WO2003023795A1 - Magnetisches bauelement - Google Patents
Magnetisches bauelement Download PDFInfo
- Publication number
- WO2003023795A1 WO2003023795A1 PCT/EP2002/008295 EP0208295W WO03023795A1 WO 2003023795 A1 WO2003023795 A1 WO 2003023795A1 EP 0208295 W EP0208295 W EP 0208295W WO 03023795 A1 WO03023795 A1 WO 03023795A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- magnetic
- component according
- conductor
- conductors
- layer
- Prior art date
Links
- 230000005291 magnetic effect Effects 0.000 title claims abstract description 175
- 239000004020 conductor Substances 0.000 claims abstract description 94
- 239000000696 magnetic material Substances 0.000 claims abstract description 35
- 238000001465 metallisation Methods 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 11
- 238000004804 winding Methods 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000000463 material Substances 0.000 abstract description 9
- 230000004907 flux Effects 0.000 abstract description 8
- 230000006872 improvement Effects 0.000 abstract description 3
- 239000000203 mixture Substances 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 10
- 230000035699 permeability Effects 0.000 description 9
- 230000005415 magnetization Effects 0.000 description 8
- 230000008569 process Effects 0.000 description 7
- 239000011162 core material Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 230000005294 ferromagnetic effect Effects 0.000 description 4
- 229910000889 permalloy Inorganic materials 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000003302 ferromagnetic material Substances 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 229910052814 silicon oxide Inorganic materials 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 229910020598 Co Fe Inorganic materials 0.000 description 1
- 229910002519 Co-Fe Inorganic materials 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000004870 electrical engineering Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000005417 remagnetization Effects 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/5227—Inductive arrangements or effects of, or between, wiring layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/645—Inductive arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0033—Printed inductances with the coil helically wound around a magnetic core
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
- H01F41/042—Printed circuit coils by thin film techniques
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
- H01F41/046—Printed circuit coils structurally combined with ferromagnetic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12465—All metal or with adjacent metals having magnetic properties, or preformed fiber orientation coordinate with shape
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/32—Composite [nonstructural laminate] of inorganic material having metal-compound-containing layer and having defined magnetic layer
Definitions
- the present invention relates to a magnetic component.
- the present invention relates in particular to a magnetic component that is integrated with other components on a substrate, for example an integrated inductor or an integrated transformer.
- Passive magnetic components such as coils or transformers
- passive components are required for a variety of applications. For example, up to 300 passive components are currently processed in a mobile radio telephone, with essential functions being performed by magnetic components.
- Each functional expansion be it a dual-band or dual-mode expansion, increases this number.
- the assembly, soldering and testing of the ever smaller individual components cause a substantial part of the costs for the device manufacturers.
- coils and inductors have often been produced using thick film technology on ceramic substrates or as air windings. Although these coils are of high quality, they are relatively expensive.
- the quality Q of a coil is calculated from the ratio of its inductance L to its resistance R.
- Integrated inductors are currently almost exclusively realized by planar spiral coils, which are usually on the top metallization level are arranged.
- the coils are made of metal (e.g. Al, AlSiCu, Cu), which means that they have a relatively low line resistance. This makes it possible to manufacture integrated inductors that achieve a quality of up to about 15 at a frequency of 1 GHz.
- Such spiral coils are described, for example, in the documents JA Power et al.
- a spiral coil is based on cable rings which lead the cable into the interior of the area enclosed by the first ring as the number of turns increases.
- planar spiral coils lie in the direction of the magnetic flux, because due to the orientation of the spiral coils, this is inevitably conducted to a large extent through the substrate. Depending on the conductance of the substrate, parasitic eddy current effects also occur there, the ohmic losses of which reduce the coil quality.
- the effects mentioned mean that integrated spiral coils on conductive substrates (p ⁇ 20 ⁇ cm) have only relatively small grades (Q ⁇ 15). Despite Great efforts by the component manufacturers have so far not been able to develop integrated spiral coils with a quality of more than 15 for series production.
- the present invention is therefore based on the object of providing a magnetic component which has a significantly improved parameters, in particular a significantly improved quality, compared to the previous magnetic components.
- a magnetic component which is integrated on a substrate and which has the following features:
- At least one first magnetic conductor made of at least a first layer of magnetic material, the domains of the magnetic material being aligned along a first direction and the winding of the first electrical conductor enclosing the first magnetic conductor, and at least one second magnetic conductor made of at least one second layer of magnetic material different from the first layer, the domains of the magnetic material being aligned along a second direction and the first and second magnetic conductors being arranged one behind the other in a magnetic circuit, so that
- a magnetic field which is generated by a current in the first electrical conductor, is guided in the magnetic conductors and the magnetic field in the first magnetic conductor is oriented substantially perpendicular to the first direction and in the second magnetic conductor substantially perpendicular to the second direction is.
