WO2002078411A1

WO2002078411A1 - Circuit support element for electronic devices, in particular for communication terminals

Info

Publication number: WO2002078411A1
Application number: PCT/DE2002/001053
Authority: WO
Inventors: Georg Busch
Original assignee: Siemens Aktiengesellschaft
Priority date: 2001-03-22
Filing date: 2002-03-22
Publication date: 2002-10-03
Also published as: CN1498519A; EP1371275A1

Abstract

According to the invention, circuit support elements (4, 5) for electronic devices, in particular for communication terminals may be protected from corrosive influences during the production process in a simple economical manner, such that no additional post-treatment of the circuit support element, or no additional provisions in the electronic device are necessary as for conventional state of the art, whereby all conducting metal surfaces made from copper, gold etc on the conducting track and contact surface side (40) and/or the component side (50) are, as far as is technically possible, replaced by non-corroding electrically-conducting surfaces (15), such as for example, carbon or nanopaste so long as the increased transfer resistance does not lead to erroneous interpretations. The latter can occur in contact surfaces for keyboards and test points. Where said method is not possible, then the metallic surfaces should be at least coated with the non-corrosive, electrically-conducting material, by application of the material such that the metallic surfaces are protected against breaking by corrosion, even with the tolerances occurring on applying said material.

Description

description

Circuit carrier element for electronic devices, in particular communication terminals

Electronic devices - e.g. devices of the consumer goods industry such as consumer electronics, communication technology etc. e.g. radio and television sets, HIFI systems, telephones for wired and wireless communication, video cell phone ^λ s, web and LAN telephones, LAN adapters - point for the functions to be implemented in the respective device and the individual components required for this purpose, as a rule, a single circuit carrier element. The circuit carrier element is usually a printed circuit board or an electronic printed circuit board, but it is also possible for the circuit carrier element to be a film. For this purpose, the circuit carrier element has a first carrier element side, on which the components are arranged and which is therefore also referred to as component side, and a second carrier element side, on which the conductor tracks and contact surfaces for input and output means as well as for measuring and testing purposes are arranged, and the consequently also referred to as the conductor track and contact surface side.

The prior art with regard to the construction of circuit carrier elements for electronic devices, in particular communication terminals, is explained with reference to FIGS. 1 to 3. Show it:

1 shows a section of a first circuit carrier element for Siemens standard telephones in the mid-1980s in a top view and cross-sectional representation of the conductor track and contact surface side,

FIGURE 2 shows a section of a second circuit carrier element for Siemens cordless phones of the MEGASET and series CO CO N3 hO P ¹ P ¹ cπ O π o Cπ 0 Cπ α rt H rt P_ HN rt tr Hi ι- <tQ <SN *! rt rt p- P> P tr φ tr ¹ Φ * J ω O 3 tl ω Ω fD Φ P 0 ι-i P- φ 0 P Φ P ¹ Φ Φ os: Φ P- P φ fl t 0 lS φ PP ¹ HPH Φ H Ω Pt ι-s 0 P φ P- P> W ⁾ : 0 Cfl Φ li 0 W ι-i rt 0 Cfl P φ P- tr Φ CD 0 rr ^ 0 rt rt Φ Ω rt N P- Hi KΩ. rt tr Ω 3 rt li 3 α rt P 0 cn tr

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P Cfl P Pf Pi 0 W Hl 0 P- rt P r— 0 p: h- 1 P 0 P CΛ P- iQ P φ

0 rt P- cn P rt o cn 0 P. 1 0 σ Φ 0 0 rt P Pf

> d P Φ φ rt P Φ P ξ P- (0 Ω Φ Ω Cfl rt P

O 0 P- 0 Ps ¹ tr ¹ tr P 0 P P- <Q Pi pj: rt PO:

