WO2002084755A3 - Keepers for mram electrodes - Google Patents
Keepers for mram electrodes Download PDFInfo
- Publication number
- WO2002084755A3 WO2002084755A3 PCT/US2002/004771 US0204771W WO02084755A3 WO 2002084755 A3 WO2002084755 A3 WO 2002084755A3 US 0204771 W US0204771 W US 0204771W WO 02084755 A3 WO02084755 A3 WO 02084755A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- magnetic
- top electrode
- bit
- mram
- keeper
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B61/00—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
- G11C11/14—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using thin-film elements
- G11C11/15—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using thin-film elements using multiple magnetic layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/01—Manufacture or treatment
Abstract
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE60222095T DE60222095T2 (en) | 2001-02-28 | 2002-02-14 | LOCK BLOCK FOR MRAM ELECTRODES |
AU2002306525A AU2002306525A1 (en) | 2001-02-28 | 2002-02-14 | Keepers for mram electrodes |
JP2002581597A JP4186046B2 (en) | 2001-02-28 | 2002-02-14 | Protective structure for MRAM electrode |
EP02761855A EP1364417B1 (en) | 2001-02-28 | 2002-02-14 | Keepers for mram electrodes |
KR1020037011279A KR100608248B1 (en) | 2001-02-28 | 2002-02-14 | Keepers for mram electrodes |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/796,326 | 2001-02-28 | ||
US09/796,326 US6413788B1 (en) | 2001-02-28 | 2001-02-28 | Keepers for MRAM electrodes |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2002084755A2 WO2002084755A2 (en) | 2002-10-24 |
WO2002084755A3 true WO2002084755A3 (en) | 2003-08-07 |
Family
ID=25167915
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2002/004771 WO2002084755A2 (en) | 2001-02-28 | 2002-02-14 | Keepers for mram electrodes |
Country Status (9)
Country | Link |
---|---|
US (2) | US6413788B1 (en) |
EP (1) | EP1364417B1 (en) |
JP (1) | JP4186046B2 (en) |
KR (1) | KR100608248B1 (en) |
AT (1) | ATE371958T1 (en) |
AU (1) | AU2002306525A1 (en) |
DE (1) | DE60222095T2 (en) |
ES (1) | ES2289136T3 (en) |
WO (1) | WO2002084755A2 (en) |
Families Citing this family (75)
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DE10043947A1 (en) * | 2000-09-06 | 2002-04-04 | Infineon Technologies Ag | Current conductor of integrated circuit, producing magnetic field with transitive effect, includes recess modifying field produced |
US6555858B1 (en) * | 2000-11-15 | 2003-04-29 | Motorola, Inc. | Self-aligned magnetic clad write line and its method of formation |
TW544677B (en) * | 2000-12-26 | 2003-08-01 | Matsushita Electric Ind Co Ltd | Magneto-resistance memory device |
US6475812B2 (en) * | 2001-03-09 | 2002-11-05 | Hewlett Packard Company | Method for fabricating cladding layer in top conductor |
US6780652B2 (en) * | 2001-03-15 | 2004-08-24 | Micron Technology, Inc. | Self-aligned MRAM contact and method of fabrication |
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JP4088052B2 (en) * | 2001-07-17 | 2008-05-21 | 株式会社東芝 | Manufacturing method of semiconductor device |
US6525957B1 (en) * | 2001-12-21 | 2003-02-25 | Motorola, Inc. | Magnetic memory cell having magnetic flux wrapping around a bit line and method of manufacturing thereof |
US6548849B1 (en) * | 2002-01-31 | 2003-04-15 | Sharp Laboratories Of America, Inc. | Magnetic yoke structures in MRAM devices to reduce programming power consumption and a method to make the same |
US6665205B2 (en) * | 2002-02-20 | 2003-12-16 | Hewlett-Packard Development Company, Lp. | Shared global word line magnetic random access memory |
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US20040032010A1 (en) * | 2002-08-14 | 2004-02-19 | Kools Jacques Constant Stefan | Amorphous soft magnetic shielding and keeper for MRAM devices |
US6914805B2 (en) * | 2002-08-21 | 2005-07-05 | Micron Technology, Inc. | Method for building a magnetic keeper or flux concentrator used for writing magnetic bits on a MRAM device |
US7018937B2 (en) | 2002-08-29 | 2006-03-28 | Micron Technology, Inc. | Compositions for removal of processing byproducts and method for using same |
US6740948B2 (en) * | 2002-08-30 | 2004-05-25 | Hewlett-Packard Development Company, L.P. | Magnetic shielding for reducing magnetic interference |
