WO2003052842A3 - Encapsulation structure that acts as a multilayer mirror - Google Patents
Encapsulation structure that acts as a multilayer mirror Download PDFInfo
- Publication number
- WO2003052842A3 WO2003052842A3 PCT/US2002/035671 US0235671W WO03052842A3 WO 2003052842 A3 WO2003052842 A3 WO 2003052842A3 US 0235671 W US0235671 W US 0235671W WO 03052842 A3 WO03052842 A3 WO 03052842A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- multilayer mirror
- oled
- layers
- electrode
- refractive index
- Prior art date
Links
- 238000005538 encapsulation Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 abstract 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract 1
- 230000004888 barrier function Effects 0.000 abstract 1
- 230000005540 biological transmission Effects 0.000 abstract 1
- 229910052760 oxygen Inorganic materials 0.000 abstract 1
- 239000001301 oxygen Substances 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/85—Arrangements for extracting light from the devices
- H10K50/856—Arrangements for extracting light from the devices comprising reflective means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
- H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/85—Arrangements for extracting light from the devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/875—Arrangements for extracting light from the devices
- H10K59/876—Arrangements for extracting light from the devices comprising a resonant cavity structure, e.g. Bragg reflector pair
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/875—Arrangements for extracting light from the devices
- H10K59/878—Arrangements for extracting light from the devices comprising reflective means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/05001—Internal layers
- H01L2224/05075—Plural internal layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/85—Arrangements for extracting light from the devices
- H10K50/852—Arrangements for extracting light from the devices comprising a resonant cavity structure, e.g. Bragg reflector pair
Abstract
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU2002365092A AU2002365092A1 (en) | 2001-11-06 | 2002-11-06 | Encapsulation structure that acts as a multilayer mirror |
DE60224698T DE60224698T2 (en) | 2001-11-06 | 2002-11-06 | SOCKET STRUCTURE THAT SERVES AS MULTILAYER MIRROR |
JP2003553639A JP5143996B2 (en) | 2001-11-06 | 2002-11-06 | Organic light emitting device structure having sealing structure that functions as multilayer mirror |
EP02802940A EP1442488B1 (en) | 2001-11-06 | 2002-11-06 | Encapsulation structure that acts as a multilayer mirror |
KR1020047006780A KR100923086B1 (en) | 2001-11-06 | 2002-11-06 | Encapsulation structure that acts as a multilayer mirror |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/992,437 | 2001-11-06 | ||
US09/992,437 US6888305B2 (en) | 2001-11-06 | 2001-11-06 | Encapsulation structure that acts as a multilayer mirror |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2003052842A2 WO2003052842A2 (en) | 2003-06-26 |
WO2003052842A3 true WO2003052842A3 (en) | 2004-01-22 |
Family
ID=25538343
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2002/035671 WO2003052842A2 (en) | 2001-11-06 | 2002-11-06 | Encapsulation structure that acts as a multilayer mirror |
Country Status (9)
Country | Link |
---|---|
US (1) | US6888305B2 (en) |
EP (1) | EP1442488B1 (en) |
JP (2) | JP5143996B2 (en) |
KR (1) | KR100923086B1 (en) |
CN (1) | CN100435376C (en) |
AT (1) | ATE384340T1 (en) |
AU (1) | AU2002365092A1 (en) |
DE (1) | DE60224698T2 (en) |
WO (1) | WO2003052842A2 (en) |
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DE60224698D1 (en) | 2008-03-06 |
US6888305B2 (en) | 2005-05-03 |
JP2012253046A (en) | 2012-12-20 |
JP5143996B2 (en) | 2013-02-13 |
JP2006505092A (en) | 2006-02-09 |
EP1442488B1 (en) | 2008-01-16 |
KR20040065554A (en) | 2004-07-22 |
KR100923086B1 (en) | 2009-10-22 |
US20030085652A1 (en) | 2003-05-08 |
WO2003052842A2 (en) | 2003-06-26 |
CN1582504A (en) | 2005-02-16 |
EP1442488A2 (en) | 2004-08-04 |
ATE384340T1 (en) | 2008-02-15 |
CN100435376C (en) | 2008-11-19 |
DE60224698T2 (en) | 2009-01-15 |
JP5379287B2 (en) | 2013-12-25 |
AU2002365092A1 (en) | 2003-06-30 |
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