WO2002086969B1 - Non-optical signal isolator - Google Patents

Non-optical signal isolator

Info

Publication number
WO2002086969B1
WO2002086969B1 PCT/US2002/012432 US0212432W WO02086969B1 WO 2002086969 B1 WO2002086969 B1 WO 2002086969B1 US 0212432 W US0212432 W US 0212432W WO 02086969 B1 WO02086969 B1 WO 02086969B1
Authority
WO
WIPO (PCT)
Prior art keywords
isolator
passive components
substrate
passive
passive component
Prior art date
Application number
PCT/US2002/012432
Other languages
French (fr)
Other versions
WO2002086969A3 (en
WO2002086969A2 (en
Inventor
Geoffrey T Haigh
Baoxing Chen
Original Assignee
Analog Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=25277306&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=WO2002086969(B1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Analog Devices Inc filed Critical Analog Devices Inc
Priority to EP02728858A priority Critical patent/EP1380052A2/en
Publication of WO2002086969A2 publication Critical patent/WO2002086969A2/en
Publication of WO2002086969A3 publication Critical patent/WO2002086969A3/en
Publication of WO2002086969B1 publication Critical patent/WO2002086969B1/en

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B5/00—Near-field transmission systems, e.g. inductive loop type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5222—Capacitive arrangements or effects of, or between wiring layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5222—Capacitive arrangements or effects of, or between wiring layers
    • H01L23/5223—Capacitor integral with wiring layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5227—Inductive arrangements or effects of, or between, wiring layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
    • H04B5/22—
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L25/00—Baseband systems
    • H04L25/02—Details ; arrangements for supplying electrical power along data transmission lines
    • H04L25/0264—Arrangements for coupling to transmission lines
    • H04L25/0266—Arrangements for providing Galvanic isolation, e.g. by means of magnetic or capacitive coupling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05553—Shape in top view being rectangular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/642—Capacitive arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/645—Inductive arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • H04B5/266—
    • H04B5/73—
    • H04B5/75—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D30/00—Reducing energy consumption in communication networks
    • Y02D30/70—Reducing energy consumption in communication networks in wireless communication networks

Abstract

A non-optical isolator having a driver circuit for providing an input signal to one or more first passive components which are coupled across a galvanic isolation barrier to one or more corresponding second passive components, and an output circuit that converts the signal from the second passive components to an output signal corresponding to the input signal. The entire structure may be formed monolithically as an integrated circuit on one or two die substrates, for low cost, small size, and low power consumption. The passive components may be coils (140, 142) or capacitor plates (130, 132, 134, 136), for example. When the first and second passive components are capacitor plates, a Faraday shield (51) may be provided between them, with the first and second passive components being referenced to separate grounds and the Faraday shield (51) referenced to the same ground as the second passive components.

Claims

AMENDED CLAIMS[received by the International Bureau on 28 October 2003 (28.10.03); original claims 1-14 replaced by amended claims 1-13 (2 pages)]
1. A signal isolator comprising: a first substrate; a first passive component formed on the first substrate; an isolation layer formed over the first passive component; a second passive component formed over the isolation layer; the first and second passive components being coils; an input for receiving an input signal; and a driver circuit coupled between the input and one of said passive components; wherein the input, driver circuit and said one of said passive components are referenced to a first ground and the other of said passive components is connected to supply an output signal referenced to a different, second ground which is galvanically isolated from the first ground..
2. A signal isolator comprising: a first substrate; a first passive component formed on the first substrate; an isolation layer formed over the first passive component; a second passive component formed over the isolation layer; the first and second passive components being capacitor plates; an input for receiving an input signal; and a driver circuit coupled between the input and one of said passive components.
3. The isolator of claim 1 or claim 2 wherein the first substrate is a semiconductor substrate.
4. The isolator of claim 3, wherein the isolator is formed on a single semiconductor substrate.
5. The isolator of claim 3, further comprising a second silicon substrate, wherein the driver circuit is formed on the second substrate. 16
6. The isolator of claim 1 or claim 2 wherein the first passive component is formed on top of the first substrate.
7. The isolator of claim 1 or claim 2 wherein the first passive component is formed into the first substrate.
8. The isolator of claim 1 or claim 2, further comprising a third passive component on the substrate, a second isolation layer over the third passive component, and a fourth passive component formed over the second isolation layer, wherein the driver circuit provides signals to the first and third passive components.
9. The isolator of claim 1 or claim 2, further comprising a third passive component on the substrate, a second isolation layer over the third passive component, and a fourth passive component formed over the second isolation layer, wherein the driver circuit provides signals to the second and fourth passive components.
10. The isolator of claim 9 wherein the first and second isolation layers are a single layer.
11. The isolator of claim 1 or claim 8, further including a Faraday shield between the first and second passive components, with the Faraday shield referenced to the same ground as the second passive components.
12. The isolator of claim 8, wherein the third and fourth passive components are capacitor plates.
13. The isolator of claim 8, wherein the first, second, third, and fourth passive components are coils.
PCT/US2002/012432 2001-04-19 2002-04-19 Non-optical signal isolator WO2002086969A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP02728858A EP1380052A2 (en) 2001-04-19 2002-04-19 Non-optical signal isolator

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/838,520 2001-04-19
US09/838,520 US6873065B2 (en) 1997-10-23 2001-04-19 Non-optical signal isolator

Publications (3)