• d 0 P O tr P P Pf iQ o t rt ω P P rt Φ Φ Pi CL P tr cn tr 0 ^ P p 0

Φ Hi Pi Hl O rt P- o rt 0 Cfl P- Φ rt Ω 0 P P- 0 Φ rt P α H pj: rt P 0

0 N Hi 0 cn 0 rt O φ P tr cn P- rt P ¹ PP ¹ i Pi P 0 P- Ω vQ Hi 0 Φ

• ds: Ω rt 1 P 1 0 tr Cfl Φ ON o 1 p: iQ O Φ P ^> Ω 0

P- 1 Φ * tr P rt P Ω P o 0 0 1 P ϊö P p: tr

Φ P- Φ Cπ 1 φ tr 1 1 1 0 1 1

1 P 1 tr 3 Φ ω P ¹

are significantly lower because the cost of carbon is about 30% of the gold price.

FIGURE 3 shows a section of a third circuit carrier element 3 for Siemens cordless telephones of the MEGASET and GIGASET series at the beginning of the 1990s in a top view and cross-sectional representation of a component side 30, in which the carrier element 3 made of the base material 11 with conductor tracks 31 applied on one side and a contact surface 32, preferably made of copper. Of the conductor tracks 31, a first conductor tracks 310 is covered with the solder resist 14, while second conductor tracks 311, which are to be connected to component connections 330, the so-called pad connections, of a ceramic component 33, are covered with solder 34 for this purpose. As the top view shows, the solder resist 14 is applied over a large area to the component side 30. The contact surfaces 32, like the fourth contact surface 133 in FIGS. 1 and 2, are designed as plated-through holes; However, in contrast to these, the contact surface 32 is open and is preferably made entirely of copper and is therefore not proportionate with the solder resist 14, for realizing the through-connection proportionately with silver conductive paste 17 and with the semi-solder mask 14 partially and completely covering the silver conductive paste 17 - Covered transparent varnish 16.

The fact that in the process steps for the production of the conductor tracks 310, 311, the individual process steps -

(1) The application of the copper layer 31 (2) The application of the solder resist 14 and (3) The application of the component 33 and the solder 34 - with precise specification of the individual layer dimensions, the manufacturing technology cannot be carried out so precisely that the individual layers lie exactly one above the other , uncovered or exposed conductor track segments 35 arise. OO ro ro P ¹ P>

Cπ o cπ o cπ o Cπ

0 rt <i rt cn P- P "CL cn P3 tr φ PL Pf α P rt cn P- C s: Cfl P z Cd Hl rt rt

P- P- o P P P- O P s

3 P- Φ rt P Φ P- Φ P- φ Φ Φ 3 P • d 0 φ Φ p- 0 0 0 0 0 φ 0 P-

Cfl vQ PP ¹ p: Cfl iQ cn Ω P Φ Cfl fl 0 3 Φ P- rt p- P Cfl PP Φ Ω Hl P P. PP 0 rt

Ω rr Cfl r- iQ Ω P tr tr P tr rt o P- rt 0 ¹ φ 0 Hi • tr CL if iQ tr Φ rt Cfl Φ tr P Φ P- Φ Φ rt P 0 tQ Pi öd cn cn φ tr 0 P Ω 0 CL Φ Φ 1 cn P-

Φ 0 Φ P Φ cn Φ Pf. rt Φ o Φ o P P- p- cn 0 <- • P7 öd Φ P- P P K s: rt 3

0 0 "Φ 0 <O Pr P> 0 Φ 0 0 P iQ H" 0 c Cfl 0 * P φ rt iQ Φ p: P P- P 3

H3 Φ P- P ¹ φ P pi o P öd PP rt Φ PP ¹ α Φ d iQ Cfl P- P Φ rt P φ p: φ

Ω P 0 φ Φ Ω P O P 3 φ 3 Φ H P p- P Φ P P φ P. Cfl p: i Cfl Φ CL iQ P

Φ cn P. CΛ 3 Φ 3 Φ P P P P- P P Pf Ω tr tr 0 0 Φ C 0 o rt P N Φ

P rt φ P φ PPO rt rt x KQ rt tr ω P φ P- 0 _^ P P- f P. P P- N • d • P fp: PP r P p: P- Φ O Cfl P- Ω rt P - φ Φ Φ 0 P- P ¹ 0 P- φ Φ φ P Φ 0 • d öd Φ o rt rt 0 φ rt rt P • P- 3

