WO2002075783A3 - Wafer level interposer - Google Patents

Wafer level interposer Download PDF

Info

Publication number
WO2002075783A3
WO2002075783A3 PCT/US2002/007863 US0207863W WO02075783A3 WO 2002075783 A3 WO2002075783 A3 WO 2002075783A3 US 0207863 W US0207863 W US 0207863W WO 02075783 A3 WO02075783 A3 WO 02075783A3
Authority
WO
WIPO (PCT)
Prior art keywords
interposer
wafer level
substrate
contact elements
level interposer
Prior art date
Application number
PCT/US2002/007863
Other languages
French (fr)
Other versions
WO2002075783A8 (en
WO2002075783A2 (en
Inventor
Benjamin N Eldridge
Carl V Reynolds
Original Assignee
Formfactor Inc
Benjamin N Eldridge
Carl V Reynolds
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Formfactor Inc, Benjamin N Eldridge, Carl V Reynolds filed Critical Formfactor Inc
Priority to AU2002245685A priority Critical patent/AU2002245685A1/en
Priority to EP02713860A priority patent/EP1371095A2/en
Publication of WO2002075783A2 publication Critical patent/WO2002075783A2/en
Publication of WO2002075783A3 publication Critical patent/WO2002075783A3/en
Publication of WO2002075783A8 publication Critical patent/WO2002075783A8/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

Double-sided interposer assemblies and methods for forming and using them. In one example of the invention, an interposer (1078) comprises a substrate having a first surface (1082) and a second surface (1086) opposite of said first surface, a first plurality of contact elements (1080) disposed on said first side (1082) of said substrate, and a second plurality of contact elements (1084) disposed on said second surface (1086) of said substrate, wherein said interposer (1078) connects electronic devices (1088, 1090) via said first and said second plurality of contact elements.
PCT/US2002/007863 2001-03-16 2002-03-13 Wafer level interposer WO2002075783A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
AU2002245685A AU2002245685A1 (en) 2001-03-16 2002-03-13 Wafer level interposer
EP02713860A EP1371095A2 (en) 2001-03-16 2002-03-13 Wafer level interposer

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/810,871 US7396236B2 (en) 2001-03-16 2001-03-16 Wafer level interposer
US09/810,871 2001-03-16

Publications (3)

Publication Number Publication Date
WO2002075783A2 WO2002075783A2 (en) 2002-09-26
WO2002075783A3 true WO2002075783A3 (en) 2003-09-04
WO2002075783A8 WO2002075783A8 (en) 2005-03-17

Family

ID=25204922

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2002/007863 WO2002075783A2 (en) 2001-03-16 2002-03-13 Wafer level interposer

Country Status (5)

Country Link
US (3) US7396236B2 (en)
EP (1) EP1371095A2 (en)
AU (1) AU2002245685A1 (en)
TW (1) TW557526B (en)
WO (1) WO2002075783A2 (en)

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US7649368B2 (en) 2010-01-19
EP1371095A2 (en) 2003-12-17
WO2002075783A8 (en) 2005-03-17
US20080265922A1 (en) 2008-10-30
US20100120267A1 (en) 2010-05-13
US7396236B2 (en) 2008-07-08
AU2002245685A1 (en) 2002-10-03
TW557526B (en) 2003-10-11
US20020132501A1 (en) 2002-09-19
WO2002075783A2 (en) 2002-09-26

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