WO2002052600A1 - Element d'emission electronique et utilisation dans un affichage a emission de champ - Google Patents
Element d'emission electronique et utilisation dans un affichage a emission de champ Download PDFInfo
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- WO2002052600A1 WO2002052600A1 PCT/JP2001/011195 JP0111195W WO02052600A1 WO 2002052600 A1 WO2002052600 A1 WO 2002052600A1 JP 0111195 W JP0111195 W JP 0111195W WO 02052600 A1 WO02052600 A1 WO 02052600A1
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- electrode
- electron
- emitting device
- emission display
- electric field
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J1/00—Details of electrodes, of magnetic control means, of screens, or of the mounting or spacing thereof, common to two or more basic types of discharge tubes or lamps
- H01J1/02—Main electrodes
- H01J1/30—Cold cathodes, e.g. field-emissive cathode
- H01J1/316—Cold cathodes, e.g. field-emissive cathode having an electric field parallel to the surface, e.g. thin film cathodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J1/00—Details of electrodes, of magnetic control means, of screens, or of the mounting or spacing thereof, common to two or more basic types of discharge tubes or lamps
- H01J1/02—Main electrodes
- H01J1/30—Cold cathodes, e.g. field-emissive cathode
- H01J1/304—Field-emissive cathodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J31/00—Cathode ray tubes; Electron beam tubes
- H01J31/08—Cathode ray tubes; Electron beam tubes having a screen on or from which an image or pattern is formed, picked up, converted, or stored
- H01J31/10—Image or pattern display tubes, i.e. having electrical input and optical output; Flying-spot tubes for scanning purposes
- H01J31/12—Image or pattern display tubes, i.e. having electrical input and optical output; Flying-spot tubes for scanning purposes with luminescent screen
- H01J31/123—Flat display tubes
- H01J31/125—Flat display tubes provided with control means permitting the electron beam to reach selected parts of the screen, e.g. digital selection
- H01J31/127—Flat display tubes provided with control means permitting the electron beam to reach selected parts of the screen, e.g. digital selection using large area or array sources, i.e. essentially a source for each pixel group
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2201/00—Electrodes common to discharge tubes
- H01J2201/30—Cold cathodes
- H01J2201/306—Ferroelectric cathodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2201/00—Electrodes common to discharge tubes
- H01J2201/30—Cold cathodes
- H01J2201/316—Cold cathodes having an electric field parallel to the surface thereof, e.g. thin film cathodes
- H01J2201/3165—Surface conduction emission type cathodes
Definitions
- the present invention relates to an electron-emitting device and a field emission display using the same.
- Such an electron-emitting device has a driving electrode and a ground electrode, and is applied to various applications such as a field emission display (FED) and a backlight.
- FED field emission display
- a plurality of electron-emitting devices are two-dimensionally arranged, and a plurality of phosphors for these electron-emitting devices are arranged at predetermined intervals.
- the straightness of the conventional electron-emitting device that is, the degree to which the emitted electrons go straight to a predetermined target (for example, a phosphor) is not good, and a desired current density is secured by the emitted electrons. To do so, it is necessary to apply a relatively high voltage to the electron-emitting device.
- An object of the present invention is to provide an electron-emitting device having good straightness of emitted electrons and a field emission display using the same.
- Another object of the present invention is to provide an electron-emitting device for realizing electron emission having a high current density at a relatively low vacuum and a very low driving voltage, and a phono device using the same. Is to provide an optional display.
- the electron-emitting device comprises:
- An electric field application unit configured by a dielectric
- a second electrode formed on one surface of the electric field applying unit and forming a slit together with the first electrode.
- the present invention when a pulse voltage is applied to the first or second electrode, electrons are emitted from the electric field application unit.
- the electric field applying portion With a dielectric, it is possible to obtain a good straightness that cannot be achieved by a conventional electron-emitting device.
- the voltage applied to the electron-emitting device in order to secure a desired current density is significantly lower than in the past, and the energy consumption is greatly reduced.
- the electron-emitting device according to the present invention is preferable from the viewpoint of durability and cost reduction.
- the first electrode, the second electrode, and the slit are preferably coated with carbon.
- the carbon coating significantly reduces the risk of damage to the first and second electrodes due to collision between electrons and ions and heat generation.
- the device further includes a third electrode disposed at a predetermined distance from the first and second electrodes, and the third electrode is disposed between the first and second electrodes and the third electrode. Preferably, the space between them is evacuated.
- Another electron-emitting device includes:
- An electric field applying unit composed of at least one of a piezoelectric material, an electrostrictive material, and an antiferroelectric material;
- the electric field application unit functions as an actuator and bends and displaces.
- the straightness of the electron-emitting device is further improved.
- the first electrode, the second electrode, and the slit are preferably coated with carbon.
- the carbon coating significantly reduces the risk of damage to the first and second electrodes due to collision between electrons and ions and heat generation.
- a third electrode disposed at a predetermined distance from the first and second electrodes is further provided, and the first and second electrodes and the third electrode are further provided.
- the space between the three electrodes is preferably evacuated.
- the electric field application unit also functions as an actuator, and the amount of emitted electrons can be controlled by its displacement operation.
- the power supply further includes a voltage source for applying a DC offset voltage to the third electrode, and a resistor arranged in series between the voltage source and the third electrode.
- a desired current density can be easily achieved, and a short circuit between the third electrode and the first and second electrodes is prevented.
- a pulse voltage is applied to the first electrode, and a direct offset voltage is applied to the second electrode.
- the apparatus further includes a capacitor arranged in series between the first electrode and a voltage signal source.
- a voltage can be applied between the first electrode and the second electrode only until the capacitor is filled, thereby preventing damage to the first and second electrodes due to a short circuit. Is done.
- the electric field applying unit between the first electrode and the third electrode functions as a capacitor. Therefore, breakage due to short circuit of the first and second electrodes is prevented.
- a pulse voltage is applied to the fourth electrode, and a DC offset voltage is applied to the second electrode.
- the device may further include a resistor arranged in series between the second electrode and the DC offset voltage source.
- a resistor arranged in series between the second electrode and the DC offset voltage source.
- the relative permittivity of the electric field application unit is 100 or more and / or the width of the slit is 500 m or less.