Φ 0 v P- Φ Φ α Cfl P- o P Φ φ 0 PL P ¹ Hl 3 0 s: P3 φ cn "» »P o vQ P

Φ <P- o 0 • * Φ P tr iQ P- Φ Φ cn Φ P Φ • d

P Φ P. O o 0 Φ 0 ¹ ^ cn 0 cn P- txi P φ ¹ PP cn P P- P ^ P £ 3 P

<1 Pf Cfl φ Hi * P 0 0 1 φ Φ Pi rt Φ 0 0 <Φ 0: • d φ o P rt o Φ Pf

O o Ό Cfl Φ P "cn Pi o P- P- 0 3 3 Cfl Hl O cn Hl Ω 0: f 0 l_I. Φ φ tr 0 rt

P 0 0 P 0: Pi Φ φ Pf Φ rt Ω O α P 0 P- O f PP ¹ Cfl φ 0 P P rt φ rt os; Cfl P o P cn O 1 φ tr tr Φ P cn 3 φ 0 Cfl rt s: P φ CL CL ¹ Φ P

CL P Ω P- Ω cn P 3 cn rt P P P rt P- 3 Cfl Ω § Φ o Φ rt Φ P 3 0 o Φ 1 rt Cfl

Φ f tr φ φ P- § Ω <Q P 00 0 tr P- tr φ Cfl P- P = P cn P- Cfl Ω φ tr

3 rt φ P vQ Φ 0 tr Φ rt o Cfl P ιQ Φ cn M P 0 Cπ 0 Pi P cn Cfl Φ Ω tr CL CL P- I Φ

Hl tr p: f fl 0 φ cn Φ tr f 0 Ω P-, cn 0: α 0 Φ P tr Φ φ P ¹ N

Ω P ¹ φ Φ rt φ P- P- rt 0 o \ o Ω 0 Φ tr Φ rt P- Ω tr fl tr P- Ω P rt φ P Cfl P φ 0:

Φ pj: 0 P- Φ P- tr f P Φ 0 φ P- Pl P H 0 0 tr P- O H iQ tr Φ P- 0 P O iQ

P Ω rt P- P 0 P- CL 9 0 rt φ P ¹ 3 0? TP ω H rt Φ 0 0 P Ω pi Cfl P "p: tr P3 pi 3 Cfl Cfl rt 0 P ¹ 3 φ S _j rt Φ vQ Φ P "Ω • 0 ö 0 tr 0 o P P- rt Φ P o P- tr P- vQ rt P P- 0 N Φ 0 rt cn 0 rt O tr ^ iQ 0 Ω P o 0 Ω

Φ 0 Cfl 3 rt P- Φ O Φ ω 0 0 Hi 0 P rt 0 Φ M Φ Cfl Φ i CL CL φ P Hi tr

N rt g Ω P 0 0 = s Φ KO P. O iQ P ¹ P 0 <! 0 P 0: 0 Ω P φ P- φ P iQ σs

0 0 P 0 P3 tr cn Φ P o CL Hi 0 cn p: O iQ o cn cn / p: P Φ 0 P CΛ Φ CL

Cfl P- rt 0 P rt 0: Φ <P Φ tr i P- Cfl rt iQ P Cfl P ¹ 3 rt cn P- 3 rt P Ω tr Φ

P Ω 0 P- 0 tr 0 O P- P- P o 0 P Ω Φ rt rt O P- cn P- Φ P i P- P tr P n

9 tr P Pf Ω N "0 Ω P α 3 P = O P Ω P tr P- vQ rt rt P 0 3 rt P 0

^ rt • d P tr 0 P- 0 tr rt Φ rt φ P- IQ P ¹ Φ ¹ p: <P- 0 f rt -> 0 3 Φ 0 rt N

Φ P rt P ¹ Ω ω Φ Φ P- P 0 rt Φ PP ¹ φ O ¹ Φ Φ 0 CL CL φ PP Φ ≤.

