WO2002064315A1 - Polishing disk with end-point detection port - Google Patents
Polishing disk with end-point detection port Download PDFInfo
- Publication number
- WO2002064315A1 WO2002064315A1 PCT/US2002/004587 US0204587W WO02064315A1 WO 2002064315 A1 WO2002064315 A1 WO 2002064315A1 US 0204587 W US0204587 W US 0204587W WO 02064315 A1 WO02064315 A1 WO 02064315A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- polishing
- poushing
- disk
- drainage channel
- substrate
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/013—Devices or means for detecting lapping completion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
- B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU2002306506A AU2002306506A1 (en) | 2001-02-16 | 2002-02-05 | Polishing disk with end-point detection port |
JP2002564089A JP4369122B2 (en) | 2001-02-16 | 2002-02-05 | Polishing pad and polishing pad manufacturing method |
EP02740116A EP1368157B1 (en) | 2001-02-16 | 2002-02-05 | Polishing disk with end-point detection port |
DE60201515T DE60201515T2 (en) | 2001-02-16 | 2002-02-05 | POLISHING DISC WITH END POINT MOUNTING OPENING |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/788,082 | 2001-02-16 | ||
US09/788,082 US6623331B2 (en) | 2001-02-16 | 2001-02-16 | Polishing disk with end-point detection port |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2002064315A1 true WO2002064315A1 (en) | 2002-08-22 |
WO2002064315A8 WO2002064315A8 (en) | 2004-04-08 |
Family
ID=25143403
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2002/004587 WO2002064315A1 (en) | 2001-02-16 | 2002-02-05 | Polishing disk with end-point detection port |
Country Status (8)
Country | Link |
---|---|
US (1) | US6623331B2 (en) |
EP (1) | EP1368157B1 (en) |
JP (1) | JP4369122B2 (en) |
CN (1) | CN100503168C (en) |
AU (1) | AU2002306506A1 (en) |
DE (1) | DE60201515T2 (en) |
TW (1) | TWI222389B (en) |
WO (1) | WO2002064315A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006005358A (en) * | 2004-06-16 | 2006-01-05 | Rohm & Haas Electronic Materials Cmp Holdings Inc | Polishing pad having pressure-relief channel |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8485862B2 (en) | 2000-05-19 | 2013-07-16 | Applied Materials, Inc. | Polishing pad for endpoint detection and related methods |
US6599765B1 (en) * | 2001-12-12 | 2003-07-29 | Lam Research Corporation | Apparatus and method for providing a signal port in a polishing pad for optical endpoint detection |
US7001242B2 (en) | 2002-02-06 | 2006-02-21 | Applied Materials, Inc. | Method and apparatus of eddy current monitoring for chemical mechanical polishing |
US6913514B2 (en) * | 2003-03-14 | 2005-07-05 | Ebara Technologies, Inc. | Chemical mechanical polishing endpoint detection system and method |
US7354334B1 (en) * | 2004-05-07 | 2008-04-08 | Applied Materials, Inc. | Reducing polishing pad deformation |
US7018581B2 (en) | 2004-06-10 | 2006-03-28 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method of forming a polishing pad with reduced stress window |
US20060286906A1 (en) * | 2005-06-21 | 2006-12-21 | Cabot Microelectronics Corporation | Polishing pad comprising magnetically sensitive particles and method for the use thereof |
US20060291530A1 (en) * | 2005-06-23 | 2006-12-28 | Alexander Tregub | Treatment of CMP pad window to improve transmittance |
US20070037487A1 (en) * | 2005-08-10 | 2007-02-15 | Kuo Charles C | Polishing pad having a sealed pressure relief channel |
TWI287486B (en) * | 2006-05-04 | 2007-10-01 | Iv Technologies Co Ltd | Polishing pad and method thereof |
US7678700B2 (en) * | 2006-09-05 | 2010-03-16 | Cabot Microelectronics Corporation | Silicon carbide polishing method utilizing water-soluble oxidizers |
US7998866B2 (en) * | 2006-09-05 | 2011-08-16 | Cabot Microelectronics Corporation | Silicon carbide polishing method utilizing water-soluble oxidizers |