- at least one of the first electrode and the second electrode has a sharp corner, and Z or the first electrode and the second electrode are carbon nanotubes. It is preferred to have
- a plurality of electron-emitting devices arranged two-dimensionally,
- a plurality of phosphors respectively arranged at predetermined intervals with respect to these electron-emitting devices,
- An electric field application unit configured by a dielectric
- a second electrode formed on one surface of the electric field applying unit and forming a slit together with the first electrode.
- the electron-emitting device since the electron-emitting device has excellent straightness, crosstalk is reduced and the phosphor pitch can be narrowed as compared with the conventional case having an electron-emitting device. Therefore, it is not necessary to provide a dalid to prevent electrons from being incident on the adjacent phosphor.
- the field emission display according to the present invention is preferable from the viewpoint of improving resolution, reducing the size of the device, and reducing costs. Since electrons can be emitted even when the degree of vacuum inside the field emission display is relatively low, the degree of vacuum inside the field emission display decreases due to excitation of the phosphor, etc. The emission of electrons can be maintained.
- the first electrode, the second electrode, and the slit are subjected to force coating.
- the carbon coating significantly reduces the risk of damage to the first and second electrodes due to collision between electrons and ions and heat generation.
- a third electrode disposed at a predetermined distance from the first and second electrodes is further provided, and the first and second electrodes and the third electrode are Preferably, the space between them is evacuated.
- a plurality of electron-emitting devices arranged two-dimensionally,
- a plurality of phosphors respectively arranged at predetermined intervals with respect to these electron-emitting devices,
- An electric field applying unit composed of at least one of a piezoelectric material, an electrostrictive material, and an antiferroelectric material;
- a second electrode formed on one surface of the electric field applying unit and forming a slit together with the first electrode.
- the field emission display according to the present invention is more preferable from the viewpoint of miniaturization and cost reduction.
- the first electrode, the second electrode, and the slit are preferably coated with carbon. In this case, the risk of damage to the first and second electrodes due to collision between electrons and ions and heat generation is significantly reduced by the car coating.
- a third electrode disposed at a predetermined distance from the first and second electrodes is further provided, and the first and second electrodes and the third electrode are further provided.
- the space between the three electrodes is preferably evacuated.
- the electric field application unit also functions as an actuator, and the amount of emitted electrons can be controlled by its displacement operation.
- the power supply further includes a voltage source for applying a DC offset voltage to the third electrode, and a resistor arranged in series between the voltage source and the third electrode.
- a voltage source for applying a DC offset voltage to the third electrode
- a resistor arranged in series between the voltage source and the third electrode.
- a pulse voltage is applied to the first electrode, and a direct offset voltage is applied to the second electrode.
- the apparatus further includes a capacitor arranged in series between the first electrode and a voltage signal source. This prevents breakage of the first and second electrodes due to short circuit.
- a fourth electrode formed on the other surface of the electric field applying unit and corresponding to the first electrode is further provided, breakage due to short circuit of the first and second electrodes is prevented.
- a pulse voltage is applied to the fourth electrode, and a DC offset voltage is applied to the second electrode.
- the relative permittivity of the electric field application section is 100 or more and ⁇ or the width of the slit is 500 m or less.
- at least one of the first electrode and the second electrode Preferably, one has an acute angled corner, and Z, or the first electrode and the second electrode comprise carbon nanotubes.
- the field emission display according to the present invention further includes a substrate integrally formed with a plurality of two-dimensionally arranged electron-emitting devices.
- FIG. 1 is a diagram showing a first embodiment of an electron-emitting device according to the present invention.
- FIG. 2 is a view showing a second embodiment of the electron-emitting device according to the present invention.
- FIG. 3 is a view showing a third embodiment of the electron-emitting device according to the present invention.
- FIG. 4 is a view showing a fourth embodiment of the electron-emitting device according to the present invention.
- FIG. 5 is a view showing a fifth embodiment of the electron-emitting device according to the present invention.
- FIG. 6 is a view showing a sixth embodiment of the electron-emitting device according to the present invention.
- FIG. 7 is a diagram for explaining the operation of the electron-emitting device according to the present invention.
- FIG. 8 is a diagram for explaining the operation of another electron-emitting device according to the present invention.
- FIG. 9 is a diagram showing an embodiment of the FED according to the present invention.
- FIG. 10 is a diagram showing the relationship between the relative permittivity of the electron-emitting device according to the present invention and the applied voltage.
- FIG. 11 is a diagram for explaining FIG. 10.
- FIG. 12 is a diagram showing the relationship between the slit width and the applied voltage of the electron-emitting device according to the present invention.
- FIG. 13 is a view showing an electron-emitting device according to a seventh embodiment of the present invention.
- FIG. 14 is a diagram for explaining the operation of the electron-emitting device of FIG.
- FIG. 15 is a view showing an eighth embodiment of the electron-emitting device according to the present invention.
- FIG. 16 is a diagram for explaining the operation of the electron-emitting device of FIG.
- FIG. 1A is a top view of a first embodiment of an electron-emitting device according to the present invention
- FIG. 1B is a cross-sectional view taken along line II of FIG.
- This electron-emitting device has an electric field applying section 1 made of a dielectric, a driving electrode 2 as a first electrode formed on one surface thereof, and a slit formed together with the driving electrode 2 on the same surface as the driving electrode 2. It has a common electrode 3 as a second electrode to be formed, and is formed on a substrate 4.
- the electron-emitting device includes an electron capture electrode 5 as a third electrode arranged at a predetermined distance from one surface of the electric field application unit 1 in order to capture the emitted electrons well. Further, the space between them is maintained in a vacuum state.
- a capacitor (not shown) is arranged in series between the drive electrode 2 and a voltage signal source (not shown), and / or A resistor (not shown) is arranged in series with a DC offset voltage source (not shown).
- a dielectric having a relatively high relative permittivity for example, 100 or more, is used as a dielectric constituting the electric field applying unit 1.
