5651865A (en) 1994-06-17 1997-07-29 Eni Preferential sputtering of insulators from conductive targets
US5705223A (en) 1994-07-26 1998-01-06 International Business Machine Corp. Method and apparatus for coating a semiconductor wafer
US5516412A (en) 1995-05-16 1996-05-14 International Business Machines Corporation Vertical paddle plating cell
US5807469A (en) 1995-09-27 1998-09-15 Intel Corporation Flexible continuous cathode contact circuit for electrolytic plating of C4, tab microbumps, and ultra large scale interconnects
US5746565A (en) * 1996-01-22 1998-05-05 Integrated Solutions, Inc. Robotic wafer handler
US5838121A (en) 1996-11-18 1998-11-17 Applied Materials, Inc. Dual blade robot
JPH1180989A (en) 1997-09-02 1999-03-26 Oki Electric Ind Co Ltd Plating apparatus
US6024856A (en) 1997-10-10 2000-02-15 Enthone-Omi, Inc. Copper metallization of silicon wafers using insoluble anodes
US6126798A (en) 1997-11-13 2000-10-03 Novellus Systems, Inc. Electroplating anode including membrane partition system and method of preventing passivation of same
US6156167A (en) 1997-11-13 2000-12-05 Novellus Systems, Inc. Clamshell apparatus for electrochemically treating semiconductor wafers
US6159354A (en) 1997-11-13 2000-12-12 Novellus Systems, Inc. Electric potential shaping method for electroplating
US6027631A (en) 1997-11-13 2000-02-22 Novellus Systems, Inc. Electroplating system with shields for varying thickness profile of deposited layer
US6179983B1 (en) 1997-11-13 2001-01-30 Novellus Systems, Inc. Method and apparatus for treating surface including virtual anode
US6113771A (en) 1998-04-21 2000-09-05 Applied Materials, Inc. Electro deposition chemistry
AU3756299A (en) * 1998-04-23 1999-11-08 Omnific International, Ltd Specialized actuators driven by oscillatory transducers
US6071388A (en) 1998-05-29 2000-06-06 International Business Machines Corporation Electroplating workpiece fixture having liquid gap spacer
DE19962247A1 (en) * 1999-12-22 2001-09-20 Agie Sa Motion transmission device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3627560A1 (en) * 1986-08-14 1988-02-18 Audi Ag Program-controlled and sensor-guided production and/or assembly system, in particular industrial robot
US5100502A (en) * 1990-03-19 1992-03-31 Applied Materials, Inc. Semiconductor wafer transfer in processing systems
US5382885A (en) * 1993-08-09 1995-01-17 The University Of British Columbia Motion scaling tele-operating system with force feedback suitable for microsurgery
US5811951A (en) * 1996-10-14 1998-09-22 Regents Of The University Of California High precision redundant robotic manipulator
US5975834A (en) * 1997-07-16 1999-11-02 Daihen Corporation Two-armed transfer robot
WO1999016111A1 (en) * 1997-09-22 1999-04-01 Applied Materials, Inc. Substrate clamping apparatus

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US6571657B1 (en) 2003-06-03
WO2002022321A2 (en) 2002-03-21

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