WO2002067302A3 - Rhodium-rich oxygen barriers - Google Patents
Rhodium-rich oxygen barriers Download PDFInfo
- Publication number
- WO2002067302A3 WO2002067302A3 PCT/US2002/004090 US0204090W WO02067302A3 WO 2002067302 A3 WO2002067302 A3 WO 2002067302A3 US 0204090 W US0204090 W US 0204090W WO 02067302 A3 WO02067302 A3 WO 02067302A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- rhodium
- capacitor
- rich oxygen
- oxygen barriers
- rich structure
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
- H01L28/40—Capacitors
- H01L28/60—Electrodes
- H01L28/75—Electrodes comprising two or more layers, e.g. comprising a barrier layer and a metal layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
- H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
- H01L21/28512—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic System
- H01L21/28568—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic System the conductive layers comprising transition metals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
- H01L28/40—Capacitors
- H01L28/55—Capacitors with a dielectric comprising a perovskite structure material
Abstract
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020037010896A KR100610303B1 (en) | 2001-02-20 | 2002-02-11 | Rhodium-rich oxygen barriers |
DE60216241T DE60216241T2 (en) | 2001-02-20 | 2002-02-11 | RHODIUM-RICH OXYGEN BARRIER |
JP2002566534A JP4399521B2 (en) | 2001-02-20 | 2002-02-11 | Capacitor, capacitor electrode, integrated circuit capacitor, and manufacturing method thereof |
EP02742467A EP1368822B1 (en) | 2001-02-20 | 2002-02-11 | Rhodium-rich oxygen barriers |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/789,335 US6518610B2 (en) | 2001-02-20 | 2001-02-20 | Rhodium-rich oxygen barriers |
US09/789,335 | 2001-02-20 |
Publications (3)
Publication Number | Publication Date |
---|---|
WO2002067302A2 WO2002067302A2 (en) | 2002-08-29 |
WO2002067302A3 true WO2002067302A3 (en) | 2003-10-16 |
WO2002067302A8 WO2002067302A8 (en) | 2004-06-03 |
Family
ID=25147325
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2002/004090 WO2002067302A2 (en) | 2001-02-20 | 2002-02-11 | Rhodium-rich oxygen barriers |
Country Status (8)
Country | Link |
---|---|
US (4) | US6518610B2 (en) |
EP (1) | EP1368822B1 (en) |
JP (1) | JP4399521B2 (en) |
KR (1) | KR100610303B1 (en) |
CN (1) | CN100373543C (en) |
AT (1) | ATE346377T1 (en) |
DE (1) | DE60216241T2 (en) |
WO (1) | WO2002067302A2 (en) |
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US6518610B2 (en) * | 2001-02-20 | 2003-02-11 | Micron Technology, Inc. | Rhodium-rich oxygen barriers |
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US7192892B2 (en) * | 2003-03-04 | 2007-03-20 | Micron Technology, Inc. | Atomic layer deposited dielectric layers |
US6900502B2 (en) * | 2003-04-03 | 2005-05-31 | Taiwan Semiconductor Manufacturing Company, Ltd. | Strained channel on insulator device |
JP4563655B2 (en) * | 2003-04-23 | 2010-10-13 | 株式会社日立製作所 | Semiconductor device and manufacturing method thereof |
US6882025B2 (en) * | 2003-04-25 | 2005-04-19 | Taiwan Semiconductor Manufacturing Company, Ltd. | Strained-channel transistor and methods of manufacture |
US6867433B2 (en) | 2003-04-30 | 2005-03-15 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor-on-insulator chip incorporating strained-channel partially-depleted, fully-depleted, and multiple-gate transistors |
US7192824B2 (en) * | 2003-06-24 | 2007-03-20 | Micron Technology, Inc. | Lanthanide oxide / hafnium oxide dielectric layers |
US20050012087A1 (en) * | 2003-07-15 | 2005-01-20 | Yi-Ming Sheu | Self-aligned MOSFET having an oxide region below the channel |
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US7078742B2 (en) | 2003-07-25 | 2006-07-18 | Taiwan Semiconductor Manufacturing Co., Ltd. | Strained-channel semiconductor structure and method of fabricating the same |
US6936881B2 (en) * | 2003-07-25 | 2005-08-30 | Taiwan Semiconductor Manufacturing Company, Ltd. | Capacitor that includes high permittivity capacitor dielectric |