0 3 O P- P 3 tr PP ¹ CL P- 0 f P φ P- Φ P φ <P- Φ P "P φ Φ PP" 0 Φ tr O: tr O Ω P " _^ p: φ Φ P ^J Φ rt P- ^ Φ 3 Ω P 0 φ rt P- P 0 tu o P-

P iQ 0 Pf Ω rt Pf 0 φ 3 Pi Cfl P ¹ öd Φ tr Φ P- P rt 0 Φ P Pf P Cfl i rt

0 r— φ Cfl tr φ Φ rt P ¹ rt 0: Φ φ 0 Cfl Φ PI tr P Φ P 0 Cd φ P rt O Φ

P- 3 φ N Φ P 0 P PI o ^ d pj: • Cfl 3 cn rt O Φ iQ φ P- P "P ςx P Pf φ CL Φ 3 P

Ω P 0 0 P rt OP P- O Ω cn Φ OP 3 Φ 0 P "Hl CL P" P- ^> < ¹ 3

0 tr rt α _"* s: 0 cn φ tr α H- 0 P <P Φ 0 Φ α Φ ih Öd P ¹ i P 0 φ 0 0

P P- vQ tr Φ N P- rt P P- Φ P- iQ rt Φ 0 - Pi 0 P- Φ P 0: Φ 3 Φ ω l-h 0 0

Ω P- f Φ φ α 0 cn P Φ P Φ f Φ P 0 rt o 0 P cn P- cn PPP o P- CL tr cn P tr P- Φ Ω rt tu 0 Cfl Φ P s, 0 Φ rt 0 i rt Φ cn p: rt 0 f rt 0 pj: P Φ P <tr 0 P 3 0 P- P cn φ vQ cn P φ P vQ s; P- rt P- 0 s: Φ P CL

0 rt P Φ φ 0 0 P P tr rt 0 0 Φ 0 3 P- Φ P vQ Φ o 0 o 0 rt P

P α Φ cn P- PP Hi c. rt rt Φ Hl α 0 P rt P- Ω Cfl Cfl Φ P 0 CL CL P- P- cn P φ Ω P- P ¹ ^■ <: Φ Φ rt 0 P Φ 0 0 Φ P- rt tr rt cn • Φ 0 or location

P- α P ¹ tr Φ P- Ω p: _^ PPP o P- rt Hl 0 0 rt Φ φ P> 0 tr P CL 0 rt

> φ s: 0 P 0 Φ Ω Cfl P- tr P- Ω Φ rt Φ. Ω P: öd P Ω φ cn Φ

0 P Φ ¹ φ iQ P 0- PP Hi tr 0 P- 0 ^ cn x P- ¹ N Ω φ p- 0 tr P Φ 0

Pi φ iQ O rt P ¹ Φ p: Φ PP ¹ Hl Φ cn P ¹ Ω Ω φ Φ 0 rt iQ f P- 0 CL 0 tr P ¹ tr Φ 0 φ P rt 0 σ rt 0 0 Ω £ 0: Φ tr P P- Φ cn P ¹ CL K CL CΛ

P φ Φ P Φ 0 f 0 Φ Φ Cfl tr P tr Φ Cfl Hi p: Ω Φ s: Hl rt α öd P- P- o iQ Ω

P- Pf 0 P iQ rt PP Φ P P- o rt fl p: öd tr P- o 0 pj: P φ Ω φ tr Φ tr rt O: CL -> cn PO tr pi 1 φ 0 tr P cn P P - tr φ Φ 1 0 P 0 0 rt N tr Cfl P- PPQP 1 Φ 1 O Φ 0 P Cfl Ω P- P ¹ vQ P 0 1 Φ 1 1 CL Φ 0 Φ φ P ¹ pj: P ¹

Φ o P 1 Φ tr 0 1 tr 0 1 1 1 3 Φ P v P 1 I /

0 1 P 1 1 1

to protect from additional protective lacquer on the circuit carrier element.