US7455571B1 (en) | 2007-06-20 | 2008-11-25 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Window polishing pad |
US9017140B2 (en) | 2010-01-13 | 2015-04-28 | Nexplanar Corporation | CMP pad with local area transparency |
CN102133734B (en) * | 2010-01-21 | 2015-02-04 | 智胜科技股份有限公司 | Grinding pad with detecting window and manufacturing method thereof |
US9156124B2 (en) | 2010-07-08 | 2015-10-13 | Nexplanar Corporation | Soft polishing pad for polishing a semiconductor substrate |
CN102441839B (en) * | 2011-11-11 | 2014-06-04 | 上海华力微电子有限公司 | Method for improving CMP (chemical mechanical polishing) process stability of polishing materials on polishing pad |
US20140120802A1 (en) * | 2012-10-31 | 2014-05-01 | Wayne O. Duescher | Abrasive platen wafer surface optical monitoring system |
TWI518176B (en) * | 2015-01-12 | 2016-01-21 | 三芳化學工業股份有限公司 | Polishing pad and method for making the same |
US9475168B2 (en) | 2015-03-26 | 2016-10-25 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad window |
US10569383B2 (en) * | 2017-09-15 | 2020-02-25 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Flanged optical endpoint detection windows and CMP polishing pads containing them |
JP7162465B2 (en) | 2018-08-06 | 2022-10-28 | 株式会社荏原製作所 | Polishing device and polishing method |
JP7083722B2 (en) * | 2018-08-06 | 2022-06-13 | 株式会社荏原製作所 | Polishing equipment and polishing method |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6014218A (en) * | 1997-12-03 | 2000-01-11 | Siemens Aktiengesellschaft | Device and method for end-point monitoring used in the polishing of components, in particular semiconductor components |
US6095902A (en) * | 1998-09-23 | 2000-08-01 | Rodel Holdings, Inc. | Polyether-polyester polyurethane polishing pads and related methods |
US6106728A (en) * | 1997-06-23 | 2000-08-22 | Iida; Shinya | Slurry recycling system and method for CMP apparatus |
US6142857A (en) * | 1998-01-06 | 2000-11-07 | Speedfam-Ipec Corporation | Wafer polishing with improved backing arrangement |
Family Cites Families (55)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4317698A (en) | 1980-11-13 | 1982-03-02 | Applied Process Technology, Inc. | End point detection in etching wafers and the like |
DE3132028A1 (en) | 1981-08-13 | 1983-03-03 | Roehm Gmbh | IMPROVED POLISHING PLATES FOR POLISHING PLASTIC SURFACES |
US4462860A (en) | 1982-05-24 | 1984-07-31 | At&T Bell Laboratories | End point detection |
US4611919A (en) | 1984-03-09 | 1986-09-16 | Tegal Corporation | Process monitor and method thereof |
JPS60242975A (en) | 1984-05-14 | 1985-12-02 | Kanebo Ltd | Surface grinding device |
US4660979A (en) | 1984-08-17 | 1987-04-28 | At&T Technologies, Inc. | Method and apparatus for automatically measuring semiconductor etching process parameters |
US4674236A (en) | 1985-05-13 | 1987-06-23 | Toshiba Machine Co., Ltd. | Polishing machine and method of attaching emery cloth to the polishing machine |
JPS63147327A (en) | 1986-12-10 | 1988-06-20 | Dainippon Screen Mfg Co Ltd | Detection of end point during surface treatment |
US4851311A (en) | 1987-12-17 | 1989-07-25 | Texas Instruments Incorporated | Process for determining photoresist develop time by optical transmission |
US4826563A (en) | 1988-04-14 | 1989-05-02 | Honeywell Inc. | Chemical polishing process and apparatus |
JPH0252205A (en) | 1988-08-17 | 1990-02-21 | Dainippon Screen Mfg Co Ltd | Film thickness measuring method |
JPH02137852A (en) | 1988-11-18 | 1990-05-28 | Dainippon Screen Mfg Co Ltd | Development end point detecting method for photoresist |
US5229303A (en) | 1989-08-29 | 1993-07-20 | At&T Bell Laboratories | Device processing involving an optical interferometric thermometry using the change in refractive index to measure semiconductor wafer temperature |
