WO2002049109A1 - Stacked die package - Google Patents

Stacked die package Download PDF

Info

Publication number
WO2002049109A1
WO2002049109A1 PCT/US2001/044427 US0144427W WO0249109A1 WO 2002049109 A1 WO2002049109 A1 WO 2002049109A1 US 0144427 W US0144427 W US 0144427W WO 0249109 A1 WO0249109 A1 WO 0249109A1
Authority
WO
WIPO (PCT)
Prior art keywords
chips
substrate
stiffener
stacked
mounting
Prior art date
Application number
PCT/US2001/044427
Other languages
French (fr)
Other versions
WO2002049109B1 (en
Inventor
Juan G. Milla
Robert L. Hubbard
Original Assignee
Medtronic, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Medtronic, Inc. filed Critical Medtronic, Inc.
Priority to EP01270907A priority Critical patent/EP1350270B1/en
Publication of WO2002049109A1 publication Critical patent/WO2002049109A1/en
Publication of WO2002049109B1 publication Critical patent/WO2002049109B1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5387—Flexible insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0657—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06517—Bump or bump-like direct electrical connections from device to substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06579—TAB carriers; beam leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06582—Housing for the assembly, e.g. chip scale package [CSP]
    • H01L2225/06586—Housing with external bump or bump-like connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06593—Mounting aids permanently on device; arrangements for alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns

