WO2003021645A3 - Wafer engine - Google Patents

Wafer engine Download PDF

Info

Publication number
WO2003021645A3
WO2003021645A3 PCT/US2002/027909 US0227909W WO03021645A3 WO 2003021645 A3 WO2003021645 A3 WO 2003021645A3 US 0227909 W US0227909 W US 0227909W WO 03021645 A3 WO03021645 A3 WO 03021645A3
Authority
WO
WIPO (PCT)
Prior art keywords
axis
wafer
moving
linear drive
wafer along
Prior art date
Application number
PCT/US2002/027909
Other languages
French (fr)
Other versions
WO2003021645A2 (en
Inventor
Anthony C Bonora
Richard H Gould
Roger G Hine
Michael Krolak
Jerry Speasl
Original Assignee
Asyst Technologies
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asyst Technologies filed Critical Asyst Technologies
Priority to DE10297171T priority Critical patent/DE10297171T5/en
Priority to JP2003525893A priority patent/JP4287271B2/en
Priority to KR1020047003086A priority patent/KR100800613B1/en
Publication of WO2003021645A2 publication Critical patent/WO2003021645A2/en
Publication of WO2003021645A3 publication Critical patent/WO2003021645A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette

Abstract

The present invention is a wafer engine for transporting wafers. The wafer engine includes a linear drive for moving the wafer along an x axis, a rotational drive for rotating the wafer about a theta axis, a linear drive for moving the wafer along a z axis, and a linear drive for moving the wafer along a radial axis. The linear drive for moving the wafer along a z axis is offset from the rotational drive. When the rotational drive rotates about the theta axis, both the z axis and radial axis drives are also rotated about the theta axis. Preferably, the linear drive for moving the wafer along a radial axis is a dual or rapid swap slide body mechanism having an upper and lower end effector. The slide body mechanism preferably also has means to align the wafer and perform various inspection and marking procedures.
PCT/US2002/027909 2001-08-31 2002-08-30 Wafer engine WO2003021645A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
DE10297171T DE10297171T5 (en) 2001-08-31 2002-08-30 wafer machine
JP2003525893A JP4287271B2 (en) 2001-08-31 2002-08-30 Wafer engine
KR1020047003086A KR100800613B1 (en) 2001-08-31 2002-08-30 Wafer engine

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US31672201P 2001-08-31 2001-08-31
US60/316,722 2001-08-31
US10/087,400 US7066707B1 (en) 2001-08-31 2002-03-01 Wafer engine
US10/087,400 2002-03-01

Publications (2)

Publication Number Publication Date
WO2003021645A2 WO2003021645A2 (en) 2003-03-13
WO2003021645A3 true WO2003021645A3 (en) 2003-07-24

Family

ID=26776942

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2002/027909 WO2003021645A2 (en) 2001-08-31 2002-08-30 Wafer engine

Country Status (7)

Country Link
US (2) US7066707B1 (en)
JP (1) JP4287271B2 (en)
KR (1) KR100800613B1 (en)
CN (1) CN1329948C (en)
DE (1) DE10297171T5 (en)
TW (1) TW579538B (en)
WO (1) WO2003021645A2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101387585B1 (en) 2007-09-22 2014-04-24 다이나믹 마이크로시스템즈 세미컨덕터 이큅먼트 게엠베하 An integrated wafer transfer mechanism

