WO2003021693A3 - Elevated pore phase-change memory - Google Patents

Elevated pore phase-change memory Download PDF

Info

Publication number
WO2003021693A3
WO2003021693A3 PCT/US2002/026375 US0226375W WO03021693A3 WO 2003021693 A3 WO2003021693 A3 WO 2003021693A3 US 0226375 W US0226375 W US 0226375W WO 03021693 A3 WO03021693 A3 WO 03021693A3
Authority
WO
WIPO (PCT)
Prior art keywords
change memory
phase
elevated
pore phase
insulator
Prior art date
Application number
PCT/US2002/026375
Other languages
French (fr)
Other versions
WO2003021693A2 (en
Inventor
Tyler A Lowrey
Original Assignee
Ovonyx Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ovonyx Inc filed Critical Ovonyx Inc
Priority to KR10-2004-7002594A priority Critical patent/KR100534530B1/en
Priority to JP2003525922A priority patent/JP4150667B2/en
Publication of WO2003021693A2 publication Critical patent/WO2003021693A2/en
Publication of WO2003021693A3 publication Critical patent/WO2003021693A3/en

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices without a potential-jump barrier or surface barrier, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/20Multistable switching devices, e.g. memristors
    • H10N70/231Multistable switching devices, e.g. memristors based on solid-state phase change, e.g. between amorphous and crystalline phases, Ovshinsky effect
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices without a potential-jump barrier or surface barrier, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/011Manufacture or treatment of multistable switching devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices without a potential-jump barrier or surface barrier, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/011Manufacture or treatment of multistable switching devices
    • H10N70/061Patterning of the switching material
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices without a potential-jump barrier or surface barrier, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801Constructional details of multistable switching devices
    • H10N70/821Device geometry
    • H10N70/826Device geometry adapted for essentially vertical current flow, e.g. sandwich or pillar type devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices without a potential-jump barrier or surface barrier, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801Constructional details of multistable switching devices
    • H10N70/841Electrodes
    • H10N70/8413Electrodes adapted for resistive heating
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices without a potential-jump barrier or surface barrier, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801Constructional details of multistable switching devices
    • H10N70/861Thermal details
    • H10N70/8616Thermal insulation means
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices without a potential-jump barrier or surface barrier, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801Constructional details of multistable switching devices
    • H10N70/881Switching materials
    • H10N70/882Compounds of sulfur, selenium or tellurium, e.g. chalcogenides
    • H10N70/8828Tellurides, e.g. GeSbTe

Abstract

An elevated phase-change memory cell (10) facilitates manufacture of phase-change memories by physically separating the fabrication of the phase-change memory components from the rest of the semiconductor substrate (12). In one embodiment, a contact (16) in the substrate (12) may be electrically coupled to a cup-shaped conductor (18) filled with an insulator 20). The conductor (18) couples current up to the elevated pore while the insulator (20) thermally and electrically isolates the pore.
PCT/US2002/026375 2001-08-31 2002-08-20 Elevated pore phase-change memory WO2003021693A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR10-2004-7002594A KR100534530B1 (en) 2001-08-31 2002-08-20 Elevated pore phase-change memory
JP2003525922A JP4150667B2 (en) 2001-08-31 2002-08-20 Phase change memory with higher pore position

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/944,478 2001-08-31
US09/944,478 US6764894B2 (en) 2001-08-31 2001-08-31 Elevated pore phase-change memory

Publications (2)

Publication Number Publication Date
WO2003021693A2 WO2003021693A2 (en) 2003-03-13
WO2003021693A3 true WO2003021693A3 (en) 2003-11-13

Family

ID=25481474

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2002/026375 WO2003021693A2 (en) 2001-08-31 2002-08-20 Elevated pore phase-change memory

Country Status (5)

Country Link
US (2) US6764894B2 (en)
JP (1) JP4150667B2 (en)
KR (1) KR100534530B1 (en)
TW (1) TW579593B (en)
WO (1) WO2003021693A2 (en)