Publication Number Publication Date
WO2002086969A2 WO2002086969A2 (en) 2002-10-31
WO2002086969A3 WO2002086969A3 (en) 2003-11-13
WO2002086969B1 true WO2002086969B1 (en) 2004-01-08

Family

ID=25277306

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2002/012432 WO2002086969A2 (en) 2001-04-19 2002-04-19 Non-optical signal isolator

Country Status (3)

Country Link
US (1) US6873065B2 (en)
EP (1) EP1380052A2 (en)
WO (1) WO2002086969A2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7719305B2 (en) 2006-07-06 2010-05-18 Analog Devices, Inc. Signal isolator using micro-transformers

Families Citing this family (185)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030042571A1 (en) 1997-10-23 2003-03-06 Baoxing Chen Chip-scale coils and isolators based thereon
US6873065B2 (en) 1997-10-23 2005-03-29 Analog Devices, Inc. Non-optical signal isolator
US6262600B1 (en) 2000-02-14 2001-07-17 Analog Devices, Inc. Isolator for transmitting logic signals across an isolation barrier
US7310039B1 (en) 2001-11-30 2007-12-18 Silicon Laboratories Inc. Surface inductor
DE10243197B4 (en) 2002-09-18 2011-05-05 Infineon Technologies Ag Digital signal transmission method
US20040222511A1 (en) * 2002-10-15 2004-11-11 Silicon Laboratories, Inc. Method and apparatus for electromagnetic shielding of a circuit element
US7141883B2 (en) * 2002-10-15 2006-11-28 Silicon Laboratories Inc. Integrated circuit package configuration incorporating shielded circuit element structure
US7275292B2 (en) 2003-03-07 2007-10-02 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Method for fabricating an acoustical resonator on a substrate
EP2302850A1 (en) * 2003-04-30 2011-03-30 Analog Devices, Inc. Signal isolators using micro-transformers
US7358831B2 (en) * 2003-10-30 2008-04-15 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Film bulk acoustic resonator (FBAR) devices with simplified packaging
US7391285B2 (en) * 2003-10-30 2008-06-24 Avago Technologies Wireless Ip Pte Ltd Film acoustically-coupled transformer
US7019605B2 (en) * 2003-10-30 2006-03-28 Larson Iii John D Stacked bulk acoustic resonator band-pass filter with controllable pass bandwidth
EP1528677B1 (en) * 2003-10-30 2006-05-10 Agilent Technologies, Inc. Film acoustically-coupled transformer with two reverse c-axis piezoelectric elements
US6946928B2 (en) * 2003-10-30 2005-09-20 Agilent Technologies, Inc. Thin-film acoustically-coupled transformer
WO2005059961A2 (en) * 2003-12-10 2005-06-30 The Regents Of The University Of California Low crosstalk substrate for mixed-signal integrated circuits
US7902627B2 (en) 2004-06-03 2011-03-08 Silicon Laboratories Inc. Capacitive isolation circuitry with improved common mode detector
US7738568B2 (en) 2004-06-03 2010-06-15 Silicon Laboratories Inc. Multiplexed RF isolator
US7302247B2 (en) 2004-06-03 2007-11-27 Silicon Laboratories Inc. Spread spectrum isolator
US8049573B2 (en) * 2004-06-03 2011-11-01 Silicon Laboratories Inc. Bidirectional multiplexed RF isolator
US7376212B2 (en) 2004-06-03 2008-05-20 Silicon Laboratories Inc. RF isolator with differential input/output
US7821428B2 (en) 2004-06-03 2010-10-26 Silicon Laboratories Inc. MCU with integrated voltage isolator and integrated galvanically isolated asynchronous serial data link
US8441325B2 (en) 2004-06-03 2013-05-14 Silicon Laboratories Inc. Isolator with complementary configurable memory
US7447492B2 (en) * 2004-06-03 2008-11-04 Silicon Laboratories Inc. On chip transformer isolator
US8198951B2 (en) * 2004-06-03 2012-06-12 Silicon Laboratories Inc. Capacitive isolation circuitry
US7737871B2 (en) 2004-06-03 2010-06-15 Silicon Laboratories Inc. MCU with integrated voltage isolator to provide a galvanic isolation between input and output
US8169108B2 (en) * 2004-06-03 2012-05-01 Silicon Laboratories Inc. Capacitive isolator
US7421028B2 (en) 2004-06-03 2008-09-02 Silicon Laboratories Inc. Transformer isolator for digital power supply
US7375411B2 (en) * 2004-06-03 2008-05-20 Silicon Laboratories Inc. Method and structure for forming relatively dense conductive layers
US7388454B2 (en) * 2004-10-01 2008-06-17 Avago Technologies Wireless Ip Pte Ltd Acoustic resonator performance enhancement using alternating frame structure
US8981876B2 (en) * 2004-11-15 2015-03-17 Avago Technologies General Ip (Singapore) Pte. Ltd. Piezoelectric resonator structures and electrical filters having frame elements
US7202560B2 (en) 2004-12-15 2007-04-10 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Wafer bonding of micro-electro mechanical systems to active circuitry
US7791434B2 (en) * 2004-12-22 2010-09-07 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Acoustic resonator performance enhancement using selective metal etch and having a trench in the piezoelectric
CN101194217B (en) * 2005-02-16 2010-05-19 李持国际有限公司 Power distribution system using solid state power controllers
US7427819B2 (en) * 2005-03-04 2008-09-23 Avago Wireless Ip Pte Ltd Film-bulk acoustic wave resonator with motion plate and method
