WO2003050852A3 - Complex microdevices and appparatus and methods for fabricating such devices - Google Patents

Complex microdevices and appparatus and methods for fabricating such devices Download PDF

Info

Publication number
WO2003050852A3
WO2003050852A3 PCT/US2002/039146 US0239146W WO03050852A3 WO 2003050852 A3 WO2003050852 A3 WO 2003050852A3 US 0239146 W US0239146 W US 0239146W WO 03050852 A3 WO03050852 A3 WO 03050852A3
Authority
WO
WIPO (PCT)
Prior art keywords
devices
appparatus
fabricating
methods
microdevices
Prior art date
Application number
PCT/US2002/039146
Other languages
French (fr)
Other versions
WO2003050852A2 (en
Inventor
Christopher A Bang
Adam L Cohen
Michael S Lockard
John D Evans
Original Assignee
Memgen Corp
Christopher A Bang
Adam L Cohen
Michael S Lockard
John D Evans
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/309,521 external-priority patent/US7259640B2/en
Application filed by Memgen Corp, Christopher A Bang, Adam L Cohen, Michael S Lockard, John D Evans filed Critical Memgen Corp
Priority to AU2002351289A priority Critical patent/AU2002351289A1/en
Priority to EP02786937A priority patent/EP1495482A2/en
Publication of WO2003050852A2 publication Critical patent/WO2003050852A2/en
Publication of WO2003050852A3 publication Critical patent/WO2003050852A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
    • H01P11/001—Manufacturing waveguides or transmission lines of the waveguide type
    • H01P11/005—Manufacturing coaxial lines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/0802—Details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/06—Coaxial lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/12—Coupling devices having more than two ports
    • H01P5/16—Conjugate devices, i.e. devices having at least one port decoupled from one other port
    • H01P5/18—Conjugate devices, i.e. devices having at least one port decoupled from one other port consisting of two coupled guides, e.g. directional couplers
    • H01P5/183—Conjugate devices, i.e. devices having at least one port decoupled from one other port consisting of two coupled guides, e.g. directional couplers at least one of the guides being a coaxial line
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/04—Optical MEMS
    • B81B2201/042—Micromirrors, not used as optical switches

Abstract

Various embodiments of the invention are directed to various microdevices including sensors, actuators, valves, scanning mirrors, accelerometers, switches, and the like. In some embodiments the devices are formed via electrochemical fabrication (EFAB TM)
PCT/US2002/039146 2001-12-06 2002-12-06 Complex microdevices and appparatus and methods for fabricating such devices WO2003050852A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
AU2002351289A AU2002351289A1 (en) 2001-12-06 2002-12-06 Complex microdevices and appparatus and methods for fabricating such devices
EP02786937A EP1495482A2 (en) 2001-12-06 2002-12-06 Complex microdevices and appparatus and methods for fabricating such devices

Applications Claiming Priority (34)

Application Number Priority Date Filing Date Title
US34037201P 2001-12-06 2001-12-06
US60/340,372 2001-12-06
US36426102P 2002-03-13 2002-03-13
US60/364,261 2002-03-13
US37917702P 2002-05-07 2002-05-07
US37913302P 2002-05-07 2002-05-07
US37918202P 2002-05-07 2002-05-07
US37913002P 2002-05-07 2002-05-07
US37918402P 2002-05-07 2002-05-07
US37913502P 2002-05-07 2002-05-07
US60/379,184 2002-05-07
US60/379,133 2002-05-07
US60/379,177 2002-05-07
US60/379,182 2002-05-07
US60/379,135 2002-05-07
US60/379,130 2002-05-07
US39253102P 2002-06-27 2002-06-27
US60/392,531 2002-06-27
US41537102P 2002-10-01 2002-10-01
US41537402P 2002-10-01 2002-10-01
US60/415,371 2002-10-01
US60/415,374 2002-10-01
US42200702P 2002-10-29 2002-10-29
US60/422,007 2002-10-29
US42298202P 2002-11-01 2002-11-01
US60/422,982 2002-11-01
US42948402P 2002-11-26 2002-11-26
US42948302P 2002-11-26 2002-11-26
US60/429,483 2002-11-26
US60/429,484 2002-11-26
US60/430,809 2002-12-02
US43080902P 2002-12-03 2002-12-03
US10/309,521 US7259640B2 (en) 2001-12-03 2002-12-03 Miniature RF and microwave components and methods for fabricating such components
US10/309,521 2002-12-03

Publications (2)

Publication Number Publication Date
WO2003050852A2 WO2003050852A2 (en) 2003-06-19
WO2003050852A3 true WO2003050852A3 (en) 2004-11-11

Family

ID=27586045

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2002/039146 WO2003050852A2 (en) 2001-12-06 2002-12-06 Complex microdevices and appparatus and methods for fabricating such devices

Country Status (3)

