WO2003006705A3 - Wafer fabrication buffer station - Google Patents

Wafer fabrication buffer station Download PDF

Info

Publication number
WO2003006705A3
WO2003006705A3 PCT/US2002/022160 US0222160W WO03006705A3 WO 2003006705 A3 WO2003006705 A3 WO 2003006705A3 US 0222160 W US0222160 W US 0222160W WO 03006705 A3 WO03006705 A3 WO 03006705A3
Authority
WO
WIPO (PCT)
Prior art keywords
buffer station
lower arms
specimen
base
supporting
Prior art date
Application number
PCT/US2002/022160
Other languages
French (fr)
Other versions
WO2003006705A2 (en
Inventor
Paul Bacchi
Paul S Filipski
Original Assignee
Newport Corp
Paul Bacchi
Paul S Filipski
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Newport Corp, Paul Bacchi, Paul S Filipski filed Critical Newport Corp
Publication of WO2003006705A2 publication Critical patent/WO2003006705A2/en
Publication of WO2003006705A3 publication Critical patent/WO2003006705A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile

Abstract

A buffer station (10) includes a base (14) and multiple posts (27) that extend from a base (14). A moveable arm (22) is coupled to each post (27) and moves between specimen (16) supporting and releasing positions. The buffer station (10) may further include supporting fingers (18) extending from the base (14) to support a specimen (16). Alternatively, the buffer station may include movable lower arms that each couple to a corresponding post. The movable lower arms move from specimen supporting and releasing positions. The movable lower arms may also couple to their own individual posts. Movement of the lower arms is independent from that of the upper arms. The buffer station supports specimens at two different elevations.
PCT/US2002/022160 2001-07-13 2002-07-12 Wafer fabrication buffer station WO2003006705A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US30542001P 2001-07-13 2001-07-13
US60/305,420 2001-07-13

Publications (2)

Publication Number Publication Date
WO2003006705A2 WO2003006705A2 (en) 2003-01-23
WO2003006705A3 true WO2003006705A3 (en) 2003-03-27

Family

ID=23180702

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2002/022160 WO2003006705A2 (en) 2001-07-13 2002-07-12 Wafer fabrication buffer station

Country Status (1)

Country Link
WO (1) WO2003006705A2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8608146B2 (en) 2009-12-18 2013-12-17 Lam Research Ag Reinforced pin for being used in a pin chuck, and a pin chuck using such reinforced pin

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008065645A1 (en) * 2006-11-27 2008-06-05 Camtek Ltd. A supporting system and a method for supporting an object

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5571325A (en) * 1992-12-21 1996-11-05 Dainippon Screen Mfg. Co., Ltd. Subtrate processing apparatus and device for and method of exchanging substrate in substrate processing apparatus
US5989346A (en) * 1995-12-12 1999-11-23 Tokyo Electron Limited Semiconductor processing apparatus
US6309163B1 (en) * 1997-10-30 2001-10-30 Applied Materials, Inc. Wafer positioning device with storage capability
US6331095B1 (en) * 1998-04-04 2001-12-18 Tokyo Electron Limited Transportation system and processing apparatus employing the transportation system
US6390767B1 (en) * 1999-03-10 2002-05-21 Nova Measuring Instruments Ltd. Positioning assembly

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5571325A (en) * 1992-12-21 1996-11-05 Dainippon Screen Mfg. Co., Ltd. Subtrate processing apparatus and device for and method of exchanging substrate in substrate processing apparatus
US5989346A (en) * 1995-12-12 1999-11-23 Tokyo Electron Limited Semiconductor processing apparatus
US6309163B1 (en) * 1997-10-30 2001-10-30 Applied Materials, Inc. Wafer positioning device with storage capability
US6331095B1 (en) * 1998-04-04 2001-12-18 Tokyo Electron Limited Transportation system and processing apparatus employing the transportation system
US6390767B1 (en) * 1999-03-10 2002-05-21 Nova Measuring Instruments Ltd. Positioning assembly

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8608146B2 (en) 2009-12-18 2013-12-17 Lam Research Ag Reinforced pin for being used in a pin chuck, and a pin chuck using such reinforced pin

Also Published As

Publication number Publication date
WO2003006705A2 (en) 2003-01-23

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