Definitions

  • the present invention relates generally to implantable medical devices (IMDs) incorporating stacked die packages. Specifically, the invention pertains to stacked die configurations adapted for use in IMDs.
  • the footprints of dice and stacked dice packages typically exceed the bottom die size.
  • the package size is much larger than the bottom die size, and is therefore very size inefficient.
  • One stacked die package in the industry uses a structure having a number of chips glued to one side of a substrate, and a connection array also laid out on the same side of the substrate. The chips are stacked by repeated hand-folding and adhering. This structure requires that perforations be placed along bend lines of the substrate to allow bending along precisely the correct lines. Further, each individual stacked package is cut individually once the substrate is folded.
  • a method for making a stacked die package includes mounting at least two chips on a first side of a flexible substrate, forming solder balls on a second side of the substrate, and interconnecting the chips and the solder balls through the substrate. Once the chips are interconnected with the solder balls, the chips are stacked, and the stacked device is surface mounted.
  • a method for forming a stacked die package includes stiffening a flexible substrate with a stiffener frame, forming an array of mounting elements on a first side of the flexible substrate, positioning the substrate mounting elements down on a reflow boat or foundation, and mounting and reflowing a number of chips on a second side of the flexible substrate in a predetermined pattern. Once the chips are mounted, they are stacked, and the substrate stiffener is removed.
  • a stacked die array includes a stacked array of chips adhered together on a flexible substrate folded to accommodate mounting, a surface mount element on a side of the substrate opposite the chips, and through-substrate routing electrically connecting the chips and the surface mount element.
  • an IMD includes a device body and a stacked chip array mounted by conventional surface mount techniques to a printed circuit board.
  • Figure 1 is a flow chart diagram of one embodiment of a method for making a stacked die package
  • Figure 1A is a flow chart diagram of one embodiment of a method for stacking chips
  • Figure 2 is a flow chart diagram of another embodiment of a method for forming a stacked die package
  • Figure 2A is a flow chart diagram of another embodiment of a method for stacking chips
  • Figure 3 is a top view of a stiffened substrate according to one embodiment of the present invention.
  • Figures 4A, 4B, 4C, 4D, 4E, and 4F are elevation views of a stacked die package in manufacture
  • Figure 5 is a view of a stacked die package according to one embodiment of the present invention.
  • Figure 6 is a view of an implantable medical device according to one embodiment if the present invention.
  • FIG. 1 is a flow chart showing method 100 for making a stacked die package according to one embodiment of the present invention.
  • Method 100 comprises using a flexible substrate as a mounting location for at least two chips in a predetermined pattern.
  • the at least two chips are mounted on a first side of the flexible substrate.
  • Solder balls in a predetermined solder ball array patterns are formed on the other side of the flexible substrate in block 104. It should be noted that the mounting of the chips and the solder balls is reversible, with solder ball array being mounted before the chips without departing from the scope of the invention.
  • the mounted chips and the solder ball array are interconnected through the substrate in block 106, and the chips are stacked in a predetermined pattern in block 108. Once the chips are stacked, the stacked die package is surface mounted in block 110.
  • the flexible substrate is stiffened with a stiffener in block 101.
  • a stiffener in block 101.
  • the method becomes more reproducible due to the added rigidity and ability to work on the product.
  • the substrate is stiffened with a printed wiring board (PWB) stiffener.
  • PWB printed wiring board
  • Other stiffeners include by way of example only and not by way of limitation, metal, screens, and the like. One requisite for a stiffener is that it be amenable to bending when the chips mounted to the substrate are to be stacked.
  • the substrate and any attached stiffener are inverted after applying the solder ball array. Once inverted, the substrate is placed on a reflow boat, and chips are mounted according to a predetermined pattern on the substrate and reflowed. In one embodiment, the predetermined pattern is laid out on the substrate in a sub panel format which has been determined for folding patterns.
  • the layout of sub panel patterns for efficient folding to stack chips is known to those of skill in the field, and will not be described further herein. Provided that the sub panel layout is sufficient for folding and stacking the chips, the layout is consistent with the embodiments of the present invention.
  • the stiffener allows the substrate to be maintained in a rigid form without the need for a specialized frame to hold the substrate during process flow. Since the stiffener is connected to the substrate, the stiffener is present wherever the substrate is, thus providing rigidity without sacrificing portability during process flow.
  • the stiffener is removed in block 109.
  • the stiffener is saw cut away, separating the stiffener and the stacked die package, leaving a stacked die package ready for surface mounting.
  • the arrangement and layout of the substrate and the stiffener allow the stiffener to be fully cut away in a single saw cut, leaving multiple stacked die packages ready for mounting.
  • the sub panel layout allows such a single saw cut to be feasible.
  • the chips are underfilled.
  • Stacking the chips in accordance with method 150 shown in Figure 1A comprises applying an adhesive to the top of selected chips in block 152, and folding the substrate and any attached stiffener in a predetermined fold pattern to align the chips to be stacked top to top with one chip inverted and the other non-inverted in block 154. Once the chips are stacked, the adhesive is cured in block 156.