- the magnetic component according to the invention uses at least two different layers or layer sequences of magnetic material for conducting and amplifying the magnetic flux, ie the first and second layers are generated in different layer generation processes or process steps.
- the magnetic conductors can be used to build a magnetic circuit with a locally adapted domain orientation. Accordingly, with the magnetic component according to the invention, significant improvements in the component parameters, in particular a significant increase in the quality, can be achieved.
- the magnetic circuit made of the magnetic conductors need not necessarily be closed. Furthermore, the first direction in which the domains of the first layer are aligned and the second direction in which the domains of the second layer are aligned need not necessarily be different.
- the magnetic area structure of layers made of ferromagnetic materials is characterized by the existence of domains ("Weissche districts"): locally, the layer material is always magnetized in saturation due to the ferromagnetic coupling of the elementary dipoles. Spatial areas within the layer material that are in saturation , are referred to as domains. Global magnetization states of the layer are realized by means of different domain arrangements. Between the domains there are the domain walls. Within them, there is a continuous rotation of the
- Magnetization direction from the preferred direction of one domain to the preferred direction of the adjacent domain instead.
- the magnetic field is applied essentially perpendicular to the alignment of the domains.
- the magnetic component according to the present invention avoids such sections by using at least two magnetic conductors made of two different layers. Accordingly, the alignment of the domains in the layers and / or the spatial arrangement of the layers with respect to one another can be chosen such that sections in which the magnetic field is oriented parallel to the domains can be largely avoided. This leads to a significantly more effective use of the magnetic material, which in turn is reflected in significantly improved parameters of the magnetic component.
- the magnetic flux is kept away from the substrate and from the winding, whereby the eddy current losses at these points are minimized.
- the magnetic component according to the invention can also be formed on conductive substrates. Since the inductance of a coil, for example, is essentially directly proportional to the permeability ⁇ r of the core material, the quality of the coil also depends directly on the permeability ⁇ r of the core material. With a large permeability ⁇ r , significantly smaller coils can be produced. The resulting reduction in the electrical cable length leads to an improvement in the quality due to the lower ohmic losses.
- At least one of the magnetic conductors is slotted. It is further preferred if at least one of the magnetic conductors is a laminate of magnetic layers and electrically insulating layers. By slitting and / or laminating the magnetic material, eddy current losses in the magnetic material can be largely avoided.
- the magnetic material is a soft magnetic material.
- the first and the second magnetic conductor are arranged in different planes.
- the magnetic flux is not limited to the level of the first layer of magnetic material and there is a significantly increased scope with regard to the design of the magnetic component.
- the second direction in which the domains of the second layer are aligned can coincide with the first direction in which the domains of the first layer are aligned. It is further preferred if the first and second magnetic conductors form a closed magnetic circuit.
- the electrical conductors formed from copper. It is further preferred if the electrical conductor is formed in two metallization levels, which are connected via vias. It is particularly preferred if contact holes are provided in the first layer of magnetic material through which the vias are guided. The correspondingly large edge regions of the magnetic conductor can prevent edge domains from penetrating into the magnetically active regions of the magnetic conductor.
- a second electrical conductor with at least one turn is provided, the second magnetic conductor being arranged within the turn of the second electrical conductor.
- Appropriate wiring of the first and second electrical conductors makes it possible to produce either a transformer or a coil with increased inductance. If such a magnetic component is used as a coil, it is preferred if the first electrical conductor and the first magnetic conductor together form a first rod coil and the second electrical conductor and the second magnetic conductor together form a second rod coil, the two rod coils in series switched and polarized in opposite directions.
- FIG. 1 shows a first embodiment of the magnetic component according to the invention
- FIG. 2 shows a further cross-sectional view of the first embodiment of the magnetic component according to the invention
- 3 shows a further embodiment of the magnetic component according to the invention
- FIG. 6 shows a further embodiment of the magnetic component according to the invention.
- the magnetic component according to the invention forms an integrated coil.
- the magnetic component according to the invention comprises a first electrical conductor 2 which has a plurality of turns.
- the electrical conductor 2 is formed from copper and it extends over two metallization levels 3 and 4, which are connected via vias 5.