- dielectrics include, in addition to barium titanate, lead zirconate, lead magnesium niobate, lead nickel niobate, lead zinc niobate, lead manganese niobate, lead magnesium tantalate, nickel tannate Ceramics containing lead oxalate, lead antimonate stannate, lead titanate, barium titanate, lead magnesium tungstate, lead cobalt niobate, or any combination thereof, and those compounds whose main components are 5 0% by weight or more, oxides such as lanthanum, calcium, strontium, molybdenum, tungsten, barium, niobium, zinc, nickel, manganese, etc., or any combination of these or other compounds with respect to the ceramics And the like can be mentioned.
- n PMN—mPT n and m are mole ratios of lead magnesium niobate (P MN) and lead titanate (PT)
- P MN lead magnesium niobate
- PT lead titanate
- the Curie point is lowered, and the relative dielectric constant at room temperature can be increased.
- the relative dielectric constant is preferably 300000 or more, which is preferable.
- drive electrode 2 has an acute angled corner. A pulse voltage is applied to the drive electrode 2 from a power supply (not shown), and electrons are emitted mainly from the corners. In order to emit electrons well, the width ⁇ of the slit between the driving electrode 2 and the common electrode 3 is preferably set to 500 m or less.
- the drive electrode 2 is preferably made of a conductor having resistance to a high-temperature oxidizing atmosphere, for example, a simple metal, an alloy, a mixture of an insulating ceramic and a single metal, a mixture of an insulating ceramic and an alloy, and the like.
- a simple metal such as platinum, palladium, rhodium, and molybdenum
- alloys containing silver-palladium, silver-platinum, and platinum-palladium as main components and cermet materials consisting of platinum and ceramic materials.
- cermet materials consisting of platinum and ceramic materials.
- it is made of a material mainly composed of platinum or a platinum-based alloy.
- Carbon or graphite materials such as diamond thin films, diamond-like carbon, and carbon nanotubes are also suitably used as electrodes.
- the ratio of the ceramic material added to the electrode material is preferably about 5 to 30% by volume.
- the above materials are used to form various thick film forming methods such as screen printing, spraying, coating, diving, coating, electrophoresis, sputtering, ion beam, vacuum deposition, and ion plating.
- the drive electrode 2 When the drive electrode 2 is formed by a thick film forming technique, its thickness is generally 20 m or less, preferably 5 m or less.
- a DC offset voltage is applied to the common electrode 3, and the common electrode 3 is drawn out from the rear surface of the substrate 4 as a wiring through a through hole (not shown).
- the common electrode 3 is formed by the same material and method as the drive electrode 2, but is preferably formed by the above-mentioned thick film forming method.
- the thickness of the common electrode 3 is also generally 20 m or less, preferably 5 m or less.
- the substrate 4 be made of an electrically insulating material.
- the substrate 4 can be made of a high heat-resistant metal or a material such as an enamel whose metal surface is covered with a ceramic material such as glass, but is most preferably made of ceramics.
- the ceramics forming the substrate 4 for example, stabilized zirconium oxide, aluminum oxide, magnesium oxide, titanium oxide, spinel, mullite, aluminum nitride, silicon nitride, glass, a mixture thereof, or the like is used. Can be done. Among them, oxidized aluminum and stabilized oxidized zirconium oxide are preferable from the viewpoint of strength and rigidity. Stabilized zirconium oxide is particularly suitable from the viewpoints of relatively high mechanical strength, relatively high toughness, and relatively small chemical reaction with the drive electrode 2 and the common electrode 3. Note that the stabilized zirconium oxide includes stabilized zirconium oxide and partially stabilized zirconium oxide. The stabilized zirconium oxide has a crystal structure such as a cubic structure, so that no phase transition occurs.
- the stabilized zirconium oxide undergoes a phase transition between monoclinic and tetragonal at around 100 ° C. However, cracks may occur during such a phase transition.
- the stabilized zirconium oxide contains 130 mol% of a stabilizer such as calcium oxide, magnesium oxide, yttrium oxide, scandium oxide, ytterbium oxide, cerium oxide, or an oxide of a rare earth metal.
- the stabilizer preferably contains yidtrium yttrium. In this case, 1.5 to 6 mol%, more preferably 2 to 4 mol% of yttrium oxide is contained, and 0.1 to 5 mol% of yttrium aluminum is further contained. preferable.
- the crystal phase can be a mixed phase of cubic + monoclinic, a mixed phase of tetragonal + monoclinic, a mixed phase of cubic + tetragonal + monoclinic, etc.
- the phase used is a tetragonal or a mixed phase of tetragonal and cubic, which is optimal from the viewpoints of strength, toughness and durability.
- the substrate 4 is made of ceramics, a relatively large number of crystal grains constitute the substrate 4, but in order to improve the mechanical strength of the substrate 4, the average grain size of the crystal grains is preferably 0.0. 5-2 im, more preferably 0.1-lim.
- the heat treatment for baking the substrate 4 and the electric field applying unit 1, the driving electrode 2, and the common electrode 3, that is, the firing temperature is generally in the range of 500 to 140 ° C., preferably , 100 0 0-140 0 C.
- heat treatment or firing is performed while controlling the atmosphere together with the evaporation source of the electric field applying section 1 so that the composition of the electric field applying section 1 does not become unstable at high temperatures.
- the electric field applying unit 1 is covered with a suitable component, and the electric field applying unit 1 is It is preferable to adopt a method of baking such that the surface is not directly exposed to the baking atmosphere. In this case, the same material as that of the substrate 4 is used as the member to be covered.
- FIG. 2A is a top view of a second embodiment of the electron-emitting device according to the present invention
- FIG. 2B is a cross-sectional view along II-II thereof.
- This electron-emitting device includes an electric field applying unit 1, a driving electrode 12, and a common electrode 13 corresponding to the electric field applying unit 1, the driving electrode 2, and the common electrode 3, respectively. It further has a drive terminal electrode 14 as a fourth electrode formed on the surface, and is formed on the substrate 15. Also in this case, preferably, the electron-emitting device is provided with an electron-capturing electrode as a third electrode arranged at a predetermined distance from one surface of the electric field applying unit 1 in order to capture the emitted electrons favorably. 16 is further provided, and the space therebetween is maintained in a vacuum state.