Families Citing this family (57)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6918731B2 (en) 2001-07-02 2005-07-19 Brooks Automation, Incorporated Fast swap dual substrate transport for load lock
JP4137711B2 (en) * 2003-06-16 2008-08-20 東京エレクトロン株式会社 Substrate processing apparatus and substrate transfer means positioning method
US7236853B2 (en) * 2003-10-01 2007-06-26 Varian Semiconductor Equipment Associates, Inc. Automated robot alignment system and method using kinematic pins and end effector sensor
US7607879B2 (en) * 2004-06-15 2009-10-27 Brooks Automation, Inc. Substrate processing apparatus with removable component module
US20060216137A1 (en) * 2004-07-02 2006-09-28 Katsunori Sakata Carrying apparatus and carrying control method for sheet-like substrate
US7578650B2 (en) * 2004-07-29 2009-08-25 Kla-Tencor Technologies Corporation Quick swap load port
US20060154385A1 (en) * 2005-01-07 2006-07-13 Ravinder Aggarwal Fabrication pathway integrated metrology device
US7410340B2 (en) * 2005-02-24 2008-08-12 Asyst Technologies, Inc. Direct tool loading
US7771151B2 (en) * 2005-05-16 2010-08-10 Muratec Automation Co., Ltd. Interface between conveyor and semiconductor process tool load port
US9457442B2 (en) * 2005-06-18 2016-10-04 Futrfab, Inc. Method and apparatus to support process tool modules in a cleanspace fabricator
US7604449B1 (en) * 2005-06-27 2009-10-20 Kla-Tencor Technologies Corporation Equipment front end module
US8821099B2 (en) 2005-07-11 2014-09-02 Brooks Automation, Inc. Load port module
KR100818044B1 (en) * 2006-05-04 2008-03-31 위순임 Substrate pedestal and substrate transfer equipment and substrate processing system and method using the same
KR100909494B1 (en) * 2006-05-11 2009-07-27 도쿄엘렉트론가부시키가이샤 Processing equipment
KR100832772B1 (en) * 2006-05-22 2008-05-27 주식회사 나온테크 Semiconductor material handling system
JP4606388B2 (en) * 2006-06-12 2011-01-05 川崎重工業株式会社 Transfer system unit for substrate transfer equipment
JP2008032335A (en) * 2006-07-31 2008-02-14 Hitachi High-Technologies Corp Mini-environment device, inspection device, manufacturing device, and space cleaning method
US9117859B2 (en) 2006-08-31 2015-08-25 Brooks Automation, Inc. Compact processing apparatus
TWI475627B (en) 2007-05-17 2015-03-01 Brooks Automation Inc Substrate carrier, substrate processing apparatus and system, for reducing particle contamination of substrate during processing and method of interfacing a carrier with a processing tool
KR101772600B1 (en) * 2007-05-17 2017-08-29 브룩스 오토메이션 인코퍼레이티드 Side opening substrate carrier and load port
US8277165B2 (en) * 2007-09-22 2012-10-02 Dynamic Micro System Semiconductor Equipment GmbH Transfer mechanism with multiple wafer handling capability
WO2009066573A1 (en) * 2007-11-21 2009-05-28 Kabushiki Kaisha Yaskawa Denki Conveyance robot, locally cleaned housing with the conveyance robot, and semiconductor manufacturing device with the housing
KR100916538B1 (en) * 2007-12-12 2009-09-11 코리아테크노(주) Wafer align and ID reading apparatus for use of multi sorter
JP4909919B2 (en) * 2008-02-20 2012-04-04 株式会社日立ハイテクコントロールシステムズ Wafer transfer device
US8757026B2 (en) * 2008-04-15 2014-06-24 Dynamic Micro Systems, Semiconductor Equipment Gmbh Clean transfer robot
WO2009130793A1 (en) * 2008-04-25 2009-10-29 株式会社アドバンテスト Test system and probe apparatus
US8287648B2 (en) * 2009-02-09 2012-10-16 Asm America, Inc. Method and apparatus for minimizing contamination in semiconductor processing chamber
