WO2002093642A3 - Integrated sensor packaging and methods of making the same - Google Patents

Integrated sensor packaging and methods of making the same Download PDF

Info

Publication number
WO2002093642A3
WO2002093642A3 PCT/IB2002/001607 IB0201607W WO02093642A3 WO 2002093642 A3 WO2002093642 A3 WO 2002093642A3 IB 0201607 W IB0201607 W IB 0201607W WO 02093642 A3 WO02093642 A3 WO 02093642A3
Authority
WO
WIPO (PCT)
Prior art keywords
gel
elements
molding
flexible
pins
Prior art date
Application number
PCT/IB2002/001607
Other languages
French (fr)
Other versions
WO2002093642A2 (en
Inventor
Johan Schuurmans
William R Betts
Roger Diels
Adrian Hill
Original Assignee
Melexis Nv
Johan Schuurmans
William R Betts
Roger Diels
Adrian Hill
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Melexis Nv, Johan Schuurmans, William R Betts, Roger Diels, Adrian Hill filed Critical Melexis Nv
Priority to EP02727868A priority Critical patent/EP1393367A2/en
Priority to AU2002258053A priority patent/AU2002258053A1/en
Publication of WO2002093642A2 publication Critical patent/WO2002093642A2/en
Publication of WO2002093642A3 publication Critical patent/WO2002093642A3/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565Moulds
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00Moulds or cores; Details thereof or accessories therefor
    • B29C33/02Moulds or cores; Details thereof or accessories therefor with incorporated heating or cooling means
    • B29C33/06Moulds or cores; Details thereof or accessories therefor with incorporated heating or cooling means using radiation, e.g. electro-magnetic waves, induction heating
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48135Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484Connecting portions
    • H01L2224/48463Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73251Location after the connecting process on different surfaces
    • H01L2224/73265Layer and wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909Post-treatment of the connector or wire bonding area
    • H01L2224/8592Applying permanent coating, e.g. protective coating
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation
    • H01L2924/1815Shape

Abstract

Elements of a sensor system are encapsulated into a single package. The sensor elements are covered with a flexible gel coat and then inserted into a molding tool cavity. Each element may be individually coated with a gel blob, or all elements may be coated with a single gel blob. One or more retractable pins are incorporated into the molding tool and in their normal position are each in contact with the gel. A molding compound is injection into the cavity so as to encapsulate the device and gel coat. When the pins are extracted and the device ejected from the molding cavity, one or more passageways in the molding are left defined by the pins. The passageways expose the flexible gel covering the device elements to the atmosphere. For pressure sensitive elements, the gel, being flexible, transfers the local air pressure to the pressure sensitive element. For optical elements, the exposed gel is preferably removed to allow for the passage of radiation to and from the device elements. Alternatively, or in addition, an optically transmitting gel is used so as to allow for the passage of radiation at specific wavelengths.
PCT/IB2002/001607 2001-05-11 2002-05-10 Integrated sensor packaging and methods of making the same WO2002093642A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP02727868A EP1393367A2 (en) 2001-05-11 2002-05-10 Integrated sensor packaging and methods of making the same
AU2002258053A AU2002258053A1 (en) 2001-05-11 2002-05-10 Integrated sensor packaging and methods of making the same

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US29032601P 2001-05-11 2001-05-11
US60/290326 2001-05-11
US09/956,483 US7060216B2 (en) 2001-05-11 2001-09-18 Tire pressure sensors and methods of making the same
US09/956483 2001-09-18

Publications (2)

Publication Number Publication Date
WO2002093642A2 WO2002093642A2 (en) 2002-11-21
WO2002093642A3 true WO2002093642A3 (en) 2003-03-13

Family

ID=26966112

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2002/001607 WO2002093642A2 (en) 2001-05-11 2002-05-10 Integrated sensor packaging and methods of making the same

Country Status (4)