- the electric field applying portion 11 between the drive electrode 12 and the drive terminal electrode 14 plays the role of a capacitor, damage due to a short circuit between the drive electrode 12 and the common electrode 13 is prevented. Therefore, it is not necessary to provide a capacitor separately. In this case, a pulse voltage is applied to the drive terminal electrode 14 and a DC offset voltage is applied to the common electrode 13.
- the drive terminal electrode 14 is also formed by the same material and method as the drive electrode 12 and the common electrode 13, but is preferably formed by the above-mentioned thick film formation method.
- the thickness of the drive terminal electrode 14 is also generally 20 m or less, preferably 5 or less.
- FIG. 3A is a top view of a third embodiment of the electron-emitting device according to the present invention
- FIG. 3B is a sectional view taken along the line III-III of FIG.
- the drive electrode 22 and the common electrode 23 are formed on one surface of the electric field application unit 21 similarly to the first embodiment.
- FIG. 4A is a top view of a fourth embodiment of the electron-emitting device according to the present invention
- FIG. 4B is a cross-sectional view taken along the line IV-IV.
- the drive electrode 32 and the common electrode 33 are formed on one surface of the electric field application unit 31, and the drive terminal electrode 34 is formed on the other surface.
- CNTs carbon nanotubes
- FIG. 5A is a top view of a fifth embodiment of the electron-emitting device according to the present invention
- FIG. 5B is a VV sectional view thereof.
- a comb-shaped drive electrode 42 and a common electrode 43 are formed on one surface of the electric field application unit 41.
- a pulse voltage is applied to the drive electrode 42 and a DC offset voltage is applied to the common electrode 43, electrons are easily emitted from the corners of the drive electrode 42 and the common electrode 3.
- FIG. 6A is a top view of a sixth embodiment of the electron-emitting device according to the present invention
- FIG. 6B is a sectional view taken along the line VI-VI of FIG.
- the electron-emitting device includes an electric field applying portion 51a, 5 lb made of an anti-strong dielectric material, comb-shaped driving electrodes 52a, 52b formed on one surface thereof, and a common electrode, respectively. 53a and 53b.
- the electron-emitting devices are arranged on a sheet layer 56 provided on a substrate 55 via a spacer layer 54.
- the electric field applying sections 5 la and 51 b, the driving electrodes 52 a and 52 b, the common electrodes 53 a and 53 b, the sheet layer 56 and the spacer layer 54 are connected to the actuators 57 a and 57 b. Respectively.
- the antiferroelectric materials constituting the electric field applying parts 51a and 51b include those mainly composed of lead zirconate, those mainly composed of lead zirconate and tin-lead, Attached with a lantern, consisting of lead zirconate and lead stannate It is preferable to use one obtained by adding lead zirconate or lead niobate to the above components. In particular, when driven at a low voltage, it is preferable to use an antiferroelectric material containing a component composed of lead zirconate and lead stannate. This composition is as follows.
- the antiferroelectric material can be made porous, and in this case, the porosity is preferably set to 30% or less.
- the screen printing method is particularly preferable because fine printing can be performed at low cost.
- a screen printing method is particularly preferably used because a large displacement is obtained at a low operating voltage.
- the thickness of the electric field applying portions 51a and 51b is preferably 5 or less, more preferably 3 to 40 m, because a large displacement is obtained at a low operating voltage.
- a paste or slurry mainly composed of ceramic particles of an antiferroelectric material having an average particle diameter of about 0.01 to 7 m, preferably about 0.05 to 5 m is used.
- a film can be formed on the surface of the sheet layer 56, and good device characteristics can be obtained.
- a film can be formed with high density and high shape control, and the technical literature "DENK I KAGAKU 53, No. 1 (1985), p 63-68 by Kazuo Anzai” It has the features described in the Advanced Forming Method of Ceramics, Symposium on Proceedings of the Study Group (1998), p5-6. P23-24. Therefore, it is preferable to appropriately select and use various methods in consideration of required accuracy, reliability, and the like.
- the sheet layer 56 is formed to be relatively thin, and has a structure susceptible to vibrations due to external stress.
- the sheet layer 56 is preferably made of a highly heat-resistant material. The reason is that when the drive terminal electrodes are directly joined to the sheet layer 56 as shown in FIGS. In the case where the sheet layer 56 is directly supported without using a material having relatively low heat resistance such as an organic adhesive, at least the sheet is formed at the time of forming the electric field applying portions 51a and 51b. This is to prevent the layers 56 from being deteriorated.
- the sheet layer 56 is made of ceramics, it is configured in the same manner as the substrate 4 in FIG.
- the spacer layer 54 is preferably made of ceramics, but it can be the same as the ceramic material forming the sheet layer 56 or a different ceramic material.
- ceramics include, similarly to the ceramic material constituting the sheet layer 56, for example, stabilized zirconium oxide, aluminum oxide, magnesium oxide, titanium oxide, spinel, mullite, aluminum nitride, silicon nitride, Glass, mixtures thereof and the like can be used.
- a ceramic material different from the ceramic material forming the spacer layer 54, the substrate 55, and the sheet layer 56 a material containing zirconium oxide as a main component and a material containing aluminum oxide as a main component Materials, materials mainly containing a mixture thereof, and the like are suitably used.
- those containing zirconium oxide as a main component are particularly preferable.
- Clay and the like may be attached as a sintering aid, but it is necessary to adjust the auxiliary component so as not to include excessively vitrified substances such as silicon oxide and boron oxide.
- These easily vitrified materials are advantageous from the viewpoint of joining with the electric field applying parts 5 la and 51 b, but promote the reaction with the electric field applying parts 51 a and 51 b, This is because it becomes difficult for the electric field application sections 5 la and 51 b to maintain a predetermined composition, and as a result, the element characteristics are degraded.
- the spacer layer 54, the substrate 55, and the sheet layer 56 it is preferable to limit silicon oxide and the like contained in the spacer layer 54, the substrate 55, and the sheet layer 56 to 3% or less by weight, preferably 1% or less.
- the main component refers to a component that exists at a weight ratio of 50% or more.
- the spacer layer 54, the substrate 55, and the sheet layer 56 are configured as a three-layered laminate.In this case, for example, simultaneous co-firing, bonding and integrating each layer with glass or resin, or retrofitting I do. Note that a laminate of four or more layers can be used.