Families Citing this family (124)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6545287B2 (en) * 2001-09-07 2003-04-08 Intel Corporation Using selective deposition to form phase-change memory cells
US7319057B2 (en) * 2001-10-30 2008-01-15 Ovonyx, Inc. Phase change material memory device
EP1469532B1 (en) * 2003-04-16 2009-08-26 STMicroelectronics S.r.l. Self-aligned process for manufacturing a phase change memory cell and phase change memory cell thereby manufactured
US6891747B2 (en) * 2002-02-20 2005-05-10 Stmicroelectronics S.R.L. Phase change memory cell and manufacturing method thereof using minitrenches
KR100481865B1 (en) * 2002-11-01 2005-04-11 삼성전자주식회사 Phase changeable memory device and method of fabricating the same
KR100481866B1 (en) * 2002-11-01 2005-04-11 삼성전자주식회사 Phase changeable memory device and method of fabricating the same
US7314776B2 (en) * 2002-12-13 2008-01-01 Ovonyx, Inc. Method to manufacture a phase change memory
US6869883B2 (en) * 2002-12-13 2005-03-22 Ovonyx, Inc. Forming phase change memories
AU2003283730A1 (en) * 2002-12-19 2004-07-14 Koninklijke Philips Electronics N.V. Electric device comprising a layer of phase change material and method of manufacturing the same
US7323734B2 (en) * 2003-02-25 2008-01-29 Samsung Electronics Co., Ltd. Phase changeable memory cells
KR100560659B1 (en) * 2003-03-21 2006-03-16 삼성전자주식회사 Phase change memory device structure and method for fabricating the same
KR100504698B1 (en) * 2003-04-02 2005-08-02 삼성전자주식회사 Phase change memory device and method for forming the same
KR100979710B1 (en) * 2003-05-23 2010-09-02 삼성전자주식회사 Semiconductor memory device and fabricating method thereof
KR100615586B1 (en) * 2003-07-23 2006-08-25 삼성전자주식회사 Phase change memory device including localized phase transition area in porous dielectric layer and method of forming the same
US7211819B2 (en) * 2003-08-04 2007-05-01 Intel Corporation Damascene phase change memory
US20050029504A1 (en) * 2003-08-04 2005-02-10 Karpov Ilya V. Reducing parasitic conductive paths in phase change memories
US7471552B2 (en) * 2003-08-04 2008-12-30 Ovonyx, Inc. Analog phase change memory
US7381611B2 (en) 2003-08-04 2008-06-03 Intel Corporation Multilayered phase change memory
US7012273B2 (en) * 2003-08-14 2006-03-14 Silicon Storage Technology, Inc. Phase change memory device employing thermal-electrical contacts with narrowing electrical current paths
DE10356285A1 (en) * 2003-11-28 2005-06-30 Infineon Technologies Ag Integrated semiconductor memory and method for manufacturing an integrated semiconductor memory
US7057923B2 (en) * 2003-12-10 2006-06-06 International Buisness Machines Corp. Field emission phase change diode memory
KR100668824B1 (en) * 2004-06-30 2007-01-16 주식회사 하이닉스반도체 Phase-change memory device and method for manufacturing the same
KR100639206B1 (en) 2004-06-30 2006-10-30 주식회사 하이닉스반도체 Phase-change memory device and method for manufacturing the same
KR101026476B1 (en) * 2004-07-01 2011-04-01 주식회사 하이닉스반도체 Phase-change random access memory device and method for manufacturing the same
KR100626381B1 (en) * 2004-07-19 2006-09-20 삼성전자주식회사 Phase change memory devices and methods of the same
KR100623181B1 (en) * 2004-08-23 2006-09-19 삼성전자주식회사 Phase-changeable memory device and method of manufacturing the same
KR100568543B1 (en) * 2004-08-31 2006-04-07 삼성전자주식회사 Method of forming a phase change memory device having a small area of contact
US7135696B2 (en) * 2004-09-24 2006-11-14 Intel Corporation Phase change memory with damascene memory element
KR100626388B1 (en) * 2004-10-19 2006-09-20 삼성전자주식회사 Phase-changable memory device and method of forming the same
US7189626B2 (en) * 2004-11-03 2007-03-13 Micron Technology, Inc. Electroless plating of metal caps for chalcogenide-based memory devices
DE102004059428A1 (en) * 2004-12-09 2006-06-22 Infineon Technologies Ag Manufacturing method for a microelectronic electrode structure, in particular for a PCM memory element, and corresponding microelectronic electrode structure
