WO2002070191A1 - Fluxing underfill compositions - Google Patents
Fluxing underfill compositions Download PDFInfo
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- WO2002070191A1 WO2002070191A1 PCT/US2001/047898 US0147898W WO02070191A1 WO 2002070191 A1 WO2002070191 A1 WO 2002070191A1 US 0147898 W US0147898 W US 0147898W WO 02070191 A1 WO02070191 A1 WO 02070191A1
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
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- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T428/31511—Of epoxy ether
Definitions
- This invention relates to fluxing underfill compositions useful for fluxing metal surfaces in preparation for providing an electrical connection and sealing the space between semiconductor devices [such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”), flip chip assemblies (“FCs”) and the like, each of which having a semiconductor chip, such as large scale integration (“LSI”)], or semiconductor chips themselves, and a circuit board to which the devices or chips, respectively, are electrically interconnected.
- semiconductor devices such as chip size or chip scale packages (“CSPs), ball grid arrays (“BGAs”), land grid arrays (“LGAs”), flip chip assemblies (“FCs”) and the like, each of which having a semiconductor chip, such as large scale integration (“LSI”)], or semiconductor chips themselves, and a circuit board to which the devices or chips, respectively, are electrically interconnected.
- CSPs chip size or chip scale packages
- BGAs ball grid arrays
- LGAs land grid arrays
- FCs flip chip assemblies
- Such CSPs, BGAs and LGAs improve the characteristics of the electronic device with which they are used while serving to protect semiconductor bare chips, such as LSIs.
- the CSP/BGA/LGA assembly is electrically interconnected to a circuit board by use of solder.
- Solder such as eutectic tin/lead solder (melting point, 183°C) or lead/indium solder (melting point, 220°C) , are ordinarily used.
- Solder serves to provide a contact pad for, for instance, metal terminals on the semiconductor device to join the integrated circuit to the substrate.
- solder bump interconnection technology was developed to eliminate the expense, unreliability, and low productivity of manual wire bonding.
- an underfill sealant is often used to temper vibrational disturbances and physical stresses that may cause electrical disconnects .
- flux is placed on the solder, allowing the solder to make a secure electrical interconnection when exposed to elevated temperatures reached during a solder reflow cycle, a typical profile for which is depicted in FIG. 2, curve B.
- the semiconductor device is then aligned with the substrate and the solder is reflowed under such elevated temperature conditions.
- residue from the flux would be removed -- in order to prevent semiconductor device corrosion -- using organic- or aqueous -based solvents, depending on the nature of the flux.
- Patent Publication No. WO 98/37134 refers to a no-flow underfill encapsulant for flip-chip technology.
- This encapsulant is based on epoxy resin (s) , an anhydride hardener, an accelerator, a surfactant and a fluxing agent, and uses a viscosity-controlling agent, such as fumed silica, and a coupling agent.
- This encapsulant is reported to provide optimized flow and a curing reaction only after attaining the maximum solder bump reflow temperature of about 190-230°C.
- U.S. Patent No. 5,128,746 (Pennisi) describes a thermally curable adhesive having a fluxing agent for use in reflow soldering an electrical component and a substrate.
- This adhesive reportedly removes oxide coatings on the metalization of the electrical component, and the adhesive at least partially cures when heated to solder reflow temperatures.
- the adhesive includes a thermoset resin, a fluxing agent, and a curing agent that reacts with and cures the thermoset resin when the thermally curable adhesive is heated.
- epoxy curatives used in commercially available or known epoxy-based compositions ordinarily either require a post cure-heating step to cure the composition in this application, because the curing agents cure slowly, or the epoxy-based compositions are too reactive, and as a result gel prematurely, thereby resulting in electrical disconnects which is the case with compositions described in the '746 patent. While either of these events may not pose problems in some commercial applications, for fluxing underfill applications where self- alignment of a semiconductor device on a carrier substrate is planned to occur, premature gellation frequently causes a misalignment of the semiconductor/device substrate interface. Such misalignment triggers an electrical disconnect, thereby rendering the mounted electronic assembly inoperable.