US7369013B2 (en) * 2005-04-06 2008-05-06 Avago Technologies Wireless Ip Pte Ltd Acoustic resonator performance enhancement using filled recessed region
US7436269B2 (en) * 2005-04-18 2008-10-14 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Acoustically coupled resonators and method of making the same
DE102005020615B4 (en) * 2005-05-03 2010-03-11 Infineon Technologies Austria Ag Signal transmission arrangement with a transformer and a receiver circuit
US7868522B2 (en) 2005-09-09 2011-01-11 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Adjusted frequency temperature coefficient resonator
US7483274B2 (en) * 2005-09-29 2009-01-27 Welch Allyn, Inc. Galvanic isolation of a signal using capacitive coupling embedded within a circuit board
US7501924B2 (en) * 2005-09-30 2009-03-10 Silicon Laboratories Inc. Self-shielding inductor
US7391286B2 (en) * 2005-10-06 2008-06-24 Avago Wireless Ip Pte Ltd Impedance matching and parasitic capacitor resonance of FBAR resonators and coupled filters
US7525398B2 (en) * 2005-10-18 2009-04-28 Avago Technologies General Ip (Singapore) Pte. Ltd. Acoustically communicating data signals across an electrical isolation barrier
US7425787B2 (en) * 2005-10-18 2008-09-16 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Acoustic galvanic isolator incorporating single insulated decoupled stacked bulk acoustic resonator with acoustically-resonant electrical insulator
US7737807B2 (en) 2005-10-18 2010-06-15 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Acoustic galvanic isolator incorporating series-connected decoupled stacked bulk acoustic resonators
US7423503B2 (en) * 2005-10-18 2008-09-09 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Acoustic galvanic isolator incorporating film acoustically-coupled transformer
US7675390B2 (en) * 2005-10-18 2010-03-09 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Acoustic galvanic isolator incorporating single decoupled stacked bulk acoustic resonator
US7463499B2 (en) * 2005-10-31 2008-12-09 Avago Technologies General Ip (Singapore) Pte Ltd. AC-DC power converter
US7561009B2 (en) * 2005-11-30 2009-07-14 Avago Technologies General Ip (Singapore) Pte. Ltd. Film bulk acoustic resonator (FBAR) devices with temperature compensation
US7612636B2 (en) * 2006-01-30 2009-11-03 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Impedance transforming bulk acoustic wave baluns
KR101387085B1 (en) * 2006-03-07 2014-04-18 스캐니메트릭스 인크. Method and apparatus for interrogating an electronic component
US8373429B2 (en) * 2006-03-07 2013-02-12 Steven Slupsky Method and apparatus for interrogating an electronic component
US20070210724A1 (en) * 2006-03-09 2007-09-13 Mark Unkrich Power adapter and DC-DC converter having acoustic transformer
US7746677B2 (en) * 2006-03-09 2010-06-29 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. AC-DC converter circuit and power supply
US7479685B2 (en) * 2006-03-10 2009-01-20 Avago Technologies General Ip (Singapore) Pte. Ltd. Electronic device on substrate with cavity and mitigated parasitic leakage path
US7791900B2 (en) * 2006-08-28 2010-09-07 Avago Technologies General Ip (Singapore) Pte. Ltd. Galvanic isolator
US8061017B2 (en) * 2006-08-28 2011-11-22 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Methods of making coil transducers
US7948067B2 (en) * 2009-06-30 2011-05-24 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Coil transducer isolator packages
US8385043B2 (en) * 2006-08-28 2013-02-26 Avago Technologies ECBU IP (Singapoare) Pte. Ltd. Galvanic isolator
US20080278275A1 (en) * 2007-05-10 2008-11-13 Fouquet Julie E Miniature Transformers Adapted for use in Galvanic Isolators and the Like
US7852186B2 (en) * 2006-08-28 2010-12-14 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Coil transducer with reduced arcing and improved high voltage breakdown performance characteristics
US8093983B2 (en) * 2006-08-28 2012-01-10 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Narrowbody coil isolator
US9105391B2 (en) * 2006-08-28 2015-08-11 Avago Technologies General Ip (Singapore) Pte. Ltd. High voltage hold-off coil transducer
US9019057B2 (en) 2006-08-28 2015-04-28 Avago Technologies General Ip (Singapore) Pte. Ltd. Galvanic isolators and coil transducers
US8427844B2 (en) * 2006-08-28 2013-04-23 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Widebody coil isolators
US7508286B2 (en) * 2006-09-28 2009-03-24 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. HBAR oscillator and method of manufacture
EP1909404B1 (en) * 2006-10-02 2009-04-01 Infineon Technologies Austria AG Data transmission method over a potential barrier
US20080181316A1 (en) * 2007-01-25 2008-07-31 Philip John Crawley Partitioned Signal and Power Transfer Across an Isolation Barrier
US7898786B2 (en) * 2007-01-26 2011-03-01 Siemens Industry, Inc. Intrinsically safe galvanically isolated barrier device and method thereof
US20080202239A1 (en) * 2007-02-28 2008-08-28 Fazzio R Shane Piezoelectric acceleration sensor