US20060138467A1 (en) * 2004-12-29 2006-06-29 Hsiang-Lan Lung Method of forming a small contact in phase-change memory and a memory cell produced by the method
US7214958B2 (en) * 2005-02-10 2007-05-08 Infineon Technologies Ag Phase change memory cell with high read margin at low power operation
US7229883B2 (en) * 2005-02-23 2007-06-12 Taiwan Semiconductor Manufacturing Company, Ltd. Phase change memory device and method of manufacture thereof
JP5474272B2 (en) * 2005-03-15 2014-04-16 ピーエスフォー ルクスコ エスエイアールエル Memory device and manufacturing method thereof
DE602005018744D1 (en) * 2005-04-08 2010-02-25 St Microelectronics Srl Lateral phase change memory
JP2006303294A (en) * 2005-04-22 2006-11-02 Renesas Technology Corp Variable-phase nonvolatile memory and its manufacturing method
US7910904B2 (en) * 2005-05-12 2011-03-22 Ovonyx, Inc. Multi-level phase change memory
JP2006351992A (en) * 2005-06-20 2006-12-28 Renesas Technology Corp Semiconductor storage device and manufacturing method thereof
KR100655440B1 (en) 2005-08-30 2006-12-08 삼성전자주식회사 Phase change memory devices and methods of the same
US7417245B2 (en) * 2005-11-02 2008-08-26 Infineon Technologies Ag Phase change memory having multilayer thermal insulation
US7635855B2 (en) 2005-11-15 2009-12-22 Macronix International Co., Ltd. I-shaped phase change memory cell
US7449710B2 (en) 2005-11-21 2008-11-11 Macronix International Co., Ltd. Vacuum jacket for phase change memory element
US7646006B2 (en) * 2006-03-30 2010-01-12 International Business Machines Corporation Three-terminal cascade switch for controlling static power consumption in integrated circuits
US20070252127A1 (en) * 2006-03-30 2007-11-01 Arnold John C Phase change memory element with a peripheral connection to a thin film electrode and method of manufacture thereof
US9178141B2 (en) 2006-04-04 2015-11-03 Micron Technology, Inc. Memory elements using self-aligned phase change material layers and methods of manufacturing same
US7812334B2 (en) * 2006-04-04 2010-10-12 Micron Technology, Inc. Phase change memory elements using self-aligned phase change material layers and methods of making and using same
US7345899B2 (en) * 2006-04-07 2008-03-18 Infineon Technologies Ag Memory having storage locations within a common volume of phase change material
JP4865433B2 (en) 2006-07-12 2012-02-01 ルネサスエレクトロニクス株式会社 Semiconductor device and manufacturing method thereof
US7696077B2 (en) * 2006-07-14 2010-04-13 Micron Technology, Inc. Bottom electrode contacts for semiconductor devices and methods of forming same
US7772581B2 (en) * 2006-09-11 2010-08-10 Macronix International Co., Ltd. Memory device having wide area phase change element and small electrode contact area
KR100782496B1 (en) 2006-11-09 2007-12-05 삼성전자주식회사 Methods fabricating of semiconductor devices having self-aligned cell diodes and methods fabricating of phase change memory devices using the same
KR100809437B1 (en) * 2006-12-05 2008-03-05 한국전자통신연구원 Phase memory device having blocking layer between upper electrode layer and phase changing layer fabrication thereof
KR100846506B1 (en) * 2006-12-19 2008-07-17 삼성전자주식회사 Phase change random access memory comprising PN diode and methods of manufacturing and operating the same
US7718989B2 (en) 2006-12-28 2010-05-18 Macronix International Co., Ltd. Resistor random access memory cell device
US20080164453A1 (en) * 2007-01-07 2008-07-10 Breitwisch Matthew J Uniform critical dimension size pore for pcram application
US20080173975A1 (en) * 2007-01-22 2008-07-24 International Business Machines Corporation Programmable resistor, switch or vertical memory cell
TWI326917B (en) * 2007-02-01 2010-07-01 Ind Tech Res Inst Phase-change memory
KR100881055B1 (en) * 2007-06-20 2009-01-30 삼성전자주식회사 Phase-change memory unit, method of forming the phase-change memory unit, phase-change memory device having the phase-change memory unit and method of manufacturing the phase-change memory device
