WO2003025595A3 - Electronic device - Google Patents

Electronic device Download PDF

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Publication number
WO2003025595A3
WO2003025595A3 PCT/IB2002/003617 IB0203617W WO03025595A3 WO 2003025595 A3 WO2003025595 A3 WO 2003025595A3 IB 0203617 W IB0203617 W IB 0203617W WO 03025595 A3 WO03025595 A3 WO 03025595A3
Authority
WO
WIPO (PCT)
Prior art keywords
test
chain
test interface
electronic device
contact
Prior art date
Application number
PCT/IB2002/003617
Other languages
French (fr)
Other versions
WO2003025595A2 (en
Inventor
Hubertus G H Vermeulen
Thomas F Waayers
Guillaume E A Lousberg
Original Assignee
Koninkl Philips Electronics Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Electronics Nv filed Critical Koninkl Philips Electronics Nv
Priority to KR1020047004092A priority Critical patent/KR100896538B1/en
Priority to DE60218498T priority patent/DE60218498T2/en
Priority to EP02762683A priority patent/EP1430319B1/en
Priority to JP2003529172A priority patent/JP4249019B2/en
Publication of WO2003025595A2 publication Critical patent/WO2003025595A2/en
Publication of WO2003025595A3 publication Critical patent/WO2003025595A3/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/3185—Reconfiguring for testing, e.g. LSSD, partitioning
    • G01R31/318533—Reconfiguring for testing, e.g. LSSD, partitioning using scanning techniques, e.g. LSSD, Boundary Scan, JTAG
    • G01R31/318558—Addressing or selecting of subparts of the device under test
    • G01R31/318563—Multiple simultaneous testing of subparts
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/3185—Reconfiguring for testing, e.g. LSSD, partitioning
    • G01R31/318533—Reconfiguring for testing, e.g. LSSD, partitioning using scanning techniques, e.g. LSSD, Boundary Scan, JTAG
    • G01R31/318558—Addressing or selecting of subparts of the device under test
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/3185—Reconfiguring for testing, e.g. LSSD, partitioning
    • G01R31/318533—Reconfiguring for testing, e.g. LSSD, partitioning using scanning techniques, e.g. LSSD, Boundary Scan, JTAG
    • G01R31/318558—Addressing or selecting of subparts of the device under test
    • G01R31/318561—Identification of the subpart
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/3185—Reconfiguring for testing, e.g. LSSD, partitioning
    • G01R31/318533—Reconfiguring for testing, e.g. LSSD, partitioning using scanning techniques, e.g. LSSD, Boundary Scan, JTAG
    • G01R31/318572—Input/Output interfaces

Abstract

An electronic device (100) has a plurality of subdevices (120a, 120b) with each subdevice (120a; 120b) coupled to a test interface (140a; 140b). The test interfaces (140a, 140b) are arranged in a chain of test interfaces (140) by coupling the TDO contact (142b) of a predecessor test interface (140a) to the TDI contact (141b) of a successor test interface (140b) in the chain (140). In addition, at its beginning, the chain (140) is extended with a boundary scan compliant test interface (160) for testing other parts of electronic device (100). Both the TDO contact (142b) of the last test interface (140b) in the chain (140) as well as the TDO contact (162) of test interface (160) are coupled to a bypass multiplexer (102), thus yielding two possible routes from test data input (110) to test data output (112): through the full chain (140, 160) or through test interface (160) only. Consequently, electronic device (100) can be tested or debugged as a macro device or as a collection of subdevices (120a, 120b).
PCT/IB2002/003617 2001-09-20 2002-09-04 Electronic device WO2003025595A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020047004092A KR100896538B1 (en) 2001-09-20 2002-09-04 Electronic device
DE60218498T DE60218498T2 (en) 2001-09-20 2002-09-04 ELECTRONIC DEVICE
EP02762683A EP1430319B1 (en) 2001-09-20 2002-09-04 Electronic device
JP2003529172A JP4249019B2 (en) 2001-09-20 2002-09-04 Electronic devices

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP01203565.5 2001-09-20
EP01203565 2001-09-20

Publications (2)

Publication Number Publication Date
WO2003025595A2 WO2003025595A2 (en) 2003-03-27
WO2003025595A3 true WO2003025595A3 (en) 2003-08-28

Family

ID=8180950

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2002/003617 WO2003025595A2 (en) 2001-09-20 2002-09-04 Electronic device

Country Status (9)

Country Link
US (1) US6988230B2 (en)
EP (1) EP1430319B1 (en)
JP (1) JP4249019B2 (en)
KR (1) KR100896538B1 (en)
CN (1) CN100342241C (en)
AT (1) ATE355534T1 (en)
DE (1) DE60218498T2 (en)
TW (1) TWI232951B (en)
WO (1) WO2003025595A2 (en)

