WO2003041904A1 - Appareil d'usinage a faisceau laser - Google Patents
Appareil d'usinage a faisceau laser Download PDFInfo
- Publication number
- WO2003041904A1 WO2003041904A1 PCT/JP2002/011838 JP0211838W WO03041904A1 WO 2003041904 A1 WO2003041904 A1 WO 2003041904A1 JP 0211838 W JP0211838 W JP 0211838W WO 03041904 A1 WO03041904 A1 WO 03041904A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- laser
- laser beam
- polarizing means
- optical path
- light
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
- B23K26/0608—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams in the same heat affected zone [HAZ]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
Definitions
- the present invention relates to a laser processing machine whose main purpose is drilling a workpiece such as a printed circuit board and to improve productivity.
- FIG. 8 is a schematic configuration diagram showing a conventional general laser processing apparatus for drilling.
- the laser beam 2 oscillated from the laser oscillator 3 is guided to the galvano scanners 5 and 6 through the necessary mask 4 and the mirror 4, and the galvano scanners 5 and 6 By controlling the deflection angle, the laser beam 2 is collected at a predetermined position of the workpiece 1 via the f ⁇ lens 7.
- the deflection angle of the galvano scanners 5 and 6 via the f ⁇ lens 7 is limited to 50 mm, for example, on all sides, so that the laser beam 2 is focused on the work piece 1 at a predetermined position. ..
- XY stage 8 By controlling XY stage 8 as well ⁇ . This makes it possible to machine 1 workpiece.
- the mass of the galvano mirror fixed to the rotating shaft of the galvano scanner and driven by controlling the deflection angle should be reduced. It is effective to reduce the deflection angle of the galvano scanner while maintaining the processing range by changing the design of the optical system, such as by changing the distance of the galvanometer.
- the mirror diameter of the galvano scanner is reduced, the peripheral part is blocked by the mask when it passes through the mask, and the diameter of the laser beam 2 that once decreases is increased by diffraction after passing through the mask.
- the galvano mirror 6 arrives the galvano mirror is larger than the galvano mirror. Can no longer be transferred to the workpiece 1 in probability, can not line Ukoto micro drilling.
- Japanese Patent Application Laid-Open No. 1 1-3 1 4 1 88 is disclosed as a laser processing apparatus for improving the productivity of the above-described method.
- FIG. 9 is a schematic configuration diagram of a laser processing apparatus disclosed in Japanese Patent Application Laid-Open No. 1 1-3 1 4 1 88.
- the laser beam machine shown in Fig. 9 splits the laser beam that has passed through the mask 10 into a plurality of light beams through the half mirror 1 1, and the divided laser beams 1 3 a and 1 3 b are f 0 lenses 1 It is possible to irradiate the divided processing areas A 1 and A 2 by leading to a plurality of galvano scanner systems arranged on the incident side of 6 and scanning with the plurality of galvano scanner systems.
- the quality of the hole is likely to vary between the laser beams 1 3 a and 1 3 b separated by the half mirror 1 1 due to the difference between reflection and transmission of the half mirror 1 1 1.
- an expensive optical component such as an optical attener is further added in the optical path of the laser beam 1 3 b, and the energy of the laser beam 1 3 b
- the optical parts such as Optical Attenae with specifications that remove a certain percentage of energy, for example, specifications that remove 5% energy and 3% energy.
- Figure 5 shows a program that automatically adjusts the angle of polarization beam splitting. First of all Flotiya.
- Fig. 7 shows the flow chart of a program that automatically corrects the deflection angle of a galvano scanner.
- the laser beam guided to the first polarization beam split 25 may not be circularly polarized light but may be linearly polarized light having an angle of 45 ° with respect to the polarization directions of the P wave and S wave.
- the laser beam is converted into linearly polarized light that forms an angle of 45 ° with respect to the polarization direction of the P wave and S wave that are split by the first polarized beam split as described above.
- the adjustment mechanism and adjustment of the polarization direction of the laser beam incident on the retarder and the retarder and the optical axis angle are not necessary, and the optical path is simplified. This makes it possible to contribute to the cost.
- the laser beam 26 b transmitted through the first polarization beam splitter 25 is guided to the second polarization beam splitter 27 via the bend mirror 24, while the first beam splitter 27.
- the laser light 26 a reflected by the laser beam 25 is scanned in the biaxial direction by the first galvano scanner 29, and then guided to the second polarization beam 27.
