WO2003060998B1 - Wire bond-less electronic component for use with an external circuit and method of manufacture - Google Patents

Wire bond-less electronic component for use with an external circuit and method of manufacture

Info

Publication number
WO2003060998B1
WO2003060998B1 PCT/US2002/039980 US0239980W WO03060998B1 WO 2003060998 B1 WO2003060998 B1 WO 2003060998B1 US 0239980 W US0239980 W US 0239980W WO 03060998 B1 WO03060998 B1 WO 03060998B1
Authority
WO
WIPO (PCT)
Prior art keywords
electronic component
wire bond
circuit
electronic device
cover
Prior art date
Application number
PCT/US2002/039980
Other languages
French (fr)
Other versions
WO2003060998A1 (en
Inventor
Lakshminarayan Viswanathan
Pierre-Marie J Piel
Garry Duane Funk
Robert P Davidson
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Priority to EP02806458A priority Critical patent/EP1472726A1/en
Priority to JP2003560988A priority patent/JP2005515637A/en
Priority to KR10-2004-7010546A priority patent/KR20040073543A/en
Priority to AU2002357222A priority patent/AU2002357222A1/en
Publication of WO2003060998A1 publication Critical patent/WO2003060998A1/en
Publication of WO2003060998B1 publication Critical patent/WO2003060998B1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01087—Francium [Fr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/163—Connection portion, e.g. seal
    • H01L2924/16315—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Abstract

A wire bond-less electronic component is for use with a circuit external to the wire bond-less electronic component. The wire bond-less electronic component includes a support substrate (110, 410), an electronic device (130) over the support substrate, and a cover (140, 440, 540) located over the electronic device and the support substrate. The cover includes an interconnect structure (141, 441, 541) electrically coupled to the electronic device and adapted to electrically couple together the electronic device and the circuit for providing impedance transformation of an electrical signal between the electronic device and the circuit.

Claims

AMENDED CLAIMS[received by the International Bureau on 28 July 2003 (28.07.03); original claims 1-10 amended (3 pages)]
1. A wire bond-less electronic component (100,500) for use with a circuit external to the wire bond-less electronic component, the wire bond ess electronic component comprising: a support substrate (110,410); an electronic device (130) over the support substrate; and a cover (140,440,540) located over the electronic device and the support substrate, the cover including: an interconnect structure (124,141,142,541) electrically coupled to the electronic device and adapted to electrically couple together the electronic device and the circuit, the interconnect structure further for providing impedance transformation of an electrical signal between the electronic device and the circuit.
2. The wire bond-less electronic component of claim 1 further comprising: electrical leads (144,147) located adjacent to the cover, wherein: the interconnect structure (124.141,142,541) electrically couples together the electronic device (130) and the electrical leads; and the electrical leads electrically couple together the interconnect structure and the circuit.
3. The wire bond-less electronic component of claim 1 wherein: the impedance transformation provided by the interconnect structure comprises: a zero inductance ground potential (146) for the electronic device (130).
4- The wire bond-less electronic component of claim 3 further comprising: an electrical termirial (142,450) at least partially located over the cover, wherein: the electrical terrrjinal is electrically coupled to a portion of the interconnect structure providing the zero inductance ground potential (146).
5. A wire bond-less electronic component (100,500) for use with a circuit external to the wire bond-less electronic component, the wire bond-less electronic component comprising: a flange (110); a semiconductor substrate (120) supported by the flange; a semiconductor device (130) supported by the semiconductor substrate; and a lid (140,440,540) located over the semiconductor device, the semicoriductor substrate, and the flange, wherein the lid includes: a multi-functional interconnect system (124,141,142,541) electrically coupled to the semiconductor device and configured for electrically coupling together the semiconductor device arid the circuit, the multi-functional interconnect system for providing a direct current (144) to the semiconductor device and for providing impedance transformation of electrical signals from the semiconductor device to the circuit and from the circuit to the semiconductor device.
6. The wire bond4ess electronic component (100,500) of claim 5 wherein: the multi-functional interconnect system (141,541) is embedded in the lid (140,540).
7. The wire bond-less electronic component of claim 5 wherein: the multi-functional interconnect system (142) is located at a surface (143) of the lid (140).
8. A method of manufacturing a wire bond-less electronic component (100,500) for use with a circuit external to the wire bond-less electronic component, the method comprising: mounting a semiconductor substrate (120) over a support substrate (110,410), the semiconductor substrate supporting an electronic device (130); and affixing a cover (140,540) over the electronic device and the support substrate, the cover comprising: an interconnect structure (124,141,142,541) electrically coupling together the electronic device and the circuit, the interconnect structure for providing impedance transformation of an electrical signal between the electronic device and the circuit.
15 , The method of claim 8 wherein: affixing the cover (140,540) further comprises: self-aligning (149,111) the cover to the support substrate (110).
0, The method of claim 8 wherein: affixing the cover (540) further comprises: self-aligning (549,525) the cover to the semiconductor substrate (120).
16
PCT/US2002/039980 2002-01-04 2002-12-16 Wire bond-less electronic component for use with an external circuit and method of manufacture WO2003060998A1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP02806458A EP1472726A1 (en) 2002-01-04 2002-12-16 Wire bond-less electronic component for use with an external circuit and method of manufacture
JP2003560988A JP2005515637A (en) 2002-01-04 2002-12-16 Wire-bondless electronic component for use with an external circuit and method of manufacturing the same
KR10-2004-7010546A KR20040073543A (en) 2002-01-04 2002-12-16 Wire bond-less electronic component for use with an external circuit and method of manufacture
AU2002357222A AU2002357222A1 (en) 2002-01-04 2002-12-16 Wire bond-less electronic component for use with an external circuit and method of manufacture