US7101742B2 (en) * | 2003-08-12 | 2006-09-05 | Taiwan Semiconductor Manufacturing Company, Ltd. | Strained channel complementary field-effect transistors and methods of manufacture |
US20050035410A1 (en) * | 2003-08-15 | 2005-02-17 | Yee-Chia Yeo | Semiconductor diode with reduced leakage |
US20050035369A1 (en) * | 2003-08-15 | 2005-02-17 | Chun-Chieh Lin | Structure and method of forming integrated circuits utilizing strained channel transistors |
US7112495B2 (en) * | 2003-08-15 | 2006-09-26 | Taiwan Semiconductor Manufacturing Company, Ltd. | Structure and method of a strained channel transistor and a second semiconductor component in an integrated circuit |
US7071052B2 (en) * | 2003-08-18 | 2006-07-04 | Taiwan Semiconductor Manufacturing Company, Ltd. | Resistor with reduced leakage |
US7888201B2 (en) | 2003-11-04 | 2011-02-15 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor-on-insulator SRAM configured using partially-depleted and fully-depleted transistors |
KR100552704B1 (en) * | 2003-12-17 | 2006-02-20 | 삼성전자주식회사 | Non-volatile capacitor of semiconductor device, semiconductor memory device comprising the same and method of operating the memory device |
US8513634B2 (en) * | 2003-12-17 | 2013-08-20 | Samsung Electronics Co., Ltd. | Nonvolatile data storage, semicoductor memory device including nonvolatile data storage and method of forming the same |
US20050186722A1 (en) * | 2004-02-25 | 2005-08-25 | Kuan-Lun Cheng | Method and structure for CMOS device with stress relaxed by ion implantation of carbon or oxygen containing ions |
US20050266632A1 (en) * | 2004-05-26 | 2005-12-01 | Yun-Hsiu Chen | Integrated circuit with strained and non-strained transistors, and method of forming thereof |
US20060151822A1 (en) * | 2005-01-07 | 2006-07-13 | Shrinivas Govindarajan | DRAM with high K dielectric storage capacitor and method of making the same |
US7316962B2 (en) * | 2005-01-07 | 2008-01-08 | Infineon Technologies Ag | High dielectric constant materials |
US7687409B2 (en) | 2005-03-29 | 2010-03-30 | Micron Technology, Inc. | Atomic layer deposited titanium silicon oxide films |
US20060228855A1 (en) * | 2005-03-29 | 2006-10-12 | Intel Corporation | Capacitor with co-planar electrodes |
US7662729B2 (en) | 2005-04-28 | 2010-02-16 | Micron Technology, Inc. | Atomic layer deposition of a ruthenium layer to a lanthanide oxide dielectric layer |
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DE102005057255B4 (en) * | 2005-12-01 | 2007-09-20 | Infineon Technologies Ag | Storage capacitor and method for producing such a storage capacitor |
US7405154B2 (en) * | 2006-03-24 | 2008-07-29 | International Business Machines Corporation | Structure and method of forming electrodeposited contacts |
US8558278B2 (en) * | 2007-01-16 | 2013-10-15 | Taiwan Semiconductor Manufacturing Company, Ltd. | Strained transistor with optimized drive current and method of forming |
FR2915315B1 (en) * | 2007-04-19 | 2009-06-26 | St Microelectronics Crolles 2 | METHOD FOR MANUFACTURING A CAPACITOR WITH HIGH STABILITY AND CORRESPONDING CAPACITOR. |
US20090085085A1 (en) * | 2007-10-01 | 2009-04-02 | James Chyi Lai | Dram cell with capacitor in the metal layer |
US7943961B2 (en) * | 2008-03-13 | 2011-05-17 | Taiwan Semiconductor Manufacturing Company, Ltd. | Strain bars in stressed layers of MOS devices |
US7808051B2 (en) * | 2008-09-29 | 2010-10-05 | Taiwan Semiconductor Manufacturing Company, Ltd. | Standard cell without OD space effect in Y-direction |
US8809827B1 (en) * | 2013-03-13 | 2014-08-19 | International Business Machines Corporation | Thermally assisted MRAM with multilayer strap and top contact for low thermal conductivity |
US9515251B2 (en) | 2014-04-09 | 2016-12-06 | International Business Machines Corporation | Structure for thermally assisted MRAM |
KR102208380B1 (en) | 2016-08-31 | 2021-01-28 | 마이크론 테크놀로지, 인크 | Memory cells and memory arrays |