- microelectronics assemblers are reluctant to use a post-cure heating step, as such post- cure may raise temperatures to an extent that may compromise the integrity of the mounted electronic assembly as a whole, by destroying one or more semiconductor devices attached to the substrate, and also increases processing time and expense .
- An alternative approach would be for microelectronics assemblers to alter the solder reflow profile.
- Such an alternative solder reflow profile which has been promoted by certain material suppliers, known as the "volcano profile" (see FIG. 2, curve A), allows solder to reflow quickly in view of the aggressive temperature increase to the solder reflow temperature over a short period of time, without any zoning or staging of the temperature ranges.
- PCT/GB99/01236 speaks to a thernally curable adhesive composition which includes a crosslinkable thermosetting material and a chemical crosslinking agent having fluxing properties and exhibiting restricted or no thermosetting reactivity with the material without the action of a catalyst and/or heat.
- the composition is thermally curable when heated to temperature range extending from the liquidus temperature of the alloy Sn/Pb 60/40 up to the liquidus temperature of the alloy Sn/Pb 3/97 and in the presence of a catalyst for the crosslinking of the material with the crosslinking agent.
- the composition is reported to be storage and reaction stable in the absence of such catalyst and at a temperature in the range of 20-25°C.
- amine salts have been used to prepare adhesive compositions for the assembly of microelectronic devices, where the adhesive cures at the temperature range within which the amine salt disassociates, which is tailored to the temperature range at which solder melts.
- Diaza- and triaza-bicyclo compounds have been used in connection with adhesives in the past, such as in adhesion promoting primer compositions for use with cyanoacrylate-containing adhesive compositions. See U.S. Patent No. 4,869,772 (McDonnell) .
- the present invention provides a fluxing underfill composition, which includes an epoxy resin component; an acidic fluxing agent component; an anhydride component; and a latent curing agent component .
- the latent curing agent component includes a complex of a portion of the acidic fluxing agent and a salt of a nitrogen-containing component.
- the invention provides a fluxing underfill composition capable of curing within specified portion of the temperature profile reached during a solder reflow cycle. With the acidic fluxing agent being included in the composition, a separate fluxing step is thereby obviated.
- a semiconductor device Before, after or during application of the composition, a semiconductor device is positioned on the carrier substrate, and solder, which is present on either or both of the semiconductor device and/or carrier substrate, is exposed to temperatures reached during solder reflow cycle conditions. During a specified portion of the temperature profile reached during the solder reflow cycle, the composition is cured, thereby establishing and maintaining an electrical interconnection while encapsulating the semiconductor device onto the substrate.
- the acidic fluxing agent removes oxides from the substrate surface as the composition cures which at present would likely interfere with the solder and the underfill performance .
- An adhesive with fluxing properties can be used to reflow solder and encapsulate surface mounted components, and flip chip integrated circuits in particular, while providing environmental protection of the active surface of the integrated circuit.
- FIG. 1 depicts a cross-sectional view showing an example of the mounting structure in which the fluxing underfill composition of the present invention is used after being reflowed.
- FIG. 2 depicts a plot of temperature (°C) versus time (seconds) of a typical solder reflow cycle ("curve B"), and of a solder reflow cycle, where the temperature has been spiked (the "volcano profile", "curve A") which is typical for the known fluxing underfill materials, such as those described in the '746 patent.
- FIGs. 3A and 3B depict differential scanning calorimetry curves for the known fluxing underfill materials, such as those described in the '746 patent, as contrasted with a fluxing underfill material in accordance with the present invention, conducted in a power compensation mode, so as to measure the power required to compensate for temperature differences between the sample and a control .
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- epoxy resins include polyepoxy compounds based on aromatic amines and epichlorohydrin, such as N,N,N' ,N' -tetraglycidyl-4,4 ' -diaminodiphenyl methane; N- diglycidyl-4-aminophenyl glycidyl ether; and N, N, N ' , N ' - tetraglycidyl-1, 3-propylene bis-4-aminobenzoate .
