WO2003049168A1 - Dispositif de support de substrat et dispositif de polissage - Google Patents

Dispositif de support de substrat et dispositif de polissage Download PDF

Info

Publication number
WO2003049168A1
WO2003049168A1 PCT/JP2002/012816 JP0212816W WO03049168A1 WO 2003049168 A1 WO2003049168 A1 WO 2003049168A1 JP 0212816 W JP0212816 W JP 0212816W WO 03049168 A1 WO03049168 A1 WO 03049168A1
Authority
WO
WIPO (PCT)
Prior art keywords
contact
polishing
substrate
parts
moving member
Prior art date
Application number
PCT/JP2002/012816
Other languages
English (en)
French (fr)
Inventor
Tetsuji Togawa
Osamu Nabeya
Makoto Fukushima
Kunihiko Sakurai
Hiroshi Yoshida
Teruhiko Ichimura
Original Assignee
Ebara Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2001372771A external-priority patent/JP4107835B2/ja
Priority claimed from JP2001379337A external-priority patent/JP4049579B2/ja
Application filed by Ebara Corporation filed Critical Ebara Corporation
Priority to AU2002354440A priority Critical patent/AU2002354440A1/en
Priority to US10/497,151 priority patent/US7033260B2/en
Priority to EP02788744A priority patent/EP1453081A4/en
Publication of WO2003049168A1 publication Critical patent/WO2003049168A1/ja
Priority to US11/312,571 priority patent/US7311585B2/en
Priority to US11/987,978 priority patent/US7632173B2/en
Priority to US12/613,016 priority patent/US20100056028A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/061—Work supports, e.g. adjustable steadies axially supporting turning workpieces, e.g. magnetically, pneumatically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • B24B49/105—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means using eddy currents
PCT/JP2002/012816 2001-12-06 2002-12-06 Dispositif de support de substrat et dispositif de polissage WO2003049168A1 (fr)

Priority Applications (6)

Application Number Priority Date Filing Date Title
AU2002354440A AU2002354440A1 (en) 2001-12-06 2002-12-06 Substrate holding device and polishing device
US10/497,151 US7033260B2 (en) 2001-12-06 2002-12-06 Substrate holding device and polishing device
EP02788744A EP1453081A4 (en) 2001-12-06 2002-12-06 SUBSTRATE MOUNTING AND POLISHING DEVICE
US11/312,571 US7311585B2 (en) 2001-12-06 2005-12-21 Substrate holding apparatus and polishing apparatus
US11/987,978 US7632173B2 (en) 2001-12-06 2007-12-06 Substrate holding apparatus and polishing apparatus
US12/613,016 US20100056028A1 (en) 2001-12-06 2009-11-05 Substrate holding apparatus and polishing apparatus

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2001-372771 2001-12-06
JP2001372771A JP4107835B2 (ja) 2001-12-06 2001-12-06 基板保持装置及びポリッシング装置
JP2001-379337 2001-12-12
JP2001379337A JP4049579B2 (ja) 2001-12-12 2001-12-12 基板保持装置及びポリッシング装置

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US10497151 A-371-Of-International 2002-12-06
US11/312,571 Division US7311585B2 (en) 2001-12-06 2005-12-21 Substrate holding apparatus and polishing apparatus

Publications (1)

Publication Number Publication Date
WO2003049168A1 true WO2003049168A1 (fr) 2003-06-12

Family

ID=26624907

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2002/012816 WO2003049168A1 (fr) 2001-12-06 2002-12-06 Dispositif de support de substrat et dispositif de polissage

Country Status (6)

Country Link
US (4) US7033260B2 (ja)
EP (1) EP1453081A4 (ja)
KR (2) KR100939556B1 (ja)
AU (1) AU2002354440A1 (ja)
TW (1) TWI266674B (ja)
WO (1) WO2003049168A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005347752A (ja) * 2004-06-04 2005-12-15 Samsung Electronics Co Ltd 化学機械的研磨装置、キャリアヘッド及び区画リング
CN106272065A (zh) * 2016-09-27 2017-01-04 东莞市联洲知识产权运营管理有限公司 一种皮鞋移动式抛光固定装置

