WO2003065424A2 - Apparatus for cyclical deposition of thin films - Google Patents
Apparatus for cyclical deposition of thin films Download PDFInfo
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- WO2003065424A2 WO2003065424A2 PCT/US2003/002408 US0302408W WO03065424A2 WO 2003065424 A2 WO2003065424 A2 WO 2003065424A2 US 0302408 W US0302408 W US 0302408W WO 03065424 A2 WO03065424 A2 WO 03065424A2
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- showerhead
- gas
- chamber
- reaction region
- fluidly coupled
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
- C23C16/45544—Atomic layer deposition [ALD] characterized by the apparatus
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4412—Details relating to the exhausts, e.g. pumps, filters, scrubbers, particle traps
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/448—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
- C23C16/452—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials by activating reactive gas streams before their introduction into the reaction chamber, e.g. by ionisation or addition of reactive species
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
- C23C16/45527—Atomic layer deposition [ALD] characterized by the ALD cycle, e.g. different flows or temperatures during half-reactions, unusual pulsing sequence, use of precursor mixtures or auxiliary reactants or activations
- C23C16/45536—Use of plasma, radiation or electromagnetic fields
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45563—Gas nozzles
- C23C16/45565—Shower nozzles
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45582—Expansion of gas before it reaches the substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32091—Radio frequency generated discharge the radio frequency energy being capacitively coupled to the plasma
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3244—Gas supply means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
- H01J37/32816—Pressure
- H01J37/32834—Exhausting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
Definitions
- the present invention generally relates to semiconductor processing. More particularly, the invention relates to an apparatus for performing cyclical deposition processes in semiconductor substrate processing systems.
- An atomic layer deposition (ALD) process is a cyclical deposition method that is generally used for depositing ultra-thin layers (e.g., mono-layers) over features of semiconductor devices having a high aspect ratio, i.e., a ratio of the depth of a feature to the smallest width of the feature.
- ultra-thin layers e.g., mono-layers
- the ALD process utilizes a chemisorption phenomenon to deposit mono-layers of reactive precursor molecules.
- reactive precursors are injected, in the form of pulsed gases, into a deposition chamber in a predetermined cyclical order.
- Each injection of a precursor provides a new atomic layer on a substrate that is additive to or combines with the previously deposited layers.
- Injections of individual precursor gases generally are separated by injections of a purge gas or, in other embodiments, the purge gas may be flown continuously into the deposition chamber.
- the purge gas generally comprises an inert gas, such as argon (Ar), helium (He), and the like or a mixture thereof.
- the deposition chamber is also continuously evacuated to reduce the gas phase reactions between the precursors.
- ALD technique that affect the film properties and costs of operation and ownership.
- unwanted gas phase reactions between precursors within the process chamber of the prior art may cause contamination of deposited films and require frequent cleaning of the chamber, thus decreasing productivity of the ALD process.
- the present invention is an apparatus for performing cyclical deposition thin films on semiconductor substrates with low film contamination and minimal gas phase reactions between the precursors.
- the apparatus comprises a process chamber having a gas distribution system facilitating separate paths for process gases and an exhaust system that is synchronized with the valves dosing the process gases.
- Various embodiments of the apparatus are described.
- the invention is used to deposit an aluminum oxide (AI 2 O 3 ) film.
- FIG. 1 is a schematic, perspective view of one illustrative embodiment of a semiconductor substrate processing system in accordance with the present invention
- FIG. 2 is a schematic, cross-sectional view of a process chamber of the processing system of FIG. 1 ;
- FIG. 3 is a schematic, partial cross-sectional view of a lid assembly of the process chamber of FIG. 2;
- FIG. 4 is a schematic, partial view of a showerhead of the process chamber of FIG. 2;
- FIG. 5 is a schematic, partial cross-sectional view of another embodiment of the lid assembly of the process chamber of FIG. 2;
- FIG. 6 is a schematic, partial cross-sectional view of another embodiment of the process chamber of the processing system FIG. 1 ;
- FIG. 7 is a schematic, partial cross-sectional view of yet another illustrative embodiment of the process chamber of the processing system FIG. 1 ;
- FIG. 8 is a schematic, partial cross-sectional view of one embodiment of a showerhead of the process chamber of FIG. 7;
- FIG. 9 is a schematic, partial cross-sectional view of another embodiment of the showerhead of the process chamber of FIG. 7.
- FIG. 10 is a schematic, plan view of a processing platform integrating the process chambers used in performing cyclical deposition processes of the present invention.
- the present invention is an apparatus for performing cyclical deposition of thin films on semiconductor substrates (e.g., using an atomic layer deposition (ALD) process and the like) with low film contamination and minimal gas phase reactions between the reactive precursors.
- the apparatus is used to deposit an aluminum oxide (AI 2 O 3 ) film.
- the apparatus may be used to deposit other films that include materials such as aluminum (Al), copper (Cu), titanium (Ti), tantalum (Ta), tungsten (W) films, hafnium (Hf), various magnetic materials and the like.
- FIGS. 1-9 are schematic views of various embodiments of an exemplary processing system 100 and salient portions of the system in accordance with the present invention. The images in FIGS. 1-9 are simplified for illustrative purposes and are not depicted to scale.
- FIG. 1 is a schematic, perspective view of one illustrative embodiment of a processing system 100 comprising a process chamber 101 , a controller 70, a dual exhaust system 50, and a source 530 of process gases that are used during a cyclical deposition process (e.g., ALD process).
- a cyclical deposition process e.g., ALD process
- the process chamber 101 comprises a chamber body 105, a lid assembly 120, and an ozonator 170.
- the process chamber 101 has two isolated zones (flow paths) for gaseous compounds that are used during an ALD process.
- gaseous compound is collectively used for one or more process gases, such as precursor gases, purge gases, carrier gases, catalytic gases, and the like, as well as for mixtures thereof, and the terms “gas” and “gas mixture” are used interchangeably.
- the isolated flow paths prevent mixing of gaseous compounds before the compounds reach a reaction region 159 of the process chamber 101.
- the process chamber 101 may comprise more than two isolated flow paths.
- the lid assembly 120 is disposed on the chamber body 105 and, in a closed position, forms a fluid-tight seal with the chamber body.
- the lid assembly 120 generally comprises a lid plate 122, a ring heater 125, a manifold block 150, a showerhead 130, and high-speed valves 155A, 155B.
- Components of the lid assembly 120 are preferably formed from process-compatible materials, such as aluminum, aluminum nitride, stainless steel, graphite, silicon carbide, and the like.
- the lid assembly 120 further comprises a handle 145 and a hinge assembly 140 used to lift the lid assembly during routine cleaning and maintenance of the process chamber 101.
- the chamber body 105 comprises a member 109, a liner 107, and a support pedestal 111.
- a slit 115 is formed in a sidewall of the chamber body 105 to facilitate transfer of a substrate into and out of the process chamber 101.
- a suitable wafer transfer robot e.g., robot 1030 described in reference to FIG. 10
- the support pedestal 111 e.g., a ceramic support pedestal, comprises a heater 53A, as well as a thermocouple 50A that is used to monitor the temperature thereof.
- a signal from the thermocouple 50A may be used in a feedback loop that controls power applied to a heater 53A.
- the heater 53A may be a resistive heater or other thermal transfer device embedded in or otherwise coupled to the support pedestal 111.
- the support pedestal 111 may be heated using a conduit (not shown) carrying a heat transfer fluid.
- the support pedestal 111 may also comprise channels (not shown) to deliver a purge gas to an edge and/or backside of the substrate.
- the substrate support 111 is coupled to a lifting mechanism and comprises a chucking device that holds the substrate thereon (both not shown). Examples of suitable chucking devices include a vacuum chuck, an electrostatic chuck, a clamp ring, and the like.
- One example of the lifting mechanism is described in the commonly assigned U.S. Patent No. 5,951 ,776.
- the liner 107 circumscribes the interior vertical surfaces of the chamber body 105. Alternatively, the liner 107 covers a bottom of the chamber body 105 (as depicted in FIG. 2) or a separate liner may be used to cover the bottom.
- the liner 107 may be constructed of any process-compatible material.