- the incident angle of the laser beam is 2 ° for the two polarized beam splits and the error is 1 ° relative to the pre-used evening angle
- the reflectance of the laser beam is 99% per one polarized beam split
- the transmittance is The energy of the two laser beams obtained through the reflection or transmission process twice is 98% and 94%, resulting in an energy difference of 4%.
- Both reflection and transmission i3 ⁇ 4 In both cases, the energy of the laser light obtained through each process is 96%, and by constructing the optical path as described above, this characteristic is achieved. It is possible to kill.
- the rotation axis in Fig. 2 is the intersection of window 3 2 and mirror 3 3
- the incident angle of the laser beam to the window 3 2 increases, whereas the incident angle to the mirror 3 3 decreases, and the laser beam incident to the window 3 2 decreases.
- the incident angle to the mirror 33 is increased against the decrease in the incident angle, and by canceling out the angle error, the exit angle with respect to the incident light to the polarization beam splitter is 90 ° with no error. There is no change in the emission position, and this effect can be obtained with either the polarization beam split window 32 or the mirror 33 on the incident side.
- step S 6 The energy difference between the two laser beams 2 6 a and 2 6 b measured in the control device is calculated (step S 6), and if it is within the allowable value, the adjustment is completed, but if it is outside the allowable value, Rotate one polarization beam splitter 2 5 and second polarization beam splitter 2 7, adjust the transmittance of each polarization beam splitter (step S 9), and measure the energy of the two laser beams again Repeat the adjustment until it is within the allowable range.
- the first galvano scanner 29 controls the laser beam 26 a to scan in a 4 mm square area centered on the laser beam 26 b
- the second galvano scanner 30 has the laser beam 2
- 6a By controlling 6a to scan in the range of 46 mm square, the laser light 26a through the first and second galvano scanners 29, 30 is in the range of 50 mm square Can be processed.
- the XY stage 31 is driven to measure the position accuracy of the machining hole with the CCD camera 36 (step S20).
- FIG. 6 is a schematic configuration diagram showing an embodiment of a laser processing apparatus when a third polarizing means is added and addition is performed with four laser beams.
- a circularly or linearly polarized laser beam is guided from a laser oscillator (not shown), and the laser beam is split by a third polarized beam splitter 38.
- the polarization direction of the laser beam 26 transmitted through the beam splitter 38 and the polarization direction of the reflected laser beam 39 are respectively reflected by the first polarization beam splitters 25 and 25 A and polarized by the transmission 25 A. Vs. direction
- the laser beam 2 6 is converted into laser beam 2 6 a and 2 6 b
- the laser beam 3 9 is converted into laser beam 3 9 a and 3 9 b. It is lighted.
- the optical path after the first deflecting beam splitter 25, 25 A is processed by irradiating the workpiece with four laser beams with the same configuration as the embodiment of the present invention shown in FIG. Making it possible.
- the laser light 2 6 (2 6 a and 2 6 6 when only the first and second shutters 3 4 a and 3 4 b are opened) b) and the energy of the laser light 3 9 (the sum of 3 9 a and 3 9 b) when only the third and fourth shutters 3 4 c and 3 4 d are opened
- the energy of the laser beam 2 6 transmitted through the polarization beam splitter 3 8 and the energy of the reflected laser beam 3 9 are Make adjustments so that they are equal (step S 3 1).
- the energy of the laser beam 3 9 a when only the third shirt evening 3 4 c is opened and the energy of the laser beam 3 9 b when only the fourth shirt evening 3 4 d is opened The first polarization beam splitter 25 A and the second polarization beam splitter 27 A are rotated, and the laser beam 39 Adjustment is made so that the energy is equally divided into the laser beams 39a and 39b (step S33).
