WO2002093472A1 - Procede de fabrication d'une carte a puce sans contact a l'aide de papier transfert - Google Patents
Procede de fabrication d'une carte a puce sans contact a l'aide de papier transfert Download PDFInfo
- Publication number
- WO2002093472A1 WO2002093472A1 PCT/FR2002/001625 FR0201625W WO02093472A1 WO 2002093472 A1 WO2002093472 A1 WO 2002093472A1 FR 0201625 W FR0201625 W FR 0201625W WO 02093472 A1 WO02093472 A1 WO 02093472A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- antenna
- chip
- transfer paper
- sheet
- connection pads
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/207—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a prefabricated paste pattern, ink pattern or powder pattern
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
- H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
- H05K1/187—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding the patterned circuits being prefabricated circuits, which are not yet attached to a permanent insulating substrate, e.g. on a temporary carrier
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/0284—Paper, e.g. as reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0376—Flush conductors, i.e. flush with the surface of the printed circuit
Definitions
- the present invention relates to the field of smart cards (or tickets) and more particularly a method of manufacturing a contactless smart card.
- Chip cards and tickets have become essential today. In addition to their use as credit cards, they have become essential tools in many areas. This development is explained in particular by the fact that, in addition to the conventional use of the card by contact with its associated reader, such as the bank card or the telephone card, the cards can now be used without any physical contact with their readers. . Indeed, the exchange of information between a contactless or hybrid contact-contactless card and the associated reading device is effected by remote electromagnetic coupling between an antenna housed in the contactless card and a second antenna located in the reader. To develop, store and process information, the card is equipped with a chip, which is linked to the antenna. The antenna is generally located on a plastic dielectric support. This ease of use has greatly enabled the development of other applications.
- the smart card was developed as a motorway payment method.
- the leisure sector it is used by supporters as a stadium subscription card.
- many companies have set up a personnel identification system using a contactless ISO chip card.
- the contactless cards conventionally found on the market are made up of several layers of plastic, in particular polyvinyl chloride (PVC). Among these layers, one layer constitutes the support for the antenna of the card, the other layers generally constituting the card bodies.
- the card antenna is usually a wired copper antenna or a chemically etched antenna.
- contactless technology involves reducing the manufacturing costs of this type of card.
- One way to reduce these costs is to use cheaper methods of manufacturing the antenna and in particular by performing the latter by screen printing of a conductive ink.
- thermomechanical properties of PVC are poor.
- the material creep is very high and the antenna form factor is not preserved.
- the temperature being higher than the softening temperature of the thermoplastic material, there is deformation of the support modifying the electrical parameters of the antenna.
- These drawbacks cause the antenna to malfunction because the electrical parameters (inductance and resistance) vary. More serious, it is not uncommon to observe antenna cuts in places where the shear stresses are strong.
- Another drawback is that when the antenna is screen printed on PVC, the connection of the chip on the antenna is much read difficult to achieve.
- the object of the invention is therefore to overcome these drawbacks by providing a manufacturing method making it possible to obtain a contactless smart card, made of plastic, with a screen-printed ink antenna, the cost price of which is low and which has high reliability.
- the invention therefore relates to a method for manufacturing a contactless smart card comprising the following steps:
- connection of a chip provided with connection pads, on one antenna, - lamination consisting in securing the transfer paper with a layer of plastic material constituting the antenna support, by hot pressing, so that the antenna and the chip are embedded in the plastic layer,
- Another object of the invention is a smart card, obtained by the method according to the invention, comprising a plastic antenna support and at least one layer of plastic material on each side of the antenna support constituting the bodies card, in which the screen-printed antenna and the chip are embedded in the antenna support.
- FIG. 1 represents a front view of a sheet of transfer paper carrying a screen-printed antenna and a chip connected to this antenna.
- FIG. 2 represents a longitudinal section along the axis AA of the sheet of transfer paper shown in FIG. 1.
- FIG. 3 represents a longitudinal section of the sheet of transfer paper secured to a plastic antenna support after a lamination step.
- FIG. 4 represents a longitudinal section of the antenna support after the step of peeling off the sheet of transfer paper.
- FIG. 5 represents a longitudinal section of the smart card according to the invention, once completed.
- the first step in the method of manufacturing the smart card according to the invention consists in producing an antenna on an appropriate support which is a sheet of transfer paper.
- the antenna is preferably obtained by screen printing of a conductive ink on this sheet of transfer paper.
- This antenna is made up of concentric turns and two screen-printed connection pads. The connection pads allow the connection between the chip and the antenna.
- the transfer paper undergoes a heat treatment allowing the screen-printed ink to be cooked.
- the ink used is a polymer ink loaded with conductive elements. It is preferably an epoxy ink loaded with particles of silver, copper or carbon.
- a first embodiment comprises the following steps:
- connection pads of the chip are opposite the connection pads of the antenna, and - exert pressure on the chip so that its connection pads deform the sheet of transfer paper and the antenna connection pads under the effect of pressure.
- the sheet of transfer paper and the antenna connection pads retain their deformation after the pressure has ceased to be exerted, thus making it possible to obtain a large contact surface between the connection pads of the chip and the pads. antenna connection.