- a first layer sequence 6 of magnetic layers 6a and electrically insulating layers 6b is arranged between the metallization levels 3 and 4. This layer sequence forms a first magnetic conductor 7, the turns of the electrical conductor 2 enclosing the first magnetic conductor 7.
- the magnetic layers 6a preferably consist of a soft magnetic material, such as permalloy, whose domains are aligned along a first direction perpendicular to the plane of the drawing.
- the electrically insulating layers 6b are made of silicon oxide, for example.
- the magnetic conductor 7 has a multiplicity of slits 9, which in turn are filled with silicon oxide.
- Eddy current losses in the magnetic material can be largely avoided. Furthermore, 6 contact holes are provided in the first layer sequence, through which the vias 5 are guided. The correspondingly large edge regions of the magnetic material can prevent edge domains from penetrating into the magnetically active regions of the magnetic conductor 7.
- a second layer sequence 8 of magnetic layers 8a and electrically insulating layers 8b is arranged above the upper metallization level 4.
- This second layer sequence 8 forms a second magnetic conductor 10.
- the magnetic layers 8a likewise consist of a soft magnetic material, such as permalloy, the domains of which in turn are along the direction perpendicular to
- the electrically insulating layers 8b are also made of silicon oxide. On the side of the layer sequence, contacts to the electrical conductor 2 are also provided (FIG. 2).
- the first magnetic conductor 7 and the second magnetic conductor 10 form the essential components of a magnetic circuit, which is closed via the insulating material between the outer regions of the magnetic conductors 7 and 10.
- Layer sequences 6 and 8 and the alignment of the domains in the layer sequences have the result that a magnetic field, which is generated by a current in the first electrical conductor 2 and is carried in the magnetic conductors 7 and 10, in both magnetic conductors 7 and 10 is aligned perpendicular to the alignment of the domains. There is thus a rotation of the magnetization within the Domains. The magnetization is reversibly turned out of the original preferred direction in order to follow the applied magnetic field.
- Magnetic reversal process provides a permeability ⁇ r of approximately 10 to 1000, depending on the material used, even at high frequencies in a range between 500 MHz and 10 GHz.
- FIG. 3 shows a further embodiment of the magnetic component according to the invention.
- the embodiment shown in FIG. 3 essentially corresponds to the embodiment shown in FIG. 1, with the difference that, due to a corresponding configuration of the second magnetic conductor 10, a closed magnetic circuit is formed which is composed only of the magnetic conductors 7 and 10.
- FIG. 4 shows a further embodiment of the magnetic component according to the invention.
- the embodiment shown in FIG. 4 has a second electrical conductor 12, the windings of which enclose the second magnetic conductor 10 and which extends over the metallization level 4 and a further metallization level 14.
- the metallization levels 4 and 14 are in turn electrically connected to one another via vias 15.
- first and second electrical conductors 12 make it possible to produce either a transformer or a coil with increased inductance. If such a magnetic component is used as a coil, it is preferred if the first electrical conductor 2 and the first magnetic conductor 7 together form a first rod coil and the second electrical conductor 12 and the second magnetic conductor 10 together form a second rod coil, the are connected in series and opposite polarity.
- 5 shows a further embodiment of the magnetic component according to the invention. Like the embodiment shown in FIG. 4, the embodiment shown in FIG. 5 has a second electrical conductor 12, the windings of which enclose the second magnetic conductor 10. In contrast to the embodiment shown in FIG. 4, an additional metallization level 16 is provided in the embodiment shown in FIG. 5, so that the second electrical conductor 12 extends over the metallization level 14 and the additional one
- Metallization level 16 extends.
- the metallization levels 14 and 16 are in turn electrically connected to one another via vias 17.
- FIG. 6 shows a further embodiment of the magnetic component according to the invention.
- the magnetic component is only arranged in one plane and FIG. 6 shows a plan view of this plane.
- the magnetic component according to the invention comprises a first electrical conductor 2 which has a plurality of turns.
- the electrical conductor 2 is formed from copper and extends over two metallization levels (not shown) which are connected via vias 5.
- the turns of the electrical conductor 2 enclose the first magnetic conductor 7, which is formed from a first layer sequence 6 of magnetic layers and electrically insulating layers.
- the magnetic component shown in FIG. 6 also has a further magnetic conductor 18, which is likewise formed from the first layer sequence 6.
- the magnetic component shown in FIG. 6 has the magnetic conductors 10a and 10b, which are formed from a second layer sequence 8 of magnetic layers and electrically insulating layers.
- the magnetic conductors 7, 10a, 10b and 18 have a plurality of slots (not shown), which in turn are filled with an insulating material. The slitting and the lamination of the magnetic material can largely avoid eddy current losses in the magnetic material.