- a purge channel 119 is formed between the liner 107 and the chamber body 105. The purge gas is flown through the purge channel 119 to confine the gaseous compounds within the reaction region 159, as well as to minimize unwanted deposition on sidewalls of the chamber and improve heat exchange between the sidewalls and the liner 107.
- the member 109 defines gas conductance of a path to the exhaust ports 117A, 117B.
- the member 109 is an annular ring having a plurality of apertures 109A.
- the apertures 109A facilitate uniform removal of gaseous compounds and by-products out of the process chamber 101.
- a diameter, number, and location of the apertures 109A may be determined based on requirements of a particular ALD process. However, in some embodiments, the member 109 may be omitted and, as such, is considered optional.
- the ring heater 125 is attached to the lid plate 120 using, e.g., conventional fasteners, such as screws and the like. Generally, the ring heater 125 comprises at least one embedded electrical heating element (not shown). During the ALD process, the ring heater 125 defines the temperature (e.g., about 90 degrees Celsius or higher) of the lid plate 122 to prevent deposition of gaseous compounds and by-products of the process on the lid plate.
- the high-speed valves 155A, 155B are mounted on the manifold block 150 such that a fluid-tight seal is provided between the manifold and a valve.
- the seal may be provided using, e.g., a gasket (not shown) that is placed between the upper surface of the manifold block 150 and bottom surface of a high-speed valve and compressed thereafter.
- gasket may be formed from stainless steel or other compressible and process-compatible material.
- the manifold block 150 comprises one or more cooling channels (not shown) disposed therein to protect the high-speed valves 155A, 155B from exposure to excessive operating temperatures during the ALD process.
- the manifold block 150 uses running water as a heat transfer medium.
- the high-speed valves 155A, 155B repeatedly deliver, in a predetermined order, pulses of gaseous compounds into the process chamber 101.
- the on/off periods of the valves are about 100 msec or less.
- the high-speed valves 155A, 155B are controlled by the controller 70 or, alternatively, by an application specific controller (nor shown), such as, e.g., described in commonly assigned U.S. patent application serial number 09/800,881 , filed on March 7, 2001 , which is incorporated herein by reference.
- the high-speed valves 155A, 155B are three-port valves each having two intake ports and one outlet port.
- the process chamber 101 may also comprise more than two high-speed valves.
- a high-speed valve may have only one intake port or more then two ports. Suitable high-speed valves are available from Fujikin Inc. of Japan and other suppliers.
- one intake port of the valve is coupled to a source a precursor gas, while the other intake port is coupled to a source of a purge gas and the outlet port is coupled to a respective outlet channel (channels 154A, 154B).
- a valve e.g., valve 155A
- a precursor gas e.g., aluminum precursor
- the other valve e.g., valve 155B
- an oxidizing gas e.g., ozone
- the purge gas can continuously flow through both valves.
- FIG. 3 depicts isolated flow paths for individual gaseous compounds.
- the paths are formed in the lid assembly 120 to separate the compounds within the lid assembly.
- each gaseous compound has a dedicated flow path, or, alternatively, the flow path may deliver more than one compound, e.g., one precursor or oxidizing gas and one purge gas.
- the flow path may deliver more than one compound, e.g., one precursor or oxidizing gas and one purge gas.
- embodiments of the invention are further described in terms of a three gaseous compound processing system 100 using e.g., one precursor gas, one oxidizing gas, and one purge gas.
- Such processing system comprises at least two isolated flow paths.
- the processing system 100 may comprise a different number of isolated flow paths and/or use a different number of gaseous compounds.
- the first flow path comprises an inlet channel 153A for a fist gaseous compound (e.g., aluminum precursor, such as at least one of trimethylaluminum (AI(CH3)3), triisopropoxyaluminum (AI(C3H7)3), and dimethylaluminumhydride (AI(CH3)2H), as well as precursors having a chemical structure AI(R1)(R2)(R3), where R1 , R2, R3 may be the same or different ligands, and the like), an inlet channel 124A for a purge gas (e.g., helium (He), argon (Ar), nitrogen (N2), hydrogen (H2), and the like), the highspeed valve 155A, and an outlet channel 154A.
- a fist gaseous compound e.g., aluminum precursor, such as at least one of trimethylaluminum (AI(CH3)3), triisopropoxyaluminum (AI(C3H7)3), and dimethylalum
- the second flow path comprises an inlet channel 153B for a second gaseous compound (e.g., oxidizing gas, such as, e.g., ozone (O3), oxygen (O2), water (H2O) vapor, nitrous oxide (N2O), nitric oxide (NO), and the like), an inlet channel 124B for the purge gas, the high-speed valve 155B, and an outlet channel 154B.
- the inlet channels 153A, 153B are generally each coupled at a first end thereof to a source (not shown) of an individual gaseous compound, as well as coupled at a second end thereof to the respective valve 155A, 155B.
- the inlet channels 124A, 124B similarly transfer one or more purge gases to the valves 155A, 155B.
- a diameter of the gas channel 154A increases towards the showerhead 130 to decrease the kinetic energy of the flowing gaseous compound.
- the first gaseous compound is dosed
- the first and second gaseous compounds are separated from one another within the lid assembly 120.
- the cavity 156 can be sealed using, e.g., o-ring seals 139A, 139M that are disposed in the channels 129A, 129B, respectively.
- a dispersion plate 132 is disposed near the slotted openings 131 A, 131 B and deflects, both horizontally and vertically, a flow of the gaseous compound from the slotted openings 131 A, 131 B.
- the plate converts a substantially vertical flow of the compound into the partially horizontal flow and prevents the gaseous compound from impinging directly on the substrate.
- the dispersion plate 132 may be a part of the showerhead 130 or, alternatively, may be affixed to the showerhead.
- the dispersion plate 132 re-directs and decreases velocity of the gaseous compound. Without such redirection, the impinging compound may sweep away (sputter) reactive molecules already disposed on the substrate. Further, the dispersion plate 132 prevents excess deposition onto regions of the substrate that oppose the openings 131 A, 131 B and, as such, facilitates uniform depositing of the film on the substrate.
- FIG. 4 is a schematic, partial view of a portion of the showerhead 130 taken along an arrow 157 in FIG 3.
- the showerhead 130 comprises a plurality of apertures 133 disposed around the slotted openings 131 A, 131 B.
- the apertures 133 comprise nozzles 130A to provide a directional delivery of a gaseous compound to the substrate below.
- the nozzles 130A are angled relative to the upper surface of the support pedestal 111.
- the apertures 133 and nozzles 130A are sized and positioned to provide uniform distribution of the gaseous compound across the substrate.
- the apertures 133 are formed on the entire surface of the showerhead 130.
- the apertures 133 are formed substantially within a region opposing the support pedestal 111.
- the openings 131 A, 131B are shown having a generally circular form factor, the openings may have any other form factor that provides a desired pattern of a flow of a gaseous compound in the reaction region 159. Further, in other embodiments, a number of the centrally located openings in the showerhead 130 may be either one or greater than two.
- the dual exhaust system 50 comprises an exhaust channel 108 formed in the liner 107, exhaust ports 117A, 117B) formed in a sidewall of the process chamber 101 , exhaust pumps 52A, 52B, and valves 55A, 55B (e.g., electronic, pneumatic or ball valves and the like).
- operation of the valves 55A, 55B is synchronized with operation of the high-speed valves 155A, 155B, e.g., the valves 55A, 55B open and close contemporaneously with such actions of the high-speed valves.
- each exhaust pump can be operated independently, and, preferably, is used to remove specific gaseous compounds.
- one pump is used to remove an aluminum precursor and the other pump is used to remove an oxidizing gas, while both pumps are use simultaneously to remove the purge gas.
- a gaseous compound dosed into the chamber body 150 using the high-speed valve 155A is exhausted from the process chamber 101 through the exhaust valve 55A that is open when the exhaust valve 55B is closed.
- the gaseous compound dosed into the process chamber 101 using the high-speed valve 155B is exhausted from the chamber through the exhaust valve 55B that is open when the exhaust valve 55A is closed.