The object on which the invention is based is to protect circuit carrier elements for electronic devices, in particular communication terminals, in the manufacturing process in a simple, cost-effective manner from corrosion influences such that no additional aftertreatments on the circuit carrier element or no additional precautions on the electronic device are required, as in the prior art.

This object is solved by the features of claim 1.

The idea on which the invention is based is as follows: on the conductor track and contact surface side and / or the component side, all conductive metallic surfaces made of copper, gold, etc., as far as technically possible, should be provided by non-corrosive electrically conductive surfaces, such as e.g. Carbon or nanopaste can be replaced, provided the higher contact resistance does not lead to misinterpretation. The latter could be the case with contact surfaces for the keyboard and test points.

Where this procedure is not possible, the metallic surfaces should be covered at least by the non-corrosive electrically conductive material by pressing on the material in such a way that the conductor tracks and contact surfaces are protected against interruptions due to corrosion despite the tolerances that occur when the material is applied.

This applies in particular to those electronic devices which have a keyboard which is normally located on the conductor track and contact surface side of the circuit carrier element, because there directly under the keyboard and in areas in which there is a film or rubber mat Small climate forms, the mentioned corrosion phenomena occur.

Advantageous developments of the invention are specified in the subclaims.

According to these subclaims, it is particularly advantageous if nanopaste is used as the non-corrosive, electrically conductive material, because this paste, which is preferably used with the aid of devices or machines that work on the principle of ink printing, even semiconductor components, such as can produce light-emitting diodes, transistors, etc. on the circuit carrier element. Nanopaste thus enables corrosion protection on the one hand and the cost-effective production of semiconductor components on the other and in a few years even smaller semiconductor circuits as an alternative to integrated circuits.

An embodiment of the invention is explained with reference to FIGURES 4 and 5. Show it:

FIGURE 4, starting from FIGURES 1 and 2, a section of a fourth circuit carrier element for electronic devices with keyboard in a top view and cross-sectional view of the conductor track and contact surface side,

FIG. 5, starting from FIG. 3, a section of a fifth circuit carrier element for electronic devices with keyboard in a top view and cross-sectional representation of the component side,

FIGURE 4 shows, starting from FIGURES 1 and 2, a section of a fourth circuit carrier element 4 for electronic devices with a keyboard in a top view and cross-sectional representation of a conductor track and contact surface side 40, in which those shown in FIGURES 1 and 2 for CO ω ro ro P ¹ P ¹

Cπ o Cπ o Cπ o Lπ: P ¹ Pl CL tr ⁴ α tr ¹ Ξ tr tr CL Cfl 0 0 ^ fl 0 ¹ i Cfl rt P ¹ P- CL CL Hi CL \ K Φ P <i tr Ji> O Φ O: P φ Φ N Φ P rt p: Φ Ω O: ¹ O P- P- P KΩ 3 Φ P- co Φ P- s Φ Φ O o φ Cfl rt Cfl P- P ≤ P- P Φ rt Cfl Ω tr rt rt P 0 P Pf PP ^ ~ - 0 Φ φ 0 P- P- P 0

P 0 φ cn rt rt iQ P ¹ Φ P- Cfl φ P cQ CL rt 0: öd vQ Cfl E cn 3 vQ 0 r— 0 P 0 ¹ rt> Φ Φ Φ Φ P- Hi PJ Ω rt PO rt Hl tr Φ 0 ¹ rt σ Ω Φ f rt P- Φ i O

P α P O: O 0 P 0 N 0 Cfl 0 3 0: tr O 0 Cfl CL> Φ P O: P tr P- o Φ P P o Cfl

^• d 0 rt 13 Hi tr 0 rt P P- 0 Cπ rt T3 P P- P P- p: P Φ rt P cn p- P 0 P "P- CL g P-