- the electric field applying portions 51a and 51b are made of an antiferroelectric material as in the present embodiment, when no electric field is applied, the electric field applying portions 51a and 51b have a flat shape like the electric field applying portion 51b. On the other hand, when an electric field is applied, it is bent and displaced in a convex shape as in the electric field application section 51a.
- Such a convex bending displacement reduces the distance between the electron-emitting device and the opposing electron-capturing electrode 58, thereby further improving the straightness of the generated electrons as indicated by the arrow. Become good. Therefore, the amount of emitted electrons reaching the electron capture electrode 58 can be controlled by using the amount of bending displacement.
- FIG. 7 is a diagram for explaining the operation of the electron-emitting device according to the present invention.
- the current control element 61 has the configuration shown in FIG. 1, and its periphery is kept in a vacuum state by the vacuum chamber 62.
- a capacitor 66 is arranged in series between the drive electrode 63 and the voltage signal source 65 in order to prevent a short circuit between the drive electrode 63 and the common electrode 64.
- the bias voltage Vb is applied to the electron capture electrode 67 facing the drive electrode 63 and the common electrode 64.
- the voltage V applied to the signal voltage source 65 is set to _400 V
- the capacitance of the capacitor 66 is set to 500 pF
- the bias voltage Vb is set to 0 V
- the drive electrode 63 and the common electrode 6 4 and the width of the slit formed by the 1 0 m
- the degree of vacuum in the inner portion of the vacuum chamber 6 2 was 1 X 1 0 3 P a
- the current flowing through the driving electrode 6 3 I is 2 ⁇ 0 a
- the density of the collector current I c taken out from the electron capture electrode 67 becomes 1.2 A / cm 2 .
- the electron-emitting device of the present invention As a result, according to the electron-emitting device of the present invention, a higher current density can be obtained at a lower voltage and a lower degree of vacuum as compared with the conventional electron-emitting device, and as a result, excellent straightness can be obtained. Note that as shown in FIG. 7B, the collector current Ic increases as the noise voltage Vb increases.
- FIG. 8 is a diagram for explaining the operation of another electron-emitting device according to the present invention.
- the current control element 71 has the configuration shown in FIG. 2, and its periphery is kept in a vacuum state by the vacuum chamber 72.
- the drive electrode 73 and the common electrode 74 In order to prevent a short circuit between the electrodes, the electric field applying section 76 between the drive electrode 73 and the drive terminal electrode 75 functions as a capacitor.
- the electron capture electrode 77 faces the drive electrode 73 and the common electrode 74.
- the voltage V applied to the signal voltage source 78 is set to ⁇ 400 V, and the electric field applying section 76 functions as a capacitor having a capacitance of 530 pF, and the width of the slit formed by the driving electrode 73 and the common electrode 74 is reduced. If the vacuum inside the vacuum chamber 72 is 1 ⁇ 10 3 Pa, the current I i flowing through the drive terminal electrode 75 is 2.0 A, and the collector current extracted from the electron capture electrode 77 is 1 O m. The density of I c is 1.2 AZcm 2 .
- FIG. 9 is a diagram showing an embodiment of the FED according to the present invention.
- This FED is composed of a plurality of two-dimensionally arrayed electron-emitting devices 81R, 81G, and 81B, and a red phosphor disposed at a predetermined distance from each of the electron-emitting devices 81R, 81G, and 81B.
- 82 R, a green phosphor 82 G and a blue phosphor 82 B is a diagram showing an embodiment of the FED according to the present invention.
- the electron-emitting devices 81 R, 81 G, and 81 B are formed on the substrate 83, and the red phosphor 82 R, the green phosphor 82 G, and the blue phosphor 82 B are connected via the electron capture electrode 84. Formed on a glass substrate 85.
- Each of the electron-emitting devices 81R, 81G, and 81B has a structure shown in FIG. 2, but may have any one of the structures shown in FIGS.
- the electron-emitting devices 81R, 81G, and 81B have excellent straightness, crosstalk is reduced as compared with the case where a conventional electron-emitting device is provided, and the phosphors 82R, The pitch between 82G and 82B can be narrowed, and there is no need to provide a dalid to prevent electrons from being incident on adjacent phosphors 82R, 82G and 82B.
- the FED of this embodiment is It is preferable from the viewpoint of cost reduction. Since electrons can be emitted even when the degree of vacuum is relatively low, it is not necessary to enlarge the vacuum space in advance and look at a magazine for a decrease in the degree of vacuum, thereby reducing restrictions on thinning the FED.
- FIG. 10 is a diagram showing the relationship between the relative permittivity and the applied voltage of the electron-emitting device according to the present invention
- FIG. 11 is a diagram for explaining the relationship.
- the characteristic of FIG. 10 is that, as shown in FIG. 11, the width d 1 and d 2 of the slit formed by the driving electrode 91 and the common electrode 92 a-92 c are both 10.
- FIG. 9 is a diagram showing a relationship between the relative permittivity of the electric field application unit and the applied voltage necessary for emitting the electric field when.
- the relative dielectric constant is preferably set to 100 or more.
- FIG. 12 is a diagram showing the relationship between the slit width and the applied voltage of the electron-emitting device according to the present invention. From FIG. 12, it is understood that the slit width must be set to 500 urn or less in order for the electron emission phenomenon to occur. In order to drive the electron-emitting device according to the present invention with a driver IC used in a commercially available plasma display, a fluorescent display tube, or a liquid crystal display, the slit width needs to be 20 m or less.
- FIG. 13A is a top view of a seventh embodiment of the electron-emitting device according to the present invention
- FIG. 13B is a sectional view taken along the line VII-VII.
- a drive electrode 102 and a common electrode 103 having a semicircular shape are formed on one side of the electric field application unit 101, and the drive electrode 102, the common electrode 103, and the like are formed.
- a force coating 104 is applied to the formed slit.
- the periphery of the current emitting element is kept in a vacuum state by the vacuum chamber 111.
- a capacitor 113 is arranged in series between the drive electrode 102 and the voltage signal source 112.
- Driving electrode 102 and common electrode; electron capture electrode 114 facing L 03 A body 115 is provided, and a bias voltage Vb is applied.