- the dual exhaust system 50 reduces mixing of gaseous compounds in the processing system 100. Consequently, half reactions occur without chemical combination that results in chemical vapor deposition (CVD). By avoiding CVD, the chamber components and exhaust conduits remain substantially free of deposited contaminants.
- an off-cycle valve i.e., temporarily closed valve
- an off-cycle valve is not opened to the exhaust port immediately upon initiation of a pulse of a gaseous compound, but instead lags the pulse by a small time delay to reduce cross- contamination of the gaseous compounds within the dual exhaust system 50.
- the exhaust valve not associated with the subsequent pulse of the other gaseous compound is closed just prior to initiation of the pulse of the compound.
- Such synchronized operation of the dual exhaust system 50 is generally performed by a computer controller 70 or, alternatively, by the application specific controller.
- the dual exhaust system 50 may further comprise a trap (not shown) disposed between the exhaust pump and exhaust valve or between the chamber body 105 and exhaust valve.
- the trap removes by-products of the ALD process from an exhaust stream thereby increasing performance and service intervals of the exhaust pump.
- the trap may be of any conventional type suited to collection of by-products generated during the ALD process.
- a single exhaust system may also be used.
- Such exhaust system may utilize, e.g., the pump 52A (or 52B), the optional trap, and the exhaust valve 55A (or 55B) coupled to the exhaust port 117A (or 117B).
- the exhaust pump is on and the exhaust valve is open.
- the ozonator 170 (i.e., source of ozone) is in fluid communication with a source of the precursor (e.g., oxygen), as well as with inlet channels 124A, 124B in the manifold block 150.
- a source of the precursor e.g., oxygen
- the ozonator 170 is disposed in close proximity to the processing system 100 (as shown in FIG. 1), such that losses associated with delivery of ozone into the process chamber 101 are minimized.
- Ozonators are available, e.g., from ASTeX® Products of Wilmington, Massachusetts.
- the oxidizing gas may be produced using, e.g., a remote source (not shown), such as a remote plasma generator (e.g., DC, radio frequency (RF), microwave (MW) plasma generator, and the like).
- a remote plasma generator e.g., DC, radio frequency (RF), microwave (MW) plasma generator, and the like.
- the remote source produces reactive species, which then are delivered to the process chamber 101.
- Such remote sources are available from Advanced Energy Industries, Inc. of Fort Collins, Colorado and others.
- the oxidizing gas can be produced using a thermal gas break-down technique, a high-intensity light source (e.g., UV or x-ray source), and the like.
- FIG. 5 is a schematic, partial cross-sectional view of an alternative embodiment of the lid assembly 120 comprising the ozonator 170 coupled to the process chamber 101 and to a buffer cavity 520, through a diverter valve 510.
- the diverter valve 510 couples the ozonator 170 to the process chamber 101 contemporaneously with an open state (with respect to the inlets 124A, 124B) of the high-speed valves 155A, 155B.
- the diverter valve 510 couples the ozonator 170 to the buffer cavity 520 when the high-speed valves 155A, 155B are in close state in respect to the inlets 124A, 124B.
- the buffer cavity 520 simulates a second process chamber and, as such, using the diverter valve 510, ozone and/or other oxidizing gas can be produced continuously during the ALD process.
- the source 530 comprises an ampoule 531 containing a liquid aluminum precursor and a vaporizer 532.
- the ampoule 531 , the vaporizer 532, and delivering lines may each be heated (e.g., using any conventional method of heating) to assist in vaporization of the liquid phase, as well as in preventing the vaporized precursor from condensing.
- the precursor may be pre-mixed with a solvent that reduces viscosity of the liquid phase, and then vaporized.
- a carrier gas such as argon, helium (He), hydrogen (H2), and the like may also be used to facilitate delivery of the precursor, in a form of a gaseous compound, to the process chamber 101.
- FIG. 6 is a schematic, partial cross-sectional view of another embodiment an ALD process chamber 301 comprising a circumferential gas delivery assembly 300 and an upper gas delivery assembly 350.
- the circumferential gas delivery assembly 300 is disposed in a chamber body
- Each gas distribution channel is coupled to a source of a gaseous compound and comprises a plurality of ports adapted for receiving gas nozzles. As such, each gas distribution channel is in fluid communication with a plurality of circumferentially mounted gas nozzles. In one embodiment, alternating ports are connected to one of the gas distribution channels, while the other ports are connected to the other channel. In the depicted embodiment, a gaseous compound from the source 352 is distributed through the nozzles 302 of the gas distribution channel 316.
- a gaseous compound from the source 358 is distributed through the nozzles 304 of the gas distribution channel 318.
- the upper gas delivery assembly 350 is disposed in the lid assembly 320 and comprises a center gas feed 312 and a nozzle 306.
- the center gas feed 312 is in fluid communication with two or more sources 364, 370 of other gaseous compounds.
- Such embodiment provides, through the peripheral gas nozzles 302, 304 and the central gas nozzle 306, three separate passes for the gaseous compounds (e.g., metal-containing precursor, oxidizing gas, and inert gas) in the process chamber 301. Further, different gaseous compounds can be introduced into a reaction volume at select locations within the chamber. In the depicted embodiment, the gaseous compounds are dosed using four high-speed valves 354A-354D each having one intake port and one outlet port. In other embodiments, during a cyclical deposition process, at least one of the gaseous compounds may be flown into the process chamber 101 continuously. In further embodiments, the gas delivery assembly 300 may comprise more than one annular gas ring 310 or the ring may have more than two gas distribution channels, as well as the upper gas delivery assembly 350 may comprise more than one gas nozzle 306.
- the gas delivery assembly 300 may comprise more than one annular gas ring 310 or the ring may have more than two gas distribution channels, as well as the upper gas delivery assembly 350 may comprise more
- the gas distribution ring 310 and the nozzles 302, 304, and 306 are made of a process-compatible material (e.g., aluminum, stainless steel, and the like), as well as are supplied with conventional process-compatible fluid-tight seals (not shown), such as o-rings and the like.
- the seals isolate the gas distribution channels 316, 318 from one another.
- the nozzles 302, 304, and 306 are threaded in the respective ports to provide fluid-tight couplings therein, as well as means facilitating prompt replacement of the nozzles.
- a form factor of the restricting orifice of a nozzle can be selected for desired dispersion of gaseous compound within the chamber.
- FIG. 7 is a schematic, cross-sectional view of still another embodiment of a process chamber 700 for performing the cyclical deposition processes.
- the process chamber 700 comprises a chamber body 702 and gas distribution system 730.
- the chamber body 702 houses a substrate support 712 that supports a substrate 710 in the chamber 700.
- the substrate support 712 comprises an embedded heater element 722.
- a temperature sensor 726 e.g., a thermocouple
- the substrate support 712 may be heated using a source of radiant heat (not shown), such as quartz lamps and the like.
- the chamber body 702 comprises an opening 708 in a sidewall 704 providing access for a robot to deliver and retrieve the substrate 710, as well as exhaust ports 717A, 717 B (only port 717A is shown) that are fluidly coupled to the dual exhaust system 50 (discussed in reference to FIG. 1 above).
- the gas distribution system 730 generally comprises a mounting plate 733, a showerhead 770, and a blocker plate 760 and provides at least two separate paths for gaseous compounds into a reaction region 728 between the showerhead 770 and the substrate support 712.
- the gas distribution system 730 also serves as a lid of the process chamber 700.
- the gas distribution system 730 may be a portion of a lid assembly of the chamber 700.
- the mounting plate 733 comprises a channel 737 and a channel 743, as well as a plurality of channels 746 that are formed to control the temperature of the gaseous compounds (e.g., by providing either a cooling or heating fluid into the channels). Such control is used to prevent decomposing or condensation of the compounds.
- Each of the channels 737, 743 provides a separate path for a gaseous compound within the gas distribution system 730.
- FIG. 8 is a schematic, partial cross-sectional view of one embodiment of the showerhead 770.
- the showerhead 770 comprises a plate 772 that is coupled to a base 780.
- the plate 772 has a plurality of openings 774, while the base 780 comprises a plurality of columns 782 and a plurality of grooves 784.
