WO2002043112A3 - Procede de fabrication d'un substrat - Google Patents

Procede de fabrication d'un substrat Download PDF

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Publication number
WO2002043112A3
WO2002043112A3 PCT/FR2001/003714 FR0103714W WO0243112A3 WO 2002043112 A3 WO2002043112 A3 WO 2002043112A3 FR 0103714 W FR0103714 W FR 0103714W WO 0243112 A3 WO0243112 A3 WO 0243112A3
Authority
WO
WIPO (PCT)
Prior art keywords
seed layer
layer
support
bonding interface
making
Prior art date
Application number
PCT/FR2001/003714
Other languages
English (en)
Other versions
WO2002043112A2 (fr
Inventor
Fabrice Letertre
Bruno Ghyselen
Original Assignee
Soitec Silicon On Insulator
Fabrice Letertre
Bruno Ghyselen
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to AU2002222036A priority Critical patent/AU2002222036A1/en
Priority to JP2002544758A priority patent/JP2004517472A/ja
Priority to DE60126328T priority patent/DE60126328T2/de
Priority to KR1020037007110A priority patent/KR100805469B1/ko
Priority to EP01997835A priority patent/EP1344246B1/fr
Application filed by Soitec Silicon On Insulator, Fabrice Letertre, Bruno Ghyselen filed Critical Soitec Silicon On Insulator
Publication of WO2002043112A2 publication Critical patent/WO2002043112A2/fr
Publication of WO2002043112A3 publication Critical patent/WO2002043112A3/fr
Priority to US10/446,605 priority patent/US6794276B2/en
Priority to US10/883,437 priority patent/US7265029B2/en
Priority to US10/922,997 priority patent/US7235462B2/en
Priority to US11/165,895 priority patent/US7288430B2/en
Priority to US11/831,484 priority patent/US7888235B2/en
Priority to US11/840,696 priority patent/US7615468B2/en
Priority to US11/852,562 priority patent/US7646038B2/en
Priority to US12/536,082 priority patent/US7839001B2/en
Priority to US12/914,194 priority patent/US7939428B2/en
Priority to US12/984,895 priority patent/US8507361B2/en
Priority to US13/246,316 priority patent/US8252664B2/en
Priority to US13/291,468 priority patent/US10002763B2/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/0405, H01L21/0445, H01L21/06, H01L21/16 and H01L21/18 with or without impurities, e.g. doping materials
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02—Epitaxial-layer growth
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02—Epitaxial-layer growth
    • C30B25/18—Epitaxial-layer growth characterised by the substrate
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10—Inorganic compounds or compositions
    • C30B29/40—AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
    • C30B29/403—AIII-nitrides
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10—Inorganic compounds or compositions
    • C30B29/40—AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
    • C30B29/403—AIII-nitrides
    • C30B29/406—Gallium nitride
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/0445—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising crystalline silicon carbide
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
    • H01L21/76251—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques
    • H01L21/76254—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques with separation/delamination along an ion implanted layer, e.g. Smart-cut, Unibond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic System
    • H01L29/1608—Silicon carbide

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Recrystallisation Techniques (AREA)
  • Led Devices (AREA)
  • Footwear And Its Accessory, Manufacturing Method And Apparatuses (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Luminescent Compositions (AREA)
  • Light Receiving Elements (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)

Abstract

L'invention concerne un procédé de fabrication de substrats, notamment pour l'optique, l'électronique ou l'opto-électronique. Le procédé comprend les étapes suivantes : report d'une couche germe (2) sur un support (12) par adhésion moléculaire au niveau d'une interface de collage, épitaxie d'une couche utile (16) sur la couche germe, et application de contraintes pour conduire au détachement de l'ensemble constitué de la couche germe (2) et de la couche utile (16) par rapport au support (12) au niveau de l'interface de collage.
PCT/FR2001/003714 2000-11-27 2001-11-26 Procede de fabrication d'un substrat WO2002043112A2 (fr)