- connection of the chip comprises the following steps:
- connection pads of said chip come to bathe in said conductive adhesive, facing the connection pads of the antenna.
- FIG. 2 A longitudinal sectional view of the transfer paper sheet, along the axis A-A, is shown in Figure 2.
- the transfer paper sheet 10 carries the antenna 12 in the form of screen-printed turns.
- the chip 14 is connected to the antenna 12.
- FIG. 3 shows the sheet of transfer paper 10 and the antenna support 16 made of plastic.
- this plastic material can be PVC or PET. It can be seen in this FIG. 3 that, once the lamination step has been carried out, the screen-printed antenna 12 and the chip 14 are embedded in the layer of PVC 16 constituting the antenna support.
- the PVC used to form the antenna support has a high Vicat point (material softening temperature). Indeed, its softening temperature is preferably 85 ° C.
- hot pressing is carried out at a temperature greater than or equal to 85 ° C., so that the PVC softens.
- the next step is to peel off the sheet of transfer paper from the PVC antenna support.
- the property of transfer paper is that once heated, it peels off, releasing what it was carrying on its surface.
- the antenna 12 and the chip 14 remain integrated in the antenna support 16 made of PVC, as shown in FIG. 4.
- the last step of the process consists in laminating at least one layer of plastic material on each side of the antenna support.
- these layers constitute the card bodies.
- this plastic material is PVC, polyester (PET, PETG), polycarbonate (PC) or 1 acrylonitrile-butadiene-styrene (ABS).
- the plastic material used is PVC.
- This PVC unlike that used for the antenna support, has a low Vicat point. Indeed, its softening temperature is preferably 75 ° C. In order to be joined, the three layers of PVC are heated and pressed at 75 ° C. The layers making up the card bodies soften and attach to the antenna support, which remains hard.
- the card thus obtained is shown in longitudinal section in FIG. 5.
- the antenna support 16 comprises the antenna 12 and the chip 14.
- This support is integral with two card bodies 18 and 20, on either side of the support 16. It can be seen that this architecture gives great protection to the vital organs of the card that are the antenna and the chip, since they are completely embedded in the antenna support.
- the card thus obtained has neither excess thickness, nor visual artifacts on the card, nor distortions of the printing which would be due to the electronic components.
- This manufacturing process therefore makes it possible to obtain a card entirely of PVC, with an antenna in screen-printed conductive ink.
- This card therefore has a very low cost, despite very high reliability, unlike conventional cards which are much more expensive to manufacture and which, by virtue of their architecture and in particular their wired or engraved copper antenna, are much more fragile.
Abstract
Description
Claims
Priority Applications (10)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP02730406A EP1393248B1 (fr) | 2001-05-16 | 2002-05-14 | Procede de fabrication d'une carte a puce sans contact a l'aide de papier transfert |
BR0205348-9A BR0205348A (pt) | 2001-05-16 | 2002-05-14 | Processo de fabricação de um cartão com chip sem contato, e, cartão com chip |
IL153644A IL153644A (en) | 2001-05-16 | 2002-05-14 | A method of making a non-contact chip card using transfer paper |
US10/333,022 US6908786B2 (en) | 2001-05-16 | 2002-05-14 | Method for producing a contactless chip card using transfer paper |
CA2413181A CA2413181C (fr) | 2001-05-16 | 2002-05-14 | Procede de fabrication d'une carte a puce sans contact a l'aide de papier transfert |
JP2002590073A JP4289478B2 (ja) | 2001-05-16 | 2002-05-14 | 転写紙を使用する無接触チップカードの製造方法 |
KR1020037000613A KR100896953B1 (ko) | 2001-05-16 | 2002-05-14 | 전송지를 이용한 비접촉 칩 카드 제조방법 |
MXPA03000412A MXPA03000412A (es) | 2001-05-16 | 2002-05-14 | Metodo para manufacturar una tarjeta inteligente sin contacto utilizando papel de transferencia. |
HK04104335A HK1061295A1 (en) | 2001-05-16 | 2004-06-16 | Method for producing a contactless chip card usingtransfer paper |
US11/126,314 US7271039B2 (en) | 2001-05-16 | 2005-05-11 | Method for manufacturing radiofrequency identification device using transfer paper and radiofrequency identification device produced using this method |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0106480A FR2824939B1 (fr) | 2001-05-16 | 2001-05-16 | Procede de fabrication d'une carte a puce sans contact a l'aide de papier transfert et carte a puce obtenue a partir de ce procede |
FR01/06480 | 2001-05-16 |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10333022 A-371-Of-International | 2002-05-14 | ||