US7852017B1 (en) 2007-03-12 2010-12-14 Cirrus Logic, Inc. Ballast for light emitting diode light sources
US20080224631A1 (en) * 2007-03-12 2008-09-18 Melanson John L Color variations in a dimmable lighting device with stable color temperature light sources
US8076920B1 (en) 2007-03-12 2011-12-13 Cirrus Logic, Inc. Switching power converter and control system
US8018171B1 (en) 2007-03-12 2011-09-13 Cirrus Logic, Inc. Multi-function duty cycle modifier
US7667408B2 (en) 2007-03-12 2010-02-23 Cirrus Logic, Inc. Lighting system with lighting dimmer output mapping
JP4985024B2 (en) * 2007-03-28 2012-07-25 富士ゼロックス株式会社 Rotating body for powder conveyance and toner cartridge
US7554473B2 (en) * 2007-05-02 2009-06-30 Cirrus Logic, Inc. Control system using a nonlinear delta-sigma modulator with nonlinear process modeling
US8362481B2 (en) 2007-05-08 2013-01-29 Scanimetrics Inc. Ultra high speed signal transmission/reception
CA2687120A1 (en) 2007-05-08 2008-11-13 Scanimetrics Inc. Ultra high speed signal transmission/reception
US8102127B2 (en) 2007-06-24 2012-01-24 Cirrus Logic, Inc. Hybrid gas discharge lamp-LED lighting system
US8861229B2 (en) * 2007-06-25 2014-10-14 Silicon Laboratories Inc. Isolator circuit including a voltage regulator
US7791435B2 (en) * 2007-09-28 2010-09-07 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Single stack coupled resonators having differential output
US7804697B2 (en) * 2007-12-11 2010-09-28 Cirrus Logic, Inc. History-independent noise-immune modulated transformer-coupled gate control signaling method and apparatus
KR100951695B1 (en) * 2007-12-24 2010-04-07 (주)페타리 Isolator and method of manufacturing the same
US8004863B2 (en) * 2007-12-26 2011-08-23 Silicon Laboratories Inc. Circuit device and method of providing feedback across an isolation barrier
US8022683B2 (en) * 2008-01-30 2011-09-20 Cirrus Logic, Inc. Powering a power supply integrated circuit with sense current
US8008898B2 (en) * 2008-01-30 2011-08-30 Cirrus Logic, Inc. Switching regulator with boosted auxiliary winding supply
US7755525B2 (en) * 2008-01-30 2010-07-13 Cirrus Logic, Inc. Delta sigma modulator with unavailable output values
US8576589B2 (en) * 2008-01-30 2013-11-05 Cirrus Logic, Inc. Switch state controller with a sense current generated operating voltage
US7796076B2 (en) * 2008-02-26 2010-09-14 Cirrus Logic, Inc. Transformer-isolated analog-to-digital converter (ADC) feedback apparatus and method
CA2623257A1 (en) * 2008-02-29 2009-08-29 Scanimetrics Inc. Method and apparatus for interrogating an electronic component
US8258911B2 (en) 2008-03-31 2012-09-04 Avago Technologies ECBU IP (Singapor) Pte. Ltd. Compact power transformer components, devices, systems and methods
US7759881B1 (en) 2008-03-31 2010-07-20 Cirrus Logic, Inc. LED lighting system with a multiple mode current control dimming strategy
US8169193B2 (en) * 2008-04-09 2012-05-01 Analog Devices, Inc. Charge injection discharge circuit
US7732977B2 (en) * 2008-04-30 2010-06-08 Avago Technologies Wireless Ip (Singapore) Transceiver circuit for film bulk acoustic resonator (FBAR) transducers
US7855618B2 (en) * 2008-04-30 2010-12-21 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Bulk acoustic resonator electrical impedance transformers
US8008902B2 (en) * 2008-06-25 2011-08-30 Cirrus Logic, Inc. Hysteretic buck converter having dynamic thresholds
US8212491B2 (en) 2008-07-25 2012-07-03 Cirrus Logic, Inc. Switching power converter control with triac-based leading edge dimmer compatibility
US8279628B2 (en) * 2008-07-25 2012-10-02 Cirrus Logic, Inc. Audible noise suppression in a resonant switching power converter
US8344707B2 (en) 2008-07-25 2013-01-01 Cirrus Logic, Inc. Current sensing in a switching power converter
US8487546B2 (en) 2008-08-29 2013-07-16 Cirrus Logic, Inc. LED lighting system with accurate current control
US8179110B2 (en) * 2008-09-30 2012-05-15 Cirrus Logic Inc. Adjustable constant current source with continuous conduction mode (“CCM”) and discontinuous conduction mode (“DCM”) operation
US8222872B1 (en) 2008-09-30 2012-07-17 Cirrus Logic, Inc. Switching power converter with selectable mode auxiliary power supply
US8288954B2 (en) 2008-12-07 2012-10-16 Cirrus Logic, Inc. Primary-side based control of secondary-side current for a transformer
US8299722B2 (en) * 2008-12-12 2012-10-30 Cirrus Logic, Inc. Time division light output sensing and brightness adjustment for different spectra of light emitting diodes
US8362707B2 (en) 2008-12-12 2013-01-29 Cirrus Logic, Inc. Light emitting diode based lighting system with time division ambient light feedback response
US7994863B2 (en) * 2008-12-31 2011-08-09 Cirrus Logic, Inc. Electronic system having common mode voltage range enhancement
JP5582134B2 (en) 2009-02-20 2014-09-03 日本電気株式会社 Receiving circuit and signal receiving method
US8432182B2 (en) * 2009-03-30 2013-04-30 Analog Devices, Inc. USB isolator with advanced control features
JP5375952B2 (en) 2009-03-31 2013-12-25 日本電気株式会社 Semiconductor device
