AMENDED CLAIMSReceived by the International Bureau on 13 June 2003 (13.06.2003) original claims 1-39 replaced by amended claims 1-22.
1. An HTS-based RF receiver comprising: a cryocooler; a cryogenic enclosure in thermal communication with the cryocooler, a RF input; a RF output; a HTS filter having an input and an output, the input of the HTS filter being operatively coupled to the RF input, the output of the HTS filter being coupled with a low noise amplifier, the low noise amplifier having an output operatively coupled to the RF output, the HTS filter and the low noise amplifier being disposed within the cryogenic enclosure; a first MEMS bypass switch positioned between the RF input and the HTS filter, the first MEMS bypass switch disposed within the cryogenic enclosure and operatively coupling the RF input to the HTS filter; a second MEMS bypass switch positioned between the low noise amplifier and the RF output, the second MEMS bypass switch disposed within the cryogenic enclosure and operatively coupling the low noise amplifier to the RF output; and a bypass pathway connected between the first bypass switch and the second bypass switch, the bypass pathway being disposed within the cryogenic enclosure,
2. The device of claim 1 , wherein the first switch and second switch are disposed on a cold stage within the cryogenic enclosure.
3. The device of claim 1 , wherein the first switch and the second switch are SPDT switches.
4. The device of claim 3, wherein the first switch and the second switch are selected such that there is no power dissipation when the first and second switches are in a quiescent state, 18
5. The device of claim 1 , the RF input being connected to an antenna.
6. The device of claim 1 , further comprising a controller operatively connected to the first switch and the second switch,
7. The device of claim 6, further comprising one or more sensors operatively coupled to the controller for measuring an operating parameter of the device.
8. The device of claim 7, wherein operating parameter measured by the sensor is the temperature of the cryoenclosure.
9. The device of claim 7, wherein operating parameter measured by the sensor is the temperature of a cold stage.
0. The device of claim 7, wherein operating parameter measured by the sensor is the current of the low noise amplifier.
11. The device of claim 7, wherein operating parameter measured by the sensor is the drive condition of the cryocooler.
12. The device of claim 1 , wherein the bypass pathway comprises a low loss transmission line.
13. The device of claim 5, wherein the HTS-based receiver is mounted atop a tower.
14. The device of claim 5, wherein the HTS-based receiver is mounted at a base of the tower. 19
15. The device of claim 5, wherein the HTS-based receiver is mounted on internal or external walls, or other structure, of a base station.
16. The device of claim 5, wherein the HTS-based receiver is rack mounted within a base station.
17. A method of bypassing a HTS filter in a RF receiver including a HTS filter and low noise amplifier connected in series and disposed within a cryogenic enclosure, the method comprising the steps of: measuring an operating parameter of the RF receiver; and switching the RF receiver to a bypass mode when the measured operating parameter is outside a pre-determined operating range, the step of switching the RF receiver to the bypass mode including the step of switching two MEMS switches disposed within the cryogenic enclosure to a bypass pathway around the HTS filter.
18. A method of bypassing a HTS filter in a RF receiver including a HTS filter and low noise amplifier connected in series and disposed within a cryogenic enclosure, the method comprising the steps of: measuring an operating parameter of the RF receiver; and switching the RF receiver to a bypass mode when the measured operating parameter is outside a pre-determined operating range, the step of switching the RF receiver to the bypass mode including the step of switching two MEMS switches disposed within the cryogenic enclosure to a bypass pathway around the HTS filter and low noise amplifier. 20
19. An HTS-based RF receiver comprising: a cryocooler; a cryogenic enclosure in thermal communication with the cryocooler; a RF input connected to an antenna; a RF output; a HTS filter having an input and an output, the input of the HTS filter being operatively coupled to the RF input, the output of the HTS filter being coupled with a low noise amplifier, the low noise amplifier having an output operatively coupled to the RF output, the HTS filter and the low noise amplifier being disposed within the cryogenic enclosure; a first MEMS bypass switch positioned between the RF input and the HTS filter, the first MEMS bypass switch operatively coupling the RF input to the HTS filter; a second MEMS bypass switch positioned between the low noise amplifier and the RF output, the second MEMS bypass switch operatively coupling the low noise amplifier to the RF output; and a bypass pathway connected between the first MEMS bypass switch and the second MEMS bypass switch; wherein the HTS-based receiver is mounted on internal or external walls, or other structure, of a base station.
20. An HTS-based RF receiver comprising: a cryocooler; a cryogenic enclosure in thermal communication with the cryocooler; a RF input connected to an antenna; a RF output; a HTS filter having an input and an output, the input of the HTS filter being operatively coupled to the RF input, the output of the HTS filter being operatively coupled with a low noise amplifier, the low noise amplifier having an output coupled to the RF output, the HTS filter and the low noise amplifier being disposed within the cryogenic enclosure; 21 a first MEMS bypass switch positioned between the RF input and the HTS filter, the first MEMS bypass switch operatively coupling the RF input to the HTS filter; a second MEMS bypass switch positioned between the HTS filter and the low noise amplifier, the second MEMS bypass switch operatively coupling the HTS filter to the low noise amplifier; a bypass pathway connected between the first MEMS bypass switch and the second MEMS bypass switch, the bypass pathway being disposed within the cryogenic enclosure; wherein the HTS-based receiver is mounted on internal or external walls, or other structure, of a base station.
21. An HTS-based RF receiver comprising: a cryocooler; a cryogenic enclosure in thermal communication with the cryocooler; a RF input; a RF output; a HTS filter having an input and an output, the input of the HTS filter being operatively coupled to the RF input, the output of the HTS filter being coupled with a low noise amplifier, the low noise amplifier having an output operatively coupled to the RF output, the HTS filter and the low noise amplifier being disposed within the cryogenic enclosure; a first MEMS bypass switch positioned between the RF input and the HTS filter, the first MEMS bypass switch operatively coupling the RF input to the HTS filter; a second MEMS bypass switch positioned between the low noise amplifier and the RF output, the second MEMS bypass switch operatively coupling the low noise amplifier to the RF output; a bypass pathway connected between the first bypass switch and the second bypass switch; and wherein the first MEMS switch is disposed within the cryogenic enclosure 22 and the second MEMS switch is disposed outside the cryogenic enclosure.
22 An HTS-based RF receiver comprising: a cryocooler, a cryogenic enclosure in thermal communication with the cryocooler; a RF input; a RF output; a HTS filter having an input and an output, the input of the HTS filter being operatively coupled to the RF input, the output of the HTS filter being coupled with a low noise amplifier, the low noise amplifier having an output operatively coupled to the RF output, the HTS filter and the low noise amplifier being disposed within the cryogenic enclosure; a first MEMS bypass switch positioned between the RF input and the HTS filter, the first MEMS bypass switch operatively coupling the RF input to the HTS filter; a second MEMS bypass switch positioned between the low noise amplifier and the RF output, the second MEMS bypass switch operatively coupling the low noise amplifier to the RF output; a bypass pathway connected between the first bypass switch and the second bypass switch; and wherein the first MEMS switch is disposed outside the cryogenic enclosure and the second MEMS switch is disposed within the cryogenic enclosure.