- the showerhead 771 comprises the plate 750 having the grooves 752 and columns 754, and a base 756 comprising a plurality of openings 758 and 759. In either embodiment, contacting surfaces of the plate and base may be brazed together to prevent mixing of the gaseous compounds within the showerhead.
- Each of the channels 737 and 743 is coupled to a source (not shown) of the respective gaseous compound. Further, the channel 743 directs the first gaseous compound into a volume 731 , while the channel 743 is coupled to a plenum 775 that provides a path for the second gaseous compound to the grooves 784.
- the blocker plate 760 comprises a plurality of openings 762 that facilitate fluid communication between the volume 731 , plenum 729, and a plurality of openings 774 that disperse the first gaseous compound into the reaction region 728.
- the gas distribution system 730 provides separate paths for the gaseous compounds delivered to the channels 737 and 743.
- the blocker plate 760 and the showerhead 770 are electrically isolated from one another, the mounting plate 733, and chamber body 702 using insulators (not shown) formed of, e.g., quartz, ceramic, and like.
- the insulators are generally disposed between the contacting surfaces in annular peripheral regions thereof to facilitate electrical biasing of these components and, as such, enable plasma enhanced cyclical deposition techniques, e.g., plasma enhanced ALD (PEALD) processing.
- PEALD plasma enhanced ALD
- a power source may be coupled, e.g., through a matching network (both not shown), to the blocker plate 760 when the showerhead 770 and chamber body 702 are coupled to a ground terminal.
- the power source may be either a radio-frequency (RF) or direct current (DC) power source that energizes the gaseous compound in the plenum 729 to form a plasma.
- the power source may be coupled to the showerhead 770 when the substrate support 712 and chamber body 702 are coupled to the ground terminal.
- the gaseous compounds may be energized to form a plasma in the reaction region 728.
- the plasma may be selectively formed either between the blocker plate 760 and showerhead 770, or between the showerhead 770 and substrate support 712.
- Such electrical biasing schemes are disclosed in commonly assigned U.S. patent application serial number , filed (Attorney docket number 7660), which is incorporated herein by reference.
- the blocker plate 760 and showerhead 770 may be coupled to separate outputs of the matching network to produce an electrical field gradient to direct the plasma species through the openings in the showerhead 770 towards the substrate 710.
- the blocker plate 760 and showerhead 770 may be individually coupled to separate power sources each using a separate matching network.
- the controller 70 comprises a central processing unit (CPU)
- the CPU 123 may be of any form of a general-purpose computer processor that is used in an industrial setting.
- the software routines can be stored in the memory 116, such as random access memory, read only memory, floppy or hard disk drive, or other form of digital storage.
- the support circuit 114 is coupled to the CPU 123 in a conventional manner and may comprise cache, clock circuits, input/output sub-systems, power supplies, and the like.
- the software routines when executed by the CPU 123, transform the CPU into a specific purpose computer (controller) 70 that controls the reactor 100 such that the processes are performed in accordance with the present invention.
- the software routines may also be stored and/or executed by a second controller (not shown) that is located remotely from the reactor 100.
- FIG. 10 is a schematic, top plan view of an exemplary integrated processing system 900 configured to form a film stack having an aluminum oxide layer.
- One such integrated processing system is a Centura® system that is available from Applied Materials, Inc. of Santa Clara, California.
- Centura® system that is available from Applied Materials, Inc. of Santa Clara, California.
- the particular embodiment of the system 900 is provided to illustrate the invention and should not be used to limit the scope of the invention.
- the system 1000 generally includes load lock chambers 1022 that protect vaccumed interior of the system 1000 from contaminants.
- a robot 1030 having a blade 1034 is used to transfer the substrates between the load lock chambers 1022 and process chambers 1010, 1012, 1014, 1016, 1020.
- One or more of the chambers is an aluminum oxide chamber, such as the process chambers described above in reference to FIGS. 1-9.
- one or more chambers may be adapted to deposit a material used during fabrication of integrated circuits, as well as be a cleaning chamber (e.g., a plasma cleaning chamber) used to remove unwanted products from a substrate.
- a cleaning chamber e.g., a plasma cleaning chamber
- Example of such cleaning chamber is the Preclean IITM chamber available from Applied Materials, Inc. of Santa Clara, CA.
- one or more of the chambers 1010, 1012, 1014, 1016, 1020 may be an annealing chamber or other thermal processing chamber, e.g., the RadianceTM chamber available from Applied Materials, Inc. of Santa Clara, CA.
- the system 1000 may comprise one or more metrology chambers 1018 connected thereto using, e.g., a factory interface 1024.
- the system 1000 may comprise other types of process chambers.
- a load lock chamber (chamber 1022), an aluminum oxide cyclical deposition chamber (chamber 1010), a first dielectric deposition chamber (chamber 1014), a metal deposition chamber (chamber 1014), a second dielectric deposition chamber (chamber 1016), and an annealing chamber (chamber 1020).
- the processing system 100 may be used to deposit with low film contamination and minimal gas phase reactions between the precursors various metal-containing films, e.g., aluminum oxide, copper, titanium, tantalum, tungsten films, and the like. In one illustrative application, the processing system 100 is used to deposit an aluminum oxide film. Various cyclical deposition processes used to deposit the aluminum oxide and other films using the processing system 100 are described in commonly assigned U.S. provisional patent application serial number 60/357,382, filed February 15, 2002, which is incorporated herein by reference.
Abstract
Description
Claims
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AU2003238853A AU2003238853A1 (en) | 2002-01-25 | 2003-01-27 | Apparatus for cyclical deposition of thin films |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005119733A1 (en) * | 2004-05-26 | 2005-12-15 | Applied Materials, Inc. | Blocker plate bypass to distribute gases in a chemical vapor deposition system |
WO2007109346A2 (en) * | 2006-03-21 | 2007-09-27 | Ultra Clean Holdings, Incorporated | Mass pulse sensor and process-gas system and mehthod |
US7622005B2 (en) | 2004-05-26 | 2009-11-24 | Applied Materials, Inc. | Uniformity control for low flow process and chamber to chamber matching |
Families Citing this family (192)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6951804B2 (en) * | 2001-02-02 | 2005-10-04 | Applied Materials, Inc. | Formation of a tantalum-nitride layer |