US5166080A (en) | 1991-04-29 | 1992-11-24 | Luxtron Corporation | Techniques for measuring the thickness of a film formed on a substrate |
US5076024A (en) | 1990-08-24 | 1991-12-31 | Intelmatec Corporation | Disk polisher assembly |
US5270222A (en) | 1990-12-31 | 1993-12-14 | Texas Instruments Incorporated | Method and apparatus for semiconductor device fabrication diagnosis and prognosis |
US5189490A (en) | 1991-09-27 | 1993-02-23 | University Of Hartford | Method and apparatus for surface roughness measurement using laser diffraction pattern |
US5499733A (en) | 1992-09-17 | 1996-03-19 | Luxtron Corporation | Optical techniques of measuring endpoint during the processing of material layers in an optically hostile environment |
US5733171A (en) | 1996-07-18 | 1998-03-31 | Speedfam Corporation | Apparatus for the in-process detection of workpieces in a CMP environment |
US5433650A (en) | 1993-05-03 | 1995-07-18 | Motorola, Inc. | Method for polishing a substrate |
JP3326443B2 (en) | 1993-08-10 | 2002-09-24 | 株式会社ニコン | Wafer polishing method and apparatus therefor |
US5891352A (en) | 1993-09-16 | 1999-04-06 | Luxtron Corporation | Optical techniques of measuring endpoint during the processing of material layers in an optically hostile environment |
US5441598A (en) | 1993-12-16 | 1995-08-15 | Motorola, Inc. | Polishing pad for chemical-mechanical polishing of a semiconductor substrate |
US5433651A (en) | 1993-12-22 | 1995-07-18 | International Business Machines Corporation | In-situ endpoint detection and process monitoring method and apparatus for chemical-mechanical polishing |
US5413941A (en) | 1994-01-06 | 1995-05-09 | Micron Technology, Inc. | Optical end point detection methods in semiconductor planarizing polishing processes |
JPH08316279A (en) | 1995-02-14 | 1996-11-29 | Internatl Business Mach Corp <Ibm> | Thickness measuring method for semiconductor base body and its measurement device |
US5893796A (en) | 1995-03-28 | 1999-04-13 | Applied Materials, Inc. | Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus |
US5533923A (en) | 1995-04-10 | 1996-07-09 | Applied Materials, Inc. | Chemical-mechanical polishing pad providing polishing unformity |
IL113829A (en) | 1995-05-23 | 2000-12-06 | Nova Measuring Instr Ltd | Apparatus for optical inspection of wafers during polishing |
JP3042593B2 (en) * | 1995-10-25 | 2000-05-15 | 日本電気株式会社 | Polishing pad |
US5695601A (en) | 1995-12-27 | 1997-12-09 | Kabushiki Kaisha Toshiba | Method for planarizing a semiconductor body by CMP method and an apparatus for manufacturing a semiconductor device using the method |
US5681216A (en) | 1996-02-06 | 1997-10-28 | Elantec, Inc. | High precision polishing tool |
US6074287A (en) | 1996-04-12 | 2000-06-13 | Nikon Corporation | Semiconductor wafer polishing apparatus |
US5800248A (en) | 1996-04-26 | 1998-09-01 | Ontrak Systems Inc. | Control of chemical-mechanical polishing rate across a substrate surface |
US5910846A (en) | 1996-05-16 | 1999-06-08 | Micron Technology, Inc. | Method and apparatus for detecting the endpoint in chemical-mechanical polishing of semiconductor wafers |
US5663797A (en) | 1996-05-16 | 1997-09-02 | Micron Technology, Inc. | Method and apparatus for detecting the endpoint in chemical-mechanical polishing of semiconductor wafers |
JP2865061B2 (en) | 1996-06-27 | 1999-03-08 | 日本電気株式会社 | Polishing pad, polishing apparatus, and semiconductor device manufacturing method |
US5645469A (en) | 1996-09-06 | 1997-07-08 | Advanced Micro Devices, Inc. | Polishing pad with radially extending tapered channels |
US5795218A (en) | 1996-09-30 | 1998-08-18 | Micron Technology, Inc. | Polishing pad with elongated microcolumns |
US5674116A (en) | 1996-10-09 | 1997-10-07 | Cmi International Inc. | Disc with coolant passages for an abrasive machining assembly |
US6246098B1 (en) | 1996-12-31 | 2001-06-12 | Intel Corporation | Apparatus for reducing reflections off the surface of a semiconductor surface |