US20080316793A1 (en) * 2007-06-22 2008-12-25 Jan Boris Philipp Integrated circuit including contact contacting bottom and sidewall of electrode
US7932167B2 (en) * 2007-06-29 2011-04-26 International Business Machines Corporation Phase change memory cell with vertical transistor
US7863593B2 (en) * 2007-07-20 2011-01-04 Qimonda Ag Integrated circuit including force-filled resistivity changing material
KR101344346B1 (en) * 2007-07-25 2013-12-24 삼성전자주식회사 Phase change memory devices and methods of forming the same
US7729161B2 (en) 2007-08-02 2010-06-01 Macronix International Co., Ltd. Phase change memory with dual word lines and source lines and method of operating same
US20090039333A1 (en) * 2007-08-09 2009-02-12 Heon Yong Chang Phase change memory device and method for manufacturing the same
EP2034536B1 (en) * 2007-09-07 2010-11-17 STMicroelectronics Srl Phase change memory device for multibit storage
TWI347607B (en) 2007-11-08 2011-08-21 Ind Tech Res Inst Writing system and method for a phase change memory
US7859025B2 (en) * 2007-12-06 2010-12-28 International Business Machines Corporation Metal ion transistor
US8426838B2 (en) 2008-01-25 2013-04-23 Higgs Opl. Capital Llc Phase-change memory
US8158965B2 (en) * 2008-02-05 2012-04-17 Macronix International Co., Ltd. Heating center PCRAM structure and methods for making
US8604457B2 (en) 2008-11-12 2013-12-10 Higgs Opl. Capital Llc Phase-change memory element
EP2202816B1 (en) 2008-12-24 2012-06-20 Imec Method for manufacturing a resistive switching memory device
TWI402845B (en) 2008-12-30 2013-07-21 Higgs Opl Capital Llc Verification circuits and methods for phase change memory
TWI412124B (en) 2008-12-31 2013-10-11 Higgs Opl Capital Llc Phase change memory
US8064247B2 (en) 2009-01-14 2011-11-22 Macronix International Co., Ltd. Rewritable memory device based on segregation/re-absorption
US7968876B2 (en) 2009-05-22 2011-06-28 Macronix International Co., Ltd. Phase change memory cell having vertical channel access transistor
US8350316B2 (en) * 2009-05-22 2013-01-08 Macronix International Co., Ltd. Phase change memory cells having vertical channel access transistor and memory plane
US8809829B2 (en) 2009-06-15 2014-08-19 Macronix International Co., Ltd. Phase change memory having stabilized microstructure and manufacturing method
US8406033B2 (en) 2009-06-22 2013-03-26 Macronix International Co., Ltd. Memory device and method for sensing and fixing margin cells
US8238149B2 (en) 2009-06-25 2012-08-07 Macronix International Co., Ltd. Methods and apparatus for reducing defect bits in phase change memory
US8363463B2 (en) 2009-06-25 2013-01-29 Macronix International Co., Ltd. Phase change memory having one or more non-constant doping profiles
US7894254B2 (en) 2009-07-15 2011-02-22 Macronix International Co., Ltd. Refresh circuitry for phase change memory
US8110822B2 (en) 2009-07-15 2012-02-07 Macronix International Co., Ltd. Thermal protect PCRAM structure and methods for making
US8198619B2 (en) 2009-07-15 2012-06-12 Macronix International Co., Ltd. Phase change memory cell structure
US8064248B2 (en) 2009-09-17 2011-11-22 Macronix International Co., Ltd. 2T2R-1T1R mix mode phase change memory array
JP2011091156A (en) * 2009-10-21 2011-05-06 Elpida Memory Inc Semiconductor device and method of manufacturing the same
US8178387B2 (en) 2009-10-23 2012-05-15 Macronix International Co., Ltd. Methods for reducing recrystallization time for a phase change material
KR101069724B1 (en) * 2009-12-22 2011-10-04 주식회사 하이닉스반도체 Phase Change Memory Having 3 Dimension Stack Structure and Method of Manufacturing the Same
US8729521B2 (en) 2010-05-12 2014-05-20 Macronix International Co., Ltd. Self aligned fin-type programmable memory cell
KR20110135285A (en) 2010-06-10 2011-12-16 삼성전자주식회사 Methods for fabricating phase change memory devices
US8310864B2 (en) 2010-06-15 2012-11-13 Macronix International Co., Ltd. Self-aligned bit line under word line memory array