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KR20050084803A (en) * 2002-08-14 2005-08-29 코닌클리즈케 필립스 일렉트로닉스 엔.브이. Module, electronic device and evaluation tool
US7010722B2 (en) * 2002-09-27 2006-03-07 Texas Instruments Incorporated Embedded symmetric multiprocessor system debug
JP2007500356A (en) * 2003-05-28 2007-01-11 コーニンクレッカ　フィリップス　エレクトロニクス　エヌ　ヴィ Signal integrity self-test architecture
US7246282B2 (en) * 2003-06-25 2007-07-17 Hewlett-Packard Development Company, L.P. Bypassing a device in a scan chain
ATE394683T1 (en) * 2004-01-13 2008-05-15 Nxp Bv JTAG TEST ARCHITECTURE FOR A MULTI-CHIP PACK
DE602005010215D1 (en) * 2004-02-19 2008-11-20 Nxp Bv ELECTRONIC STREAM PROCESSING CIRCUIT WITH TEST ACCESS
WO2005086940A2 (en) * 2004-03-11 2005-09-22 Interdigital Technology Corporation Control of device operation within an area
US20060137018A1 (en) * 2004-11-29 2006-06-22 Interdigital Technology Corporation Method and apparatus to provide secured surveillance data to authorized entities
US20060159440A1 (en) * 2004-11-29 2006-07-20 Interdigital Technology Corporation Method and apparatus for disrupting an autofocusing mechanism
TWI285742B (en) * 2004-12-06 2007-08-21 Interdigital Tech Corp Method and apparatus for detecting portable electronic device functionality
US7574220B2 (en) * 2004-12-06 2009-08-11 Interdigital Technology Corporation Method and apparatus for alerting a target that it is subject to sensing and restricting access to sensed content associated with the target
US20060227640A1 (en) * 2004-12-06 2006-10-12 Interdigital Technology Corporation Sensing device with activation and sensing alert functions
US20090307545A1 (en) * 2004-12-20 2009-12-10 Koninklijke Philips Electronics N.V. Testable multiprocessor system and a method for testing a processor system
JP4388903B2 (en) 2005-02-09 2009-12-24 富士通マイクロエレクトロニクス株式会社 JTAG test method
TW200708750A (en) 2005-07-22 2007-03-01 Koninkl Philips Electronics Nv Testable integrated circuit, system in package and test instruction set
JP2009512873A (en) * 2005-10-24 2009-03-26 エヌエックスピー ビー ヴィ IC testing method and apparatus
WO2007069097A1 (en) * 2005-11-02 2007-06-21 Nxp B.V. Ic testing methods and apparatus
EP1791133A1 (en) * 2005-11-29 2007-05-30 STMicroelectronics Pvt. Ltd. A method of sharing testing components for multiple embedded memories and the memory system incorporating the same
US7579689B2 (en) * 2006-01-31 2009-08-25 Mediatek Inc. Integrated circuit package, and a method for producing an integrated circuit package having two dies with input and output terminals of integrated circuits of the dies directly addressable for testing of the package
JP4791533B2 (en) * 2006-03-16 2011-10-12 パナソニック株式会社 Terminal device
US7546498B1 (en) * 2006-06-02 2009-06-09 Lattice Semiconductor Corporation Programmable logic devices with custom identification systems and methods
US7620864B2 (en) * 2006-10-26 2009-11-17 International Business Machines Corporation Method and apparatus for controlling access to and/or exit from a portion of scan chain
KR100829402B1 (en) * 2006-11-01 2008-05-15 주식회사 유니테스트 Sequential semiconductor test apparatus
US7657854B2 (en) * 2006-11-24 2010-02-02 Freescale Semiconductor, Inc. Method and system for designing test circuit in a system on chip
US8108744B2 (en) * 2006-11-28 2012-01-31 Stmicroelectronics Pvt. Ltd. Locally synchronous shared BIST architecture for testing embedded memories with asynchronous interfaces
JP2008310792A (en) * 2007-05-11 2008-12-25 Nec Electronics Corp Test circuit
US7937631B2 (en) * 2007-08-28 2011-05-03 Qimonda Ag Method for self-test and self-repair in a multi-chip package environment
US7904770B2 (en) * 2008-09-09 2011-03-08 Qualcomm Incorporated Testing circuit split between tiers of through silicon stacking chips
EP2372379B1 (en) * 2010-03-26 2013-01-23 Imec Test access architecture for TSV-based 3D stacked ICS
KR101035399B1 (en) * 2010-10-19 2011-05-20 (주)청석엔지니어링 Buthyl synthetic rubber sheets waterproof material of self-adhesion type containing used tire polymer and construction method for waterproofing by using the same
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Also Published As

Publication number Publication date
KR20040035848A (en) 2004-04-29
DE60218498D1 (en) 2007-04-12
ATE355534T1 (en) 2006-03-15
CN1555491A (en) 2004-12-15
TWI232951B (en) 2005-05-21
EP1430319A2 (en) 2004-06-23
US6988230B2 (en) 2006-01-17
KR100896538B1 (en) 2009-05-07
JP2005503563A (en) 2005-02-03
JP4249019B2 (en) 2009-04-02
WO2003025595A2 (en) 2003-03-27
US20030079166A1 (en) 2003-04-24
CN100342241C (en) 2007-10-10
EP1430319B1 (en) 2007-02-28
DE60218498T2 (en) 2007-11-08

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