  • Method 200 for forming a stacked die package is shown in Figure 2.
  • Method 200 comprises stiffening a flexible substrate in block 202, laying out a sub panel pattern for chip placement on a first side of the substrate in block 204, forming an array of solder balls on the other side of the substrate in block 206, positioning the substrate solder ball array side down on a reflow boat in block 208, and mounting chips according to the laid out pattern in block 210. Once the chips have been mounted, the substrate is folded to stack the chips in a predetermined pattern in block 212.
  • This process involves applying an adhesive to at least a portion of the chips in block 212A, folding the substrate along a predetermined fold line or set of fold lines in block 212B, abutting chips top to top in block 212C, and curing the adhesive in block 212D. Once the chips are stacked, the stiffener is removed in block 214.
  • Stiffened substrate 300 comprises a flexible substrate 302 which has been mounted or otherwise attached to a stiffener or stiffening frame 304.
  • a sub panel layout 306 is arranged on the substrate 302 in such a pattern as to allow folding of the substrate 302 and stiffener 304 to align chips 308 mounted to the substrate 302.
  • the substrate includes open areas 310 arranged to facilitate folding of the substrate 302 and stiffener 304.
  • stiffener such as stiffener 304
  • other means or components for maintaining rigidity and workability of the substrate are contemplated, and are within the scope of the invention.
  • a spacer is used instead of the stiffener.
  • Figure 4A shows a substrate 302 stiffened by a stiffener 304.
  • An array 402 of solder balls is formed on side 404 of the substrate in a pattern that has been determined to be acceptable for the stacking operation.
  • the substrate/stiffener is placed on a reflow boat 408 inverted, so that the solder ball arrays rest in openings 409 of reflow boat 408.
  • Reflow boat holding elements 407 secure the stiffener 304 and therefore the substrate 302 to the reflow boat 408 to allow further process flow.
  • the inverted placement of the substrate 302 and stiffener 304 exposes opposite side 406 of the substrate 302 for further processing.
  • chips 410 are mounted and reflowed onto side 406 of substrate 302 according to a predetermined pattern as described above.
  • the chips 410 and the solder ball array 402 are electrically interconnected through the substrate 302.
  • adhesive 412 is placed on the tops 411 of selected chips 410 in preparation for adhering chips together in a stacking operation.
  • the stiffener end sections 413 are removed from the reflow boat foundation securing elements 407 and the substrate 302 and stiffener 304 are folded along predetermined fold lines such as folds 416 and 418 to align chips such as chips 410a and 410b top 411a to top 411b.
  • Adhesive 412 secures the chips together. Once the substrate 302 and stiffener 304 are folded to align or abut chips such as chips 410, the assembly is clamped with clamp 414, and the adhesive is cured. Other chips 410 are also aligned top to top with each other in the same or additional folding operations.
  • the assembly 300 is removed from the reflow boat and placed into a saw fixture 416.
  • a wafer saw 418 is used to singulate the assembly 300 into individual piece parts 422 using saw blades 420.
  • the wafer saw 418 is a dual blade saw.
  • the arrangement of chips such as chips 410 on the substrate such as substrate 302 is such in one embodiment that the wafer saw 418 cuts all the individual piece parts 422 into singular parts with one saw cut.
  • the stiffener 304 is fully removed from the substrate 302, leaving only a stacked die package 422.
  • the individual stacked die packages 422 are then ready for mounting by conventional surface mount technology.
  • Figure 5 shows a stacked die package 500 comprising a stacked array of chips 502 mounted on a side 504 of a flexible substrate 506 folded to accommodate mounting with surface mount elements 508 on a side 510 of the substrate opposite the chips.
  • the chips 502 are adhered together by an adhesive layer 512.
  • Through-substrate routing (not shown) electrically connects the chips and the surface mount elements 506.
  • the surface mount elements 508 are solder balls of a solder ball array.
  • the flexible substrate 506 has formed therein a sub panel layout for the layout of chips such as chips 502 so that folding of the substrate 506 aligns or abuts the chips 502 top to top. Multiple individual designs are laid out on the substrate 506 in one embodiment. The substrate folds along predetermined patterns to align the chips together as desired.
  • an implantable medical device 600 comprises a body 602 housing medical device components including by way of example only and not by way of limitation substrates, batteries, shielding, antenna and telemetry devices and components, control circuitry, high power circuits, integrated circuits, and the like.
  • Integrated circuits include stacked die packages such as stacked die package 500.
  • the stacked die package such as a stacked die package 500 is mounted to the substrate of the implantable medical device by conventional surface mount techniques.
  • the substrates of the present invention are laid out in a format wherein the components to be stacked are not the same size. With proper arrangement and chip layout, chips or components of different sizes are stacked in the same manner as that described above.
  • Stacking dice significantly reduces the area required on hybrid modules and therefore decreases the necessary volume of the module.
  • the stacked die packages of the present invention embodiments have smaller footprints, but typically have increased vertical height over traditional packages due to the stacking of chips. The increase in vertical height due to the use of stacked die packages is not a critically limiting factor due to the use of other high profile components in such devices.