JP2004128229A (en) * | 2002-10-02 | 2004-04-22 | Nec Corp | Magnetic memory and its manufacture |
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US20040175845A1 (en) * | 2003-03-03 | 2004-09-09 | Molla Jaynal A. | Method of forming a flux concentrating layer of a magnetic device |
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US7020009B2 (en) * | 2003-05-14 | 2006-03-28 | Macronix International Co., Ltd. | Bistable magnetic device using soft magnetic intermediary material |
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US7183130B2 (en) * | 2003-07-29 | 2007-02-27 | International Business Machines Corporation | Magnetic random access memory and method of fabricating thereof |
US6927075B2 (en) * | 2003-08-25 | 2005-08-09 | Headway Technologies, Inc. | Magnetic memory with self-aligned magnetic keeper structure |
US7078239B2 (en) | 2003-09-05 | 2006-07-18 | Micron Technology, Inc. | Integrated circuit structure formed by damascene process |
US6900491B2 (en) * | 2003-10-06 | 2005-05-31 | Hewlett-Packard Development Company, L.P. | Magnetic memory |
US6990012B2 (en) * | 2003-10-07 | 2006-01-24 | Hewlett-Packard Development Company, L.P. | Magnetic memory device |
JP4868431B2 (en) * | 2003-10-10 | 2012-02-01 | Tdk株式会社 | Magnetic storage cell and magnetic memory device |
US20050095855A1 (en) * | 2003-11-05 | 2005-05-05 | D'urso John J. | Compositions and methods for the electroless deposition of NiFe on a work piece |
US7083988B2 (en) * | 2004-01-26 | 2006-08-01 | Micron Technology, Inc. | Magnetic annealing sequences for patterned MRAM synthetic antiferromagnetic pinned layers |
US6946698B1 (en) | 2004-04-02 | 2005-09-20 | Taiwan Semiconductor Manufacturing Company, Ltd. | MRAM device having low-k inter-metal dielectric |
US20060039183A1 (en) * | 2004-05-21 | 2006-02-23 | Taiwan Semiconductor Manufacturing Co., Ltd. | Multi-sensing level MRAM structures |
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US7344896B2 (en) * | 2004-07-26 | 2008-03-18 | Infineon Technologies Ag | Ferromagnetic liner for conductive lines of magnetic memory cells and methods of manufacturing thereof |
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US20060022286A1 (en) * | 2004-07-30 | 2006-02-02 | Rainer Leuschner | Ferromagnetic liner for conductive lines of magnetic memory cells |
US7714441B2 (en) * | 2004-08-09 | 2010-05-11 | Lam Research | Barrier layer configurations and methods for processing microelectronic topographies having barrier layers |
US7221584B2 (en) * | 2004-08-13 | 2007-05-22 | Taiwan Semiconductor Manufacturing Company, Ltd. | MRAM cell having shared configuration |
US7075807B2 (en) * | 2004-08-18 | 2006-07-11 | Infineon Technologies Ag | Magnetic memory with static magnetic offset field |
US7083990B1 (en) * | 2005-01-28 | 2006-08-01 | Infineon Technologies Ag | Method of fabricating MRAM cells |
US7444740B1 (en) | 2005-01-31 | 2008-11-04 | Western Digital (Fremont), Llc | Damascene process for fabricating poles in recording heads |
US8019022B2 (en) * | 2007-03-22 | 2011-09-13 | Mediatek Inc. | Jitter-tolerance-enhanced CDR using a GDCO-based phase detector |
US20090026618A1 (en) * | 2007-07-25 | 2009-01-29 | Samsung Electronics Co., Ltd. | Semiconductor device including interlayer interconnecting structures and methods of forming the same |
US8015692B1 (en) | 2007-11-07 | 2011-09-13 | Western Digital (Fremont), Llc | Method for providing a perpendicular magnetic recording (PMR) head |
US7782660B2 (en) * | 2008-03-20 | 2010-08-24 | International Business Machines Corporation | Magnetically de-coupling magnetic memory cells and bit/word lines for reducing bit selection errors |
US8273582B2 (en) | 2009-07-09 | 2012-09-25 | Crocus Technologies | Method for use in making electronic devices having thin-film magnetic components |
US8513749B2 (en) * | 2010-01-14 | 2013-08-20 | Qualcomm Incorporated | Composite hardmask architecture and method of creating non-uniform current path for spin torque driven magnetic tunnel junction |
US8304863B2 (en) | 2010-02-09 | 2012-11-06 | International Business Machines Corporation | Electromigration immune through-substrate vias |
US8313947B2 (en) * | 2010-06-18 | 2012-11-20 | Freescale Semiconductor, Inc. | Method for testing a contact structure |