Country Link
US (1) US7060216B2 (en)
EP (1) EP1393367A2 (en)
AU (1) AU2002258053A1 (en)
WO (1) WO2002093642A2 (en)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6762077B2 (en) * 2001-05-11 2004-07-13 Melexis Nv Integrated sensor packages and methods of making the same
US7182738B2 (en) 2003-04-23 2007-02-27 Marctec, Llc Patient monitoring apparatus and method for orthosis and other devices
DE10324139B4 (en) 2003-05-26 2005-07-21 Infineon Technologies Ag Microelectromechanical component and method for its production
JP4066929B2 (en) * 2003-10-08 2008-03-26 株式会社日立製作所 Electronic device and manufacturing method thereof
US6945104B2 (en) * 2003-10-24 2005-09-20 Lear Corporation Attachment mechanism for a tire monitoring system
US20050087007A1 (en) * 2003-10-24 2005-04-28 Lear Corporation Tire monitor system with spring retention clip
US7086411B2 (en) * 2003-10-24 2006-08-08 Lear Corporation Snap-in grommet for a valve stem assembly
US7086412B2 (en) 2003-10-24 2006-08-08 Lear Corporation Snap-in grommet for a valve steam assembly
US7028541B2 (en) 2003-11-04 2006-04-18 Lear Corporation Tire pressure sensing component for detecting air pressure and related method
US7518495B2 (en) * 2003-11-18 2009-04-14 Lear Corporation Universal tire pressure monitor
DE102004027094A1 (en) * 2004-06-02 2005-12-29 Infineon Technologies Ag Semiconductor module with a semiconductor sensor chip and a plastic housing and method for its production
GB0412435D0 (en) * 2004-06-04 2004-07-07 Melexis Nv Packaged intergrated circuit devices
DE102005025754B4 (en) * 2005-06-02 2019-08-08 Infineon Technologies Ag Semiconductor sensor component with a sensor chip and method for producing semiconductor sensor components
US7284418B2 (en) * 2005-06-03 2007-10-23 Temic Automotive Of North America, Inc. Tire pressure sensor assembly
JP5502729B2 (en) 2007-07-03 2014-05-28 コンティネンタル オートモーティブ システムズ ユーエス, インコーポレイティッド General-purpose tire pressure monitoring sensor
US7900521B2 (en) * 2009-02-10 2011-03-08 Freescale Semiconductor, Inc. Exposed pad backside pressure sensor package
US8751092B2 (en) 2011-01-13 2014-06-10 Continental Automotive Systems, Inc. Protocol protection
US9258670B2 (en) 2011-06-10 2016-02-09 Aliphcom Wireless enabled cap for a data-capable device
US8446275B2 (en) 2011-06-10 2013-05-21 Aliphcom General health and wellness management method and apparatus for a wellness application using data from a data-capable band
US20120315382A1 (en) * 2011-06-10 2012-12-13 Aliphcom Component protective overmolding using protective external coatings
CN103889745B (en) 2011-08-09 2016-08-31 大陆汽车系统公司 Agreement misunderstanding for tire pressure monitoring system avoids equipment and method
WO2013022436A1 (en) 2011-08-09 2013-02-14 Continental Automotive Systems Us, Inc. Protocol arrangement in a tire pressure monitoring system
US8742914B2 (en) 2011-08-09 2014-06-03 Continental Automotive Systems, Inc. Tire pressure monitoring apparatus and method
EP2741927B1 (en) 2011-08-09 2017-04-26 Continental Automotive Systems, Inc. Apparatus and method for activating a localization process for a tire pressure monitor
US9676238B2 (en) 2011-08-09 2017-06-13 Continental Automotive Systems, Inc. Tire pressure monitor system apparatus and method
US8643169B2 (en) 2011-11-09 2014-02-04 Freescale Semiconductor, Inc. Semiconductor sensor device with over-molded lid
US20150014793A1 (en) * 2013-07-15 2015-01-15 Kai Yun Yow Pressure sensor having down-set flag
US9190352B2 (en) 2013-11-21 2015-11-17 Freescale Semiconductor, Inc. Multi-die sensor device
US9134193B2 (en) 2013-12-06 2015-09-15 Freescale Semiconductor, Inc. Stacked die sensor package
US9446636B2 (en) 2014-02-26 2016-09-20 Continental Automotive Systems, Inc. Pressure check tool and method of operating the same
GB2524235A (en) * 2014-03-07 2015-09-23 Melexis Technologies Nv Semiconductor device having a transparent window for passing radiation
US9517664B2 (en) 2015-02-20 2016-12-13 Continental Automotive Systems, Inc. RF transmission method and apparatus in a tire pressure monitoring system
JP6476036B2 (en) * 2015-03-31 2019-02-27 株式会社フジクラ Pressure sensor
DE102016213290A1 (en) 2015-08-03 2017-02-09 Continental Automotive Systems, Inc. Apparatus, system and method for configuring a tire information sensor with a transmission protocol based on vehicle trigger characteristics
CN107527874B (en) 2016-06-20 2023-08-01 恩智浦美国有限公司 Cavity type pressure sensor device