Abstract

A stacked die package is formed by stiffening a flexible substrate, arranging a chip mounting pattern on one side of the substrate, and mounting chips according to the arranged pattern. A solder ball array on the opposite side of the substrate is routed to the chips, and the flexible substrate and stiffener are folded to align the chips in the stacked die package. The stiffener is removed by a single saw cut.

Description

STACKED DIE PACKAGE
The present invention relates generally to implantable medical devices (IMDs) incorporating stacked die packages. Specifically, the invention pertains to stacked die configurations adapted for use in IMDs.
As implantable medical devices become smaller and smaller, and as more and more components are added to such devices, the real estate available for components is shrinking. Components too are shrinking in size, but the need for improving the use of available volume and space continues.
In implantable medical devices, the footprints of dice and stacked dice packages typically exceed the bottom die size. For example, when wire bonding is used to electrically connect a die to rigid or flexible interposers, the package size is much larger than the bottom die size, and is therefore very size inefficient.
One stacked die package in the industry uses a structure having a number of chips glued to one side of a substrate, and a connection array also laid out on the same side of the substrate. The chips are stacked by repeated hand-folding and adhering. This structure requires that perforations be placed along bend lines of the substrate to allow bending along precisely the correct lines. Further, each individual stacked package is cut individually once the substrate is folded.
SUMMARY OF THE INVENTION
In one embodiment, a method for making a stacked die package includes mounting at least two chips on a first side of a flexible substrate, forming solder balls on a second side of the substrate, and interconnecting the chips and the solder balls through the substrate. Once the chips are interconnected with the solder balls, the chips are stacked, and the stacked device is surface mounted.
In another embodiment, a method for forming a stacked die package includes stiffening a flexible substrate with a stiffener frame, forming an array of mounting elements on a first side of the flexible substrate, positioning the substrate mounting elements down on a reflow boat or foundation, and mounting and reflowing a number of chips on a second side of the flexible substrate in a predetermined pattern. Once the chips are mounted, they are stacked, and the substrate stiffener is removed.
In yet another embodiment, a stacked die array includes a stacked array of chips adhered together on a flexible substrate folded to accommodate mounting, a surface mount element on a side of the substrate opposite the chips, and through-substrate routing electrically connecting the chips and the surface mount element.
In still another embodiment, an IMD includes a device body and a stacked chip array mounted by conventional surface mount techniques to a printed circuit board.
Other embodiments are described and claimed as described hereinbelow.. BRIEF DESCRIPTION OF THE DRAWINGS
Figure 1 is a flow chart diagram of one embodiment of a method for making a stacked die package;
Figure 1A is a flow chart diagram of one embodiment of a method for stacking chips;
Figure 2 is a flow chart diagram of another embodiment of a method for forming a stacked die package;
Figure 2A is a flow chart diagram of another embodiment of a method for stacking chips;
Figure 3 is a top view of a stiffened substrate according to one embodiment of the present invention;
Figures 4A, 4B, 4C, 4D, 4E, and 4F are elevation views of a stacked die package in manufacture;
Figure 5 is a view of a stacked die package according to one embodiment of the present invention; and
Figure 6 is a view of an implantable medical device according to one embodiment if the present invention.
DETAILED DESCRIPTION OF THE DRAWINGS
In the following detailed description of the embodiments, reference is made to the accompanying drawings which form a part hereof, and in which is shown by way of illustration specific embodiments in which the invention may be practiced. It is to be understood that other embodiments may be utilized and structural or logical changes may be made without departing from the scope of the present invention.
Figure 1 is a flow chart showing method 100 for making a stacked die package according to one embodiment of the present invention. Method 100 comprises using a flexible substrate as a mounting location for at least two chips in a predetermined pattern. In block 102, the at least two chips are mounted on a first side of the flexible substrate. Solder balls in a predetermined solder ball array patterns are formed on the other side of the flexible substrate in block 104. It should be noted that the mounting of the chips and the solder balls is reversible, with solder ball array being mounted before the chips without departing from the scope of the invention. The mounted chips and the solder ball array are interconnected through the substrate in block 106, and the chips are stacked in a predetermined pattern in block 108. Once the chips are stacked, the stacked die package is surface mounted in block 110.
In one embodiment, the flexible substrate is stiffened with a stiffener in block 101. When the substrate is stiffened, the method becomes more reproducible due to the added rigidity and ability to work on the product. In one embodiment, the substrate is stiffened with a printed wiring board (PWB) stiffener. Other stiffeners include by way of example only and not by way of limitation, metal, screens, and the like. One requisite for a stiffener is that it be amenable to bending when the chips mounted to the substrate are to be stacked.
To mount chips as in block 102, in one embodiment the substrate and any attached stiffener are inverted after applying the solder ball array. Once inverted, the substrate is placed on a reflow boat, and chips are mounted according to a predetermined pattern on the substrate and reflowed. In one embodiment, the predetermined pattern is laid out on the substrate in a sub panel format which has been determined for folding patterns. The layout of sub panel patterns for efficient folding to stack chips is known to those of skill in the field, and will not be described further herein. Provided that the sub panel layout is sufficient for folding and stacking the chips, the layout is consistent with the embodiments of the present invention.
The stiffener allows the substrate to be maintained in a rigid form without the need for a specialized frame to hold the substrate during process flow. Since the stiffener is connected to the substrate, the stiffener is present wherever the substrate is, thus providing rigidity without sacrificing portability during process flow.
In one embodiment, once the chips have been stacked by folding and adhering and curing, and before mounting the stacked die package, the stiffener is removed in block 109. In one embodiment, the stiffener is saw cut away, separating the stiffener and the stacked die package, leaving a stacked die package ready for surface mounting. The arrangement and layout of the substrate and the stiffener allow the stiffener to be fully cut away in a single saw cut, leaving multiple stacked die packages ready for mounting. The sub panel layout allows such a single saw cut to be feasible. In optional process flow, the chips are underfilled.