US8882433B2 (en) 2009-05-18 2014-11-11 Brooks Automation, Inc. Integrated systems for interfacing with substrate container storage systems
JP2011003864A (en) * 2009-06-22 2011-01-06 Tokyo Electron Ltd Substrate carrier, method of carrying substrate, coating, developing device and storage medium
US20120136472A1 (en) * 2010-11-25 2012-05-31 Li Yan-Ze Dual-arm type robotic arm and its method of transporting panels
US9431282B2 (en) * 2011-12-27 2016-08-30 Rudolph Technologies, Inc. Wafer inversion mechanism
JP5920626B2 (en) * 2012-08-20 2016-05-18 Tdk株式会社 Load port device
JP5920627B2 (en) * 2012-08-29 2016-05-18 Tdk株式会社 Load port device
US9335347B2 (en) * 2012-09-10 2016-05-10 Advantest Corporation Method and apparatus for massively parallel multi-wafer test
US9545724B2 (en) * 2013-03-14 2017-01-17 Brooks Automation, Inc. Tray engine with slide attached to an end effector base
CN103496590A (en) * 2013-10-14 2014-01-08 吴江市博众精工科技有限公司 Material sucking mechanism
JP6190692B2 (en) * 2013-10-22 2017-08-30 日本電産サンキョー株式会社 Industrial robot
JP6349750B2 (en) * 2014-01-31 2018-07-04 シンフォニアテクノロジー株式会社 EFEM
US11273558B2 (en) * 2014-01-17 2022-03-15 Brooks Automation Us, Llc Substrate transport apparatus
WO2015195493A1 (en) * 2014-06-17 2015-12-23 Kateeva, Inc. Printing systems assemblies and methods
JP6215785B2 (en) * 2014-06-30 2017-10-18 ファナック株式会社 Work transfer system
JP6451453B2 (en) * 2015-03-31 2019-01-16 Tdk株式会社 GAS PURGE DEVICE, LOAD PORT DEVICE, PURGE CONTAINER CONTAINER STAND, AND GAS PURGE METHOD
KR20230113410A (en) 2015-07-13 2023-07-28 브룩스 오토메이션 인코퍼레이티드 A Substrate Transport Apparatus
US10134623B2 (en) 2015-07-13 2018-11-20 Brooks Automation, Inc. On the fly automatic wafer centering method and apparatus
US9961782B2 (en) 2016-07-08 2018-05-01 Kateeva, Inc. Transport path correction techniques and related systems, methods and devices
US10607879B2 (en) 2016-09-08 2020-03-31 Brooks Automation, Inc. Substrate processing apparatus
US10541165B2 (en) * 2016-11-10 2020-01-21 Applied Materials, Inc. Systems, apparatus, and methods for an improved load port backplane
US10566216B2 (en) * 2017-06-09 2020-02-18 Lam Research Corporation Equipment front end module gas recirculation
US10903107B2 (en) 2017-07-11 2021-01-26 Brooks Automation, Inc. Semiconductor process transport apparatus comprising an adapter pendant
US10861723B2 (en) * 2017-08-08 2020-12-08 Taiwan Semiconductor Manufacturing Co., Ltd. EFEM robot auto teaching methodology
US11088004B2 (en) 2018-01-30 2021-08-10 Brooks Automation, Inc. Automatic wafer centering method and apparatus
TWI815869B (en) 2018-03-16 2023-09-21 美商布魯克斯自動機械美國公司 Substrate transport apparauts and method therefor
US11194259B2 (en) * 2018-08-30 2021-12-07 Taiwan Semiconductor Manufacturing Co., Ltd. Equipment module with enhanced protection from airborne contaminants, and method of operation
CN111375558B (en) * 2018-12-29 2024-01-09 乐山希尔电子股份有限公司 Withstand voltage testing arrangement
US11276593B2 (en) 2019-07-22 2022-03-15 Rorze Automation, Inc. Systems and methods for horizontal wafer packaging
TW202249142A (en) * 2021-02-25 2022-12-16 日商東京威力科創股份有限公司 Substrate conveying mechanism and substrate conveying method
US11735455B2 (en) * 2021-03-12 2023-08-22 Taiwan Semiconductor Manufacturing Company, Ltd. Systems, devices, and methods for air flow optimization including adjacent a FOUP