KR101143485B1 (en) * 2010-07-30 2012-05-10 에스케이하이닉스 주식회사 Phase Change Random Access Memory And Fabricating The Same
CN102376879B (en) * 2010-08-10 2013-10-09 中芯国际集成电路制造(上海)有限公司 Method for forming phase-change memory
US8728859B2 (en) * 2010-08-12 2014-05-20 International Business Machines Corporation Small footprint phase change memory cell
US8395935B2 (en) 2010-10-06 2013-03-12 Macronix International Co., Ltd. Cross-point self-aligned reduced cell size phase change memory
US8497705B2 (en) 2010-11-09 2013-07-30 Macronix International Co., Ltd. Phase change device for interconnection of programmable logic device
US8467238B2 (en) 2010-11-15 2013-06-18 Macronix International Co., Ltd. Dynamic pulse operation for phase change memory
KR101781483B1 (en) 2010-12-03 2017-09-26 삼성전자 주식회사 Method Of Forming Resistance Changeable Memory Device
US8486743B2 (en) 2011-03-23 2013-07-16 Micron Technology, Inc. Methods of forming memory cells
KR101298189B1 (en) * 2011-05-11 2013-08-20 에스케이하이닉스 주식회사 Phase-Change Random Access Memory Device and Fabrication Method Thereof
US8994489B2 (en) 2011-10-19 2015-03-31 Micron Technology, Inc. Fuses, and methods of forming and using fuses
US8723155B2 (en) 2011-11-17 2014-05-13 Micron Technology, Inc. Memory cells and integrated devices
US9252188B2 (en) 2011-11-17 2016-02-02 Micron Technology, Inc. Methods of forming memory cells
US8546231B2 (en) 2011-11-17 2013-10-01 Micron Technology, Inc. Memory arrays and methods of forming memory cells
US8765555B2 (en) 2012-04-30 2014-07-01 Micron Technology, Inc. Phase change memory cells and methods of forming phase change memory cells
US9136467B2 (en) * 2012-04-30 2015-09-15 Micron Technology, Inc. Phase change memory cells and methods of forming phase change memory cells
CN103855300B (en) * 2012-12-04 2017-03-29 中芯国际集成电路制造(上海)有限公司 Phase transition storage and forming method thereof
US9553262B2 (en) 2013-02-07 2017-01-24 Micron Technology, Inc. Arrays of memory cells and methods of forming an array of memory cells
US9012880B2 (en) * 2013-02-21 2015-04-21 Winbond Electronics Corp. Resistance memory device
US9099637B2 (en) * 2013-03-28 2015-08-04 Intellectual Discovery Co., Ltd. Phase change memory and method of fabricating the phase change memory
KR20140140746A (en) * 2013-05-30 2014-12-10 에스케이하이닉스 주식회사 Phase-change random access memory device and method of manufacturing the same
JP2015002283A (en) * 2013-06-17 2015-01-05 ピーエスフォー ルクスコ エスエイアールエルPS4 Luxco S.a.r.l. Semiconductor device and manufacturing method therefor
US9112148B2 (en) 2013-09-30 2015-08-18 Taiwan Semiconductor Manufacturing Co., Ltd. RRAM cell structure with laterally offset BEVA/TEVA
US9881971B2 (en) 2014-04-01 2018-01-30 Micron Technology, Inc. Memory arrays
US9178144B1 (en) 2014-04-14 2015-11-03 Taiwan Semiconductor Manufacturing Co., Ltd. RRAM cell with bottom electrode
US9362494B2 (en) 2014-06-02 2016-06-07 Micron Technology, Inc. Array of cross point memory cells and methods of forming an array of cross point memory cells
US9343506B2 (en) 2014-06-04 2016-05-17 Micron Technology, Inc. Memory arrays with polygonal memory cells having specific sidewall orientations
US9209392B1 (en) 2014-10-14 2015-12-08 Taiwan Semiconductor Manufacturing Co., Ltd. RRAM cell with bottom electrode
US9672906B2 (en) 2015-06-19 2017-06-06 Macronix International Co., Ltd. Phase change memory with inter-granular switching
KR102301774B1 (en) 2017-03-31 2021-09-13 삼성전자주식회사 Semiconductor device and method for fabricating the same
US10366982B2 (en) 2017-11-30 2019-07-30 Taiwan Semiconductor Manufacturing Co., Ltd. Structure with embedded memory device and contact isolation scheme
US11139430B2 (en) * 2018-10-31 2021-10-05 Taiwan Semiconductor Manufacturing Co., Ltd. Phase change random access memory and method of manufacturing
US11264569B2 (en) * 2019-11-01 2022-03-01 International Business Machines Corporation Phase change memory device
CN113795937A (en) * 2021-07-28 2021-12-14 长江先进存储产业创新中心有限责任公司 Phase change memory device and forming method thereof