Priority Applications (17)

Application Number Priority Date Filing Date Title
AU2002222036A AU2002222036A1 (en) 2000-11-27 2001-11-26 Method for making a substrate
JP2002544758A JP2004517472A (ja) 2000-11-27 2001-11-26 基板、特に光学、電子工学または電子光学用基板の製造方法、およびこの製造方法により得られる基板
DE60126328T DE60126328T2 (de) 2000-11-27 2001-11-26 Verfahren zur herstellung eines substrats insbesondere für die optik, elektronik oder optoelektronik und resultierendes substrat
KR1020037007110A KR100805469B1 (ko) 2000-11-27 2001-11-26 특히 광학, 전자 공학 또는 광전자 공학용의 기판 제조방법, 및 이 방법에 의한 기판
EP01997835A EP1344246B1 (fr) 2000-11-27 2001-11-26 Procede de fabrication d'un substrat notamment pour l'optique, l'electronique ou l'optoelectronique et substrat obtenu par ce procede
US10/446,605 US6794276B2 (en) 2000-11-27 2003-05-27 Methods for fabricating a substrate
US10/883,437 US7265029B2 (en) 2000-11-27 2004-07-01 Fabrication of substrates with a useful layer of monocrystalline semiconductor material
US10/922,997 US7235462B2 (en) 2000-11-27 2004-08-23 Methods for fabricating a substrate
US11/165,895 US7288430B2 (en) 2000-11-27 2005-06-24 Method of fabricating heteroepitaxial microstructures
US11/831,484 US7888235B2 (en) 2000-11-27 2007-07-31 Fabrication of substrates with a useful layer of monocrystalline semiconductor material
US11/840,696 US7615468B2 (en) 2000-11-27 2007-08-17 Methods for making substrates and substrates formed therefrom
US11/852,562 US7646038B2 (en) 2000-11-27 2007-09-10 Method of fabricating heteroepitaxial microstructures
US12/536,082 US7839001B2 (en) 2000-11-27 2009-08-05 Methods for making substrates and substrates formed therefrom
US12/914,194 US7939428B2 (en) 2000-11-27 2010-10-28 Methods for making substrates and substrates formed therefrom
US12/984,895 US8507361B2 (en) 2000-11-27 2011-01-05 Fabrication of substrates with a useful layer of monocrystalline semiconductor material
US13/246,316 US8252664B2 (en) 2000-11-27 2011-09-27 Fabrication of substrates with a useful layer of monocrystalline semiconductor material
US13/291,468 US10002763B2 (en) 2000-11-27 2011-11-08 Fabrication of substrates with a useful layer of monocrystalline semiconductor material

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0015279A FR2817394B1 (fr) 2000-11-27 2000-11-27 Procede de fabrication d'un substrat notamment pour l'optique, l'electronique ou l'optoelectronique et substrat obtenu par ce procede
FR00/15279 2000-11-27

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US10/446,605 Continuation US6794276B2 (en) 2000-11-27 2003-05-27 Methods for fabricating a substrate

Publications (2)

Publication Number Publication Date
WO2002043112A2 WO2002043112A2 (fr) 2002-05-30
WO2002043112A3 true WO2002043112A3 (fr) 2002-07-18

Family

ID=8856906

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/FR2001/003714 WO2002043112A2 (fr) 2000-11-27 2001-11-26 Procede de fabrication d'un substrat

Country Status (11)

Country Link
US (2) US6794276B2 (fr)
EP (2) EP1344246B1 (fr)
JP (2) JP2004517472A (fr)
KR (1) KR100805469B1 (fr)
CN (2) CN100399511C (fr)
AT (2) ATE352866T1 (fr)
AU (1) AU2002222036A1 (fr)
DE (2) DE60126328T2 (fr)
FR (1) FR2817394B1 (fr)
TW (1) TW536728B (fr)
WO (1) WO2002043112A2 (fr)

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