WO2002069044A3 - Polymers and photoresist compositions - Google Patents

Polymers and photoresist compositions Download PDF

Info

Publication number
WO2002069044A3
WO2002069044A3 PCT/US2002/005627 US0205627W WO02069044A3 WO 2002069044 A3 WO2002069044 A3 WO 2002069044A3 US 0205627 W US0205627 W US 0205627W WO 02069044 A3 WO02069044 A3 WO 02069044A3
Authority
WO
WIPO (PCT)
Prior art keywords
polymers
photoresist compositions
hydroxyadamantyl
photoresists
functionality
Prior art date
Application number
PCT/US2002/005627
Other languages
French (fr)
Other versions
WO2002069044A2 (en
Inventor
George G Barclay
Robert J Kavanagh
Original Assignee
Shipley Co Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shipley Co Llc filed Critical Shipley Co Llc
Priority to AU2002255598A priority Critical patent/AU2002255598A1/en
Priority to KR10-2003-7011140A priority patent/KR20040030511A/en
Priority to JP2002568102A priority patent/JP2004524565A/en
Publication of WO2002069044A2 publication Critical patent/WO2002069044A2/en
Publication of WO2002069044A3 publication Critical patent/WO2002069044A3/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G03F7/0397—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain

Abstract

The present invention includes polymers and photoresist compositions that comprise the polymers as a resin binder component. Polymers of the invention contain a hydroxyadamantyl functionality. Photoresists of the invention include chemically-amplified positive-acting resists that can be effectively imaged at short wavelengths such as sub-200 nm, particularly 193 nm.
PCT/US2002/005627 2001-02-25 2002-02-25 Polymers and photoresist compositions WO2002069044A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
AU2002255598A AU2002255598A1 (en) 2001-02-25 2002-02-25 Polymers and photoresist compositions
KR10-2003-7011140A KR20040030511A (en) 2001-02-25 2002-02-25 Novel copolymers and photoresist compositions
JP2002568102A JP2004524565A (en) 2001-02-25 2002-02-25 Novel copolymer and photoresist composition

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US27140401P 2001-02-25 2001-02-25
US60/271,404 2001-02-25

Publications (2)

Publication Number Publication Date
WO2002069044A2 WO2002069044A2 (en) 2002-09-06
WO2002069044A3 true WO2002069044A3 (en) 2003-02-27

Family

ID=23035399

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2002/005627 WO2002069044A2 (en) 2001-02-25 2002-02-25 Polymers and photoresist compositions

Country Status (7)

Country Link
US (1) US20020187420A1 (en)
JP (1) JP2004524565A (en)
KR (1) KR20040030511A (en)
CN (1) CN1310090C (en)
AU (1) AU2002255598A1 (en)
TW (1) TWI293402B (en)
WO (1) WO2002069044A2 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3890989B2 (en) * 2002-01-25 2007-03-07 住友化学株式会社 Resist composition
US7488565B2 (en) * 2003-10-01 2009-02-10 Chevron U.S.A. Inc. Photoresist compositions comprising diamondoid derivatives
US7208334B2 (en) * 2004-03-31 2007-04-24 Kabushiki Kaisha Toshiba Method of manufacturing semiconductor device, acid etching resistance material and copolymer
JP4279237B2 (en) * 2004-05-28 2009-06-17 東京応化工業株式会社 Positive resist composition and resist pattern forming method
EP1662320A1 (en) * 2004-11-24 2006-05-31 Rohm and Haas Electronic Materials, L.L.C. Photoresist compositions
JP5031310B2 (en) * 2006-01-13 2012-09-19 東京応化工業株式会社 Resist composition and resist pattern forming method
JP5782283B2 (en) * 2010-03-31 2015-09-24 ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ Novel polymer and photoresist compositions

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0982628A2 (en) * 1998-08-26 2000-03-01 Sumitomo Chemical Company, Limited A chemical amplifying type positive resist composition

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100245410B1 (en) * 1997-12-02 2000-03-02 윤종용 Photosensitive polymer and chemically amplified resist composition using the same
US6103445A (en) * 1997-03-07 2000-08-15 Board Of Regents, The University Of Texas System Photoresist compositions comprising norbornene derivative polymers with acid labile groups
TWI263866B (en) * 1999-01-18 2006-10-11 Sumitomo Chemical Co Chemical amplification type positive resist composition
JP3353292B2 (en) * 1999-03-29 2002-12-03 日本電気株式会社 Chemically amplified resist
JP4061801B2 (en) * 2000-01-24 2008-03-19 住友化学株式会社 Chemically amplified positive resist composition
US6610465B2 (en) * 2001-04-11 2003-08-26 Clariant Finance (Bvi) Limited Process for producing film forming resins for photoresist compositions

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0982628A2 (en) * 1998-08-26 2000-03-01 Sumitomo Chemical Company, Limited A chemical amplifying type positive resist composition

Also Published As

Publication number Publication date
AU2002255598A1 (en) 2002-09-12
CN1310090C (en) 2007-04-11
JP2004524565A (en) 2004-08-12
CN1498361A (en) 2004-05-19
TWI293402B (en) 2008-02-11
KR20040030511A (en) 2004-04-09
US20020187420A1 (en) 2002-12-12
WO2002069044A2 (en) 2002-09-06

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