- the domain structure of the magnetic material is additionally shown in FIG. 6.
- the domains are exaggerated for clarity. It can be seen that the domains of the magnetic conductors 7 and 18, which are formed from the first layer 6 of magnetic material, are oriented in a first direction (x direction). In contrast, the domains of the magnetic conductors 10a and 10b formed from the second layer 8 of magnetic material are oriented in a second direction (y direction) perpendicular to the first direction (x direction).
- the magnetic conductors shown in FIG. 6 with their domain orientations can, for example, produce the following process steps.
- a mask is produced which has openings at the points at which the magnetic conductors 7 and 18 are to be produced, for example.
- the first layer sequence 6 of magnetic material is then applied over the entire surface, for example by sputtering. With the help of a so-called "lift-off" technique, this layer sequence is removed again except for the layer parts which are arranged in the openings of the paint mask.
- heat treatment in a relatively strong magnetic field leads to the impressing of the domain orientation of the magnetic element shown in FIG Heads 7 and 18.
- a paint mask is then applied to the structure produced in this way, which has openings at the points at which the magnetic conductors 10a and 10b are to be produced.
- the second layer 8 of magnetic material is then applied by sputtering.
- a characteristic of the desired domain orientation is now already applied to a magnetic field during the sputtering process, so that the domain orientation of the magnetic conductors 10a and 10b shown in FIG. 6 is created.
- the structure shown in FIG. 6 is finally produced by a further lift-off process.
- FIG. 6 shows the magnetic field H that is generated by a current in the first electrical conductor 2. It can be seen that the magnetic field is guided in the magnetic conductors 7, 10a, 10b and 17 and that the magnetic field H in the magnetic conductors is oriented essentially perpendicular to the domain orientations.
- the magnetic component according to FIG present invention such sections by using at least two magnetic conductors from two different layers. Accordingly, the alignment of the domains in the layers and / or the spatial arrangement of the layers with respect to one another can be chosen such that sections in which the magnetic field is oriented parallel to the domains can be largely avoided. This leads to a significantly more effective use of the magnetic material, which in turn is reflected in significantly improved parameters of the magnetic component. In particular, you can integrated coils can be realized that have a quality Q> 30 or Q> 50.
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE50209602T DE50209602D1 (de) | 2001-09-10 | 2002-07-25 | Magnetisches bauelement |
EP02754938A EP1425765B1 (de) | 2001-09-10 | 2002-07-25 | Magnetisches bauelement |
US10/797,221 US6873242B2 (en) | 2001-09-10 | 2004-03-10 | Magnetic component |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10144380A DE10144380A1 (de) | 2001-09-10 | 2001-09-10 | Magnetisches Bauelement |
DE10144380.3 | 2001-09-10 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/797,221 Continuation US6873242B2 (en) | 2001-09-10 | 2004-03-10 | Magnetic component |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2003023795A1 true WO2003023795A1 (de) | 2003-03-20 |
Family
ID=7698394
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2002/008295 WO2003023795A1 (de) | 2001-09-10 | 2002-07-25 | Magnetisches bauelement |
Country Status (6)
Country | Link |
---|---|
US (1) | US6873242B2 (de) |
EP (1) | EP1425765B1 (de) |
CN (1) | CN1280844C (de) |
DE (2) | DE10144380A1 (de) |
TW (1) | TW552597B (de) |
WO (1) | WO2003023795A1 (de) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6319206B1 (en) | 1999-11-24 | 2001-11-20 | Exergen Corporation | Temporal thermometer disposable cap |
EP2297751B1 (de) | 2008-07-02 | 2013-02-13 | Nxp B.V. | Planare monolithisch integrierte spule |
NZ589312A (en) | 2010-11-16 | 2013-03-28 | Powerbyproxi Ltd | Battery having inductive power pickup coils disposed within the battery casing and at an angle to the casing axis |