Country Link
EP (1) EP1495482A2 (en)
AU (1) AU2002351289A1 (en)
WO (1) WO2003050852A2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008011466A1 (en) * 2006-07-19 2008-01-24 University Of Florida Research Foundation, Inc. Method and apparatus for electromagnetic actuation
CN104466317B (en) * 2014-11-18 2017-03-08 中国电子科技集团公司第十研究所 GaAs bimodule band-pass filter and preparation method thereof
US11789253B2 (en) * 2020-09-01 2023-10-17 Beijing Voyager Technology Co., Ltd. Capacitance sensing in a MEMS mirror structure
CN114839398A (en) * 2022-04-27 2022-08-02 东南大学 Capacitive flexible acceleration sensor and preparation method thereof

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0594937A (en) * 1991-10-01 1993-04-16 Sumitomo Electric Ind Ltd Formation method of fine structure body
US5335544A (en) * 1989-06-23 1994-08-09 Fraunhofer Gesellschaft Zur Forderung Der Angewandten Forschung E.V. Apparatus for measuring mechanical forces and force actions
US5591910A (en) * 1994-06-03 1997-01-07 Texas Instruments Incorporated Accelerometer
US6027630A (en) * 1997-04-04 2000-02-22 University Of Southern California Method for electrochemical fabrication
US20010042404A1 (en) * 1997-09-08 2001-11-22 The Regents Of The University Of Michigan Single-side microelectromechanical capacitive accelerometer and method of making same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5335544A (en) * 1989-06-23 1994-08-09 Fraunhofer Gesellschaft Zur Forderung Der Angewandten Forschung E.V. Apparatus for measuring mechanical forces and force actions
JPH0594937A (en) * 1991-10-01 1993-04-16 Sumitomo Electric Ind Ltd Formation method of fine structure body
US5591910A (en) * 1994-06-03 1997-01-07 Texas Instruments Incorporated Accelerometer
US6027630A (en) * 1997-04-04 2000-02-22 University Of Southern California Method for electrochemical fabrication
US20010042404A1 (en) * 1997-09-08 2001-11-22 The Regents Of The University Of Michigan Single-side microelectromechanical capacitive accelerometer and method of making same

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 017, no. 440 (E - 1414) 13 August 1993 (1993-08-13) *
See also references of EP1495482A2 *

Also Published As

Publication number Publication date
EP1495482A2 (en) 2005-01-12
WO2003050852A2 (en) 2003-06-19
AU2002351289A1 (en) 2003-06-23

Similar Documents

Publication Publication Date Title
AU2002308940A1 (en) Silicon oxide membrane
AU2002351820A1 (en) Assay based on doped nanoparticles
GB2373922B (en) CMOS semiconductor device, and method of manufacturing the same
AU2002362662A1 (en) Programmable microelectronic device, structure, and system, and method of forming the same
WO2002097130A3 (en) Microstructures and use thereof for the directed evolution of biomolecules
WO2005040715A3 (en) Z-axis angular rate micro electro-mechanical systems (mems) sensor
AU2002230071A1 (en) Complex carbohydrate arrays and methods for the manufacture and uses thereof
ITTO20000585A0 (en) PROCEDURE FOR THE PRODUCTION OF AXLES FOR INDUSTRIAL VEHICLES.
AU2003206552A1 (en) Deflectable microstructure and method of manufacturing the same through bonding of wafers
ITTO20010327A0 (en) RESCUE VEHICLE.
ES1049932Y (en) MULTIDIRECTIONAL COMMAND ORGAN.
EP1419064A4 (en) Foldable vehicle external mirror having auxiliary mirror
DE50212439D1 (en) SENSOR ARRANGEMENT, IN PARTICULAR MICROMECHANICAL SENSOR ARRANGEMENT
WO2003050852A3 (en) Complex microdevices and appparatus and methods for fabricating such devices
MXPA03006556A (en) Improved hydrophobic properties of polymer housings.
WO2002051742A3 (en) Micromechanical component and corresponding production method
AU2001270703A1 (en) Electronic microcomponent, sensor and actuator incorporating same
DE10196506T1 (en) Thin film structural body and manufacturing method therefor, and acceleration sensor and manufacturing method therefor
DE50207313D1 (en) Micromechanical cap structure and corresponding manufacturing method
AU2001272721A1 (en) The filtration of car exhaustes gases
WO2004063089A3 (en) Recessed microstructure device and fabrication method thereof
WO2005017093A8 (en) Polypeptides of streptococcus pyogenes
AU2002253996A1 (en) Semiconductor structures utilizing binary metal oxide layers
AU2002225190A1 (en) Anticoagulants and their uses
AU2001272264A1 (en) Headliner and method of manufacturing the same

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ OM PH PL PT RO RU SD SE SG SK SL TJ TM TN TR TT TZ UA UG US UZ VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR IE IT LU MC NL PT SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
WWE Wipo information: entry into national phase

Ref document number: 2002786937

Country of ref document: EP

WWP Wipo information: published in national office

Ref document number: 2002786937

Country of ref document: EP

NENP Non-entry into the national phase

Ref country code: JP

WWW Wipo information: withdrawn in national office

Country of ref document: JP