US8482223B2 (en) * 2009-04-30 2013-07-09 Cirrus Logic, Inc. Calibration of lamps
US8902023B2 (en) * 2009-06-24 2014-12-02 Avago Technologies General Ip (Singapore) Pte. Ltd. Acoustic resonator structure having an electrode with a cantilevered portion
US8248185B2 (en) * 2009-06-24 2012-08-21 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Acoustic resonator structure comprising a bridge
US8963535B1 (en) 2009-06-30 2015-02-24 Cirrus Logic, Inc. Switch controlled current sensing using a hall effect sensor
US8248145B2 (en) * 2009-06-30 2012-08-21 Cirrus Logic, Inc. Cascode configured switching using at least one low breakdown voltage internal, integrated circuit switch to control at least one high breakdown voltage external switch
US8198874B2 (en) * 2009-06-30 2012-06-12 Cirrus Logic, Inc. Switching power converter with current sensing transformer auxiliary power supply
US8212493B2 (en) 2009-06-30 2012-07-03 Cirrus Logic, Inc. Low energy transfer mode for auxiliary power supply operation in a cascaded switching power converter
US9155174B2 (en) * 2009-09-30 2015-10-06 Cirrus Logic, Inc. Phase control dimming compatible lighting systems
US8654483B2 (en) * 2009-11-09 2014-02-18 Cirrus Logic, Inc. Power system having voltage-based monitoring for over current protection
US8193877B2 (en) * 2009-11-30 2012-06-05 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Duplexer with negative phase shifting circuit
US8380146B2 (en) * 2009-12-31 2013-02-19 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Multi-band, multi-mode RF transmit amplifier system with separate signal paths for linear and saturated operation
US9243316B2 (en) 2010-01-22 2016-01-26 Avago Technologies General Ip (Singapore) Pte. Ltd. Method of fabricating piezoelectric material with selected c-axis orientation
US8796904B2 (en) 2011-10-31 2014-08-05 Avago Technologies General Ip (Singapore) Pte. Ltd. Bulk acoustic resonator comprising piezoelectric layer and inverse piezoelectric layer
JP5170165B2 (en) 2010-06-11 2013-03-27 株式会社村田製作所 Isolated switching power supply
US20120002377A1 (en) * 2010-06-30 2012-01-05 William French Galvanic isolation transformer
US8451032B2 (en) 2010-12-22 2013-05-28 Silicon Laboratories Inc. Capacitive isolator with schmitt trigger
US8962443B2 (en) 2011-01-31 2015-02-24 Avago Technologies General Ip (Singapore) Pte. Ltd. Semiconductor device having an airbridge and method of fabricating the same
US9154112B2 (en) 2011-02-28 2015-10-06 Avago Technologies General Ip (Singapore) Pte. Ltd. Coupled resonator filter comprising a bridge
US9425764B2 (en) 2012-10-25 2016-08-23 Avago Technologies General Ip (Singapore) Pte. Ltd. Accoustic resonator having composite electrodes with integrated lateral features
US9148117B2 (en) 2011-02-28 2015-09-29 Avago Technologies General Ip (Singapore) Pte. Ltd. Coupled resonator filter comprising a bridge and frame elements
US9136818B2 (en) 2011-02-28 2015-09-15 Avago Technologies General Ip (Singapore) Pte. Ltd. Stacked acoustic resonator comprising a bridge
US9048812B2 (en) 2011-02-28 2015-06-02 Avago Technologies General Ip (Singapore) Pte. Ltd. Bulk acoustic wave resonator comprising bridge formed within piezoelectric layer
US9203374B2 (en) 2011-02-28 2015-12-01 Avago Technologies General Ip (Singapore) Pte. Ltd. Film bulk acoustic resonator comprising a bridge
US9083302B2 (en) 2011-02-28 2015-07-14 Avago Technologies General Ip (Singapore) Pte. Ltd. Stacked bulk acoustic resonator comprising a bridge and an acoustic reflector along a perimeter of the resonator
US8575820B2 (en) 2011-03-29 2013-11-05 Avago Technologies General Ip (Singapore) Pte. Ltd. Stacked bulk acoustic resonator
US9444426B2 (en) 2012-10-25 2016-09-13 Avago Technologies General Ip (Singapore) Pte. Ltd. Accoustic resonator having integrated lateral feature and temperature compensation feature
WO2012157180A1 (en) 2011-05-18 2012-11-22 ルネサスエレクトロニクス株式会社 Reception circuit and signal reception method
TWI536776B (en) * 2011-05-25 2016-06-01 西拉娜集團私人有限公司 Usb isolator integrated circuit with usb 2.0 high speed mode and automatic speed detection
US8350445B1 (en) 2011-06-16 2013-01-08 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Bulk acoustic resonator comprising non-piezoelectric layer and bridge
US9009382B2 (en) * 2011-06-24 2015-04-14 Maxim Integrated Products, Inc. USB hubs with galvanic isolation
US8890368B2 (en) 2011-06-27 2014-11-18 Maxim Integrated Products, Inc. Systems and methods for power transfer based on resonance coupling of inductors
US8625242B2 (en) 2011-08-03 2014-01-07 Maxim Integrated Products, Inc. Failsafe galvanic isolation barrier
US9209091B1 (en) 2011-08-05 2015-12-08 Maxim Integrated Products, Inc. Integrated monolithic galvanic isolator
US8922302B2 (en) 2011-08-24 2014-12-30 Avago Technologies General Ip (Singapore) Pte. Ltd. Acoustic resonator formed on a pedestal
US8558344B2 (en) 2011-09-06 2013-10-15 Analog Devices, Inc. Small size and fully integrated power converter with magnetics on chip