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5306380A (en) * 1992-04-28 1994-04-26 Tokyo Electron Limited Vacuum processing apparatus
US5460478A (en) * 1992-02-05 1995-10-24 Tokyo Electron Limited Method for processing wafer-shaped substrates
US5645391A (en) * 1992-06-05 1997-07-08 Tokyo Electron Limited Substrate transfer apparatus, and method of transferring substrates
FR2778496A1 (en) * 1998-05-05 1999-11-12 Recif Sa METHOD AND DEVICE FOR CHANGING THE POSITION OF A SEMICONDUCTOR PLATE
US6091498A (en) * 1996-07-15 2000-07-18 Semitool, Inc. Semiconductor processing apparatus having lift and tilt mechanism
US6142722A (en) * 1998-06-17 2000-11-07 Genmark Automation, Inc. Automated opening and closing of ultra clean storage containers
US6155768A (en) * 1998-01-30 2000-12-05 Kensington Laboratories, Inc. Multiple link robot arm system implemented with offset end effectors to provide extended reach and enhanced throughput
JP2001031211A (en) * 1999-07-26 2001-02-06 Murata Mach Ltd Carrying system
WO2001010756A1 (en) * 1999-08-11 2001-02-15 Multilevel Metals, Inc. Load lock system for foups

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4770590A (en) * 1986-05-16 1988-09-13 Silicon Valley Group, Inc. Method and apparatus for transferring wafers between cassettes and a boat
JP2839265B2 (en) * 1988-08-11 1998-12-16 ファナック 株式会社 Horizontal joint type robot
US5135349A (en) * 1990-05-17 1992-08-04 Cybeq Systems, Inc. Robotic handling system
JP2913439B2 (en) * 1993-03-18 1999-06-28 東京エレクトロン株式会社 Transfer device and transfer method
US5849602A (en) * 1995-01-13 1998-12-15 Tokyo Electron Limited Resist processing process
US5667353A (en) * 1995-03-31 1997-09-16 Inspex Inc. Robot system
US5794487A (en) * 1995-07-10 1998-08-18 Smart Machines Drive system for a robotic arm
TW317644B (en) * 1996-01-26 1997-10-11 Tokyo Electron Co Ltd
US6099643A (en) * 1996-12-26 2000-08-08 Dainippon Screen Mfg. Co., Ltd. Apparatus for processing a substrate providing an efficient arrangement and atmospheric isolation of chemical treatment section
US5951770A (en) * 1997-06-04 1999-09-14 Applied Materials, Inc. Carousel wafer transfer system
US6138721A (en) 1997-09-03 2000-10-31 Asyst Technologies, Inc. Tilt and go load port interface alignment system
US6002840A (en) * 1997-09-30 1999-12-14 Brooks Automation Inc. Substrate transport apparatus
WO1999028952A2 (en) 1997-11-28 1999-06-10 Fortrend Engineering Corporation Wafer-mapping load port interface
JPH11220001A (en) 1998-01-30 1999-08-10 Hitachi Ltd Load port in semiconductor wafer processing system and load port carrying truck
US6281516B1 (en) 1998-07-13 2001-08-28 Newport Corporation FIMS transport box load interface
US6220808B1 (en) 1998-07-13 2001-04-24 Asyst Technologies, Inc. Ergonomic, variable size, bottom opening system compatible with a vertical interface
US6261044B1 (en) 1998-08-06 2001-07-17 Asyst Technologies, Inc. Pod to port door retention and evacuation system
US6188323B1 (en) 1998-10-15 2001-02-13 Asyst Technologies, Inc. Wafer mapping system
US6656273B1 (en) * 1999-06-16 2003-12-02 Tokyo Electron Limited Film forming method and film forming system
JP4248695B2 (en) * 1999-07-26 2009-04-02 東京エレクトロン株式会社 Emergency stop device for wafer transfer equipment
US6305500B1 (en) 1999-08-25 2001-10-23 Maxtor Corporation Material delivery system for clean room-like environments
AU2001273666A1 (en) * 2000-07-07 2002-01-21 Applied Materials, Inc. Automatic door opener
US6327517B1 (en) * 2000-07-27 2001-12-04 Applied Materials, Inc. Apparatus for on-the-fly center finding and notch aligning for wafer handling robots
US20030031538A1 (en) * 2001-06-30 2003-02-13 Applied Materials, Inc. Datum plate for use in installations of substrate handling systems

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5460478A (en) * 1992-02-05 1995-10-24 Tokyo Electron Limited Method for processing wafer-shaped substrates
US5306380A (en) * 1992-04-28 1994-04-26 Tokyo Electron Limited Vacuum processing apparatus
US5645391A (en) * 1992-06-05 1997-07-08 Tokyo Electron Limited Substrate transfer apparatus, and method of transferring substrates
US6091498A (en) * 1996-07-15 2000-07-18 Semitool, Inc. Semiconductor processing apparatus having lift and tilt mechanism
US6155768A (en) * 1998-01-30 2000-12-05 Kensington Laboratories, Inc. Multiple link robot arm system implemented with offset end effectors to provide extended reach and enhanced throughput
FR2778496A1 (en) * 1998-05-05 1999-11-12 Recif Sa METHOD AND DEVICE FOR CHANGING THE POSITION OF A SEMICONDUCTOR PLATE
US6142722A (en) * 1998-06-17 2000-11-07 Genmark Automation, Inc. Automated opening and closing of ultra clean storage containers
JP2001031211A (en) * 1999-07-26 2001-02-06 Murata Mach Ltd Carrying system
WO2001010756A1 (en) * 1999-08-11 2001-02-15 Multilevel Metals, Inc. Load lock system for foups