Stacking the chips in accordance with method 150 shown in Figure 1A comprises applying an adhesive to the top of selected chips in block 152, and folding the substrate and any attached stiffener in a predetermined fold pattern to align the chips to be stacked top to top with one chip inverted and the other non-inverted in block 154. Once the chips are stacked, the adhesive is cured in block 156.
In another embodiment, method 200 for forming a stacked die package is shown in Figure 2. Method 200 comprises stiffening a flexible substrate in block 202, laying out a sub panel pattern for chip placement on a first side of the substrate in block 204, forming an array of solder balls on the other side of the substrate in block 206, positioning the substrate solder ball array side down on a reflow boat in block 208, and mounting chips according to the laid out pattern in block 210. Once the chips have been mounted, the substrate is folded to stack the chips in a predetermined pattern in block 212. This process, shown in greater detail in Figure 2A, involves applying an adhesive to at least a portion of the chips in block 212A, folding the substrate along a predetermined fold line or set of fold lines in block 212B, abutting chips top to top in block 212C, and curing the adhesive in block 212D. Once the chips are stacked, the stiffener is removed in block 214.
An embodiment 300 of a stiffened substrate is shown in Figure 3. Stiffened substrate 300 comprises a flexible substrate 302 which has been mounted or otherwise attached to a stiffener or stiffening frame 304. On substrate 302, a sub panel layout 306 is arranged on the substrate 302 in such a pattern as to allow folding of the substrate 302 and stiffener 304 to align chips 308 mounted to the substrate 302. In one embodiment, the substrate includes open areas 310 arranged to facilitate folding of the substrate 302 and stiffener 304.
While a stiffener such as stiffener 304 is described herein, other means or components for maintaining rigidity and workability of the substrate are contemplated, and are within the scope of the invention. For example, in one embodiment, a spacer is used instead of the stiffener.
Once the substrate 302 is stiffened with stiffener 304, it undergoes in one embodiment the processes described above. These processes are shown in greater detail on Figures 4A, 4B, 4C, 4D, 4E, and 4F. Figure 4A shows a substrate 302 stiffened by a stiffener 304. An array 402 of solder balls is formed on side 404 of the substrate in a pattern that has been determined to be acceptable for the stacking operation.
In Figure 4B, the substrate/stiffener is placed on a reflow boat 408 inverted, so that the solder ball arrays rest in openings 409 of reflow boat 408. Reflow boat holding elements 407 secure the stiffener 304 and therefore the substrate 302 to the reflow boat 408 to allow further process flow. The inverted placement of the substrate 302 and stiffener 304 exposes opposite side 406 of the substrate 302 for further processing.
In Figure 4C, chips 410 are mounted and reflowed onto side 406 of substrate 302 according to a predetermined pattern as described above. The chips 410 and the solder ball array 402 are electrically interconnected through the substrate 302.
In Figure 4D, adhesive 412 is placed on the tops 411 of selected chips 410 in preparation for adhering chips together in a stacking operation.
In Figure 4E, the stiffener end sections 413 are removed from the reflow boat foundation securing elements 407 and the substrate 302 and stiffener 304 are folded along predetermined fold lines such as folds 416 and 418 to align chips such as chips 410a and 410b top 411a to top 411b. Adhesive 412 secures the chips together. Once the substrate 302 and stiffener 304 are folded to align or abut chips such as chips 410, the assembly is clamped with clamp 414, and the adhesive is cured. Other chips 410 are also aligned top to top with each other in the same or additional folding operations.
In Figure 4F, once the adhesive 412 is fully cured, and the chips 410 are secured together in top to top stacked fashion, the assembly 300 is removed from the reflow boat and placed into a saw fixture 416. A wafer saw 418 is used to singulate the assembly 300 into individual piece parts 422 using saw blades 420. In one embodiment, the wafer saw 418 is a dual blade saw. The arrangement of chips such as chips 410 on the substrate such as substrate 302 is such in one embodiment that the wafer saw 418 cuts all the individual piece parts 422 into singular parts with one saw cut. When the wafer saw 418 cuts the assembly 300, the stiffener 304 is fully removed from the substrate 302, leaving only a stacked die package 422. The individual stacked die packages 422 are then ready for mounting by conventional surface mount technology.
Figure 5 shows a stacked die package 500 comprising a stacked array of chips 502 mounted on a side 504 of a flexible substrate 506 folded to accommodate mounting with surface mount elements 508 on a side 510 of the substrate opposite the chips. The chips 502 are adhered together by an adhesive layer 512. Through-substrate routing (not shown) electrically connects the chips and the surface mount elements 506. In one embodiment, the surface mount elements 508 are solder balls of a solder ball array.
In one embodiment, the flexible substrate 506 has formed therein a sub panel layout for the layout of chips such as chips 502 so that folding of the substrate 506 aligns or abuts the chips 502 top to top. Multiple individual designs are laid out on the substrate 506 in one embodiment. The substrate folds along predetermined patterns to align the chips together as desired.
In another embodiment shown in Figure 6, an implantable medical device 600 comprises a body 602 housing medical device components including by way of example only and not by way of limitation substrates, batteries, shielding, antenna and telemetry devices and components, control circuitry, high power circuits, integrated circuits, and the like. Integrated circuits include stacked die packages such as stacked die package 500. In one embodiment, the stacked die package such as a stacked die package 500 is mounted to the substrate of the implantable medical device by conventional surface mount techniques.
Recently, high voltage flip chip designs have been implemented in implantable medical devices. Such a high voltage flip chip design is not described herein, but the methods and devices of the present invention are also amenable and applicable to use in high voltage flip chip stacked die packages.
In another embodiment, the substrates of the present invention are laid out in a format wherein the components to be stacked are not the same size. With proper arrangement and chip layout, chips or components of different sizes are stacked in the same manner as that described above.
Most electronic devices can afford the extra volume of previous larger footprint designs. However, decreased volume and space are a market driver for implantable medical devices, specifically, and other medical devices. Stacking dice significantly reduces the area required on hybrid modules and therefore decreases the necessary volume of the module. The stacked die packages of the present invention embodiments have smaller footprints, but typically have increased vertical height over traditional packages due to the stacking of chips. The increase in vertical height due to the use of stacked die packages is not a critically limiting factor due to the use of other high profile components in such devices.
It is to be understood that the above description is intended to be illustrative, and not restrictive. Many other embodiments will be apparent to those of skill in the art upon reading and understanding the above description. The scope of the invention should, therefore, be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled.