US8648664B2 (en) 2011-09-30 2014-02-11 Silicon Laboratories Inc. Mutual inductance circuits
US8497700B2 (en) 2011-10-21 2013-07-30 Samsung Electro-Mechanics Systems and methods for propagating digital data across an isolation barrier
US9972196B2 (en) 2012-04-23 2018-05-15 Analog Devices, Inc. Isolator system with status data integrated with measurement data
US9768945B2 (en) 2012-04-23 2017-09-19 Analog Devices, Inc. Isolated system data communication
US9054690B2 (en) 2012-08-29 2015-06-09 Analog Devices Global Chopped oscillator
US8786393B1 (en) 2013-02-05 2014-07-22 Analog Devices, Inc. Step up or step down micro-transformer with tight magnetic coupling
US9337253B2 (en) * 2013-03-09 2016-05-10 Microchip Technology Incorporated Method and apparatus for constructing an isolation capacitor in an integrated circuit
US9293997B2 (en) 2013-03-14 2016-03-22 Analog Devices Global Isolated error amplifier for isolated power supplies
US8928383B2 (en) 2013-03-15 2015-01-06 Analog Devices, Inc. Integrated delayed clock for high speed isolated SPI communication
US9466413B2 (en) 2013-06-28 2016-10-11 Freescale Semiconductor, Inc. Die-to-die inductive communication devices and methods
US9337905B2 (en) * 2013-07-01 2016-05-10 Texas Instruments Incorporated Inductive structures with reduced emissions and interference
JP6115408B2 (en) 2013-08-29 2017-04-19 三菱電機株式会社 Semiconductor device
US9160423B2 (en) 2013-12-12 2015-10-13 Freescale Semiconductor, Inc. Die-to-die inductive communication devices and methods
US10992346B2 (en) 2014-03-26 2021-04-27 Nxp Usa, Inc. Systems and devices with common mode noise suppression structures and methods
US10051701B2 (en) 2014-07-16 2018-08-14 Philips Lighting Holding B.V. Systems and methods for maintaining dimmer behavior in a low-power lamp assembly
US9584147B2 (en) 2014-08-22 2017-02-28 Analog Devices Global Isolator system supporting multiple ADCs via a single isolator channel
US9660848B2 (en) 2014-09-15 2017-05-23 Analog Devices Global Methods and structures to generate on/off keyed carrier signals for signal isolators
US10270630B2 (en) 2014-09-15 2019-04-23 Analog Devices, Inc. Demodulation of on-off-key modulated signals in signal isolator systems
US10536309B2 (en) 2014-09-15 2020-01-14 Analog Devices, Inc. Demodulation of on-off-key modulated signals in signal isolator systems
US9998301B2 (en) 2014-11-03 2018-06-12 Analog Devices, Inc. Signal isolator system with protection for common mode transients
US10200073B2 (en) * 2014-12-09 2019-02-05 Northrop Grumman Systems Corporation Launchable communications device for a distributed communication system
US9219028B1 (en) 2014-12-17 2015-12-22 Freescale Semiconductor, Inc. Die-to-die inductive communication devices and methods
US9531376B2 (en) * 2015-05-29 2016-12-27 Silicon Laboratories Inc. Solid state relay using capacitive isolation
US9829531B2 (en) 2015-10-23 2017-11-28 Maxim Integrated Products, Inc. Dual galvanic isolation barriers and monitoring systems and methods
US10651147B2 (en) 2016-09-13 2020-05-12 Allegro Microsystems, Llc Signal isolator having bidirectional communication between die
US11049639B2 (en) * 2017-02-13 2021-06-29 Analog Devices, Inc. Coupled coils with lower far field radiation and higher noise immunity
CN108933029A (en) * 2017-05-24 2018-12-04 通用电气公司 With the signal and power transmission integrated system being galvanically isolated
US10074939B1 (en) 2017-08-08 2018-09-11 Allegro Microsystems, Llc Signal isolator having inductive and capacitive signal coupling
US10236932B1 (en) * 2017-11-02 2019-03-19 Allegro Microsystems, Llc Signal isolator having magnetic signal latching
US10753968B2 (en) 2018-02-27 2020-08-25 Allegro Microsystems, Llc Integrated circuit having insulation breakdown detection
WO2020003481A1 (en) * 2018-06-29 2020-01-02 新電元工業株式会社 Electronic device
EP3598409B1 (en) 2018-07-16 2021-03-10 Melexis Technologies NV Transceiver with galvanic isolation means
US11482924B2 (en) 2018-07-26 2022-10-25 Analog Devices International Unlimited Company Power isolator exhibiting low electromagnetic interference
US11112465B2 (en) 2019-02-05 2021-09-07 Allegro Microsystems, Llc Integrated circuit having insulation monitoring with frequency discrimination
US11342288B2 (en) 2019-06-04 2022-05-24 Allegro Microsystems, Llc Signal isolator having at least one isolation island
US11029366B2 (en) 2019-08-13 2021-06-08 Allegro Microsystems, Llc Ground disconnect detection for multiple voltage domains
US20210057330A1 (en) * 2019-08-22 2021-02-25 Allegro Microsystems, Llc Single chip signal isolator
US11115244B2 (en) 2019-09-17 2021-09-07 Allegro Microsystems, Llc Signal isolator with three state data transmission
US11515246B2 (en) 2020-10-09 2022-11-29 Allegro Microsystems, Llc Dual circuit digital isolator
US11626805B2 (en) 2020-12-22 2023-04-11 Infineon Technologies Ag Control loop for flyback power converter
US11804770B2 (en) 2021-10-06 2023-10-31 Infineon Technologies Ag Analyzing a control signal in order to control a power converter to deliver energy to a load