CN109155310B (en) | 2016-08-31 | 2023-03-31 | 美光科技公司 | Memory cell and memory array |
EP3840046A1 (en) * | 2016-08-31 | 2021-06-23 | Micron Technology, Inc. | Memory cells and memory arrays |
WO2018132250A1 (en) | 2017-01-12 | 2018-07-19 | Micron Technology, Inc. | Memory cells, arrays of two transistor-one capacitor memory cells, methods of forming an array of two transistor-one capacitor memory cells, and methods used in fabricating integrated circuitry |
EP3676835A4 (en) | 2017-08-29 | 2020-08-19 | Micron Technology, Inc. | Memory circuitry |
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US5576928A (en) * | 1994-08-01 | 1996-11-19 | Texas Instruments Incorporated | High-dielectric-constant material electrodes comprising thin platinum layers |
US5751540A (en) * | 1995-03-20 | 1998-05-12 | Samsung Electronics Co., Ltd. | Ferroelectric capacitor with rhodium electrodes |
US5807774A (en) * | 1996-12-06 | 1998-09-15 | Sharp Kabushiki Kaisha | Simple method of fabricating ferroelectric capacitors |
WO2000013215A1 (en) * | 1998-08-27 | 2000-03-09 | Micron Technology, Inc. | Ruthenium silicide diffusion barrier layers and methods of forming same |
US6518610B2 (en) * | 2001-02-20 | 2003-02-11 | Micron Technology, Inc. | Rhodium-rich oxygen barriers |
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-
2001
- 2001-02-20 US US09/789,335 patent/US6518610B2/en not_active Expired - Lifetime
-
2002
- 2002-02-11 KR KR1020037010896A patent/KR100610303B1/en not_active IP Right Cessation
- 2002-02-11 WO PCT/US2002/004090 patent/WO2002067302A2/en active IP Right Grant
- 2002-02-11 AT AT02742467T patent/ATE346377T1/en not_active IP Right Cessation
- 2002-02-11 CN CNB028049187A patent/CN100373543C/en not_active Expired - Fee Related
- 2002-02-11 EP EP02742467A patent/EP1368822B1/en not_active Expired - Lifetime
- 2002-02-11 JP JP2002566534A patent/JP4399521B2/en not_active Expired - Fee Related
- 2002-02-11 DE DE60216241T patent/DE60216241T2/en not_active Expired - Lifetime
- 2002-07-30 US US10/209,386 patent/US6740554B2/en not_active Expired - Fee Related
- 2002-12-12 US US10/318,597 patent/US6781175B2/en not_active Expired - Fee Related
-
2004
- 2004-05-21 US US10/850,664 patent/US7038263B2/en not_active Expired - Fee Related
Patent Citations (5)
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US5576928A (en) * | 1994-08-01 | 1996-11-19 | Texas Instruments Incorporated | High-dielectric-constant material electrodes comprising thin platinum layers |
US5751540A (en) * | 1995-03-20 | 1998-05-12 | Samsung Electronics Co., Ltd. | Ferroelectric capacitor with rhodium electrodes |
US5807774A (en) * | 1996-12-06 | 1998-09-15 | Sharp Kabushiki Kaisha | Simple method of fabricating ferroelectric capacitors |
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YAMAMICHI S ET AL: "A STACKED CAPACITOR TECHNOLOGY WITH ECR PLASMA MOCVD BBA,SR)TIO3 AND RUO2/RU/TIN/TISIX STORAGE NODES FOR GB-SCALE DRAM'S", IEEE TRANSACTIONS ON ELECTRON DEVICES, IEEE INC. NEW YORK, US, vol. 44, no. 7, 1 July 1997 (1997-07-01), pages 1076 - 1083, XP000658199, ISSN: 0018-9383 * |
Also Published As
Publication number | Publication date |
---|---|
EP1368822B1 (en) | 2006-11-22 |
JP2004532512A (en) | 2004-10-21 |
CN100373543C (en) | 2008-03-05 |
US20030102501A1 (en) | 2003-06-05 |
US7038263B2 (en) | 2006-05-02 |
EP1368822A2 (en) | 2003-12-10 |
US6518610B2 (en) | 2003-02-11 |
WO2002067302A2 (en) | 2002-08-29 |
US20040212002A1 (en) | 2004-10-28 |
KR100610303B1 (en) | 2006-08-09 |
KR20030088433A (en) | 2003-11-19 |
US6740554B2 (en) | 2004-05-25 |
DE60216241T2 (en) | 2007-04-19 |
ATE346377T1 (en) | 2006-12-15 |
WO2002067302A8 (en) | 2004-06-03 |
JP4399521B2 (en) | 2010-01-20 |
US20020190303A1 (en) | 2002-12-19 |
CN1518758A (en) | 2004-08-04 |
US20020113260A1 (en) | 2002-08-22 |
DE60216241D1 (en) | 2007-01-04 |
US6781175B2 (en) | 2004-08-24 |
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