WO2002060011B1 - Connector molding method and shielded waferized connector made therefrom - Google Patents

Connector molding method and shielded waferized connector made therefrom

Info

Publication number
WO2002060011B1
WO2002060011B1 PCT/US2002/001883 US0201883W WO02060011B1 WO 2002060011 B1 WO2002060011 B1 WO 2002060011B1 US 0201883 W US0201883 W US 0201883W WO 02060011 B1 WO02060011 B1 WO 02060011B1
Authority
WO
WIPO (PCT)
Prior art keywords
connector
housing
shield plates
signal contacts
piece
Prior art date
Application number
PCT/US2002/001883
Other languages
French (fr)
Other versions
WO2002060011A3 (en
WO2002060011A2 (en
Inventor
Allan L Astbury Jr
Thomas S Cohen
Original Assignee
Teradyne Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Teradyne Inc filed Critical Teradyne Inc
Priority to JP2002560236A priority Critical patent/JP4221466B2/en
Priority to EP02720835A priority patent/EP1356550B1/en
Priority to MXPA03006690A priority patent/MXPA03006690A/en
Priority to AU2002251809A priority patent/AU2002251809A1/en
Priority to DE60216728T priority patent/DE60216728T2/en
Priority to CA002435759A priority patent/CA2435759A1/en
Publication of WO2002060011A2 publication Critical patent/WO2002060011A2/en
Publication of WO2002060011A3 publication Critical patent/WO2002060011A3/en
Publication of WO2002060011B1 publication Critical patent/WO2002060011B1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6581—Shield structure
    • H01R13/6585—Shielding material individually surrounding or interposed between mutually spaced contacts
    • H01R13/6586—Shielding material individually surrounding or interposed between mutually spaced contacts for separating multiple connector modules
    • H01R13/6587—Shielding material individually surrounding or interposed between mutually spaced contacts for separating multiple connector modules for mounting on PCBs

Abstract

A high speed, high density electrical connector. The connector is assembled from wafers. Each wafer is formed by molding a first dielectric housing over a shield plate. Signal contacts are inserted into the first dielectric housing and a second housing is overmolded on the first housing. Features are employed to lock the first and second housings together with the shield plate to provide a mechanically robust subassembly. The connector as formed has a good electrical properties, including precise impedance control and low cross talk.

Claims

AMENDED CLAIMS
[received by the International Bureau on 24 June 2003 (24.06.03)
inserting signal contacts.
11. An electrical connector having a first piece attachable to a first printed circuit board and a second intermateable piece attachable to a second printed circuit board, the first connector piece comprising: a) a first housing having opposing side walls; b) a plurality of blades disposed in rows parallel to the opposing side walls; c) a plurality of first shield plates disposed between adjacent rows of blades, each of the shield plates having a flat portion and a plurality of slots; the second connector piece comprising: a) a second housing having a mating face with a plurality of openings therein, each of the openings aligned with one of the blades from the first connector piece; b) a plurality of signal contacts each having a mating portion accessible within one of the openings; c) a plurality of second shield plates disposed within the second housing perpendicular to the shield plates in the first connector piece, each of the shield plates having a slot formed therein, the slots positioned to engage one of the plurality of first shield plates; d) wherein the second housing is shaped to expose portions of the second shield plates adjacent the slots in the second shield plate, whereby the slots of the first shield plates engage the exposed portions.
12. The electrical connector of claim 11 wherein the second connector piece is assembled from a plurality of wafers, each wafer comprising a shield plate, a portion of the second housing and a column of signal contacts.
13. The electrical connector of claim 12 wherein the portion of the second housing in each wafer comprises a first portion molded around the shield plate to leave a cavity with the signal contacts disposed within the cavity and a second portion molded in the cavity.
24
PCT/US2002/001883 2001-01-25 2002-01-23 Connector molding method and shielded waferized connector made therefrom WO2002060011A2 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2002560236A JP4221466B2 (en) 2001-01-25 2002-01-23 Connector molding method and shielded wafer type connector made by the same method
EP02720835A EP1356550B1 (en) 2001-01-25 2002-01-23 Connector moulding method and shielded waferized connector made therefrom
MXPA03006690A MXPA03006690A (en) 2001-01-25 2002-01-23 Connector molding method and shielded waferized connector made therefrom.
AU2002251809A AU2002251809A1 (en) 2001-01-25 2002-01-23 Connector molding method and shielded waferized connector made therefrom
DE60216728T DE60216728T2 (en) 2001-01-25 2002-01-23 Connector molding method and shielded connector of panel type
CA002435759A CA2435759A1 (en) 2001-01-25 2002-01-23 Connector molding method and shielded waferized connector made therefrom

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/769,868 2001-01-25
US09/769,868 US6409543B1 (en) 2001-01-25 2001-01-25 Connector molding method and shielded waferized connector made therefrom

Publications (3)

Publication Number Publication Date
WO2002060011A2 WO2002060011A2 (en) 2002-08-01
WO2002060011A3 WO2002060011A3 (en) 2003-07-24
WO2002060011B1 true WO2002060011B1 (en) 2003-11-06

Family

ID=25086752

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2002/001883 WO2002060011A2 (en) 2001-01-25 2002-01-23 Connector molding method and shielded waferized connector made therefrom

Country Status (10)

Country Link
US (2) US6409543B1 (en)
EP (1) EP1356550B1 (en)
JP (1) JP4221466B2 (en)
CN (1) CN1295819C (en)
AU (1) AU2002251809A1 (en)
CA (1) CA2435759A1 (en)
DE (1) DE60216728T2 (en)
MX (1) MXPA03006690A (en)
TW (1) TW595052B (en)
WO (1) WO2002060011A2 (en)

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US6409543B1 (en) 2002-06-25
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US6602095B2 (en) 2003-08-05
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MXPA03006690A (en) 2004-05-31
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