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003543776A JP4148138B2 (ja) | 2001-11-15 | 2002-11-13 | レーザ加工装置 |
KR1020047007443A KR100578949B1 (ko) | 2001-11-15 | 2002-11-13 | 레이저 가공장치 |
DE10297451T DE10297451B4 (de) | 2001-11-15 | 2002-11-13 | Laser-Materialverarbeitungsvorrichtung |
US10/495,781 US6984802B2 (en) | 2001-11-15 | 2002-11-13 | Laser beam machining device |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001-349664 | 2001-11-15 | ||
JP2001349664 | 2001-11-15 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2003041904A1 true WO2003041904A1 (fr) | 2003-05-22 |
Family
ID=19162300
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2002/011838 WO2003041904A1 (fr) | 2001-11-15 | 2002-11-13 | Appareil d'usinage a faisceau laser |
Country Status (7)
Country | Link |
---|---|
US (1) | US6984802B2 (ja) |
JP (1) | JP4148138B2 (ja) |
KR (1) | KR100578949B1 (ja) |
CN (1) | CN1290660C (ja) |
DE (1) | DE10297451B4 (ja) |
TW (1) | TW555612B (ja) |
WO (1) | WO2003041904A1 (ja) |
Cited By (7)
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WO2004101211A1 (ja) * | 2003-05-19 | 2004-11-25 | Mitsubishi Denki Kabushiki Kaisha | レーザ加工装置 |
WO2005118207A1 (ja) * | 2004-06-01 | 2005-12-15 | Mitsubishi Denki Kabushiki Kaisha | レーザ加工装置 |
KR100819616B1 (ko) * | 2006-03-13 | 2008-04-04 | 미쓰비시덴키 가부시키가이샤 | 레이저 가공 장치 |
JP2008296254A (ja) * | 2007-05-31 | 2008-12-11 | Disco Abrasive Syst Ltd | レーザー加工装置 |
JP2010172961A (ja) * | 2009-02-02 | 2010-08-12 | Mitsubishi Electric Corp | 分光ユニット及びそれを用いたレーザ加工装置 |
JP4915348B2 (ja) * | 2005-12-28 | 2012-04-11 | 株式会社ニコン | 光走査装置、光走査型顕微鏡、観察方法、制御装置、及び制御プログラム |
CN102554467A (zh) * | 2010-12-07 | 2012-07-11 | 住友重机械工业株式会社 | 激光加工装置及激光加工方法 |
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US8497450B2 (en) | 2001-02-16 | 2013-07-30 | Electro Scientific Industries, Inc. | On-the fly laser beam path dithering for enhancing throughput |
US7245412B2 (en) | 2001-02-16 | 2007-07-17 | Electro Scientific Industries, Inc. | On-the-fly laser beam path error correction for specimen target location processing |
KR100508329B1 (ko) * | 2002-03-28 | 2005-08-17 | 미쓰비시덴키 가부시키가이샤 | 레이저 가공장치 |
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US20060114948A1 (en) * | 2004-11-29 | 2006-06-01 | Lo Ho W | Workpiece processing system using a common imaged optical assembly to shape the spatial distributions of light energy of multiple laser beams |
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JP4297952B2 (ja) * | 2007-05-28 | 2009-07-15 | 三菱電機株式会社 | レーザ加工装置 |
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JP6590382B2 (ja) * | 2016-01-18 | 2019-10-16 | 三菱電機株式会社 | レーザ光のためのパワーバランス装置、レーザ加工装置 |
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JP6975190B2 (ja) * | 2019-02-26 | 2021-12-01 | ファナック株式会社 | 機械学習装置、レーザ加工装置及びレーザ加工システム |
CN110102879A (zh) * | 2019-06-03 | 2019-08-09 | 常州英诺激光科技有限公司 | 激光加工系统、工作方法及多路光束快速切换方法 |
JP2022128033A (ja) * | 2021-02-22 | 2022-09-01 | 住友重機械工業株式会社 | レーザ加工装置及びレーザ加工方法 |
Citations (4)
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JPH0929467A (ja) * | 1995-07-21 | 1997-02-04 | Matsushita Electric Ind Co Ltd | レーザ加工装置 |
JP2000190087A (ja) * | 1998-12-25 | 2000-07-11 | Sumitomo Heavy Ind Ltd | 2軸レ―ザ加工機 |
