WO2003012835A3 - Substrate support and method of fabricating the same - Google Patents

Substrate support and method of fabricating the same Download PDF

Info

Publication number
WO2003012835A3
WO2003012835A3 PCT/US2002/024548 US0224548W WO03012835A3 WO 2003012835 A3 WO2003012835 A3 WO 2003012835A3 US 0224548 W US0224548 W US 0224548W WO 03012835 A3 WO03012835 A3 WO 03012835A3
Authority
WO
WIPO (PCT)
Prior art keywords
subassembly
fabricating
substrate support
mold
same
Prior art date
Application number
PCT/US2002/024548
Other languages
French (fr)
Other versions
WO2003012835A2 (en
Inventor
Naomi Matsumura
Masahiko Kowaka
William A Bagley
Akira Terashi
Hideaki Kondo
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Priority to EP02756906A priority Critical patent/EP1412968A2/en
Priority to JP2003517919A priority patent/JP2005524968A/en
Priority to KR1020047001655A priority patent/KR100589281B1/en
Publication of WO2003012835A2 publication Critical patent/WO2003012835A2/en
Publication of WO2003012835A3 publication Critical patent/WO2003012835A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D19/00—Casting in, on, or around objects which form part of the product
    • B22D19/02—Casting in, on, or around objects which form part of the product for making reinforced articles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component

Abstract

A substrate support and method of fabricating the same are provided. Generally, one method of fabrication includes assembling a subassembly comprising a first reinforcing member and a heating element, supporting the subassembly at least 40mm from a bottom of a mold, encapsulating the supported subassembly with molten aluminum, and applying pressure to the molten aluminum. Alternatively, a method of fabrication includes assembling a subassembly comprising a stud disposed through a heating element sandwiched between a first reinforcing member and a second reinforcing member, supporting the subassembly above a bottom of a mold, encapsulating the subassembly disposed in the mold with molten aluminum to form a casting, forming a hole in the casting by removing at least a portion of the stud, and disposing a plug in at least a portion of the hole.
PCT/US2002/024548 2001-08-01 2002-08-01 Substrate support and method of fabricating the same WO2003012835A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP02756906A EP1412968A2 (en) 2001-08-01 2002-08-01 Substrate support and method of fabricating the same
JP2003517919A JP2005524968A (en) 2001-08-01 2002-08-01 Substrate support and manufacturing method thereof
KR1020047001655A KR100589281B1 (en) 2001-08-01 2002-08-01 Substrate support and method of fabricating the same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/921,104 2001-08-01
US09/921,104 US6510888B1 (en) 2001-08-01 2001-08-01 Substrate support and method of fabricating the same

Publications (2)

Publication Number Publication Date
WO2003012835A2 WO2003012835A2 (en) 2003-02-13
WO2003012835A3 true WO2003012835A3 (en) 2003-08-28

Family

ID=25444923

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2002/024548 WO2003012835A2 (en) 2001-08-01 2002-08-01 Substrate support and method of fabricating the same

Country Status (7)

Country Link
US (2) US6510888B1 (en)
EP (1) EP1412968A2 (en)
JP (1) JP2005524968A (en)
KR (1) KR100589281B1 (en)
CN (1) CN100470715C (en)
TW (1) TW559979B (en)
WO (1) WO2003012835A2 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7122979B2 (en) * 2000-12-27 2006-10-17 Transportation Techniques, Llc Method and apparatus for selective operation of a hybrid electric vehicle in various driving modes
US20040221959A1 (en) * 2003-05-09 2004-11-11 Applied Materials, Inc. Anodized substrate support
US8372205B2 (en) * 2003-05-09 2013-02-12 Applied Materials, Inc. Reducing electrostatic charge by roughening the susceptor
TWI412621B (en) * 2004-07-16 2013-10-21 Applied Materials Inc Shadow frame with mask panels
US20060054090A1 (en) * 2004-09-15 2006-03-16 Applied Materials, Inc. PECVD susceptor support construction
US8173228B2 (en) * 2006-01-27 2012-05-08 Applied Materials, Inc. Particle reduction on surfaces of chemical vapor deposition processing apparatus
US20080131622A1 (en) * 2006-12-01 2008-06-05 White John M Plasma reactor substrate mounting surface texturing
JP2010114280A (en) * 2008-11-07 2010-05-20 Sukegawa Electric Co Ltd Substrate heating plate heater
KR101147998B1 (en) * 2011-11-14 2012-05-24 주식회사 포톤 High efficiency susceptor and method for manufacturing the same
JP5857081B2 (en) * 2014-02-17 2016-02-10 助川電気工業株式会社 Manufacturing method of substrate heating plate heater
CN104570419B (en) * 2014-12-26 2018-01-30 深圳市华星光电技术有限公司 Absorption type microscope carrier and its adsorption method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3885128A (en) * 1974-07-01 1975-05-20 Gen Electric Glass-ceramic plate heating unit cast-in heat spreader
US5851298A (en) * 1996-02-01 1998-12-22 Tokyo Electron Limited Susceptor structure for mounting processing object thereon
EP0962961A2 (en) * 1998-05-29 1999-12-08 Ngk Insulators, Ltd. Susceptors

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5996236A (en) 1982-11-26 1984-06-02 Toyota Motor Corp Production of composite material
US5293923A (en) 1992-07-13 1994-03-15 Alabi Muftau M Process for metallurgically bonding aluminum-base inserts within an aluminum casting
JPH0711446A (en) 1993-05-27 1995-01-13 Applied Materials Inc Suscepter device for vapor growth
US5509459A (en) 1994-09-28 1996-04-23 The United States Of America As Represented By The Secretary Of The Navy Pressure cast alumina tile reinforced aluminum alloy armor and process for producing the same
US6086680A (en) 1995-08-22 2000-07-11 Asm America, Inc. Low-mass susceptor
US5584936A (en) 1995-12-14 1996-12-17 Cvd, Incorporated Susceptor for semiconductor wafer processing
DE19711702C1 (en) 1997-03-20 1998-06-25 Siemens Ag Semiconductor substrate wafer processing apparatus e.g. for rapid thermal processing
US6190113B1 (en) 1997-04-30 2001-02-20 Applied Materials, Inc. Quartz pin lift for single wafer chemical vapor deposition/etch process chamber

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3885128A (en) * 1974-07-01 1975-05-20 Gen Electric Glass-ceramic plate heating unit cast-in heat spreader
US5851298A (en) * 1996-02-01 1998-12-22 Tokyo Electron Limited Susceptor structure for mounting processing object thereon
EP0962961A2 (en) * 1998-05-29 1999-12-08 Ngk Insulators, Ltd. Susceptors

Also Published As

Publication number Publication date
EP1412968A2 (en) 2004-04-28
US6510888B1 (en) 2003-01-28
TW559979B (en) 2003-11-01
CN100470715C (en) 2009-03-18
US20030024680A1 (en) 2003-02-06
US20030079853A1 (en) 2003-05-01
WO2003012835A2 (en) 2003-02-13
KR20040030917A (en) 2004-04-09
CN1555569A (en) 2004-12-15
JP2005524968A (en) 2005-08-18
KR100589281B1 (en) 2006-06-14

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