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1453081A4 (en) * 2001-12-06 2008-07-09 Ebara Corp SUBSTRATE MOUNTING AND POLISHING DEVICE
WO2004070806A1 (en) * 2003-02-10 2004-08-19 Ebara Corporation Substrate holding apparatus and polishing apparatus
JP4583207B2 (ja) * 2004-03-31 2010-11-17 不二越機械工業株式会社 研磨装置
KR100621629B1 (ko) * 2004-06-04 2006-09-19 삼성전자주식회사 화학적 기계적 연마 장치에 사용되는 연마 헤드 및 연마방법
US20080113877A1 (en) * 2006-08-16 2008-05-15 Intematix Corporation Liquid solution deposition of composition gradient materials
JP5390807B2 (ja) * 2008-08-21 2014-01-15 株式会社荏原製作所 研磨方法および装置
JP5392483B2 (ja) * 2009-08-31 2014-01-22 不二越機械工業株式会社 研磨装置
JP5303491B2 (ja) * 2010-02-19 2013-10-02 信越半導体株式会社 研磨ヘッド及び研磨装置
JP5648954B2 (ja) * 2010-08-31 2015-01-07 不二越機械工業株式会社 研磨装置
US8419502B2 (en) 2010-12-10 2013-04-16 Victoria's Secret Stores Brand Management Breast pad construction with improved nipple concealment
US20120264359A1 (en) * 2011-04-13 2012-10-18 Nanya Technology Corporation Membrane
KR101212501B1 (ko) 2011-12-08 2012-12-14 주식회사 케이씨텍 캐리어 헤드의 멤브레인
US9706605B2 (en) * 2012-03-30 2017-07-11 Applied Materials, Inc. Substrate support with feedthrough structure
JP5875950B2 (ja) * 2012-06-29 2016-03-02 株式会社荏原製作所 基板保持装置および研磨装置
JP6158637B2 (ja) * 2012-08-28 2017-07-05 株式会社荏原製作所 弾性膜及び基板保持装置
US9199354B2 (en) * 2012-10-29 2015-12-01 Wayne O. Duescher Flexible diaphragm post-type floating and rigid abrading workholder
US20140357161A1 (en) * 2013-05-31 2014-12-04 Sunedison Semiconductor Limited Center flex single side polishing head
US10043686B2 (en) * 2013-12-31 2018-08-07 Lam Research Ag Apparatus for treating surfaces of wafer-shaped articles
KR102173323B1 (ko) 2014-06-23 2020-11-04 삼성전자주식회사 캐리어 헤드, 화학적 기계식 연마 장치 및 웨이퍼 연마 방법
KR102317008B1 (ko) * 2015-03-02 2021-10-26 주식회사 케이씨텍 화학 기계적 연마 장치용 캐리어 헤드의 멤브레인
SG10201606197XA (en) 2015-08-18 2017-03-30 Ebara Corp Substrate adsorption method, substrate holding apparatus, substrate polishing apparatus, elastic film, substrate adsorption determination method for substrate holding apparatus, and pressure control method for substrate holding apparatus
JP6562779B2 (ja) * 2015-09-02 2019-08-21 株式会社荏原製作所 研磨装置及び研磨方法
US10930535B2 (en) * 2016-12-02 2021-02-23 Applied Materials, Inc. RFID part authentication and tracking of processing components
USD839224S1 (en) * 2016-12-12 2019-01-29 Ebara Corporation Elastic membrane for semiconductor wafer polishing
JP7023062B2 (ja) 2017-07-24 2022-02-21 株式会社荏原製作所 基板研磨装置及び方法
JP7003838B2 (ja) 2018-05-17 2022-01-21 株式会社Sumco 研磨ヘッド及びこれを用いたウェーハ研磨装置及び研磨方法
KR102071240B1 (ko) * 2018-06-08 2020-03-23 주식회사 케이씨텍 연마 장치용 캐리어 헤드 및 이에 사용되는 멤브레인
JP7287761B2 (ja) * 2018-07-31 2023-06-06 株式会社荏原製作所 球面軸受の軸受半径決定方法
JP7058209B2 (ja) * 2018-11-21 2022-04-21 株式会社荏原製作所 基板ホルダに基板を保持させる方法
CN115135449A (zh) * 2020-06-26 2022-09-30 应用材料公司 可变形的基板卡盘
CN114505782B (zh) * 2020-11-17 2023-08-04 长鑫存储技术有限公司 固定装置及检测系统
CN113427393B (zh) * 2021-07-23 2022-06-03 长江存储科技有限责任公司 吸盘装置及化学机械研磨设备