Claims

What is claimed is:
1. A method for making a stacked die package, comprising: mounting at least two chips on a first side of a flexible substrate; forming solder balls on a second side of the substrate; interconnecting the chips and the solder balls through the substrate; stacking the chips to form the stacked die package; and surface mounting the stacked die package.
2. The method of claim 1 , wherein the chips are surface mounted.
3. The method of claim 1, wherein the chips are flip chips.
4. The method of claim 1, wherem the substrate includes a sub panel format with multiple images of individual designs.
5. The method of claim 1, wherein the flexible substrate is stiffened by a printed wiring board.
6. The method of claim 5, and further comprising: stiffening the substrate with a stiffener; and cutting the stiffener away after folding the substrate to stack the chips.
7. The method of claim 6, wherein cutting is performed with a single saw cut.
8. The method of claim 1, wherem stacking the chips comprises: folding the substrate to abut chips together top to top; and adhering abutting chips to one another.
9. The method of claim 1, and further comprising: underfilling the flip chips after mounting and reflowing.
10. The method of claim 1 , wherein mounting comprises : placing the substrate on a reflow boat; laying out chips in a predetermined pattern; and reflowing the chips to the substrate.
11. A method for forming a stacked die package, comprising: stiffening a flexible substrate with a stiffener frame; forming an array of mounting elements on a first side of the flexible substrate; positioning the substrate mounting elements down on a reflow boat; mounting and reflowing a plurality of chips on a second side of the flexible substrate in a predetermined pattern; stacking the chips; and removing the substrate stiffener.
12. The method of claim 11 , wherein removing the stiffener comprises: sawing the stiffener away.
13. The method of claim 12, wherein sawing is accomplished with a single saw cut.
14. The method of claim 11, wherein stacking the chips comprises: folding the substrate and stiffener in a predetermined pattern; aligning chips to be stacked; and adhering the stacked chips together.
15. The method of claim 14, wherein adhering comprises : applying an adhesive to the chips; and folding the substrate to stack the chips.
16. The method of claim 11 , and further comprising: underfilling the chips.
17. The method of claim 11, wherein the stiffener is a printed wiring board frame disposed around a perimeter of the substrate.
18. The method of claim 11 , wherein the stiffener is a spacer.
19. The method of claim 11 , wherein the stiffener is a metal frame.
20. A method of forming a stacked die package, comprising: stiffening a substrate with a stiffener; forming solder balls on a back side of a substrate; placing the substrate on a reflow boat with the back side facing down; mounting at least two chips in a predetermined pattern on a front side of the substrate; dispensing adhesive on a portion of the chips; removing a portion of the stiffener; folding the substrate and remaining stiffener to align the remaining portion of the chips with the portion of the chips having adhesive; and curing the adhesive.
21. The method of claim 20, and further comprising: removing the remaining portion of the stiffener after curing.
22. The method of claim 21, wherein removing the remaining portion of stiffener is accomplished with a single saw cut.
23. A method of making a stacked die package, comprising: designing a substrate in sub panel format for folding to abut mounted chips top to top; stiffening the substrate with a printed wiring board stiffener; forming an array of solder balls on a side of the substrate; mounting a plurality of chips on another side of the substrate in the sub panel arrangement; folding the substrate to abut the mounted chips; and removing the stiffener after adhering the chips top to top.
24. A stacked die array, comprising: a stacked array of chips adhered together on a flexible substrate folded to accommodate mounting; a surface mount element on a side of the substrate opposite the chips; and a through-substrate routing for electrically connecting the chips and the surface mount element.
25. The stacked die of claim 24, wherein the flexible substrate is a sub panel format with multiple images of individual designs.
26. The stacked die of claim 24, wherein the surface mount element is a solder ball array.
27. An implantable medical device, comprising: a device body; a stacked chip array comprising: a stacked array of chips adhered together on a flexible substrate folded to accommodate mounting; a surface mount element on a side of the substrate opposite the chips; and a through-substrate routing for electrically connecting the chips and the surface mount element.
28. The implantable medical device of claim 28, wherein the stacked chip array is mounted by conventional surface mount technology to a circuit board.
29. The implantable medical device of claim 28, wherein the surface mount element is an array of solder balls.
PCT/US2001/044427 2000-12-11 2001-11-27 Stacked die package WO2002049109A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP01270907A EP1350270B1 (en) 2000-12-11 2001-11-27 Stacked die package

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/734,073 2000-12-11
US09/734,073 US20020121693A1 (en) 2000-12-11 2000-12-11 Stacked die package

Publications (2)

Publication Number Publication Date
WO2002049109A1 true WO2002049109A1 (en) 2002-06-20
WO2002049109B1 WO2002049109B1 (en) 2002-09-26

Family

ID=24950200

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/044427 WO2002049109A1 (en) 2000-12-11 2001-11-27 Stacked die package

Country Status (3)

Country Link
US (4) US20020121693A1 (en)
EP (1) EP1350270B1 (en)
WO (1) WO2002049109A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6991961B2 (en) 2003-06-18 2006-01-31 Medtronic, Inc. Method of forming a high-voltage/high-power die package