KR100756107B1 (en) * | 2001-02-09 | 2007-09-05 | 동경 엘렉트론 주식회사 | Film forming device |
US6878206B2 (en) * | 2001-07-16 | 2005-04-12 | Applied Materials, Inc. | Lid assembly for a processing system to facilitate sequential deposition techniques |
US9051641B2 (en) | 2001-07-25 | 2015-06-09 | Applied Materials, Inc. | Cobalt deposition on barrier surfaces |
US20090004850A1 (en) | 2001-07-25 | 2009-01-01 | Seshadri Ganguli | Process for forming cobalt and cobalt silicide materials in tungsten contact applications |
US8110489B2 (en) | 2001-07-25 | 2012-02-07 | Applied Materials, Inc. | Process for forming cobalt-containing materials |
US7085616B2 (en) | 2001-07-27 | 2006-08-01 | Applied Materials, Inc. | Atomic layer deposition apparatus |
US6916398B2 (en) * | 2001-10-26 | 2005-07-12 | Applied Materials, Inc. | Gas delivery apparatus and method for atomic layer deposition |
US7780789B2 (en) * | 2001-10-26 | 2010-08-24 | Applied Materials, Inc. | Vortex chamber lids for atomic layer deposition |
US7204886B2 (en) * | 2002-11-14 | 2007-04-17 | Applied Materials, Inc. | Apparatus and method for hybrid chemical processing |
US20080102203A1 (en) * | 2001-10-26 | 2008-05-01 | Dien-Yeh Wu | Vortex chamber lids for atomic layer deposition |
US7780785B2 (en) * | 2001-10-26 | 2010-08-24 | Applied Materials, Inc. | Gas delivery apparatus for atomic layer deposition |
JP4121269B2 (en) * | 2001-11-27 | 2008-07-23 | 日本エー・エス・エム株式会社 | Plasma CVD apparatus and method for performing self-cleaning |
US7081271B2 (en) * | 2001-12-07 | 2006-07-25 | Applied Materials, Inc. | Cyclical deposition of refractory metal silicon nitride |
AU2003238853A1 (en) * | 2002-01-25 | 2003-09-02 | Applied Materials, Inc. | Apparatus for cyclical deposition of thin films |
US6911391B2 (en) | 2002-01-26 | 2005-06-28 | Applied Materials, Inc. | Integration of titanium and titanium nitride layers |
US6866746B2 (en) * | 2002-01-26 | 2005-03-15 | Applied Materials, Inc. | Clamshell and small volume chamber with fixed substrate support |
US6972267B2 (en) | 2002-03-04 | 2005-12-06 | Applied Materials, Inc. | Sequential deposition of tantalum nitride using a tantalum-containing precursor and a nitrogen-containing precursor |
US7160577B2 (en) | 2002-05-02 | 2007-01-09 | Micron Technology, Inc. | Methods for atomic-layer deposition of aluminum oxides in integrated circuits |
US7067439B2 (en) * | 2002-06-14 | 2006-06-27 | Applied Materials, Inc. | ALD metal oxide deposition process using direct oxidation |
US7186385B2 (en) | 2002-07-17 | 2007-03-06 | Applied Materials, Inc. | Apparatus for providing gas to a processing chamber |
JP2005536890A (en) * | 2002-08-26 | 2005-12-02 | 東京エレクトロン株式会社 | Volume-reduced plasma reactor |
US7037863B2 (en) * | 2002-09-10 | 2006-05-02 | Samsung Electronics Co., Ltd. | Post thermal treatment methods of forming high dielectric layers over interfacial layers in integrated circuit devices |
KR100536797B1 (en) * | 2002-12-17 | 2005-12-14 | 동부아남반도체 주식회사 | Chemical vapor deposition apparatus |
US20040177813A1 (en) | 2003-03-12 | 2004-09-16 | Applied Materials, Inc. | Substrate support lift mechanism |
US7166528B2 (en) | 2003-10-10 | 2007-01-23 | Applied Materials, Inc. | Methods of selective deposition of heavily doped epitaxial SiGe |
US20050095859A1 (en) * | 2003-11-03 | 2005-05-05 | Applied Materials, Inc. | Precursor delivery system with rate control |
US20050109276A1 (en) * | 2003-11-25 | 2005-05-26 | Applied Materials, Inc. | Thermal chemical vapor deposition of silicon nitride using BTBAS bis(tertiary-butylamino silane) in a single wafer chamber |
US20050150452A1 (en) * | 2004-01-14 | 2005-07-14 | Soovo Sen | Process kit design for deposition chamber |
US20050229849A1 (en) * | 2004-02-13 | 2005-10-20 | Applied Materials, Inc. | High productivity plasma processing chamber |
US20050183824A1 (en) * | 2004-02-25 | 2005-08-25 | Advanced Display Process Engineering Co., Ltd. | Apparatus for manufacturing flat-panel display |
US20050221618A1 (en) * | 2004-03-31 | 2005-10-06 | Amrhein Frederick J | System for controlling a plenum output flow geometry |
US20050252449A1 (en) * | 2004-05-12 | 2005-11-17 | Nguyen Son T | Control of gas flow and delivery to suppress the formation of particles in an MOCVD/ALD system |
US8323754B2 (en) | 2004-05-21 | 2012-12-04 | Applied Materials, Inc. | Stabilization of high-k dielectric materials |
US8119210B2 (en) | 2004-05-21 | 2012-02-21 | Applied Materials, Inc. | Formation of a silicon oxynitride layer on a high-k dielectric material |
DE602005016933D1 (en) * | 2004-06-28 | 2009-11-12 | Cambridge Nanotech Inc | ATOMIC SEPARATION SYSTEM AND METHOD |
KR101063737B1 (en) * | 2004-07-09 | 2011-09-08 | 주성엔지니어링(주) | Shower Head of Substrate Manufacturing Equipment |
US20060019032A1 (en) * | 2004-07-23 | 2006-01-26 | Yaxin Wang | Low thermal budget silicon nitride formation for advance transistor fabrication |
US7601649B2 (en) | 2004-08-02 | 2009-10-13 | Micron Technology, Inc. | Zirconium-doped tantalum oxide films |
US20090011150A1 (en) * | 2004-08-04 | 2009-01-08 | Hyeong-Tag Jeon | Remote Plasma Atomic Layer Deposition Apparatus and Method Using Dc Bias |
US7081421B2 (en) | 2004-08-26 | 2006-07-25 | Micron Technology, Inc. | Lanthanide oxide dielectric layer |
US20060084283A1 (en) * | 2004-10-20 | 2006-04-20 | Paranjpe Ajit P | Low temperature sin deposition methods |
US7682940B2 (en) * | 2004-12-01 | 2010-03-23 | Applied Materials, Inc. | Use of Cl2 and/or HCl during silicon epitaxial film formation |
US7312128B2 (en) * | 2004-12-01 | 2007-12-25 | Applied Materials, Inc. | Selective epitaxy process with alternating gas supply |
US7560352B2 (en) * | 2004-12-01 | 2009-07-14 | Applied Materials, Inc. | Selective deposition |
US7560395B2 (en) | 2005-01-05 | 2009-07-14 | Micron Technology, Inc. | Atomic layer deposited hafnium tantalum oxide dielectrics |
WO2006078666A2 (en) | 2005-01-18 | 2006-07-27 | Asm America, Inc. | Reaction system for growing a thin film |
US7235492B2 (en) | 2005-01-31 | 2007-06-26 | Applied Materials, Inc. | Low temperature etchant for treatment of silicon-containing surfaces |
US7435454B2 (en) * | 2005-03-21 | 2008-10-14 | Tokyo Electron Limited | Plasma enhanced atomic layer deposition system and method |
US7341959B2 (en) * | 2005-03-21 | 2008-03-11 | Tokyo Electron Limited | Plasma enhanced atomic layer deposition system and method |
US8974868B2 (en) * | 2005-03-21 | 2015-03-10 | Tokyo Electron Limited | Post deposition plasma cleaning system and method |
US8163087B2 (en) * | 2005-03-31 | 2012-04-24 | Tokyo Electron Limited | Plasma enhanced atomic layer deposition system and method |
US7662729B2 (en) | 2005-04-28 | 2010-02-16 | Micron Technology, Inc. | Atomic layer deposition of a ruthenium layer to a lanthanide oxide dielectric layer |
US7572695B2 (en) | 2005-05-27 | 2009-08-11 | Micron Technology, Inc. | Hafnium titanium oxide films |
US7648927B2 (en) | 2005-06-21 | 2010-01-19 | Applied Materials, Inc. | Method for forming silicon-containing materials during a photoexcitation deposition process |