US5838448A (en) | 1997-03-11 | 1998-11-17 | Nikon Corporation | CMP variable angle in situ sensor |
US6102775A (en) | 1997-04-18 | 2000-08-15 | Nikon Corporation | Film inspection method |
DE19720623C1 (en) | 1997-05-16 | 1998-11-05 | Siemens Ag | Polishing device for semiconductor substrate |
US6108091A (en) | 1997-05-28 | 2000-08-22 | Lam Research Corporation | Method and apparatus for in-situ monitoring of thickness during chemical-mechanical polishing |
US6146248A (en) * | 1997-05-28 | 2000-11-14 | Lam Research Corporation | Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher |
US5882251A (en) | 1997-08-19 | 1999-03-16 | Lsi Logic Corporation | Chemical mechanical polishing pad slurry distribution grooves |
US5963781A (en) | 1997-09-30 | 1999-10-05 | Intel Corporation | Technique for determining semiconductor substrate thickness |
US5972162A (en) | 1998-01-06 | 1999-10-26 | Speedfam Corporation | Wafer polishing with improved end point detection |
JPH11254298A (en) * | 1998-03-06 | 1999-09-21 | Speedfam Co Ltd | Slurry circulation supplying type surface polishing device |
US6068539A (en) | 1998-03-10 | 2000-05-30 | Lam Research Corporation | Wafer polishing device with movable window |
US6106662A (en) * | 1998-06-08 | 2000-08-22 | Speedfam-Ipec Corporation | Method and apparatus for endpoint detection for chemical mechanical polishing |
US6146242A (en) * | 1999-06-11 | 2000-11-14 | Strasbaugh, Inc. | Optical view port for chemical mechanical planarization endpoint detection |
US6077147A (en) | 1999-06-19 | 2000-06-20 | United Microelectronics Corporation | Chemical-mechanical polishing station with end-point monitoring device |
JP3508747B2 (en) | 2001-08-08 | 2004-03-22 | 株式会社ニコン | Polishing pad and wafer polishing apparatus |
-
2001
- 2001-02-16 US US09/788,082 patent/US6623331B2/en not_active Expired - Lifetime
- 2001-12-31 TW TW090133214A patent/TWI222389B/en not_active IP Right Cessation
-
2002
- 2002-02-05 EP EP02740116A patent/EP1368157B1/en not_active Expired - Lifetime
- 2002-02-05 DE DE60201515T patent/DE60201515T2/en not_active Expired - Lifetime
- 2002-02-05 JP JP2002564089A patent/JP4369122B2/en not_active Expired - Fee Related
- 2002-02-05 WO PCT/US2002/004587 patent/WO2002064315A1/en active IP Right Grant
- 2002-02-05 CN CNB028034600A patent/CN100503168C/en not_active Expired - Fee Related
- 2002-02-05 AU AU2002306506A patent/AU2002306506A1/en not_active Abandoned
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6106728A (en) * | 1997-06-23 | 2000-08-22 | Iida; Shinya | Slurry recycling system and method for CMP apparatus |
US6014218A (en) * | 1997-12-03 | 2000-01-11 | Siemens Aktiengesellschaft | Device and method for end-point monitoring used in the polishing of components, in particular semiconductor components |
US6142857A (en) * | 1998-01-06 | 2000-11-07 | Speedfam-Ipec Corporation | Wafer polishing with improved backing arrangement |
US6095902A (en) * | 1998-09-23 | 2000-08-01 | Rodel Holdings, Inc. | Polyether-polyester polyurethane polishing pads and related methods |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006005358A (en) * | 2004-06-16 | 2006-01-05 | Rohm & Haas Electronic Materials Cmp Holdings Inc | Polishing pad having pressure-relief channel |
Also Published As
Publication number | Publication date |
---|---|
EP1368157A1 (en) | 2003-12-10 |
JP2004522598A (en) | 2004-07-29 |
DE60201515D1 (en) | 2004-11-11 |
US6623331B2 (en) | 2003-09-23 |
US20020115379A1 (en) | 2002-08-22 |
AU2002306506A1 (en) | 2002-08-28 |
EP1368157B1 (en) | 2004-10-06 |
JP4369122B2 (en) | 2009-11-18 |
TWI222389B (en) | 2004-10-21 |
DE60201515T2 (en) | 2005-02-03 |
CN100503168C (en) | 2009-06-24 |
CN1484568A (en) | 2004-03-24 |
WO2002064315A8 (en) | 2004-04-08 |
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