- polyepoxy compounds based on aromatic amines and epichlorohydrin such as N,N,N' ,N' -tetraglycidyl-4,4 ' -diaminodiphenyl methane; N- diglycidyl-4-aminophenyl glycidyl ether; and N, N, N ' , N ' - tetraglycidyl-1, 3-propylene bis-4-aminobenzoate
- epoxy resins suitable for use herein also include polyglycidyl derivatives of phenolic compounds, such as those available commercially under the tradename "EPON”, such as “EPON” 1031 from Shell Chemical Co.; "DER” 331, “DER” 332, “DER” 334, and “DER” 542 from Dow Chemical Co.; and “BREN-S” from Nippon Kayaku, Japan.
- suitable epoxy resins include polyepoxides prepared from polyols and the like and polyglycidyl derivatives of phenol-formaldehyde novolacs, the latter of which are available commercially under the tradename "DEN”, such as "DEN” 431, "DEN” 438, and "DEN” 439 from Dow Chemical.
- Cresol analogs are also available commercially under the tradename "ARALDITE", such as “ARALDITE” ECN 1235, “ARALDITE” ECN 1273, and “ARALDITE” ECN 1299 from Ciba Specialty Chemicals.
- SU-8 is believed to be a cresol novolac epoxy available from Interez, Inc.
- Polyglycidyl adducts of amines, aminoalcohols and polycarboxylic acids are also useful in this invention, commercially available resins of which include “GLYAMINE” 135, “GLYAMINE” 125, and “GLYAMINE” 115 from F.I.C.
- acidic fluxing agents appropriate for use herein include abietic acid, adipic acid, ascorbic acid, acrylic acid, citric acid, 2-furanoic acid, malic acid, salicylic acid, glutaric acid, pimelic acid, polyacrylic acids, and organic acids, such as phenol and derivatives thereof, and sulfonic acids, such as toluene sulfonic acids.
- DIACID 1550 is a liquid monocyclic twenty one carbon dicarboxylic acid derived from tall oil fatty acids; specifically, it is 5-n- hexyl-2- (carboxy-n-heptyl) cyclohex-3-ene carboxylic acid, available commercially from Westvaco Oleo Chemicals.
- anhydride compounds for use herein include mono- and poly-anhydrides, such as hexahydrophthalic anhydride ("HHPA”) and methyl hexahydrophthalic anhydride (“MHHPA”) (commercially available from Lindau Chemicals, Inc., Columbia, South Carolina, used individually or as a combination, which combination is available under the trade designation "LINDRIDE” 62C) , 5- (2 , 5-dioxotetrahydrol) -3- methyl-3-cyclohexene-l, 2 -dicarboxylic dianhydride (commercially available from ChrisKev Co., Leewood, Kansas under the trade designation B-4400) , nadic methyl anhydride, 3 , 3 ' , 4 , 4 ' -benzophenone tetracarboxylic dianhydride (“BTDA”), pyromelli
- the anhydride component should be present in an amount within the range of about 15 to about 50 weight percent, such as about 30 to about 40 weight percent, desirably about 35 weight percent.
- the latent curing agent component includes materials capable of catalyzing the polymerization of the epoxy resin component of the inventive compositions once a triggering event occurs, such as a certain temperature is reached.
- the latent curing agents include complexes of the salt of the nitrogen containing compounds and a portion of the acidic fluxing agent.
- the nitrogen-containing compound portion of the salt thereof is ordinarily amine compounds, including polyamines and di- and tri-aza compounds, amide compounds, imidazole compounds, and combinations thereof.
- the nitrogen-containing compound portion of the salt thereof desirably includes di-aza compounds or tri-aza compounds .
- di-or tri-aza compounds examples include:
- DBU 1, 8-diazabicyclo [5.4.0] undec-7-ene
- amine compounds include the following alkyl poly amines: diethylenetriamine, triethylenetetraamine , diethylaminopropylamine , isophoronediamine and menthenediamine; and the aromatic polyamines: m-xylenediamine, diaminodiphenylamine, and quinoxaline .
- amide compounds include cyano- functionalized amides, such as dicyandiamide .
- the imidazole compounds may be chosen from imidazole, isoimidazole, and substituted imidazoles -- such as alkyl-substituted imidazoles (e.g.