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4823605A (en) * 1987-03-18 1989-04-25 Siemens Aktiengesellschaft Semiconductor pressure sensor with casing and method for its manufacture
JPH04352435A (en) * 1991-05-30 1992-12-07 Mitsubishi Electric Corp Mold for manufacturing hollow semiconductor pressure sensor sealed with resin
JPH06196750A (en) * 1993-10-27 1994-07-15 Sharp Corp Manufacture of reflection type photo interrupter
JPH085473A (en) * 1990-11-30 1996-01-12 Mitsubishi Electric Corp Hollow type resin sealed semiconductor pressure sensor
US5622873A (en) * 1994-01-24 1997-04-22 Goldstar Electron Co., Ltd. Process for manufacturing a resin molded image pick-up semiconductor chip having a window
JPH09119875A (en) * 1995-10-25 1997-05-06 Matsushita Electric Works Ltd Semiconductor pressure sensor
JPH09298249A (en) * 1996-04-30 1997-11-18 Matsushita Electron Corp Semiconductor device
JPH09304211A (en) * 1996-05-15 1997-11-28 Omron Corp Structure and method for packaging of capacitive pressure sensor
EP0813236A1 (en) * 1996-06-11 1997-12-17 European Semiconductor Assembly (Eurasem) B.V. Method for encapsulating an integrated semi-conductor circuit
JPH11307808A (en) * 1998-04-17 1999-11-05 Sanyo Electric Co Ltd Photocoupler device
US6254815B1 (en) * 1994-07-29 2001-07-03 Motorola, Inc. Molded packaging method for a sensing die having a pressure sensing diaphragm

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3706840A (en) * 1971-05-10 1972-12-19 Intersil Inc Semiconductor device packaging
US5731754A (en) * 1994-06-03 1998-03-24 Computer Methods Corporation Transponder and sensor apparatus for sensing and transmitting vehicle tire parameter data
US5500065A (en) * 1994-06-03 1996-03-19 Bridgestone/Firestone, Inc. Method for embedding a monitoring device within a tire during manufacture
US5971046A (en) * 1997-09-17 1999-10-26 Bridgestone/Firestone, Inc. Method and apparatus for bonding an active tag to a patch and a tire
US5960844A (en) * 1997-12-22 1999-10-05 Bridgestone/Firestone, Inc. Method and apparatus for monitoring conditions of a vehicle tire
US5977870A (en) * 1997-12-22 1999-11-02 Bridgestone/Firestone, Inc. Method and apparatus for transmitting stored data and engineering conditions of a tire to a remote location
US6534711B1 (en) * 1998-04-14 2003-03-18 The Goodyear Tire & Rubber Company Encapsulation package and method of packaging an electronic circuit module
US6722191B2 (en) * 1998-11-13 2004-04-20 Bridgestone/Firestone North American Tire, Llc Non-attached monitoring assembly for pneumatic tire
US6543277B2 (en) * 1998-11-13 2003-04-08 Bridgestone/Firestone North American Tire, Llc Non-attached monitoring assembly for pneumatic tire
US6208244B1 (en) * 1999-04-29 2001-03-27 Bridgestone/Firestone Research, Inc. Combination monitoring device and patch for a pneumatic tire and method of installing the same with a coupled antenna
US6388567B1 (en) * 1999-04-29 2002-05-14 Bridgestone/Firestone North American Tire, Llc Combination monitoring device and patch for a pneumatic tire and method of installing the same
US6688353B1 (en) * 2000-03-31 2004-02-10 Bridgestone/Firestone North American Tire, Llc Attachment patch for mounting an electronic monitoring device to the inside of a pneumatic tire
US6580363B1 (en) * 2000-06-30 2003-06-17 Bridgestone/Firestone North American Tire, Llc Method of encapsulating an electronic tire tag