US11/126,314 Continuation-In-Part US7271039B2 (en) | 2001-05-16 | 2005-05-11 | Method for manufacturing radiofrequency identification device using transfer paper and radiofrequency identification device produced using this method |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2002093472A1 true WO2002093472A1 (fr) | 2002-11-21 |
Family
ID=8863369
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/FR2002/001625 WO2002093472A1 (fr) | 2001-05-16 | 2002-05-14 | Procede de fabrication d'une carte a puce sans contact a l'aide de papier transfert |
Country Status (13)
Country | Link |
---|---|
US (2) | US6908786B2 (fr) |
EP (1) | EP1393248B1 (fr) |
JP (1) | JP4289478B2 (fr) |
KR (1) | KR100896953B1 (fr) |
CN (1) | CN1301483C (fr) |
BR (1) | BR0205348A (fr) |
CA (1) | CA2413181C (fr) |
FR (1) | FR2824939B1 (fr) |
HK (1) | HK1061295A1 (fr) |
IL (1) | IL153644A (fr) |
MX (1) | MXPA03000412A (fr) |
TW (1) | TWI238973B (fr) |
WO (1) | WO2002093472A1 (fr) |
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WO2009093248A1 (fr) | 2008-01-23 | 2009-07-30 | On Track Innovations Ltd. | Procédés de fabrication d'une carte à puce |
FR2824939B1 (fr) * | 2001-05-16 | 2003-10-10 | A S K | Procede de fabrication d'une carte a puce sans contact a l'aide de papier transfert et carte a puce obtenue a partir de ce procede |
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FR2881251B1 (fr) * | 2005-01-24 | 2007-04-13 | Ask Sa | Livret d'identite a dispositif d'identification radiofrequence resistant aux milieux humides |
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US8424757B2 (en) | 2010-12-06 | 2013-04-23 | On Track Innovations Ltd. | Contactless smart SIM functionality retrofit for mobile communication device |
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- 2002-05-14 WO PCT/FR2002/001625 patent/WO2002093472A1/fr active Application Filing
- 2002-05-14 CN CNB02801698XA patent/CN1301483C/zh not_active Expired - Fee Related
- 2002-05-14 IL IL153644A patent/IL153644A/en not_active IP Right Cessation
- 2002-05-14 JP JP2002590073A patent/JP4289478B2/ja not_active Expired - Fee Related
- 2002-05-14 BR BR0205348-9A patent/BR0205348A/pt not_active Application Discontinuation
- 2002-05-14 US US10/333,022 patent/US6908786B2/en not_active Expired - Lifetime
- 2002-05-14 EP EP02730406A patent/EP1393248B1/fr not_active Expired - Lifetime
- 2002-05-14 CA CA2413181A patent/CA2413181C/fr not_active Expired - Fee Related
- 2002-05-14 KR KR1020037000613A patent/KR100896953B1/ko not_active IP Right Cessation
- 2002-05-14 MX MXPA03000412A patent/MXPA03000412A/es active IP Right Grant
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2004
- 2004-06-16 HK HK04104335A patent/HK1061295A1/xx not_active IP Right Cessation
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2005
- 2005-05-11 US US11/126,314 patent/US7271039B2/en not_active Expired - Fee Related
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EP0920056A2 (fr) * | 1997-11-26 | 1999-06-02 | Hitachi, Ltd. | Carte à puce, méthode et appareil pour sa fabrication |
WO2000022673A1 (fr) * | 1998-10-13 | 2000-04-20 | Ksw Microtec Gesellschaft Für Angewandte Mikrotechnik Mbh Dresden | Support plan pour microplaquette semi-conductrice et procede de fabrication associe |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2977958A1 (fr) * | 2011-07-12 | 2013-01-18 | Ask Sa | Carte a circuit integre hybride contact-sans contact a tenue renforcee du module electronique |
WO2013007897A3 (fr) * | 2011-07-12 | 2013-03-28 | Ask S.A. | Carte à circuit intégré hybride contact - sans contact a tenue renforcée du module électronique |
FR3032295A1 (fr) * | 2015-01-29 | 2016-08-05 | Ask Sa | Dispositif d'identification radiofrequence et son procede de fabrication pour faciliter et ameliorer la connexion du module electronique a l'antenne |
Also Published As
Publication number | Publication date |
---|---|
US6908786B2 (en) | 2005-06-21 |
KR100896953B1 (ko) | 2009-05-12 |
MXPA03000412A (es) | 2003-10-15 |
US20050230486A1 (en) | 2005-10-20 |
CN1463410A (zh) | 2003-12-24 |
JP4289478B2 (ja) | 2009-07-01 |
IL153644A0 (en) | 2003-07-06 |
EP1393248A1 (fr) | 2004-03-03 |
EP1393248B1 (fr) | 2012-11-21 |
CA2413181A1 (fr) | 2002-11-21 |
FR2824939A1 (fr) | 2002-11-22 |
IL153644A (en) | 2007-09-20 |
FR2824939B1 (fr) | 2003-10-10 |
US20030153120A1 (en) | 2003-08-14 |
BR0205348A (pt) | 2003-04-22 |
TWI238973B (en) | 2005-09-01 |
US7271039B2 (en) | 2007-09-18 |
CN1301483C (zh) | 2007-02-21 |
JP2004520656A (ja) | 2004-07-08 |
CA2413181C (fr) | 2011-03-22 |
KR20030025270A (ko) | 2003-03-28 |
HK1061295A1 (en) | 2004-09-10 |
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