- the nitrogen-containing compound (depending on the relative basisity of the compound) is typically added to the composition as a salt with a weak or strong acid, thereby offering a spread of ion pair strength.
- a weak acid such as a phenol
- a strong acid such as p- toluenesulfonic acid, may form a salt with the nitrogen- containing compound.
- a strong acid such as p- toluenesulfonic acid
- POLYCAT SA-102 is the ethyl hexanoate salt of DBU, and is also commercially available from Air Products .
- the pKa values of the acid used to form the salt with the nitrogen-containing compound should ordinarily be in the range of about 2.8 to about 10, with about 4 being particularly desirable, depending of course on the chosen nitrogen- containing compound.
- acids include acetic acid, halogenated acetic acid, phenol, and aromatic sulfonic acids.
- the pKb values of the nitrogen- containing compound should ordinarily be in the range of about 0.5 to about 9.5, with about 5 being desirable depending of course on the chosen acid compound. Examples of such nitrogen-containing compounds are set forth above.
- the salt of the nitrogen-containing compound and the acidic fluxing agent are contacted together to form a complex, thereby creating the latent curing agent component .
- the complex so formed should have a disassociation potential appropriate to allow for disassociation to occur in an epoxy-based matrix which is at least in part within the temperature range reached during the solder reflow cycle.
- the latent curing agent component may be used in an amount of from about 0.3 to about 30 weight percent, based on the weight of the epoxy resin component, depending of course on the type and identity of the components which constitute the latent curing agent component.
- the nitrogen-containing compound should be used in the inventive compositions in an amount within the range of about 0.1 to about 1, such as about 0.5, thereby forming a latent curing agent having a nitrogen- containing compound portion of the complex in substantially the same amount .
- Additives may be included in the inventive compositions, such as a reactive co-monomer component (e.g.. a reactive diluent) , defoaming agents (like those available commercially from BYK-Chemie, Wallingford, Connecticut under the BYK trade name, such as BYK-515 or BYK-555) , leveling agents, dyes, pigments, adhesion promoters, and the like.
- a reactive co-monomer component e.g. a reactive diluent
- defoaming agents like those available commercially from BYK-Chemie, Wallingford, Connecticut under the BYK trade name, such as BYK-515 or BYK-555
- leveling agents dyes, pigments, adhesion promoters, and the like.
- Appropriate reactive diluents for use herein may include monofunctional or certain multifunctional epoxy resins.
- the reactive diluent should have a viscosity which is lower
- the reactive diluent should have a viscosity less than about 250 cPs .
- such resin should be employed in an amount of up to about 50 weight percent, based on weight of the epoxy resin component.
- the monofunctional epoxy resin should have an epoxy group with an alkyl group of about 6 to about 28 carbon atoms, examples of which include C 6 _ 28 alkyl glycidyl ethers, C 6 . 28 fatty acid glycidyl esters and C 6 . 28 alkylphenol glycidyl ethers.
- monofunctional epoxy resin reactive diluents include those from Pacific Epoxy Polymers, Richmond, Michigan, under the trade designations PEP-6770 (glycidyl ester of neodecandoic acid) , PEP-6740 (phenyl glycidyl ether) and PEP-6741 (butyl glycidyl ether) .
- Multifunctional epoxy resin reactive diluents include those from Pacific Epoxy Polymers, under the trade designations PEP-6752 (trimethylolpropane triglycidyl ether) and PEP-6760 (diglycidyl aniline) .
- the defoaming agent appears to provide beneficial affects on wetting the solder.
- the defoaming agent seems to reduce the surface tension on the solder, which is important in solder fluxing.
- the defoaming agent When used, the defoaming agent may be used in an amount up to about 1 weight percent, based on the total weight of the composition.
- adhesion promoters such as the silanes, glycidoxypropyl trimethoxysilane (commercially available from OSI under the trade designation A-187) , gamma-amino propyl triethoxysilane (commercially available from OSI under the trade designation A-1100) or a trimethoxysilyl propylated isocyanurate (commercially available from OSI under the trade name SILQUEST, such as Y- 11597) , may be used.
- the adhesion promoters should be included in the inventive compositions in an amount up to about 2 weight percent .