- the drive electrode 102 and the common electrode 103 are made of Au having a film thickness of 3 ⁇ , and the drive electrode 102 and the common electrode 103 and the slit portion therebetween are coated with a force film coating 104 (thickness 3 ⁇ ). went.
- the voltage Vk applied to the signal voltage source 112 is set to 25 V
- the capacitance of the capacitor 113 is set to 5 nF
- the bias voltage Vb is set to 300 V
- the electric field applying unit 101 is made of an electrostrictive material having a relative dielectric constant of 14000.
- FIG. 15A is a top view of an eighth embodiment of the electron-emitting device according to the present invention
- FIG. 15B is a cross-sectional view taken along the line VIII-VIII.
- a semicircular drive electrode 202 and a common electrode 203 are formed on one side of the electric field application unit 201.
- FIG. 16 explains that the electron-emitting device having the configuration shown in FIG. 15 emits electrons at a low vacuum of 200 Pa or less even without force-bonding. I do.
- the periphery of the current emitting element is kept in a vacuum state by the vacuum chamber 211.
- a capacitor is connected between the drive electrode 202 and the voltage signal source 212.
- Sensors 2 13 are arranged in series.
- a phosphor 215 is provided on an electron capture electrode 214 facing the drive electrode 202 and the common electrode 203, and a bias voltage Vb is applied.
- the material of the drive electrode 202 and the common electrode 203 is both Au, the voltage Vk applied to the signal voltage source 212 is 160 V, and the capacitance of the capacitor 211 is 5 nF
- the bias voltage Vb is set to 300 V, the electric field applying section 201 is made of an electrostrictive material having a relative dielectric constant of 450, and the driving electrode 202 and the common electrode 203 are connected to each other.
- the width of the slit formed by the above is set to 10 m and the degree of vacuum inside the vacuum chamber 211 is set to 2 OOPa or less, the current Ic flowing through the electron capture electrode 2 14 becomes 1.2 A, Approximately 60% of the current I (2 A) flowing through the driving electrode 202 is extracted as an electron current, and the voltage V s between the driving electrode 202 and the common electrode 203 is That is, the voltage required for emitting electrons is 153 V. Note that the waveforms of the currents II 2 and I c and the voltage V s are shown by curves i-11 in FIG. 16B, respectively.
- electrons can be emitted at a very low degree of vacuum of 200 Pa or less. Since the size can be reduced, a narrow frame panel can be realized. Also, when the display is enlarged by arranging a plurality of panels, the joints between the panels are less noticeable. Furthermore, in the conventional FED, the gas generated from the phosphor or the like may reduce the degree of vacuum in the internal space of the FED, which may adversely affect the durability of the panel. According to the method, electrons can be emitted at a very low vacuum of 200 Pa or less, so that the adverse effect of the reduced vacuum inside the FED is greatly reduced, and the durability and reliability of the panel are reduced. The performance is greatly improved.
- the device is simpler It can be made simple and compact. Specifically, first, since the degree of vacuum in the internal space of the FED can be reduced, the structure for maintaining the housing against the pressure difference between the outside and the outside of the outer peripheral sealing portion of the FED should be simple and small. Can be. In addition, since the applied voltage required for emitting electrons and the bias voltage to be applied to the electron capture electrode can be made relatively low, the need for the FED to have a withstand voltage structure is eliminated. Can be made thinner.
- the bias voltage to be applied to the electron capture electrode may be 0 V.
- the electric field application section of the electron-emitting device according to the present invention special processing is not required as in the case of forming a Spindt-type electron emission element, and the electrodes and the electric field application section are formed by thick film printing. Since it can be formed, the electron-emitting device according to the present invention and the FED using the same can be manufactured at lower cost than before.
- the applied voltage required for emitting electrons and the bias voltage to be applied to the electron capture electrode can be made relatively low, a small and inexpensive drive IC having a relatively small withstand voltage can be used. Therefore, an FED using the field emission device according to the present invention can be manufactured at low cost.
- the electron-emitting device according to the present invention can be applied to other applications such as a backlight. Since the electron-emitting device according to the present invention can emit a relatively large amount of electron beams at a relatively low voltage, a small-sized and high-efficiency sterilizing device can be used instead of a conventional sterilizing device that mainly uses an ultraviolet radiation method. It is suitable for constituting a device.
- the electron-emitting device according to the present invention can employ any other electrode structure having a corner.
- a resistor can be arranged in series between the second electrode, that is, the common electrode and the DC offset voltage source.
- the electric field applying portions 51a and 51b are made of an anti-dielectric material.
- the electric field applying units 51 a and 51 b may be formed of at least one of a piezoelectric material, an electrostrictive material, and an anti-dielectric material.
- a piezoelectric material and / or an electrostrictive material for example, a material mainly composed of lead zirconate (PZ type), a material mainly composed of lead nickel niobate, and a major component composed of lead zinc niobate Materials, Lead manganese niobate-based material, Lead magnesium tantalate-based material, Nickel lead tantalate-based material, Lead antimonate-based material, Lead titanate A material containing a main component, a material containing magnesium lead tungstate as a main component, a material containing lead cobalt niobate as a main component, or a composite material containing any combination thereof can be used.
- zircon Ceramics containing lead acid are the most frequently used as piezoelectric and Z or electrostrictive materials.
- the piezoelectric material and Z or the electrostrictive material are ceramics
- the above materials include lanthanum, barium, niobium, zinc, cerium, cadmium, chromium, cobalt, antimony, iron, yttrium, tantalum, tungsten, nickel, manganese, Oxide such as lithium, strontium, bismuth, etc., or any combination of these or other appropriate compounds as appropriate material, for example, a material obtained by adding specified additives to the material so that it becomes PLZT-based Is also preferably used.
- piezoelectric materials and Z or electrostrictive materials materials mainly composed of a component composed of lead magnesium niobate, lead zirconate and lead titanate, lead nickel niobate, lead magnesium niobate and zirconate Material mainly composed of lead and lead titanate, material mainly composed of lead magnesium niobate, lead nickel tantalate, lead zirconate and lead titanate, lead magnesium tantalate and magnesium Materials whose main component is a component consisting of lead gnesium niobate, lead zirconate and lead titanate, and those in which part of the lead of these materials is replaced with strontium and / or lanthanum are preferably used.