Family Cites Families (59)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3537022A (en) 1968-01-10 1970-10-27 Hewlett Packard Co Signal translating circuit
US3714540A (en) 1970-11-10 1973-01-30 Oxy Metal Finishing Corp Isolation and transforming circuit
US3798608A (en) 1972-12-15 1974-03-19 Johnson Service Co Digital signal transmission apparatus
DE2529296A1 (en) 1975-07-01 1977-01-20 Ferranti Ltd Isolating transformer used as pulse transformer - is for use with high speed pulses and has two annular cores covered in windings
US4027152A (en) 1975-11-28 1977-05-31 Hewlett-Packard Company Apparatus and method for transmitting binary-coded information
US4118603A (en) 1977-05-31 1978-10-03 Noramco, Inc. DC signaling circuit for use in conjunction with isolation transformers
US4227045A (en) 1978-06-28 1980-10-07 Honeywell Inc. Data processing protocol system
US4302807A (en) 1980-08-04 1981-11-24 Burroughs Corporation Controlled current base drive circuit
JPS58215833A (en) 1982-06-10 1983-12-15 Yamatake Honeywell Co Ltd Transmitter of magnetic signal
US4818855A (en) 1985-01-11 1989-04-04 Indala Corporation Identification system
US4660014A (en) * 1985-06-19 1987-04-21 Jaycor Electromagnetic pulse isolation transformer
US4835486A (en) 1986-04-28 1989-05-30 Burr-Brown Corporation Isolation amplifier with precise timing of signals coupled across isolation barrier
US4780795A (en) * 1986-04-28 1988-10-25 Burr-Brown Corporation Packages for hybrid integrated circuit high voltage isolation amplifiers and method of manufacture
US4748419A (en) 1986-04-28 1988-05-31 Burr-Brown Corporation Isolation amplifier with precise timing of signals coupled across isolation barrier
US4825450A (en) 1987-03-12 1989-04-25 The Boeing Company Binary data communication system
US4885582A (en) 1987-09-28 1989-12-05 The Grass Valley Group, Inc. "Simple code" encoder/decoder
JPH01116281A (en) * 1987-10-29 1989-05-09 Aisin Seiki Co Ltd Ignition device
US4859877A (en) 1988-01-04 1989-08-22 Gte Laboratories Incorporated Bidirectional digital signal transmission system
US4817865A (en) 1988-03-17 1989-04-04 Racal Data Communications Inc. Ventilation system for modular electronic housing
US5041780A (en) 1988-09-13 1991-08-20 California Institute Of Technology Integrable current sensors
CA1331214C (en) 1989-01-05 1994-08-02 Kun-Ming Lee Interfacing control circuit with active circuit charge or discharge
US5057968A (en) 1989-10-16 1991-10-15 Lockheed Corporation Cooling system for electronic modules
US5396394A (en) 1990-02-06 1995-03-07 International Business Machines Corp. ISDN device line protection circuit
US5102040A (en) 1991-03-28 1992-04-07 At&T Bell Laboratories Method and apparatus for fan control to achieve enhanced cooling
US5204551A (en) 1991-07-01 1993-04-20 Motorola, Inc. Method and apparatus for high power pulse modulation
FR2679670B1 (en) 1991-07-23 1993-10-29 Dan Serbanescu CONTACTLESS BILATERAL COMMUNICATION SYSTEM FOR MICROPROCESSOR CREDIT CARDS.
US5142432A (en) 1991-10-21 1992-08-25 General Motors Corporation Fault detection apparatus for a transformer isolated transistor drive circuit for a power device
US5270882A (en) 1992-07-15 1993-12-14 International Business Machines Corporation Low-voltage, low-power amplifier for magnetoresistive sensor
US5588021A (en) 1992-09-25 1996-12-24 Light & Sound Design Limited Repeater for use in a control network
US5384808A (en) 1992-12-31 1995-01-24 Apple Computer, Inc. Method and apparatus for transmitting NRZ data signals across an isolation barrier disposed in an interface between adjacent devices on a bus
US5533054A (en) 1993-07-09 1996-07-02 Technitrol, Inc. Multi-level data transmitter
WO1995020768A1 (en) 1994-01-31 1995-08-03 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Miniaturized planar-design coil assembly for the detection of ferromagnetic materials
US5467607A (en) 1994-02-22 1995-11-21 At&T Corp. Air conditioning control system
JP3213156B2 (en) 1994-03-15 2001-10-02 富士通株式会社 Electronics
US5701037A (en) 1994-11-15 1997-12-23 Siemens Aktiengesellschaft Arrangement for inductive signal transmission between the chip layers of a vertically integrated circuit
US5818112A (en) * 1994-11-15 1998-10-06 Siemens Aktiengesellschaft Arrangement for capacitive signal transmission between the chip layers of a vertically integrated circuit
US5539598A (en) 1994-12-08 1996-07-23 International Business Machines Corporation Electrostatic protection for a shielded MR sensor
JP3487461B2 (en) * 1994-12-17 2004-01-19 ソニー株式会社 Transformers and amplifiers
US5596466A (en) 1995-01-13 1997-01-21 Ixys Corporation Intelligent, isolated half-bridge power module
US5786979A (en) * 1995-12-18 1998-07-28 Douglass; Barry G. High density inter-chip connections by electromagnetic coupling
CN1183587C (en) 1996-04-08 2005-01-05 德克萨斯仪器股份有限公司 Method and apparatus for galvanically isolating two integrated circuits from each others
US5831526A (en) * 1996-08-01 1998-11-03 Hansler; Richard L. Atmospheric hazard detector network
US5831426A (en) 1996-08-16 1998-11-03 Nonvolatile Electronics, Incorporated Magnetic current sensor
US5731954A (en) 1996-08-22 1998-03-24 Cheon; Kioan Cooling system for computer
US5714938A (en) 1996-11-19 1998-02-03 Cae Electronics Ltd. Temperature protection device for air cooled electronics housing
US5952849A (en) 1997-02-21 1999-09-14 Analog Devices, Inc. Logic isolator with high transient immunity
DE19718420A1 (en) 1997-04-30 1998-11-12 Siemens Ag Integrated data transmission circuit with electrical isolation between input and output circuit
US5969590A (en) * 1997-08-05 1999-10-19 Applied Micro Circuits Corporation Integrated circuit transformer with inductor-substrate isolation
US5831525A (en) 1997-09-18 1998-11-03 Harvey; James C. Filtered air, temperature controlled removable computer cartridge devices
US6873065B2 (en) 1997-10-23 2005-03-29 Analog Devices, Inc. Non-optical signal isolator
US6054780A (en) 1997-10-23 2000-04-25 Analog Devices, Inc. Magnetically coupled signal isolator using a Faraday shielded MR or GMR receiving element
TW419810B (en) * 1998-06-18 2001-01-21 Hitachi Ltd Semiconductor device
US6127663A (en) 1998-10-09 2000-10-03 Ericsson Inc. Electronics cabinet cooling system
US6087882A (en) * 1998-12-04 2000-07-11 Analog Devices, Inc. Ultra-low power magnetically coupled digital isolator using spin valve resistors
DE19922127C2 (en) 1999-05-12 2002-05-29 Siemens Ag Integrated circuit with an A / D or D / A converter with electrical isolation
DE19922128C1 (en) 1999-05-12 2001-01-25 Siemens Ag Integrated circuit for generating a drive signal for an isolated gate bipolar transistor (IGBT)
DE19922123A1 (en) 1999-05-12 2000-11-23 Siemens Ag Bus interface implemented as integrated circuit
DE19922129C1 (en) 1999-05-12 2000-09-28 Siemens Ag Logical combination method for signals
US6262600B1 (en) 2000-02-14 2001-07-17 Analog Devices, Inc. Isolator for transmitting logic signals across an isolation barrier