- thermosetting resin compositions of the present invention may be of the one-pack type, in which all the ingredients are mixed together, or of the two-pack type in which the curable component (s) , is (are) included in one part and the curing agent is stored separately in a second part, and mixed together only prior to use.
- the fluxing underfill compositions according to the present invention are ordinarily dispensed onto the circuit board, with or without a smoothing application, and a semiconductor chip or semiconductor device positioned thereover. More specifically, the inventive compositions are ordinarily applied to a circuit board having metallization pads. Solder is disposed over the composition coated-metallization pads. The semiconductor chip or semiconductor device is positioned over and mated with the circuit board and the solder reflowed. During the reflow step, the fluxing agent promotes adhesion of the solder to the metallization pads on the circuit board and the adhesive material is cured to mechanically interconnect and seal the underfilling between the circuit board and the semiconductor chip or semiconductor device.
- the inventive compositions have been designed to cure at a certain time/temperature range combination within specified portions of the temperature portfolio reached during a solder reflow cycle that is observed during the solder reflow cycle. (See FIG. 2, curve B) .
- the solder reflow profile for which the inventive compositions were designed is composed of several zones, where a temperature is reached or maintained for a set time period, or temperature increases occur over a set time period. These zones may be referred to as a pre-heating zone, a soak zone and a reflow zone.
- the circuit board and semiconductor components are gradually heated to the soaking zone temperature.
- the heating gradation in the pre-heating zone may progress through the temperature range of about 30°C to about 150°C in a period of time of up to about 60 seconds .
- the semiconductor components are allowed to thermally equilibrate so that the thermal expansions of the semiconductor components may occur and temperature adjustments can occur.
- the heating gradation in the soak zone may progress through the temperature range of about 150°C to slightly greater than 180°C, such as about 183°C, from a period of time of about 60 to about 175 seconds from initiation.
- the solder flows and forms the electrical connection.
- the underfill sealant should gel after the solder has flowed and forms the electrical connection, otherwise the component present can shift, thereby causing an electrical disconnect .
- the heating gradation in the reflow zone may progress through the temperature range of slightly greater than 180 °C, such as about 183 °C, to about 220°C + 10°C, from a period of about 175 to about 205-265 seconds from initiation. See R.P. Prasad, Surface Mount Technology: Principles and Practice. Part Three -- Manufacturing with Surface Mounting, International Thomson Publishing, New York, 578 (1997) . It is desirable for the underfill sealant to cure completely after the solder has flowed to form the electrical connection. u> > o
- the gel times of the compositions will also be tailored to a specified period of time (such as 15 seconds, or 1 or 2 minutes) at a temperature of about 150°C.
- the inventive compositions should show no or substantially no increase of viscosity after a period of time of about ten minutes. With such a gel time, the compositions penetrate into the space (e.g. , of 10 to 200 ⁇ m) between the circuit board and the semiconductor device relatively rapidly, and allow for a greater number of assemblies to be filled without observing a viscosity increase in the composition thereby rendering it less effective for application.
- FIG. 1 shows a semiconductor device 4 having circuit board 1 with metallization pads 5 and 6 that have been coated using conventional dispensing techniques with a fluxing underfill adhesive composition 3 within the scope of this invention, and a semiconductor chip 2.
- the fluxing underfill composition may be applied on either the carrier substrate or the semiconductor chip.
- a semiconductor chip 2 with solder bumps 7 and 8 is positioned over the circuit board 1 so that the solder bumps 7 and 8 of the semiconductor chip 2 face the circuit board 1 and are aligned grossly with the metallization pads 5 and 6.
- the semiconductor chip 2 is then contacted with the circuit board 1 so that the solder bumps 7 and 8 and the metallization pads 5 and 6 are contacted to form an assembly.
- the assembly so formed is introduced to a zoned solder reflow oven, causing after the preheating and soak zones, the solder to flow thereby forming an electrical interconnection between the semiconductor chip 2 and the circuit board 1 once the reflow zone is reached.
- This allows for the solder bumps 7 and 8 of the semiconductor chip 2 to align finely with the circuit board 1.