- piezoelectric and Z or electrostrictive characteristics change depending on the composition of the components.
- lead magnesium niobate-zirconate which is preferably employed in the sixth embodiment
- the three-component materials of lead-monotitanate and the four-component materials of lead magnesium niobate-lead nickel nickel tantalate-lead titanate and lead magnesium tantalate-lead magnesium niobate-lead zirconate-lead titanate The composition near the phase boundary between the pseudocubic and tetrahedral crystals is preferred.
- magnesium niobium lead 15-50 mol%, lead zirconate: 10-45 mol%, lead titanate: 30-45 Mol%
- lead magnesium niobate 15-50 mol%, lead nickel tantalate: 10-40 mol%
- lead zirconate 10-45 mol%
- lead titanate 30-45 mol%
- Magnesium niobate Lead 15-50 mol%, lead magnesium tantalate: 10-40 mol%, lead zirconate: 10-45 mol%, lead titanate: 30-45 mol%
- high piezoelectric constant and term electromechanical coupling It is preferably adopted because it has a coefficient.
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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JP2002553207A JP3699451B2 (ja) | 2000-12-22 | 2001-12-20 | 電子放出素子及びそれを用いたフィールドエミッションディスプレイ |
EP01272270A EP1265263A4 (en) | 2000-12-22 | 2001-12-20 | ELECTRONIC TRANSMITTING ELEMENT AND USE IN A FIELD EMISSION DISPLAY |
Applications Claiming Priority (2)
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JP2000-390299 | 2000-12-22 | ||
JP2000390299 | 2000-12-22 |
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WO2002052600A1 true WO2002052600A1 (fr) | 2002-07-04 |
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PCT/JP2001/011195 WO2002052600A1 (fr) | 2000-12-22 | 2001-12-20 | Element d'emission electronique et utilisation dans un affichage a emission de champ |
Country Status (4)
Country | Link |
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US (1) | US7088049B2 (ja) |
EP (1) | EP1265263A4 (ja) |
JP (1) | JP3699451B2 (ja) |
WO (1) | WO2002052600A1 (ja) |
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4426125B1 (ja) * | 1967-03-20 | 1969-11-04 | ||
JPS4620944B1 (ja) * | 1968-01-20 | 1971-06-12 | ||
JPH01311533A (ja) * | 1988-06-10 | 1989-12-15 | Canon Inc | 電子放出素子及びそれを用いた電子放出装置並びに発光装置 |
JPH07147131A (ja) * | 1993-11-24 | 1995-06-06 | Tdk Corp | 冷陰極電子源の製造方法 |
JP2000285801A (ja) * | 1999-03-31 | 2000-10-13 | Canon Inc | 電子放出素子の製造方法、該電子放出素子を用いた電子源および画像形成装置 |
Family Cites Families (45)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3126158B2 (ja) * | 1991-04-10 | 2001-01-22 | 日本放送協会 | 薄膜冷陰極 |
US6313815B1 (en) * | 1991-06-06 | 2001-11-06 | Canon Kabushiki Kaisha | Electron source and production thereof and image-forming apparatus and production thereof |
US5453661A (en) * | 1994-04-15 | 1995-09-26 | Mcnc | Thin film ferroelectric flat panel display devices, and methods for operating and fabricating same |
US5831387A (en) * | 1994-05-20 | 1998-11-03 | Canon Kabushiki Kaisha | Image forming apparatus and a method for manufacturing the same |
US5508590A (en) * | 1994-10-28 | 1996-04-16 | The Regents Of The University Of California | Flat panel ferroelectric electron emission display system |
US5747926A (en) * | 1995-03-10 | 1998-05-05 | Kabushiki Kaisha Toshiba | Ferroelectric cold cathode |
JPH08264105A (ja) * | 1995-03-27 | 1996-10-11 | Kanebo Ltd | 強誘電体電子放出冷陰極 |
JPH0927273A (ja) * | 1995-07-12 | 1997-01-28 | Canon Inc | 電子放出素子、電子源、及びこれを用いた画像形成装置とそれらの製造方法 |
JPH0945226A (ja) * | 1995-07-31 | 1997-02-14 | Canon Inc | 電子放出素子、それを用いた電子源並びに画像形成装置と、それらの製造方法 |
US5666019A (en) * | 1995-09-06 | 1997-09-09 | Advanced Vision Technologies, Inc. | High-frequency field-emission device |
JPH0990882A (ja) * | 1995-09-20 | 1997-04-04 | Komatsu Ltd | 発光表示素子 |
JP3376220B2 (ja) * | 1995-10-03 | 2003-02-10 | キヤノン株式会社 | 画像形成装置とその製造方法 |
KR100369066B1 (ko) * | 1995-12-29 | 2003-03-28 | 삼성에스디아이 주식회사 | 강유전성에미터를적용한음극구조체및이를적용한전자총과음극선관 |
US5729094A (en) * | 1996-04-15 | 1998-03-17 | Massachusetts Institute Of Technology | Energetic-electron emitters |
JP3320333B2 (ja) * | 1996-04-30 | 2002-09-03 | キヤノン株式会社 | 電子放出装置、それを用いた画像形成装置及びそれらの製造方法 |
JP2907113B2 (ja) * | 1996-05-08 | 1999-06-21 | 日本電気株式会社 | 電子ビーム装置 |
US5726524A (en) * | 1996-05-31 | 1998-03-10 | Minnesota Mining And Manufacturing Company | Field emission device having nanostructured emitters |
US5818166A (en) * | 1996-07-03 | 1998-10-06 | Si Diamond Technology, Inc. | Field emission device with edge emitter and method for making |
TW353758B (en) * | 1996-09-30 | 1999-03-01 | Motorola Inc | Electron emissive film and method |
CN1154148C (zh) * | 1996-10-07 | 2004-06-16 | 佳能株式会社 | 图象形成装置及其驱动方法 |
DE19651552A1 (de) * | 1996-12-11 | 1998-06-18 | Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh | Kaltkathode für Entladungslampen, Entladungslampe mit dieser Kaltkathode und Betriebsweise für diese Entladungslampe |