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020121693A1 (en) 2000-12-11 2002-09-05 Milla Juan G. Stacked die package
US7177698B2 (en) * 2002-06-28 2007-02-13 Advanced Bionics Corporation Telemetry system for use with microstimulator
US7089984B2 (en) 2002-09-30 2006-08-15 Intel Corporation Forming folded-stack packaged device using progressive folding tool
US6833287B1 (en) * 2003-06-16 2004-12-21 St Assembly Test Services Inc. System for semiconductor package with stacked dies
JP2005011986A (en) * 2003-06-19 2005-01-13 Sanyo Electric Co Ltd Semiconductor device
US7163155B2 (en) * 2003-11-05 2007-01-16 Interdigital Technology Corporation ASIC-embedded switchable antenna arrays
US7241642B2 (en) * 2004-01-30 2007-07-10 Intel Corporation Mounting and dicing process for wafers
US7454105B2 (en) * 2004-11-22 2008-11-18 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. Passive alignment using elastic averaging in optoelectronics applications
US7327592B2 (en) * 2005-08-30 2008-02-05 Micron Technology, Inc. Self-identifying stacked die semiconductor components
US7767543B2 (en) * 2005-09-06 2010-08-03 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing a micro-electro-mechanical device with a folded substrate
KR100780691B1 (en) * 2006-03-29 2007-11-30 주식회사 하이닉스반도체 Folding chip planr stack package
KR100885976B1 (en) * 2007-06-25 2009-03-03 삼성전자주식회사 Printed circuit board, memory module having the same and fabrication method thereof
US7998797B2 (en) * 2008-12-09 2011-08-16 Infineon Technologies Ag Semiconductor device
US8397380B2 (en) * 2009-06-01 2013-03-19 Taiwan Semiconductor Manufacturing Company, Ltd. Controlling warpage in BGA components in a re-flow process
US7883991B1 (en) * 2010-02-18 2011-02-08 Taiwan Semiconductor Manufacturing Company, Ltd. Temporary carrier bonding and detaching processes
KR20120079742A (en) 2011-01-05 2012-07-13 삼성전자주식회사 Folded stacked package and method for manufacturing the same
US20130069230A1 (en) 2011-09-16 2013-03-21 Nagesh Vodrahalli Electronic assembly apparatus and associated methods

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5345205A (en) * 1990-04-05 1994-09-06 General Electric Company Compact high density interconnected microwave system
US5397747A (en) * 1993-08-19 1995-03-14 International Business Machines Corporation Vertical chip mount memory package and method
US5448511A (en) * 1994-06-01 1995-09-05 Storage Technology Corporation Memory stack with an integrated interconnect and mounting structure
US5452182A (en) * 1990-04-05 1995-09-19 Martin Marietta Corporation Flexible high density interconnect structure and flexibly interconnected system
US5776797A (en) * 1995-12-22 1998-07-07 Fairchild Space And Defense Corporation Three-dimensional flexible assembly of integrated circuits
CH689502A5 (en) * 1997-05-30 1999-05-14 Valtronic S A Miniaturised electronic circuit module, especially for mobile telephones
US6121676A (en) * 1996-12-13 2000-09-19 Tessera, Inc. Stacked microelectronic assembly and method therefor
EP1041633A1 (en) * 1998-09-09 2000-10-04 Seiko Epson Corporation Semiconductor device, method of manufacture thereof, circuit board, and electronic device
EP1119049A2 (en) * 2000-01-18 2001-07-25 Sony Corporation Laminate type semiconductor apparatus

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US36613A (en) * 1862-10-07 Improvement in buckets and measures
US127837A (en) * 1872-06-11 Improvement in clamps for moving pianos
US44423A (en) * 1864-09-27 Improved screw for music-stools
US6252A (en) * 1849-04-03 Henry ritchie
US123172A (en) * 1872-01-30 Improvement in tables
US5391747A (en) * 1989-05-23 1995-02-21 Bayer Aktiengesellschaft Substituted (quinolin-2-yl-methoxy)phenyl-acyl-sulphon-amides and -cyanamides, processes for their preparation and their use in medicaments
US5012323A (en) 1989-11-20 1991-04-30 Micron Technology, Inc. Double-die semiconductor package having a back-bonded die and a face-bonded die interconnected on a single leadframe
US5281852A (en) 1991-12-10 1994-01-25 Normington Peter J C Semiconductor device including stacked die
US5291061A (en) 1993-04-06 1994-03-01 Micron Semiconductor, Inc. Multi-chip stacked devices
US5428190A (en) 1993-07-02 1995-06-27 Sheldahl, Inc. Rigid-flex board with anisotropic interconnect and method of manufacture
US5386341A (en) 1993-11-01 1995-01-31 Motorola, Inc. Flexible substrate folded in a U-shape with a rigidizer plate located in the notch of the U-shape
TW272352B (en) 1993-11-10 1996-03-11 Ming-Dong Sheen A packing method for setting a die on printed circuit boards
US5721452A (en) 1995-08-16 1998-02-24 Micron Technology, Inc. Angularly offset stacked die multichip device and method of manufacture
US5874781A (en) 1995-08-16 1999-02-23 Micron Technology, Inc. Angularly offset stacked die multichip device and method of manufacture
US5811317A (en) * 1995-08-25 1998-09-22 Texas Instruments Incorporated Process for reflow bonding a semiconductor die to a substrate and the product produced by the product
US5760465A (en) * 1996-02-01 1998-06-02 International Business Machines Corporation Electronic package with strain relief means
US5696031A (en) 1996-11-20 1997-12-09 Micron Technology, Inc. Device and method for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
JP3695893B2 (en) * 1996-12-03 2005-09-14 沖電気工業株式会社 Semiconductor device, manufacturing method and mounting method thereof
US6225688B1 (en) 1997-12-11 2001-05-01 Tessera, Inc. Stacked microelectronic assembly and method therefor
US5953588A (en) 1996-12-21 1999-09-14 Irvine Sensors Corporation Stackable layers containing encapsulated IC chips
US6208521B1 (en) * 1997-05-19 2001-03-27 Nitto Denko Corporation Film carrier and laminate type mounting structure using same
JP4066127B2 (en) * 1999-03-25 2008-03-26 セイコーエプソン株式会社 Semiconductor device and manufacturing method thereof, circuit board and electronic apparatus.
JP2000353767A (en) 1999-05-14 2000-12-19 Universal Instr Corp Board for mounting electronic component, package, mounting method, and method for housing integrated circuit chip in package
US20020121693A1 (en) 2000-12-11 2002-09-05 Milla Juan G. Stacked die package