13 LNN • d tr P tr Φ iQ rt Hi 0 d rt O 0 φ Ω ¹ P- Cfl 0 Ω N rt P ¹ φ Φ 3 O φ P φ P- P ^> P tr P- i Φ P ¹ rt NPP ¹ P- P Hi tr P Ω rt Hl> tr Φ P 0 P 0 0

P cn 0 PP P- 0 P o P- Φ 9 Φ Φ iQ P <! rt P φ 13 tr O rt 0 rt f P rt 0 ¹ 0

P Ω P Φ α P 3 rt P- P 0 P- Cfl Ω i PP 0 13 ^• d P Pi P rt v Φ P- 0

0 tr ¹ Cfl fl f iQ 0 Φ P Φ P Cfl i CΛ Pf f Φ fl Cfl Φ CL O Φ r P ¹ Φ Pi S. P- f 0

PO: O cn φ 3 o Ω P Φ rt CΛ rt rt P Cfl rt ω Φ P Φ ¹ rt P ro P -> CL Φ rt P rt rt OP CO Cfl φ _^ PP Ω O ι_ι- 0 Ω Φ vQ Ώ PP Φ P- • _* p: Φ P Φ rt Φ

NP J->P> P ¹ r P- tr rt tr P Hi Φ 0 tr 0 φ 3 0 Ω 0 P tö Ω 0 CL P P- P

CL P- 0 J- »CL o Φ o P Hi ö 0 P 0 Hi CL 0: CL tr Φ 0 tr * f CL i, - P tr φ tr o

P 0 cn 1 φ P- 0 P 0: P 0} - • Cfl φ P rt Φ φ 0 CL Φ Φ Φ ro O Φ Pl P P 0 CL

CL 0 iQ 0 P 0 P 0 rt iQ <! P 0 N 0 P rt P- P ¹ 0 0 - - N 0 P tr Cfl Φ

0 Φ s: 0 CO L 0 Ω rt P- 0 Φ φ Cfl rt φ Φ CL rt Φ cn P φ P

PO Pi Φ α i P ¹ Φ Φ P "i Φ 0 0 tr PP rt • P3 PP Φ PI CL α Cfl P ¹ rt P- cn 0

Ω Ji> 0: iQ 0 P> P P- o P- iQ φ P Φ O P> CL P 0 O Φ P Cfl ω P P Φ CL J tr tr Φ. - • d i <P Φ Cfl P φ CL p- P "i KΩ 0 tr 0 cn Cfl CΛ P> rt CL v iQ O

P- PPO Pi d Φ o P φ P- rt α 0 φ P ¹ Φ o PP CL Φ Ω 0 φ

- ^• 3 Φ P

CL 3 rt φ CL P 0 0 o Cfl 0 P CL P Φ PP <Ω P ^J P Pi> tr 0 P 3 Φ P vQ

P- CL P P- o CL Cfl φ Φ p: <i φ φ P rt o tr P CL P P 0 P 0? P: Φ φ CXI Φ ö ω φ N Φ «P- P- 0 iQ o rt CL 0 P cn P 0 P Pi P- CL O tr rt rt cn

Φ Φ PP Ω Φ oo rt Φ P 0 ¹ φ N Pf 'CL Φ Cfl N tr tr rt P Φ Φ Φ rt for ⁴ PP Cfl tr φ Cfl 10 3 0 φ Ü P s: P cn Φ rt Cfl P- Ώ Φ 0 P rt CL rt P- P Φ φ Φ CL tr P- P- ω Φ 3 0 Φ CL Φ Ω 0 Hi rt φ 3 Φ PP P- φ Φ P tr P "