US8686522B2 (en) * | 2011-10-13 | 2014-04-01 | International Business Machines Corporation | Semiconductor trench inductors and transformers |
US9817087B2 (en) | 2012-03-14 | 2017-11-14 | Analog Devices, Inc. | Sensor with magnetroesitive and/or thin film element abutting shorting bars and a method of manufacture thereof |
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US9299924B1 (en) | 2015-06-29 | 2016-03-29 | International Business Machines Corporation | Injection pillar definition for line MRAM by a self-aligned sidewall transfer |
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US9917137B1 (en) | 2017-01-11 | 2018-03-13 | International Business Machines Corporation | Integrated magnetic tunnel junction (MTJ) in back end of line (BEOL) interconnects |
US10403424B2 (en) * | 2017-06-09 | 2019-09-03 | Texas Instruments Incorporated | Method to form magnetic core for integrated magnetic devices |
US10700263B2 (en) | 2018-02-01 | 2020-06-30 | International Business Machines Corporation | Annealed seed layer for magnetic random access memory |
US10741748B2 (en) | 2018-06-25 | 2020-08-11 | International Business Machines Corporation | Back end of line metallization structures |
RU2694289C1 (en) * | 2018-09-28 | 2019-07-11 | Общество с ограниченной ответственностью "КРОКУС НАНОЭЛЕКТРОНИКА" | Method of forming copper distribution with a thick cobalt-containing insert in the structure of devices operating based on magnetic tunnel junction |
US20220180911A1 (en) * | 2020-12-07 | 2022-06-09 | International Business Machines Corporation | External magnetic bottom contact structure for mram |
US11942126B2 (en) * | 2021-05-26 | 2024-03-26 | International Business Machines Corporation | Selectively biasing magnetoresistive random-access memory cells |
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Citations (8)
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US5940319A (en) * | 1998-08-31 | 1999-08-17 | Motorola, Inc. | Magnetic random access memory and fabricating method thereof |
WO2000010172A2 (en) * | 1998-08-12 | 2000-02-24 | Infineon Technologies Ag | Storage cell array and corresponding production method |
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WO2001071777A2 (en) * | 2000-03-21 | 2001-09-27 | Motorola, Inc. | Method of fabricating flux concentrating layer for use with magnetoresistive random access memories |
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EP1239489A1 (en) * | 2001-03-09 | 2002-09-11 | Hewlett-Packard Company | Method for fabricating cladding layer in top conductor |
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-
2001
- 2001-02-28 US US09/796,326 patent/US6413788B1/en not_active Expired - Lifetime
- 2001-07-27 US US09/916,884 patent/US6417561B1/en not_active Expired - Lifetime
-
2002
- 2002-02-14 KR KR1020037011279A patent/KR100608248B1/en active IP Right Grant
- 2002-02-14 JP JP2002581597A patent/JP4186046B2/en not_active Expired - Lifetime
- 2002-02-14 ES ES02761855T patent/ES2289136T3/en not_active Expired - Lifetime
- 2002-02-14 DE DE60222095T patent/DE60222095T2/en not_active Expired - Lifetime
- 2002-02-14 AU AU2002306525A patent/AU2002306525A1/en not_active Abandoned
- 2002-02-14 EP EP02761855A patent/EP1364417B1/en not_active Expired - Lifetime
- 2002-02-14 WO PCT/US2002/004771 patent/WO2002084755A2/en active IP Right Grant
- 2002-02-14 AT AT02761855T patent/ATE371958T1/en not_active IP Right Cessation
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WO2001071777A2 (en) * | 2000-03-21 | 2001-09-27 | Motorola, Inc. | Method of fabricating flux concentrating layer for use with magnetoresistive random access memories |
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Non-Patent Citations (1)
Title |
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Also Published As
Publication number | Publication date |
---|---|
EP1364417B1 (en) | 2007-08-29 |
DE60222095T2 (en) | 2008-05-29 |
AU2002306525A1 (en) | 2002-10-28 |
US6417561B1 (en) | 2002-07-09 |
ATE371958T1 (en) | 2007-09-15 |
JP2004527123A (en) | 2004-09-02 |
KR20030084951A (en) | 2003-11-01 |
JP4186046B2 (en) | 2008-11-26 |
DE60222095D1 (en) | 2007-10-11 |
US6413788B1 (en) | 2002-07-02 |
ES2289136T3 (en) | 2008-02-01 |
EP1364417A2 (en) | 2003-11-26 |
KR100608248B1 (en) | 2006-08-04 |
WO2002084755A2 (en) | 2002-10-24 |
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