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6031287A (en) * 1997-06-18 2000-02-29 Micron Technology, Inc. Contact structure and memory element incorporating the same
US6117720A (en) * 1995-06-07 2000-09-12 Micron Technology, Inc. Method of making an integrated circuit electrode having a reduced contact area
WO2000057498A1 (en) * 1999-03-25 2000-09-28 Energy Conversion Devices, Inc. Electrically programmable memory element with improved contacts

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5296716A (en) * 1991-01-18 1994-03-22 Energy Conversion Devices, Inc. Electrically erasable, directly overwritable, multibit single cell memory elements and arrays fabricated therefrom
US5166758A (en) 1991-01-18 1992-11-24 Energy Conversion Devices, Inc. Electrically erasable phase change memory
US5879955A (en) * 1995-06-07 1999-03-09 Micron Technology, Inc. Method for fabricating an array of ultra-small pores for chalcogenide memory cells
US5837564A (en) * 1995-11-01 1998-11-17 Micron Technology, Inc. Method for optimal crystallization to obtain high electrical performance from chalcogenides
US5814527A (en) * 1996-07-22 1998-09-29 Micron Technology, Inc. Method of making small pores defined by a disposable internal spacer for use in chalcogenide memories
US6337266B1 (en) * 1996-07-22 2002-01-08 Micron Technology, Inc. Small electrode for chalcogenide memories
US6534781B2 (en) * 2000-12-26 2003-03-18 Ovonyx, Inc. Phase-change memory bipolar array utilizing a single shallow trench isolation for creating an individual active area region for two memory array elements and one bipolar base contact
US7365354B2 (en) * 2001-06-26 2008-04-29 Ovonyx, Inc. Programmable resistance memory element and method for making same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6117720A (en) * 1995-06-07 2000-09-12 Micron Technology, Inc. Method of making an integrated circuit electrode having a reduced contact area
US6031287A (en) * 1997-06-18 2000-02-29 Micron Technology, Inc. Contact structure and memory element incorporating the same
WO2000057498A1 (en) * 1999-03-25 2000-09-28 Energy Conversion Devices, Inc. Electrically programmable memory element with improved contacts
US20020017701A1 (en) * 1999-03-25 2002-02-14 Patrick Klersy Electrically programmable memory element with raised pore