- the underfill composition cures without requiring a post cure to effect complete cure. During the solder reflow zone, therefore the semiconductor device is electrically interconnected by the solder and secured by the underfill .
- the semiconductor chip ordinarily may be coated with a polyimide-, poly-benzocyclobutane- or silicone nitride-based material to passivate environmental corrosion.
- the circuit board 1 may be constructed from ceramic substrates of A1 2 0 3 , SiN 3 and mullite (Al 2 0 3 -Si0 2 ) ; substrates or tapes of heat-resistant resins, such as polyimides; glass-reinforced epoxy; ABS and phenolic substrates which are also used commonly as circuit boards; and the like. Any electrical connection of the semiconductor chip to the carrier substrate may be used, such as connection by a high-melting solder or electrically (or anisotropically) conductive adhesive and the like.
- the electrodes may be formed as wire bond bumps.
- Cured reaction products of the thermosetting resin compositions of the present invention demonstrate excellent adhesive force, heat resistance and electric properties, and acceptable mechanical properties, such as flex-cracking resistance, chemical resistance, moisture resistance and the like, for the applications for which they are used herein.
- thermosetting resin composition of the present invention In the mounting process by using the thermosetting resin composition of the present invention, after the semiconductor device is mounted on the circuit board as described above, the resulting structure is tested with respect to characteristics of the semiconductor device, connection between the semiconductor device and the circuit board, other electrical characteristics, and the state of sealing.
- a reactor was charged with the anhydride and the Part A epoxy premix. This mixture was then mixed rapidly under vacuum at a temperature of about 25°C for a period of time of about 90 minutes, after which time the adhesion promoter and the Part B accelerator premix were added. This mixture was then stirred under a vacuum with cooling for a period of time of about 30 minutes, after which time the vacuum was released and the mixer purged with nitrogen.
- Sample Nos. 1-5 are within the scope of the present invention, whereas Sample No. 6 is not, as it does not include a salt of a nitrogen containing compound.
- Sample No. 6 includes an imidazole without an acid salt .
- Sample Nos. 1-3 were used to connect and underfill ten 4X4 PB8 die to a test circuit board and reflowed using a profile comparable to FIG. 2, curve B. All of these die demonstrated electrical conductivity.
- Sample Nos. 4-6 were used to connect and underfill four FB 250 die to a test circuit board and reflowed using a profile comparable to FIG. 2, curve B. All four die demonstrated electrical conduction with Sample Nos. 4 and 5, whereas none of the four die demonstrated electrical conductivity with Sample No. 6.
- Example 2 Example 4 from U.S. Patent No. 5,128,746 was replicated to demonstrate the benefits and advantages of the present invention.
- Example 4 of the '746 patent uses EPON 828 as the epoxy resin and malic acid as the acidic fluxing agent for each of the formulations
- the comparison used RE- 310-S as the epoxy resin, which too is a bisphenol A epoxy resin, and salicylic acid as the acidic fluxing agent.
- Sample Nos. 9 and 10 were disposed within an aluminum DSC pan, and heated according to the solder reflow profile like that depicted in FIG. 2, curve B.
- Reference to FIG. 3A shows that Sample No. 9 begins to cure at a temperature of about 140 °C -- during the pre-heating zone.
- FIG. 3A indicates that Sample No. 9 has cured during the soak zone.