P- P- φ Φ> Ω 0 Λ P- 0 0 cπ PP ¹ Φ P i P ^J p: Φ P ¹ Cfl P Pf CL NPP ¹ Ω rt Ω PP 0 tr N Ω rt 0 o C Φ P CL P v pj: 0 0 ¹ P Φ Cfl iQ I rt φ ≤. 0 rt φ tr Cfl Pi rt Φ tr Φ P- rt Hi 3 φ OP Φ Ω CL Φ rt fo P> φ £ Pi 0 Hi ω

P rt tr PP Pf Φ fl φ ^ 0 CL tr vQ tr P- P- Φ rt Cπ 0. -. P ¹ pj: P tr CL CL Φ P CO 0 P- tr PP tr P- 0 I • Φ o Φ φ iQ rt PPP ¹ - p: mi

P Φ PP ¹ P- P ¹ Φ rt P rt Φ Ω rt Ω P 0 0 P Φ tr P- 0 1 CL ^• - - o Ω P o P "Ω tr 0 Cfl P ¹ P 0 rt tr P- CL P - tr cn α cn PPN cn ω φ 0 tr o 0 P- Φ

P cn 0 iQ _^^ Φ 0 o Φ rt J iQ α rt tr tr fört φ N rt vQ il 0 0 CL 1 cπ P ≥i P α P. Ω KQ S. Cl Q cn tr ¹ 0 Φ ro h 0 Cf tr Φ Φ PPP φ P Φ Φ

Φ Φ cn iQ P - P Φ Cfl Φ O 0 P rt O Φ tr Hi iQ ¹ CΛ Pf cn Pf 0 tr iQ P- P- CΛ o Pl vQ φ <! 3 0 Pi N 0 Φ rt Ω P Pi P ^J 0: Φ O: rt P ¹ Cfl rt Φ

3 rt Ω tr CL ö N 0: 3 0 O 0 0: φ O P ISl Pf Cfl o Φ tr P rt> P- co fl Hl tr P

Φ Φ tr φ P φ P Φ CL P CL CL P P- P ^• d tr Φ Φ P P- P Cfl 0 Φ o Ω P ¹ N tr

PP CL Cfl cn cn <Q iQ P- PP ¹ PP CL 0 iQ rt rt rt CL rt Pi P tr p: s: φ rt tr CL P- cn CL rt Φ Φ φ IO Φ φ Cfl Φ Φ. 3 P th φ O tr 0 0 Ω P-

Φ P φ 0 ω> cn P- Φ P Cfl 0 P iQ rt Ω P φ f pj: s; P 13 P P CL P- tr rt

0- P iQ P 0 Ω Φ p: rt P- Φ Φ Φ Φ tr P rt tr φ 13 P- vQ Φ rt Φ N Φ O 0 rt 0 Hi tr O rt Φ P 0 JV 3 0 tr 0 rt Hi P - 0 tr H 0 cn 0 rt P 0 0 cπ Cfl tr ¹ rt tr P tu cπ φ P ¹ Cfl rt 0 Φ 0 φ Pi Φ P ¹ vQ CL Φ P Pi Φ cn φ O: P Φ P P- Φ 0 P. OP Cfl P- P iQ P p: Φ φ P Ω Φ P * <τ) P Φ «tr

<! iQ rt 0 P- P- rt 0 Φ rt φ tr O Cfl 0 CL Φ fl CL tr Ω P fl Pf 0 p: P iQ o Φ

O 3 Cfl Pi P ¹ p rt fl P ¹ P Φ P 0 Ω 0 rt P- N tr i rt Cfl Ω 0: Hi 3 0 P-

P ¹ Φ rt rt cn <Q Φ rt P- PP P- P- tr φ P φ Φ s: Φ P Φ P, tr Hi 0: φ P 3

0 OP φ Φ 3 Pi * 1 rt Cfl 0 P- P CL Cfl • 0 P CL P ¹ P ¹ Φ Φ 1 0 P o ω rt ^• d Φ co 0 1 P ¹ P- p: Ω H rt Ω P- 0 Cfl 0 Φ cn tr P! - • J-. PP rt cn Ω rt Φ • d rt CO 0 Φ Ω α ^ = rt rt P 0 i Φ O fl 0 CL Φ P- φ