US7651955B2 (en) | 2005-06-21 | 2010-01-26 | Applied Materials, Inc. | Method for forming silicon-containing materials during a photoexcitation deposition process |
US7927948B2 (en) | 2005-07-20 | 2011-04-19 | Micron Technology, Inc. | Devices with nanocrystals and methods of formation |
EP1915470A4 (en) * | 2005-07-29 | 2012-04-04 | Aviza Tech Inc | Deposition apparatus for semiconductor processing |
US7402534B2 (en) | 2005-08-26 | 2008-07-22 | Applied Materials, Inc. | Pretreatment processes within a batch ALD reactor |
US20070082507A1 (en) * | 2005-10-06 | 2007-04-12 | Applied Materials, Inc. | Method and apparatus for the low temperature deposition of doped silicon nitride films |
US7464917B2 (en) | 2005-10-07 | 2008-12-16 | Appiled Materials, Inc. | Ampoule splash guard apparatus |
KR101019293B1 (en) | 2005-11-04 | 2011-03-07 | 어플라이드 머티어리얼스, 인코포레이티드 | Apparatus and process for plasma-enhanced atomic layer deposition |
US20070125303A1 (en) * | 2005-12-02 | 2007-06-07 | Ward Ruby | High-throughput deposition system for oxide thin film growth by reactive coevaportation |
US20070128861A1 (en) * | 2005-12-05 | 2007-06-07 | Kim Myoung S | CVD apparatus for depositing polysilicon |
CN101370963B (en) * | 2006-01-19 | 2012-03-28 | Asm美国公司 | High temperature ald inlet manifold |
US7833437B2 (en) * | 2006-01-26 | 2010-11-16 | Global Tungsten & Powders Corp. | Moisture-resistant electroluminescent phosphor with high initial brightness and method of making |
US8298666B2 (en) * | 2006-01-26 | 2012-10-30 | Global Tungsten & Powders Corp. | Moisture resistant electroluminescent phosphor with high initial brightness and method of making |
US7645710B2 (en) * | 2006-03-09 | 2010-01-12 | Applied Materials, Inc. | Method and apparatus for fabricating a high dielectric constant transistor gate using a low energy plasma system |
US7837838B2 (en) * | 2006-03-09 | 2010-11-23 | Applied Materials, Inc. | Method of fabricating a high dielectric constant transistor gate using a low energy plasma apparatus |
US7678710B2 (en) * | 2006-03-09 | 2010-03-16 | Applied Materials, Inc. | Method and apparatus for fabricating a high dielectric constant transistor gate using a low energy plasma system |
US7674337B2 (en) | 2006-04-07 | 2010-03-09 | Applied Materials, Inc. | Gas manifolds for use during epitaxial film formation |
US7798096B2 (en) | 2006-05-05 | 2010-09-21 | Applied Materials, Inc. | Plasma, UV and ion/neutral assisted ALD or CVD in a batch tool |
US7825038B2 (en) * | 2006-05-30 | 2010-11-02 | Applied Materials, Inc. | Chemical vapor deposition of high quality flow-like silicon dioxide using a silicon containing precursor and atomic oxygen |
US20070277734A1 (en) * | 2006-05-30 | 2007-12-06 | Applied Materials, Inc. | Process chamber for dielectric gapfill |
US7902080B2 (en) | 2006-05-30 | 2011-03-08 | Applied Materials, Inc. | Deposition-plasma cure cycle process to enhance film quality of silicon dioxide |
US7498273B2 (en) * | 2006-05-30 | 2009-03-03 | Applied Materials, Inc. | Formation of high quality dielectric films of silicon dioxide for STI: usage of different siloxane-based precursors for harp II—remote plasma enhanced deposition processes |
US20070289534A1 (en) * | 2006-05-30 | 2007-12-20 | Applied Materials, Inc. | Process chamber for dielectric gapfill |
US20070281106A1 (en) * | 2006-05-30 | 2007-12-06 | Applied Materials, Inc. | Process chamber for dielectric gapfill |
US7790634B2 (en) * | 2006-05-30 | 2010-09-07 | Applied Materials, Inc | Method for depositing and curing low-k films for gapfill and conformal film applications |
US8232176B2 (en) | 2006-06-22 | 2012-07-31 | Applied Materials, Inc. | Dielectric deposition and etch back processes for bottom up gapfill |
US7501355B2 (en) * | 2006-06-29 | 2009-03-10 | Applied Materials, Inc. | Decreasing the etch rate of silicon nitride by carbon addition |
KR100799735B1 (en) * | 2006-07-10 | 2008-02-01 | 삼성전자주식회사 | Method of forming metal oxide and apparatus for performing the same |
EP2047009B1 (en) * | 2006-07-21 | 2016-04-27 | Linde LLC | Methods and apparatus for the vaporization and delivery of solution precursors for atomic layer deposition |
US8029620B2 (en) | 2006-07-31 | 2011-10-04 | Applied Materials, Inc. | Methods of forming carbon-containing silicon epitaxial layers |
US7605030B2 (en) | 2006-08-31 | 2009-10-20 | Micron Technology, Inc. | Hafnium tantalum oxynitride high-k dielectric and metal gates |
US7902018B2 (en) * | 2006-09-26 | 2011-03-08 | Applied Materials, Inc. | Fluorine plasma treatment of high-k gate stack for defect passivation |
US7775508B2 (en) | 2006-10-31 | 2010-08-17 | Applied Materials, Inc. | Ampoule for liquid draw and vapor draw with a continuous level sensor |
US20080145536A1 (en) * | 2006-12-13 | 2008-06-19 | Applied Materials, Inc. | METHOD AND APPARATUS FOR LOW TEMPERATURE AND LOW K SiBN DEPOSITION |
US20080206987A1 (en) | 2007-01-29 | 2008-08-28 | Gelatos Avgerinos V | Process for tungsten nitride deposition by a temperature controlled lid assembly |
US9157152B2 (en) * | 2007-03-29 | 2015-10-13 | Tokyo Electron Limited | Vapor deposition system |
US7745352B2 (en) * | 2007-08-27 | 2010-06-29 | Applied Materials, Inc. | Curing methods for silicon dioxide thin films deposited from alkoxysilane precursor with harp II process |
US7943531B2 (en) * | 2007-10-22 | 2011-05-17 | Applied Materials, Inc. | Methods for forming a silicon oxide layer over a substrate |
US7867923B2 (en) | 2007-10-22 | 2011-01-11 | Applied Materials, Inc. | High quality silicon oxide films by remote plasma CVD from disilane precursors |
US7803722B2 (en) * | 2007-10-22 | 2010-09-28 | Applied Materials, Inc | Methods for forming a dielectric layer within trenches |
US7541297B2 (en) | 2007-10-22 | 2009-06-02 | Applied Materials, Inc. | Method and system for improving dielectric film quality for void free gap fill |
US20090120368A1 (en) * | 2007-11-08 | 2009-05-14 | Applied Materials, Inc. | Rotating temperature controlled substrate pedestal for film uniformity |
US7964040B2 (en) * | 2007-11-08 | 2011-06-21 | Applied Materials, Inc. | Multi-port pumping system for substrate processing chambers |
US8075728B2 (en) * | 2008-02-28 | 2011-12-13 | Applied Materials, Inc. | Gas flow equalizer plate suitable for use in a substrate process chamber |
US7659158B2 (en) | 2008-03-31 | 2010-02-09 | Applied Materials, Inc. | Atomic layer deposition processes for non-volatile memory devices |
US20090277587A1 (en) * | 2008-05-09 | 2009-11-12 | Applied Materials, Inc. | Flowable dielectric equipment and processes |
US8357435B2 (en) | 2008-05-09 | 2013-01-22 | Applied Materials, Inc. | Flowable dielectric equipment and processes |
US7699935B2 (en) * | 2008-06-19 | 2010-04-20 | Applied Materials, Inc. | Method and system for supplying a cleaning gas into a process chamber |
EP2151509A1 (en) * | 2008-08-04 | 2010-02-10 | Applied Materials, Inc. | Reactive gas distributor, reactive gas treatment system, and reactive gas treatment method |
US20100098851A1 (en) * | 2008-10-20 | 2010-04-22 | Varian Semiconductor Equipment Associates, Inc. | Techniques for atomic layer deposition |