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7719305B2 (en) 2006-07-06 2010-05-18 Analog Devices, Inc. Signal isolator using micro-transformers

Also Published As

Publication number Publication date
EP1380052A2 (en) 2004-01-14
WO2002086969A3 (en) 2003-11-13
US20020135236A1 (en) 2002-09-26
US6873065B2 (en) 2005-03-29
WO2002086969A2 (en) 2002-10-31

Similar Documents

Publication Publication Date Title
WO2002086969B1 (en) Non-optical signal isolator
US11864295B2 (en) Selectively shielded radio frequency module with multi-mode stacked power amplifier stage
WO2003065569A3 (en) Output circuit for a semiconductor amplifier element
EP1388988B1 (en) Chip-scale coils and isolators based thereon
WO2003021667A3 (en) Package with integrated inductor and/or capacitor
US7268659B2 (en) Micro electric power converter
US8385028B2 (en) Galvanic isolator
RU2190879C2 (en) Card having built-in ic-chip and semiconductor ic-chip usable with the card
US20060226905A1 (en) Stacked RF power amplifier
TW200601561A (en) High-performance cmos soi devices on hybrid crystal-oriented substrates
WO2005000733A3 (en) Integrated circuit on high performance chip
WO2009028683A1 (en) Electronic parts
WO2008087781A1 (en) Dc-dc converter module
WO2005003790A3 (en) Magnetic resonance imaging interference immune device
EP1156530A3 (en) Compound semiconductor switching device for high frequency switching
WO2006062616A3 (en) Galvanically isolated signal conditioning system
US20100027568A1 (en) Technique for sharing transmit and receive ports of a cmos based transceiver
WO2004064152A3 (en) Modular construction component with encapsulation
WO1999044307A3 (en) Antenna-gain diversity
WO2003060998B1 (en) Wire bond-less electronic component for use with an external circuit and method of manufacture
WO2002056462A3 (en) Gain and bandwidth enhancement for rf power amplifier package
US20060082408A1 (en) Semiconductor switching circuit
US7349724B2 (en) Radio frequency arrangement and production method and also use
US20020117750A1 (en) Semiconductor device
EP0746024A2 (en) Semiconductor device with built-in AC coupling circuitry

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ OM PH PL PT RO RU SD SE SG SI SK SL TJ TM TN TR TT TZ UA UG UZ VN YU ZA ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
WWE Wipo information: entry into national phase

Ref document number: 2002728858

Country of ref document: EP

B Later publication of amended claims

Effective date: 20031028

WWP Wipo information: published in national office

Ref document number: 2002728858

Country of ref document: EP

REG Reference to national code

Ref country code: DE

Ref legal event code: 8642

NENP Non-entry into the national phase

Ref country code: JP

WWW Wipo information: withdrawn in national office

Country of ref document: JP