Also Published As

Publication number Publication date
JP4150667B2 (en) 2008-09-17
JP2005525690A (en) 2005-08-25
KR100534530B1 (en) 2005-12-07
US6764894B2 (en) 2004-07-20
US20030116794A1 (en) 2003-06-26
WO2003021693A2 (en) 2003-03-13
US7326952B2 (en) 2008-02-05
KR20040032955A (en) 2004-04-17
US20040202033A1 (en) 2004-10-14
TW579593B (en) 2004-03-11

Similar Documents

Publication Publication Date Title
WO2003021693A3 (en) Elevated pore phase-change memory
WO2003023875A3 (en) Phase change material memory device
AU2002362009A1 (en) Electrode structure for use in an integrated circuit
EP1265286A3 (en) Integrated circuit structure
TW200505033A (en) Capacitor and method of fabricating the same
EP1187204A3 (en) Circuit device and method of manufacturing the same
MY120575A (en) Semiconductor device and method of manufacturing same
WO2006078985A3 (en) Optoelectronic architecture having compound conducting substrate
WO2007051765A3 (en) Electrically programmable fuse
WO2008033878A3 (en) Enhanced local interconnects employing ferroelectric electrodes
DE602006016864D1 (en) VERTICAL PHASE SWITCHING MEMORY CELL AND METHOD OF MANUFACTURING THEREOF
WO2004055899A3 (en) Memory and access device and manufacturing method therefor
TW200719437A (en) Method of manufacturing a pipe shaped phase change memory
TW200639980A (en) Lid used in package structure and the package structure of having the same
JP2006510219A5 (en)
TW200633188A (en) Methods and structures for electrical communication with an overlying electrode for a semiconductor element
EP1447851A4 (en) Semiconductor storage device, its manufacturing method and operating method, and portable electronic apparatus
EP1630883A3 (en) Molecular photovoltaics
GB0624408D0 (en) Phase changable memory cells and methods of forming the same
WO2006057980A3 (en) An electrically programmable fuse for silicon-on-insulator (soi) technology
TW200601485A (en) Semiconductor device substrate with wmbedded capacitor
WO2006083310A3 (en) Nanowire device with (111) vertical sidewalls and method of fabrication
JP2005534163A5 (en)
TW200616140A (en) SER immune cell structure
WO2005018002A3 (en) Damascene conductive line for contacting an underlying memory element

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BY BZ CA CH CN CO CR CU CZ DE DM DZ EC EE ES FI GB GD GE GH HR HU ID IL IN IS JP KE KG KP KR LC LK LR LS LT LU LV MA MD MG MN MW MX MZ NO NZ OM PH PL PT RU SD SE SG SI SK SL TJ TM TN TR TZ UA UG UZ VC VN YU ZA ZM

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ OM PH PL PT RO RU SD SE SG SI SK SL TJ TM TN TR TT TZ UA UG UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): GH GM KE LS MW MZ SD SL SZ UG ZM ZW AM AZ BY KG KZ RU TJ TM AT BE BG CH CY CZ DK EE ES FI FR GB GR IE IT LU MC PT SE SK TR BF BJ CF CG CI GA GN GQ GW ML MR NE SN TD TG

Kind code of ref document: A2

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR IE IT LU MC NL PT SE SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
121 Ep: the epo has been informed by wipo that ep was designated in this application
WWE Wipo information: entry into national phase

Ref document number: 1020047002594

Country of ref document: KR

WWE Wipo information: entry into national phase

Ref document number: 2003525922

Country of ref document: JP

122 Ep: pct application non-entry in european phase