WO2000053365A1 (fr) * | 1999-03-05 | 2000-09-14 | Mitsubishi Denki Kabushiki Kaisha | Appareil d'usinage au laser |
JP2001269790A (ja) * | 2000-03-27 | 2001-10-02 | Sumitomo Heavy Ind Ltd | レーザ加工方法及び加工装置 |
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JP3945951B2 (ja) * | 1999-01-14 | 2007-07-18 | 日立ビアメカニクス株式会社 | レーザ加工方法およびレーザ加工機 |
JP3237832B2 (ja) * | 1999-03-12 | 2001-12-10 | 住友重機械工業株式会社 | レーザ加工装置及びレーザ穴あけ加工方法 |
US6424670B1 (en) * | 2000-02-17 | 2002-07-23 | Universal Laser Systems, Inc. | Apparatus and method for making laser sources and laser platforms interchangeable and interfaceable |
CN1159129C (zh) * | 2000-08-29 | 2004-07-28 | 三菱电机株式会社 | 激光加工装置 |
KR100508329B1 (ko) * | 2002-03-28 | 2005-08-17 | 미쓰비시덴키 가부시키가이샤 | 레이저 가공장치 |
-
2002
- 2002-11-13 US US10/495,781 patent/US6984802B2/en not_active Expired - Lifetime
- 2002-11-13 KR KR1020047007443A patent/KR100578949B1/ko active IP Right Grant
- 2002-11-13 TW TW091133229A patent/TW555612B/zh not_active IP Right Cessation
- 2002-11-13 WO PCT/JP2002/011838 patent/WO2003041904A1/ja active Application Filing
- 2002-11-13 DE DE10297451T patent/DE10297451B4/de not_active Expired - Fee Related
- 2002-11-13 JP JP2003543776A patent/JP4148138B2/ja not_active Expired - Lifetime
- 2002-11-13 CN CNB028226003A patent/CN1290660C/zh not_active Expired - Lifetime
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH0929467A (ja) * | 1995-07-21 | 1997-02-04 | Matsushita Electric Ind Co Ltd | レーザ加工装置 |
JP2000190087A (ja) * | 1998-12-25 | 2000-07-11 | Sumitomo Heavy Ind Ltd | 2軸レ―ザ加工機 |
WO2000053365A1 (fr) * | 1999-03-05 | 2000-09-14 | Mitsubishi Denki Kabushiki Kaisha | Appareil d'usinage au laser |
JP2001269790A (ja) * | 2000-03-27 | 2001-10-02 | Sumitomo Heavy Ind Ltd | レーザ加工方法及び加工装置 |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2004101211A1 (ja) * | 2003-05-19 | 2004-11-25 | Mitsubishi Denki Kabushiki Kaisha | レーザ加工装置 |
WO2005118207A1 (ja) * | 2004-06-01 | 2005-12-15 | Mitsubishi Denki Kabushiki Kaisha | レーザ加工装置 |
JPWO2005118207A1 (ja) * | 2004-06-01 | 2008-04-03 | 三菱電機株式会社 | レーザ加工装置 |
JP4539652B2 (ja) * | 2004-06-01 | 2010-09-08 | 三菱電機株式会社 | レーザ加工装置 |
JP4915348B2 (ja) * | 2005-12-28 | 2012-04-11 | 株式会社ニコン | 光走査装置、光走査型顕微鏡、観察方法、制御装置、及び制御プログラム |
KR100819616B1 (ko) * | 2006-03-13 | 2008-04-04 | 미쓰비시덴키 가부시키가이샤 | 레이저 가공 장치 |
JP2008296254A (ja) * | 2007-05-31 | 2008-12-11 | Disco Abrasive Syst Ltd | レーザー加工装置 |
JP2010172961A (ja) * | 2009-02-02 | 2010-08-12 | Mitsubishi Electric Corp | 分光ユニット及びそれを用いたレーザ加工装置 |
CN102554467A (zh) * | 2010-12-07 | 2012-07-11 | 住友重机械工业株式会社 | 激光加工装置及激光加工方法 |
CN102554467B (zh) * | 2010-12-07 | 2014-11-05 | 住友重机械工业株式会社 | 激光加工装置及激光加工方法 |
TWI481462B (zh) * | 2010-12-07 | 2015-04-21 | Sumitomo Heavy Industries | Laser processing device and laser processing method |
Also Published As
Publication number | Publication date |
---|---|
KR20040065561A (ko) | 2004-07-22 |
DE10297451B4 (de) | 2009-12-24 |
KR100578949B1 (ko) | 2006-05-12 |
DE10297451T5 (de) | 2004-12-23 |
JPWO2003041904A1 (ja) | 2005-03-03 |
CN1585684A (zh) | 2005-02-23 |
TW555612B (en) | 2003-10-01 |
US6984802B2 (en) | 2006-01-10 |
CN1290660C (zh) | 2006-12-20 |
US20040262275A1 (en) | 2004-12-30 |
JP4148138B2 (ja) | 2008-09-10 |
TW200300372A (en) | 2003-06-01 |
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