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 19 5 June 2001 (2001-06-05) *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101387585B1 (en) 2007-09-22 2014-04-24 다이나믹 마이크로시스템즈 세미컨덕터 이큅먼트 게엠베하 An integrated wafer transfer mechanism

Also Published As

Publication number Publication date
US7648327B2 (en) 2010-01-19
US7066707B1 (en) 2006-06-27
DE10297171T5 (en) 2004-07-29
JP4287271B2 (en) 2009-07-01
KR20040041157A (en) 2004-05-14
US20060120833A1 (en) 2006-06-08
KR100800613B1 (en) 2008-02-05
TW579538B (en) 2004-03-11
WO2003021645A2 (en) 2003-03-13
CN1329948C (en) 2007-08-01
CN1561536A (en) 2005-01-05
JP2005527966A (en) 2005-09-15

Similar Documents

Publication Publication Date Title
WO2003021645A3 (en) Wafer engine
KR102480024B1 (en) Substrate processing apparatus
JP4979530B2 (en) Industrial robot
CN1225388C (en) System for parallel processing or workpieces
WO2002089183A3 (en) Holding device for wafers
JP5102564B2 (en) Industrial robot
ATE291993T1 (en) JOINT MECHANISM WITH A CABLE-DRIVEN REDUCTION DEVICE FOR A ROBOT ARM
US20220161418A1 (en) Substrate processing apparatus
US20040131461A1 (en) Substrate conveyer robot
WO2002099165A3 (en) Tools with transfer devices for handling workpieces
CA2494237A1 (en) Drill tool shaft-to-housing locking device
JP2009503811A (en) Unequal length link SCARA arm
AU2003240620A1 (en) Chuck for receiving tools operated by rotating around the axis thereof
WO2004014207A3 (en) Secure removable gripping device
WO2004048238A3 (en) Transfer apparatus for transferring a workpiece from a moving anvil to a moving carrier
WO2003036690A3 (en) Identification code reader integrated with substrate carrier robot
EP0999576A3 (en) Sample processing system
KR100686707B1 (en) Substrate Transfer System
JP2006205264A (en) Substrate transfer device
WO2003014000A3 (en) Edge gripping pre-aligner
EP1334808A3 (en) Backlash clutch and joint mechanism for a robot comprising the clutch
JP2006245079A (en) Aligner apparatus
AU2964400A (en) Test head manipulator
JP2007216364A (en) Vacuum robot
JP2009000783A (en) Polishing and grinding device

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ OM PH PL PT RO RU SD SE SG SI SK SL TJ TM TN TR TT TZ UA UG UZ VN YU ZA ZM ZW

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BY BZ CA CH CN CO CR CU CZ DE DM DZ EC EE ES FI GB GD GE GH HR HU ID IL IN IS JP KE KG KP KR LC LK LR LS LT LU LV MA MD MG MN MW MX MZ NO NZ OM PH PL PT RU SD SE SG SI SK SL TJ TM TN TR TZ UA UG UZ VN YU ZA ZM

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR IE IT LU MC NL PT SE SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

Kind code of ref document: A2

Designated state(s): GH GM KE LS MW MZ SD SL SZ UG ZM ZW AM AZ BY KG KZ RU TJ TM AT BE BG CH CY CZ DK EE ES FI FR GB GR IE IT LU MC PT SE SK TR BF BJ CF CG CI GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
WWE Wipo information: entry into national phase

Ref document number: 2003525893

Country of ref document: JP

WWE Wipo information: entry into national phase

Ref document number: 1020047003086

Country of ref document: KR

WWE Wipo information: entry into national phase

Ref document number: 20028193318

Country of ref document: CN

122 Ep: pct application non-entry in european phase