JP2950274B2 (ja) * | 1997-01-28 | 1999-09-20 | 日本電気株式会社 | 電界放出型冷陰極素子の駆動方法及び電界放出型冷陰極電子銃 |
US5990605A (en) * | 1997-03-25 | 1999-11-23 | Pioneer Electronic Corporation | Electron emission device and display device using the same |
JP3570864B2 (ja) * | 1997-08-08 | 2004-09-29 | パイオニア株式会社 | 電子放出素子及びこれを用いた表示装置 |
EP0935274B1 (en) * | 1997-08-27 | 2003-10-01 | Matsushita Electric Industrial Co., Ltd. | Electron emitting device, field emission display, and method of producing the same |
JPH11213866A (ja) * | 1998-01-22 | 1999-08-06 | Sony Corp | 電子放出装置及びその製造方法並びにこれを用いた表示装置 |
JPH11317149A (ja) * | 1998-05-01 | 1999-11-16 | Canon Inc | 電子放出素子及びその製造方法 |
US6285123B1 (en) * | 1998-09-11 | 2001-09-04 | Pioneer Corporation | Electron emission device with specific island-like regions |
JP3293571B2 (ja) * | 1998-10-28 | 2002-06-17 | 日本電気株式会社 | 電界放出型冷陰極素子及びその駆動方法並びにそれらを用いた画像表示装置 |
FR2789221B1 (fr) * | 1999-01-29 | 2001-04-06 | Univ Nantes | Corps de cathode pour l'emission d'electrons |
JP3382172B2 (ja) * | 1999-02-04 | 2003-03-04 | 株式会社日立製作所 | 横型絶縁ゲートバイポーラトランジスタ |
US6198225B1 (en) * | 1999-06-07 | 2001-03-06 | Symetrix Corporation | Ferroelectric flat panel displays |
JP2001052652A (ja) * | 1999-06-18 | 2001-02-23 | Cheol Jin Lee | 白色光源及びその製造方法 |
EP1073090A3 (en) | 1999-07-27 | 2003-04-16 | Iljin Nanotech Co., Ltd. | Field emission display device using carbon nanotubes and manufacturing method thereof |
US6359383B1 (en) * | 1999-08-19 | 2002-03-19 | Industrial Technology Research Institute | Field emission display device equipped with nanotube emitters and method for fabricating |
US6452309B1 (en) * | 1999-10-01 | 2002-09-17 | Ngk Insulators, Ltd. | Piezoelectric/electrostrictive device |
US6396193B1 (en) * | 1999-10-01 | 2002-05-28 | Ngk Insulators, Ltd. | Piezoelectric/electrostrictive device having mutually opposing thin plate portions |
US6426590B1 (en) * | 2000-01-13 | 2002-07-30 | Industrial Technology Research Institute | Planar color lamp with nanotube emitters and method for fabricating |
US6445122B1 (en) * | 2000-02-22 | 2002-09-03 | Industrial Technology Research Institute | Field emission display panel having cathode and anode on the same panel substrate |
US6479924B1 (en) * | 2000-08-11 | 2002-11-12 | Samsung Electronics Co., Ltd. | Ferroelectric emitter |
US6545421B1 (en) * | 2000-08-28 | 2003-04-08 | Ngk Insulators, Ltd. | Current controlling element |
US6476336B1 (en) * | 2000-08-28 | 2002-11-05 | Ngk Insulators, Ltd. | Current controlling element |
JP3639808B2 (ja) * | 2000-09-01 | 2005-04-20 | キヤノン株式会社 | 電子放出素子及び電子源及び画像形成装置及び電子放出素子の製造方法 |
JP2002169507A (ja) * | 2000-11-30 | 2002-06-14 | Fujitsu Ltd | プラズマディスプレイパネル及びその駆動方法 |
WO2002052600A1 (fr) | 2000-12-22 | 2002-07-04 | Ngk Insulators, Ltd. | Element d'emission electronique et utilisation dans un affichage a emission de champ |
-
2001
- 2001-12-20 WO PCT/JP2001/011195 patent/WO2002052600A1/ja active Application Filing
- 2001-12-20 EP EP01272270A patent/EP1265263A4/en not_active Withdrawn
- 2001-12-20 JP JP2002553207A patent/JP3699451B2/ja not_active Expired - Fee Related
- 2001-12-20 US US10/027,232 patent/US7088049B2/en not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4426125B1 (ja) * | 1967-03-20 | 1969-11-04 | ||
JPS4620944B1 (ja) * | 1968-01-20 | 1971-06-12 | ||
JPH01311533A (ja) * | 1988-06-10 | 1989-12-15 | Canon Inc | 電子放出素子及びそれを用いた電子放出装置並びに発光装置 |
JPH07147131A (ja) * | 1993-11-24 | 1995-06-06 | Tdk Corp | 冷陰極電子源の製造方法 |
JP2000285801A (ja) * | 1999-03-31 | 2000-10-13 | Canon Inc | 電子放出素子の製造方法、該電子放出素子を用いた電子源および画像形成装置 |
Non-Patent Citations (1)
Title |
---|
See also references of EP1265263A4 * |
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US7379037B2 (en) | 2003-03-26 | 2008-05-27 | Ngk Insulators, Ltd. | Display apparatus, method of driving display apparatus, electron emitter, method of driving electron emitter, apparatus for driving electron emitter, electron emission apparatus, and method of driving electron emission apparatus |
US7474060B2 (en) | 2003-08-22 | 2009-01-06 | Ngk Insulators, Ltd. | Light source |
US7176609B2 (en) | 2003-10-03 | 2007-02-13 | Ngk Insulators, Ltd. | High emission low voltage electron emitter |
US7336026B2 (en) | 2003-10-03 | 2008-02-26 | Ngk Insulators, Ltd. | High efficiency dielectric electron emitter |
US7307383B2 (en) | 2003-10-03 | 2007-12-11 | Ngk Insulators, Ltd. | Electron emitter and method of producing the same |
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JPWO2002052600A1 (ja) | 2004-04-30 |
US20020153827A1 (en) | 2002-10-24 |
EP1265263A4 (en) | 2006-11-08 |
JP3699451B2 (ja) | 2005-09-28 |
EP1265263A1 (en) | 2002-12-11 |
US7088049B2 (en) | 2006-08-08 |
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