US20100108263A1 (en) * | 2008-10-30 | 2010-05-06 | Applied Materials, Inc. | Extended chamber liner for improved mean time between cleanings of process chambers |
US8146896B2 (en) | 2008-10-31 | 2012-04-03 | Applied Materials, Inc. | Chemical precursor ampoule for vapor deposition processes |
US20100183825A1 (en) * | 2008-12-31 | 2010-07-22 | Cambridge Nanotech Inc. | Plasma atomic layer deposition system and method |
WO2010123877A2 (en) * | 2009-04-21 | 2010-10-28 | Applied Materials, Inc. | Cvd apparatus for improved film thickness non-uniformity and particle performance |
US8980382B2 (en) | 2009-12-02 | 2015-03-17 | Applied Materials, Inc. | Oxygen-doping for non-carbon radical-component CVD films |
US7935643B2 (en) | 2009-08-06 | 2011-05-03 | Applied Materials, Inc. | Stress management for tensile films |
US8741788B2 (en) | 2009-08-06 | 2014-06-03 | Applied Materials, Inc. | Formation of silicon oxide using non-carbon flowable CVD processes |
US7989365B2 (en) | 2009-08-18 | 2011-08-02 | Applied Materials, Inc. | Remote plasma source seasoning |
US8449942B2 (en) | 2009-11-12 | 2013-05-28 | Applied Materials, Inc. | Methods of curing non-carbon flowable CVD films |
SG181670A1 (en) | 2009-12-30 | 2012-07-30 | Applied Materials Inc | Dielectric film growth with radicals produced using flexible nitrogen/hydrogen ratio |
US8329262B2 (en) | 2010-01-05 | 2012-12-11 | Applied Materials, Inc. | Dielectric film formation using inert gas excitation |
JP2013517616A (en) | 2010-01-06 | 2013-05-16 | アプライド マテリアルズ インコーポレイテッド | Flowable dielectrics using oxide liners |
SG182333A1 (en) | 2010-01-07 | 2012-08-30 | Applied Materials Inc | In-situ ozone cure for radical-component cvd |
CN102844848A (en) | 2010-03-05 | 2012-12-26 | 应用材料公司 | Conformal layers by radical-component cvd |
US8236708B2 (en) | 2010-03-09 | 2012-08-07 | Applied Materials, Inc. | Reduced pattern loading using bis(diethylamino)silane (C8H22N2Si) as silicon precursor |
US7994019B1 (en) | 2010-04-01 | 2011-08-09 | Applied Materials, Inc. | Silicon-ozone CVD with reduced pattern loading using incubation period deposition |
US8476142B2 (en) | 2010-04-12 | 2013-07-02 | Applied Materials, Inc. | Preferential dielectric gapfill |
US20110256692A1 (en) * | 2010-04-14 | 2011-10-20 | Applied Materials, Inc. | Multiple precursor concentric delivery showerhead |
TWI539025B (en) * | 2010-04-28 | 2016-06-21 | 應用材料股份有限公司 | Process chamber lid design with built-in plasma source for short lifetime species |
US8524004B2 (en) | 2010-06-16 | 2013-09-03 | Applied Materials, Inc. | Loadlock batch ozone cure |
US8318584B2 (en) | 2010-07-30 | 2012-11-27 | Applied Materials, Inc. | Oxide-rich liner layer for flowable CVD gapfill |
WO2012031192A1 (en) * | 2010-09-03 | 2012-03-08 | First Solar, Inc. | Deposition system |
US9285168B2 (en) | 2010-10-05 | 2016-03-15 | Applied Materials, Inc. | Module for ozone cure and post-cure moisture treatment |
US8664127B2 (en) | 2010-10-15 | 2014-03-04 | Applied Materials, Inc. | Two silicon-containing precursors for gapfill enhancing dielectric liner |
WO2012088371A1 (en) | 2010-12-22 | 2012-06-28 | Brooks Automation, Inc. | Workpiece handling module |
US10283321B2 (en) | 2011-01-18 | 2019-05-07 | Applied Materials, Inc. | Semiconductor processing system and methods using capacitively coupled plasma |
US20120180954A1 (en) | 2011-01-18 | 2012-07-19 | Applied Materials, Inc. | Semiconductor processing system and methods using capacitively coupled plasma |
US8450191B2 (en) | 2011-01-24 | 2013-05-28 | Applied Materials, Inc. | Polysilicon films by HDP-CVD |
US8716154B2 (en) | 2011-03-04 | 2014-05-06 | Applied Materials, Inc. | Reduced pattern loading using silicon oxide multi-layers |
US8445078B2 (en) | 2011-04-20 | 2013-05-21 | Applied Materials, Inc. | Low temperature silicon oxide conversion |
US8466073B2 (en) | 2011-06-03 | 2013-06-18 | Applied Materials, Inc. | Capping layer for reduced outgassing |
US9404178B2 (en) | 2011-07-15 | 2016-08-02 | Applied Materials, Inc. | Surface treatment and deposition for reduced outgassing |
US8617989B2 (en) | 2011-09-26 | 2013-12-31 | Applied Materials, Inc. | Liner property improvement |
US8551891B2 (en) | 2011-10-04 | 2013-10-08 | Applied Materials, Inc. | Remote plasma burn-in |
US9109754B2 (en) | 2011-10-19 | 2015-08-18 | Applied Materials, Inc. | Apparatus and method for providing uniform flow of gas |
US8955547B2 (en) | 2011-10-19 | 2015-02-17 | Applied Materials, Inc. | Apparatus and method for providing uniform flow of gas |
US9017481B1 (en) | 2011-10-28 | 2015-04-28 | Asm America, Inc. | Process feed management for semiconductor substrate processing |
US9574268B1 (en) | 2011-10-28 | 2017-02-21 | Asm America, Inc. | Pulsed valve manifold for atomic layer deposition |
US8826857B2 (en) * | 2011-11-21 | 2014-09-09 | Lam Research Corporation | Plasma processing assemblies including hinge assemblies |
US9388492B2 (en) | 2011-12-27 | 2016-07-12 | Asm America, Inc. | Vapor flow control apparatus for atomic layer deposition |
US8889566B2 (en) | 2012-09-11 | 2014-11-18 | Applied Materials, Inc. | Low cost flowable dielectric films |
WO2014074589A1 (en) * | 2012-11-06 | 2014-05-15 | Applied Materials, Inc. | Apparatus for spatial atomic layer deposition with recirculation and methods of use |
US9018108B2 (en) | 2013-01-25 | 2015-04-28 | Applied Materials, Inc. | Low shrinkage dielectric films |
US9275869B2 (en) * | 2013-08-02 | 2016-03-01 | Lam Research Corporation | Fast-gas switching for etching |
WO2015061616A1 (en) | 2013-10-24 | 2015-04-30 | Surmet Corporation | High purity polycrystalline aluminum oxynitride bodies |
US11414759B2 (en) * | 2013-11-29 | 2022-08-16 | Taiwan Semiconductor Manufacturing Co., Ltd | Mechanisms for supplying process gas into wafer process apparatus |
US9353440B2 (en) | 2013-12-20 | 2016-05-31 | Applied Materials, Inc. | Dual-direction chemical delivery system for ALD/CVD chambers |
US9657397B2 (en) * | 2013-12-31 | 2017-05-23 | Lam Research Ag | Apparatus for treating surfaces of wafer-shaped articles |
US9412581B2 (en) | 2014-07-16 | 2016-08-09 | Applied Materials, Inc. | Low-K dielectric gapfill by flowable deposition |
JP6446881B2 (en) * | 2014-07-17 | 2019-01-09 | 東京エレクトロン株式会社 | Gas supply device and valve device |
US9460915B2 (en) | 2014-09-12 | 2016-10-04 | Lam Research Corporation | Systems and methods for reducing backside deposition and mitigating thickness changes at substrate edges |
TWI676709B (en) * | 2015-01-22 | 2019-11-11 | 美商應用材料股份有限公司 | Atomic layer deposition of films using spatially separated injector chamber |
JP6398761B2 (en) * | 2015-02-04 | 2018-10-03 | 東京エレクトロン株式会社 | Substrate processing equipment |
US9435677B1 (en) * | 2015-03-12 | 2016-09-06 | Diamond Shine, Inc. | Liquid containment and measurement apparatus and method |
US11384432B2 (en) * | 2015-04-22 | 2022-07-12 | Applied Materials, Inc. | Atomic layer deposition chamber with funnel-shaped gas dispersion channel and gas distribution plate |
WO2016209886A1 (en) * | 2015-06-22 | 2016-12-29 | University Of South Carolina | MOCVD SYSTEM INJECTOR FOR FAST GROWTH OF AlInGaBN MATERIAL |