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/039,800 US6724079B2 (en) 2002-01-04 2002-01-04 Wire bond-less electronic component for use with an external circuit and method of manufacture
US10/039,800 2002-01-04

Publications (2)

Publication Number Publication Date
WO2003060998A1 WO2003060998A1 (en) 2003-07-24
WO2003060998B1 true WO2003060998B1 (en) 2003-12-18

Family

ID=21907401

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2002/039980 WO2003060998A1 (en) 2002-01-04 2002-12-16 Wire bond-less electronic component for use with an external circuit and method of manufacture

Country Status (9)

Country Link
US (2) US6724079B2 (en)
EP (1) EP1472726A1 (en)
JP (1) JP2005515637A (en)
KR (1) KR20040073543A (en)
CN (1) CN100362652C (en)
AU (1) AU2002357222A1 (en)
MY (1) MY131124A (en)
TW (1) TWI313498B (en)
WO (1) WO2003060998A1 (en)

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US6982483B2 (en) * 2003-05-30 2006-01-03 Freescale Semiconductor, Inc. High impedance radio frequency power plastic package
DE10336171B3 (en) * 2003-08-07 2005-02-10 Technische Universität Braunschweig Carolo-Wilhelmina Multi-chip circuit module and method of making this
DE10352079A1 (en) * 2003-11-08 2005-06-02 Robert Bosch Gmbh Electric motor, and method of making such
US7148554B2 (en) * 2004-12-16 2006-12-12 Delphi Technologies, Inc. Discrete electronic component arrangement including anchoring, thermally conductive pad
US7755610B2 (en) * 2005-02-01 2010-07-13 Industrial Technology Research Institute Writing device for bistable material with improved flexible material alignment features
US7250675B2 (en) * 2005-05-05 2007-07-31 International Business Machines Corporation Method and apparatus for forming stacked die and substrate structures for increased packing density
TWI320219B (en) * 2005-07-22 2010-02-01 Method for forming a double embossing structure
US7724484B2 (en) * 2006-12-29 2010-05-25 Cobham Defense Electronic Systems Corporation Ultra broadband 10-W CW integrated limiter
JP4558012B2 (en) * 2007-07-05 2010-10-06 株式会社東芝 Semiconductor package heat dissipation plate and semiconductor device
WO2009065105A2 (en) * 2007-11-16 2009-05-22 Continental Automotive Systems Us, Inc. Thermal packaging of transmission controller using carbon composite printed circuit board material
US7868729B2 (en) * 2009-03-03 2011-01-11 Freescale Semiconductor, Inc. Stacked device assembly with integrated coil and method of forming same
JP5827476B2 (en) * 2011-03-08 2015-12-02 株式会社東芝 Semiconductor module and manufacturing method thereof
CN102345145B (en) * 2011-09-30 2013-07-24 成都四威高科技产业园有限公司 Method for electroplating surface of molybdenum and copper alloy
US9349693B2 (en) 2014-08-05 2016-05-24 Freescale Semiconductor, Inc. Semiconductor device with an isolation structure coupled to a cover of the semiconductor device
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Also Published As

Publication number Publication date
US20030128080A1 (en) 2003-07-10
US20040198012A1 (en) 2004-10-07
KR20040073543A (en) 2004-08-19
MY131124A (en) 2007-07-31
US6724079B2 (en) 2004-04-20
CN1618126A (en) 2005-05-18
TW200302610A (en) 2003-08-01
WO2003060998A1 (en) 2003-07-24
EP1472726A1 (en) 2004-11-03
AU2002357222A1 (en) 2003-07-30
JP2005515637A (en) 2005-05-26
TWI313498B (en) 2009-08-11
US6844221B2 (en) 2005-01-18
CN100362652C (en) 2008-01-16

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