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4823605A (en) * 1987-03-18 1989-04-25 Siemens Aktiengesellschaft Semiconductor pressure sensor with casing and method for its manufacture
JPH085473A (en) * 1990-11-30 1996-01-12 Mitsubishi Electric Corp Hollow type resin sealed semiconductor pressure sensor
JPH04352435A (en) * 1991-05-30 1992-12-07 Mitsubishi Electric Corp Mold for manufacturing hollow semiconductor pressure sensor sealed with resin
JPH06196750A (en) * 1993-10-27 1994-07-15 Sharp Corp Manufacture of reflection type photo interrupter
US5622873A (en) * 1994-01-24 1997-04-22 Goldstar Electron Co., Ltd. Process for manufacturing a resin molded image pick-up semiconductor chip having a window
US6254815B1 (en) * 1994-07-29 2001-07-03 Motorola, Inc. Molded packaging method for a sensing die having a pressure sensing diaphragm
JPH09119875A (en) * 1995-10-25 1997-05-06 Matsushita Electric Works Ltd Semiconductor pressure sensor
JPH09298249A (en) * 1996-04-30 1997-11-18 Matsushita Electron Corp Semiconductor device
JPH09304211A (en) * 1996-05-15 1997-11-28 Omron Corp Structure and method for packaging of capacitive pressure sensor
EP0813236A1 (en) * 1996-06-11 1997-12-17 European Semiconductor Assembly (Eurasem) B.V. Method for encapsulating an integrated semi-conductor circuit
JPH11307808A (en) * 1998-04-17 1999-11-05 Sanyo Electric Co Ltd Photocoupler device

Non-Patent Citations (6)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 017, no. 214 (E - 1357) 27 April 1993 (1993-04-27) *
PATENT ABSTRACTS OF JAPAN vol. 018, no. 545 (E - 1617) 18 October 1994 (1994-10-18) *
PATENT ABSTRACTS OF JAPAN vol. 1996, no. 05 31 May 1996 (1996-05-31) *
PATENT ABSTRACTS OF JAPAN vol. 1997, no. 09 30 September 1997 (1997-09-30) *
PATENT ABSTRACTS OF JAPAN vol. 1998, no. 03 27 February 1998 (1998-02-27) *
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 02 29 February 2000 (2000-02-29) *

Also Published As

Publication number Publication date
US7060216B2 (en) 2006-06-13
EP1393367A2 (en) 2004-03-03
AU2002258053A1 (en) 2002-11-25
US20020168795A1 (en) 2002-11-14
WO2002093642A2 (en) 2002-11-21

Similar Documents

Publication Publication Date Title
WO2002093642A3 (en) Integrated sensor packaging and methods of making the same
WO2005098975A3 (en) Methods for packaging a light emitting device and packaged light emitting devices
US6917089B2 (en) Integrated sensor packages and methods of making the same
WO2003073474A3 (en) Modular semiconductor die package and method of manufacturing thereof
AU2090801A (en) Sensitive substance encapsulation
CA2203114A1 (en) Injection of encapsulating material on an optocomponent
EP0823589A3 (en) Encapsulated explosion-proof pilot light
AU2000275687A1 (en) A mold
AU2003259472A1 (en) Encapsulated optical fiber end-coupled device
CA2193095A1 (en) Packaged optical device
MY141098A (en) Method of forming a leaded molded array package
EP0974809A3 (en) Method for manufacturing a position sensor
WO2002102294A3 (en) Flocked cosmetic sampler, method of making and method of use
EP1654572A4 (en) Encapsulated optical package
WO2005119757A3 (en) Packaged integrated circuit devices
US7214996B2 (en) Optical semiconductor housing with transparent chip and method for making same
KR970009747A (en) Tint and Brightness Indication System for Dental Products
AU2003232323A1 (en) System and method for packaging a fibre optic sensor
CN207202860U (en) Livestock temperature monitoring device
EP0778616A3 (en) Method of packaging devices with a gel medium confined by a rim member
US20230413464A1 (en) Circuit housing for wearable intraoral application
FR2804287B1 (en) CHEWING GUM BASE, CHEWING GUM CONTAINER AND STABILIZED RUBBER
CN207740796U (en) A kind of optical fiber light-guiding type water proof lamp band
EP1033321A3 (en) Package and method for packaging glass base material
CN205294830U (en) Optical chip and inertial sensor's integrated device

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ OM PH PL PT RO RU SD SE SG SI SK SL TJ TM TN TR TT TZ UA UG US UZ VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
AK Designated states

Kind code of ref document: A3

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ OM PH PL PT RO RU SD SE SG SI SK SL TJ TM TN TR TT TZ UA UG US UZ VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A3

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
WWE Wipo information: entry into national phase

Ref document number: 2002727868

Country of ref document: EP

WWP Wipo information: published in national office

Ref document number: 2002727868

Country of ref document: EP

REG Reference to national code

Ref country code: DE

Ref legal event code: 8642

NENP Non-entry into the national phase

Ref country code: JP

WWW Wipo information: withdrawn in national office

Country of ref document: JP