EP2764522B1 (de) | 2011-09-29 | 2019-01-09 | Apple Inc. | Drahtlos wiederaufladbare batterie und komponenten davon |
CN104517941B (zh) * | 2013-09-29 | 2018-12-28 | 澜起科技股份有限公司 | 线圈及制备应用于电感元件的线圈的方法 |
IT201600098500A1 (it) * | 2016-09-30 | 2018-03-30 | St Microelectronics Srl | Micro-trasformatore con confinamento del campo magnetico e metodo di fabbricazione dello stesso |
US10932332B2 (en) * | 2017-07-31 | 2021-02-23 | Illinois Tool Works Inc. | Methods and apparatus to provide asymmetrical magnetic fields, and induction heating using asymmetrical magnetic fields |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57111006A (en) * | 1980-12-27 | 1982-07-10 | Sony Corp | Inductance element |
EP0725407A1 (de) * | 1995-02-03 | 1996-08-07 | International Business Machines Corporation | Dreidimensionale integrierte Induktivität |
US6103405A (en) * | 1997-02-04 | 2000-08-15 | Kabushiki Kaisha Toshiba | Planar inductance element |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5279988A (en) * | 1992-03-31 | 1994-01-18 | Irfan Saadat | Process for making microcomponents integrated circuits |
US5574420A (en) * | 1994-05-27 | 1996-11-12 | Lucent Technologies Inc. | Low profile surface mounted magnetic devices and components therefor |
US5609946A (en) * | 1995-10-03 | 1997-03-11 | General Electric Company | High frequency, high density, low profile, magnetic circuit components |
US5847634A (en) * | 1997-07-30 | 1998-12-08 | Lucent Technologies Inc. | Article comprising an inductive element with a magnetic thin film |
US5998048A (en) * | 1998-03-02 | 1999-12-07 | Lucent Technologies Inc. | Article comprising anisotropic Co-Fe-Cr-N soft magnetic thin films |
US6008102A (en) * | 1998-04-09 | 1999-12-28 | Motorola, Inc. | Method of forming a three-dimensional integrated inductor |
DE10104648B4 (de) * | 2000-07-14 | 2004-06-03 | Forschungszentrum Karlsruhe Gmbh | Hochfrequenz-Mikroinduktivität |
WO2002007172A1 (de) * | 2000-07-14 | 2002-01-24 | Forschungszentrum Karlsruhe Gmbh | I-induktor als hochfrequenz-mikroinduktor |
-
2001
- 2001-09-10 DE DE10144380A patent/DE10144380A1/de not_active Withdrawn
-
2002
- 2002-07-25 DE DE50209602T patent/DE50209602D1/de not_active Expired - Lifetime
- 2002-07-25 EP EP02754938A patent/EP1425765B1/de not_active Expired - Lifetime
- 2002-07-25 CN CN02822329.2A patent/CN1280844C/zh not_active Expired - Fee Related
- 2002-07-25 TW TW091116572A patent/TW552597B/zh not_active IP Right Cessation
- 2002-07-25 WO PCT/EP2002/008295 patent/WO2003023795A1/de active IP Right Grant
-
2004
- 2004-03-10 US US10/797,221 patent/US6873242B2/en not_active Expired - Lifetime
Patent Citations (3)
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JPS57111006A (en) * | 1980-12-27 | 1982-07-10 | Sony Corp | Inductance element |
EP0725407A1 (de) * | 1995-02-03 | 1996-08-07 | International Business Machines Corporation | Dreidimensionale integrierte Induktivität |
US6103405A (en) * | 1997-02-04 | 2000-08-15 | Kabushiki Kaisha Toshiba | Planar inductance element |
Non-Patent Citations (3)
Title |
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INOUE T ET AL: "THE EFFECT OF MAGNETIC FILM STRUCTURE ON THE INDUCTANCE OF A PLANAR INDUCTOR", IEEE TRANSACTIONS ON MAGNETICS, IEEE INC. NEW YORK, US, vol. 34, no. 4, PART 1, July 1998 (1998-07-01), pages 1372 - 1374, XP000833113, ISSN: 0018-9464 * |
NOSE M ET AL: "DOMAIN STRUCTURES AND HIGH-FREQUENCY RESPONSE OF MAGNETIZATION FOR CONBZR STRIPE FILMS", IEEE TRANSLATION JOURNAL ON MAGNETICS IN JAPAN, IEEE INC, NEW YORK, US, vol. 9, no. 1, 1994, pages 59 - 66, XP000484258, ISSN: 0882-4959 * |
PATENT ABSTRACTS OF JAPAN vol. 006, no. 200 (E - 135) 9 October 1982 (1982-10-09) * |
Also Published As
Publication number | Publication date |
---|---|
US6873242B2 (en) | 2005-03-29 |
TW552597B (en) | 2003-09-11 |
CN1585991A (zh) | 2005-02-23 |
EP1425765B1 (de) | 2007-02-28 |
US20040191569A1 (en) | 2004-09-30 |
DE10144380A1 (de) | 2003-03-27 |
CN1280844C (zh) | 2006-10-18 |
EP1425765A1 (de) | 2004-06-09 |
DE50209602D1 (de) | 2007-04-12 |
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