P = -> Φ _^^ 0 P- P ¹ iQ P Φ rt öd Φ Ω 0 53 o 9 0 cn 0 0 Pi P ¹ P- O tr

POPP 0 P> 0 φ P- Φ PJ 0 φ P ¹ tr vQ Φ 0 3 iQ 0 0 o Φ P ¹ 0 P

Cπ Ω CL P Cfl - iQ P ιQ tr 1 Ω Φ 1 P ¹ Cfl P- 1 φ P ¹ fl Cfl CL 13 M KO P

P- f Φ CL rt Φ Φ CO Φ P- Φ tr cn 0 Cπ p- tr 1 *> 0 ιQ 0 P P 1 1 φ Φ rt Ω Φ Ω

1 1 Φ tr 1 tr

cover. In this way, the specified conductor tracks are protected against interruptions due to corrosion despite the manufacturing tolerances.

Claims

claims

1.Circuit support element for electronic devices, in particular communication terminals, with the following features: (a) on the conductor track and contact surface side (40) and / or component side (50) are conductor tracks (12, 120, 31, 310, 311) and contact surfaces (13 , 130, 131, 132, 133, 32) made of a corrosive metallic material (12, 13) or a non-corrosive electrically conductive material (15), (b) the conductor tracks built up with the corrosive metallic material (12, 13) 12, 120, 31, 310, 311) and contact surfaces (13, 130, 131, 132, 133, 32) are with the non-corrosive electrically conductive material (15) or with the non-corrosive electrically conductive material (15) and covered at least one coating material (14, 18),

(c) the conductor tracks (12, 120, 31, 310, 311) and contact surfaces (13, 130, 131, 132, 133, 32) constructed with the non-corrosive electrically conductive material (15) are exposed or with at least one Coating material (14, 18) covered,

(d) on the conductor track and contact surface side (40) and / or the component side (50) are the coating material (14, 18) and / or the non-corrosive electrically conductive material

(15) so printed on the conductor tracks (12, 120, 31, 310, 311) and contact surfaces (13, 130, 131, 132, 133, 32) that the coating material (14, 18) and the non-corrosive electrical conductive material (15) overlap and thereby the conductor tracks (12, 120, 31, 310, 311) and contact surfaces (13, 130, 131, 132, 133, 32) despite the tolerances that occur when applying the coating material (14, 18) and / or protect the non-corrosive electrically conductive material (15) against interruptions due to corrosion.

2. Circuit carrier element according to claim 1, wherein the non-corrosive electrically conductive material (15) is carbon.

3. Circuit carrier element according to claim 1, wherein the non-corrosive electrically conductive material (15) is nanopaste.

4. Circuit carrier element according to one of claims 1 to 3, wherein the coating material (14, 18) is a solder resist, a

Is insulating varnish and / or a protective varnish.

5. Circuit carrier element according to claim 3, wherein the nanopaste is applied to the conductor track and contact surface side (40) and / or the component side (50) of the carrier element (4, 5) and is covered with the coating material (14, 18) that semiconductor components can be generated.

6. Circuit carrier element according to claim 5, wherein the coating material for generating a light-emitting diode

(14, 18) is translucent.

7. Circuit carrier element according to claim 6, wherein the coating material (14, 18) is silicone lacquer.

8. Circuit carrier element according to claim 5, wherein the coating material (14, 18) is opaque to produce a transistor.

9. circuit carrier element according to claim 1, wherein the lacquer () and / or the non-corrosive electrically conductive material (15), the or on the conductor tracks (12, 120, 31, 310, 311) and contact surfaces (13, 130, 131, 132, 133, 32) is printed on the conductor track and contact surface side (40) and / or the component side (50), over a large area over the whole

Printed conductor and contact surface side (40) and / or the component side (50) is printed.