Abstract
Description
Claims
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020027011746A KR100823750B1 (en) | 2001-01-08 | 2001-12-13 | Fluxing Underfill Compositions |
JP2002569343A JP4204865B2 (en) | 2001-01-08 | 2001-12-13 | Underfill composition for flux treatment |
CA002401739A CA2401739A1 (en) | 2001-01-08 | 2001-12-13 | Fluxing underfill compositions |
MXPA03002672 MX247834B (en) | 2001-01-08 | 2001-12-13 | Fluxing underfill compositions. |
EP01273400A EP1339524A1 (en) | 2001-01-08 | 2001-12-13 | Fluxing underfill compositions |
US10/302,949 US6706417B2 (en) | 2001-01-08 | 2002-11-25 | Fluxing underfill compositions |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/755,146 | 2001-01-08 | ||
US09/755,146 US6458472B1 (en) | 2001-01-08 | 2001-01-08 | Fluxing underfill compositions |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
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US09/755,146 Continuation-In-Part US6458472B1 (en) | 2001-01-08 | 2001-01-08 | Fluxing underfill compositions |
US10/302,949 Continuation-In-Part US6706417B2 (en) | 2001-01-08 | 2002-11-25 | Fluxing underfill compositions |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2002070191A1 true WO2002070191A1 (en) | 2002-09-12 |
WO2002070191A8 WO2002070191A8 (en) | 2002-12-27 |
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PCT/US2001/047898 WO2002070191A1 (en) | 2001-01-08 | 2001-12-13 | Fluxing underfill compositions |
Country Status (8)
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US (2) | US6458472B1 (en) |
EP (1) | EP1339524A1 (en) |
JP (1) | JP4204865B2 (en) |
KR (1) | KR100823750B1 (en) |
CN (1) | CN1222392C (en) |
CA (1) | CA2401739A1 (en) |
MX (1) | MX247834B (en) |
WO (1) | WO2002070191A1 (en) |
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PATENT ABSTRACTS OF JAPAN vol. 1998, no. 06 30 April 1998 (1998-04-30) * |
See also references of EP1339524A1 * |
Cited By (10)
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EP1384738A1 (en) * | 2001-03-30 | 2004-01-28 | Sunstar Giken Kabushiki Kaisha | One-component hot-setting epoxy resin composition and semiconductor mounting underfill material |
EP1384738A4 (en) * | 2001-03-30 | 2005-08-10 | Sunstar Engineering Inc | One-component hot-setting epoxy resin composition and semiconductor mounting underfill material |
US7449362B2 (en) | 2001-03-30 | 2008-11-11 | Sunstar Giken Kabushiki Kaisha | One-component hot-setting epoxy resin composition and semiconductor mounting underfill material |
WO2003075338A1 (en) * | 2002-03-01 | 2003-09-12 | National Starch And Chemical Investment Holding Corporation | Underfill encapsulant for wafer packaging and method for its application |
US7037399B2 (en) | 2002-03-01 | 2006-05-02 | National Starch And Chemical Investment Holding Corporation | Underfill encapsulant for wafer packaging and method for its application |
JP2006505674A (en) * | 2002-11-05 | 2006-02-16 | ヘンケル コーポレイション | Organic acid-containing composition and method of use thereof |
KR20130035946A (en) * | 2011-09-30 | 2013-04-09 | 롬 앤드 하스 일렉트로닉 머트어리얼즈, 엘.엘.씨. | Amine, carboxylic acid flux composition and method of soldering |
KR20130035954A (en) * | 2011-09-30 | 2013-04-09 | 롬 앤드 하스 일렉트로닉 머트어리얼즈, 엘.엘.씨. | Curable amine, carboxylic acid flux composition and method of soldering |
KR101992637B1 (en) | 2011-09-30 | 2019-06-25 | 다우 글로벌 테크놀로지스 엘엘씨 | Curable Amine, Carboxylic Acid Flux Composition and Method of Soldering |
KR101992639B1 (en) | 2011-09-30 | 2019-06-25 | 다우 글로벌 테크놀로지스 엘엘씨 | Amine, Carboxylic Acid Flux Composition and Method of Soldering |
Also Published As
Publication number | Publication date |
---|---|
JP2004530740A (en) | 2004-10-07 |
CN1222392C (en) | 2005-10-12 |
EP1339524A1 (en) | 2003-09-03 |
MXPA03002672A (en) | 2003-06-24 |
CA2401739A1 (en) | 2002-09-12 |
US6458472B1 (en) | 2002-10-01 |
US20030124378A1 (en) | 2003-07-03 |
MX247834B (en) | 2007-08-06 |
US20020128353A1 (en) | 2002-09-12 |
KR100823750B1 (en) | 2008-04-21 |
JP4204865B2 (en) | 2009-01-07 |
WO2002070191A8 (en) | 2002-12-27 |
US6706417B2 (en) | 2004-03-16 |
KR20030028454A (en) | 2003-04-08 |
CN1427753A (en) | 2003-07-02 |
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