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5345205A (en) * 1990-04-05 1994-09-06 General Electric Company Compact high density interconnected microwave system
US5452182A (en) * 1990-04-05 1995-09-19 Martin Marietta Corporation Flexible high density interconnect structure and flexibly interconnected system
US5397747A (en) * 1993-08-19 1995-03-14 International Business Machines Corporation Vertical chip mount memory package and method
US5448511A (en) * 1994-06-01 1995-09-05 Storage Technology Corporation Memory stack with an integrated interconnect and mounting structure
US5776797A (en) * 1995-12-22 1998-07-07 Fairchild Space And Defense Corporation Three-dimensional flexible assembly of integrated circuits
US6121676A (en) * 1996-12-13 2000-09-19 Tessera, Inc. Stacked microelectronic assembly and method therefor
CH689502A5 (en) * 1997-05-30 1999-05-14 Valtronic S A Miniaturised electronic circuit module, especially for mobile telephones
EP1041633A1 (en) * 1998-09-09 2000-10-04 Seiko Epson Corporation Semiconductor device, method of manufacture thereof, circuit board, and electronic device
EP1119049A2 (en) * 2000-01-18 2001-07-25 Sony Corporation Laminate type semiconductor apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6991961B2 (en) 2003-06-18 2006-01-31 Medtronic, Inc. Method of forming a high-voltage/high-power die package

Also Published As

Publication number Publication date
US20020127837A1 (en) 2002-09-12
US6696318B2 (en) 2004-02-24
US6670217B2 (en) 2003-12-30
US20020121693A1 (en) 2002-09-05
WO2002049109B1 (en) 2002-09-26
US7045390B2 (en) 2006-05-16
EP1350270A1 (en) 2003-10-08
US20020123172A1 (en) 2002-09-05
US20030180987A1 (en) 2003-09-25
EP1350270B1 (en) 2012-01-04

Similar Documents

Publication Publication Date Title
US7045390B2 (en) Stacked die package
EP1097467B1 (en) Ic stack utilizing secondary leadframes
US8384199B2 (en) Integrated conductive structures and fabrication methods thereof facilitating implementing a cell phone or other electronic system
US7149095B2 (en) Stacked microelectronic assemblies
US6469377B1 (en) Semiconductor device
US6677670B2 (en) Semiconductor device
EP0892434B1 (en) RF IC package
US7246431B2 (en) Methods of making microelectronic packages including folded substrates
US20050167834A1 (en) Semiconductor device including semiconductor element mounted on another semiconductor element
US6408510B1 (en) Method for making chip scale packages
EP2081226A1 (en) Multi-channel stackable semiconductor device and method for fabricating the same, and stacking substrate applied to the semiconductor device
JP2004134814A (en) Manufacturing method of circuit substrate having three-dimensional surface mounting array of semiconductor chip and device
US8829684B2 (en) Integrated circuit package
US8643192B2 (en) Integrated circuit package with discrete components surface mounted on exposed side
US20080316716A1 (en) Frame for a packaging method using flexible printed circuit boards and method thereof
US6534392B1 (en) Methods of making microelectronic assemblies using bonding stage and bonding stage therefor
KR100377466B1 (en) lamination apparatus of circuit film for semiconductor package and its method
US20040252474A1 (en) Integrated circuit stack with lead frames
JP2007281264A (en) Method of manufacturing semiconductor device
KR20040004979A (en) Method for stacking a semiconductor device with plastic package and a semiconductor device with bga package

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): CA JP

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR

AK Designated states

Kind code of ref document: B1

Designated state(s): CA JP

AL Designated countries for regional patents

Kind code of ref document: B1

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR

121 Ep: the epo has been informed by wipo that ep was designated in this application
DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
WWE Wipo information: entry into national phase

Ref document number: 2001270907

Country of ref document: EP

WWP Wipo information: published in national office

Ref document number: 2001270907

Country of ref document: EP

NENP Non-entry into the national phase

Ref country code: JP

WWW Wipo information: withdrawn in national office

Country of ref document: JP