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08229804A (ja) * 1995-02-28 1996-09-10 Mitsubishi Materials Corp ウェーハ研磨装置および研磨方法
JP2000301453A (ja) * 1999-02-15 2000-10-31 Ebara Corp ポリッシング装置
EP1066925A2 (en) * 1999-07-09 2001-01-10 Applied Materials, Inc. Closed loop control of wafer polishing in a chemical mechanical polishing system
JP2001260004A (ja) * 2000-03-14 2001-09-25 Mitsubishi Materials Corp ウェーハ研磨ヘッド
JP2002187060A (ja) * 2000-10-11 2002-07-02 Ebara Corp 基板保持装置、ポリッシング装置、及び研磨方法
US20020098780A1 (en) * 2000-11-23 2002-07-25 Samsung Electronics Co., Ltd. Apparatus for polishing a semiconductor wafer and method therefor

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6390904B1 (en) * 1998-05-21 2002-05-21 Applied Materials, Inc. Retainers and non-abrasive liners used in chemical mechanical polishing
US6210255B1 (en) * 1998-09-08 2001-04-03 Applied Materials, Inc. Carrier head for chemical mechanical polishing a substrate
US6132298A (en) * 1998-11-25 2000-10-17 Applied Materials, Inc. Carrier head with edge control for chemical mechanical polishing
US6165058A (en) * 1998-12-09 2000-12-26 Applied Materials, Inc. Carrier head for chemical mechanical polishing
US6422927B1 (en) * 1998-12-30 2002-07-23 Applied Materials, Inc. Carrier head with controllable pressure and loading area for chemical mechanical polishing
US6857945B1 (en) * 2000-07-25 2005-02-22 Applied Materials, Inc. Multi-chamber carrier head with a flexible membrane
TW525221B (en) * 2000-12-04 2003-03-21 Ebara Corp Substrate processing method
EP1453081A4 (en) * 2001-12-06 2008-07-09 Ebara Corp SUBSTRATE MOUNTING AND POLISHING DEVICE

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08229804A (ja) * 1995-02-28 1996-09-10 Mitsubishi Materials Corp ウェーハ研磨装置および研磨方法
JP2000301453A (ja) * 1999-02-15 2000-10-31 Ebara Corp ポリッシング装置
EP1066925A2 (en) * 1999-07-09 2001-01-10 Applied Materials, Inc. Closed loop control of wafer polishing in a chemical mechanical polishing system
JP2001260004A (ja) * 2000-03-14 2001-09-25 Mitsubishi Materials Corp ウェーハ研磨ヘッド
JP2002187060A (ja) * 2000-10-11 2002-07-02 Ebara Corp 基板保持装置、ポリッシング装置、及び研磨方法
US20020098780A1 (en) * 2000-11-23 2002-07-25 Samsung Electronics Co., Ltd. Apparatus for polishing a semiconductor wafer and method therefor

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP1453081A4 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005347752A (ja) * 2004-06-04 2005-12-15 Samsung Electronics Co Ltd 化学機械的研磨装置、キャリアヘッド及び区画リング
CN106272065A (zh) * 2016-09-27 2017-01-04 东莞市联洲知识产权运营管理有限公司 一种皮鞋移动式抛光固定装置

Also Published As

Publication number Publication date
KR20090045425A (ko) 2009-05-07
AU2002354440A1 (en) 2003-06-17
EP1453081A1 (en) 2004-09-01
US7311585B2 (en) 2007-12-25
KR20050044692A (ko) 2005-05-12
TW200300721A (en) 2003-06-16
US20100056028A1 (en) 2010-03-04
US7632173B2 (en) 2009-12-15
EP1453081A4 (en) 2008-07-09
TWI266674B (en) 2006-11-21
US7033260B2 (en) 2006-04-25
US20080119121A1 (en) 2008-05-22
KR100914988B1 (ko) 2009-09-02
KR100939556B1 (ko) 2010-01-29
US20060099892A1 (en) 2006-05-11
US20050107015A1 (en) 2005-05-19

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