US20170211180A1 (en) * | 2016-01-22 | 2017-07-27 | Silcotek Corp. | Diffusion-rate-limited thermal chemical vapor deposition coating |
US10256075B2 (en) * | 2016-01-22 | 2019-04-09 | Applied Materials, Inc. | Gas splitting by time average injection into different zones by fast gas valves |
US10662527B2 (en) | 2016-06-01 | 2020-05-26 | Asm Ip Holding B.V. | Manifolds for uniform vapor deposition |
US9896762B1 (en) * | 2016-12-16 | 2018-02-20 | Asm Ip Holding B.V. | Method of depositing and etching film in one processing apparatus |
TWI649446B (en) * | 2017-03-15 | 2019-02-01 | 漢民科技股份有限公司 | Detachable gas injectorused for semiconductor equipment |
US10276411B2 (en) | 2017-08-18 | 2019-04-30 | Applied Materials, Inc. | High pressure and high temperature anneal chamber |
US10636629B2 (en) * | 2017-10-05 | 2020-04-28 | Applied Materials, Inc. | Split slit liner door |
US10872804B2 (en) | 2017-11-03 | 2020-12-22 | Asm Ip Holding B.V. | Apparatus and methods for isolating a reaction chamber from a loading chamber resulting in reduced contamination |
US10872803B2 (en) | 2017-11-03 | 2020-12-22 | Asm Ip Holding B.V. | Apparatus and methods for isolating a reaction chamber from a loading chamber resulting in reduced contamination |
US10818479B2 (en) * | 2017-11-12 | 2020-10-27 | Taiwan Semiconductor Manufacturing Company, Ltd. | Grounding cap module, gas injection device and etching apparatus |
CN111670265A (en) * | 2018-01-31 | 2020-09-15 | 朗姆研究公司 | Manifold valve for multiple precursors |
US10679870B2 (en) * | 2018-02-15 | 2020-06-09 | Applied Materials, Inc. | Semiconductor processing chamber multistage mixing apparatus |
SG11202008268RA (en) | 2018-03-19 | 2020-10-29 | Applied Materials Inc | Methods for depositing coatings on aerospace components |
US11015252B2 (en) | 2018-04-27 | 2021-05-25 | Applied Materials, Inc. | Protection of components from corrosion |
US11009339B2 (en) | 2018-08-23 | 2021-05-18 | Applied Materials, Inc. | Measurement of thickness of thermal barrier coatings using 3D imaging and surface subtraction methods for objects with complex geometries |
TW202020218A (en) | 2018-09-14 | 2020-06-01 | 美商應用材料股份有限公司 | Apparatus for multi-flow precursor dosage |
JP6966499B2 (en) * | 2019-03-06 | 2021-11-17 | Ckd株式会社 | Gas supply unit and gas supply method |
US11492701B2 (en) | 2019-03-19 | 2022-11-08 | Asm Ip Holding B.V. | Reactor manifolds |
KR20210138119A (en) | 2019-04-08 | 2021-11-18 | 어플라이드 머티어리얼스, 인코포레이티드 | Methods for Modifying Photoresist Profiles and Tuning Critical Dimensions |
WO2020219332A1 (en) | 2019-04-26 | 2020-10-29 | Applied Materials, Inc. | Methods of protecting aerospace components against corrosion and oxidation |
US11794382B2 (en) | 2019-05-16 | 2023-10-24 | Applied Materials, Inc. | Methods for depositing anti-coking protective coatings on aerospace components |
US11697879B2 (en) | 2019-06-14 | 2023-07-11 | Applied Materials, Inc. | Methods for depositing sacrificial coatings on aerospace components |
JP7285152B2 (en) * | 2019-07-08 | 2023-06-01 | 東京エレクトロン株式会社 | Plasma processing equipment |
US11466364B2 (en) | 2019-09-06 | 2022-10-11 | Applied Materials, Inc. | Methods for forming protective coatings containing crystallized aluminum oxide |
US11881384B2 (en) * | 2019-09-27 | 2024-01-23 | Applied Materials, Inc. | Monolithic modular microwave source with integrated process gas distribution |
US11205589B2 (en) * | 2019-10-06 | 2021-12-21 | Applied Materials, Inc. | Methods and apparatuses for forming interconnection structures |
KR20210048408A (en) | 2019-10-22 | 2021-05-03 | 에이에스엠 아이피 홀딩 비.브이. | Semiconductor deposition reactor manifolds |
US11519066B2 (en) | 2020-05-21 | 2022-12-06 | Applied Materials, Inc. | Nitride protective coatings on aerospace components and methods for making the same |
EP4175772A1 (en) | 2020-07-03 | 2023-05-10 | Applied Materials, Inc. | Methods for refurbishing aerospace components |
US20220084845A1 (en) * | 2020-09-17 | 2022-03-17 | Applied Materials, Inc. | High conductance process kit |
US20220328293A1 (en) * | 2021-04-13 | 2022-10-13 | Applied Materials, Inc. | Isolator for processing chambers |
JP2023161122A (en) * | 2022-04-25 | 2023-11-07 | キオクシア株式会社 | Film forming device and film forming method |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3854443A (en) * | 1973-12-19 | 1974-12-17 | Intel Corp | Gas reactor for depositing thin films |
WO1998023788A1 (en) * | 1996-11-27 | 1998-06-04 | Emcore Corporation | Chemical vapor deposition apparatus |
US5976261A (en) * | 1996-07-11 | 1999-11-02 | Cvc Products, Inc. | Multi-zone gas injection apparatus and method for microelectronics manufacturing equipment |
JP2000212752A (en) * | 1999-01-18 | 2000-08-02 | Samsung Electronics Co Ltd | Reaction chamber gas flowing method and shower head used therefor |
US6176198B1 (en) * | 1998-11-02 | 2001-01-23 | Applied Materials, Inc. | Apparatus and method for depositing low K dielectric materials |
EP1167569A1 (en) * | 2000-06-24 | 2002-01-02 | IPS Limited | Apparatus and method for depositing thin film on wafer using atomic layer deposition |
Family Cites Families (239)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SE393967B (en) | 1974-11-29 | 1977-05-31 | Sateko Oy | PROCEDURE AND PERFORMANCE OF LAYING BETWEEN THE STORAGE IN A LABOR PACKAGE |
FI57975C (en) | 1979-02-28 | 1980-11-10 | Lohja Ab Oy | OVER ANCHORING VIDEO UPDATE FOR AVAILABILITY |
US4270999A (en) * | 1979-09-28 | 1981-06-02 | International Business Machines Corporation | Method and apparatus for gas feed control in a dry etching process |
US4389973A (en) | 1980-03-18 | 1983-06-28 | Oy Lohja Ab | Apparatus for performing growth of compound thin films |
US4415275A (en) | 1981-12-21 | 1983-11-15 | Dietrich David E | Swirl mixing device |
FI64878C (en) | 1982-05-10 | 1984-01-10 | Lohja Ab Oy | KOMBINATIONSFILM FOER ISYNNERHET TUNNFILMELEKTROLUMINENSSTRUKTURER |
US5294286A (en) | 1984-07-26 | 1994-03-15 | Research Development Corporation Of Japan | Process for forming a thin film of silicon |
GB2162207B (en) | 1984-07-26 | 1989-05-10 | Japan Res Dev Corp | Semiconductor crystal growth apparatus |
US4612077A (en) * | 1985-07-29 | 1986-09-16 | The Perkin-Elmer Corporation | Electrode for plasma etching system |
US4747367A (en) * | 1986-06-12 | 1988-05-31 | Crystal Specialties, Inc. | Method and apparatus for producing a constant flow, constant pressure chemical vapor deposition |
US4761269A (en) * | 1986-06-12 | 1988-08-02 | Crystal Specialties, Inc. | Apparatus for depositing material on a substrate |
JPH0639357B2 (en) | 1986-09-08 | 1994-05-25 | 新技術開発事業団 | Method for growing element semiconductor single crystal thin film |
DE3721637A1 (en) | 1987-06-30 | 1989-01-12 | Aixtron Gmbh | GAS INLET FOR A MULTIPLE DIFFERENT REACTION GAS IN REACTION VESSELS |
DE3743938C2 (en) | 1987-12-23 | 1995-08-31 | Cs Halbleiter Solartech | Process for atomic layer epitaxy growth of a III / V compound semiconductor thin film |
FR2628985B1 (en) * | 1988-03-22 | 1990-12-28 | Labo Electronique Physique | EPITAXY REACTOR WITH WALL PROTECTION |
US5261959A (en) | 1988-05-26 | 1993-11-16 | General Electric Company | Diamond crystal growth apparatus |
JPH0824191B2 (en) | 1989-03-17 | 1996-03-06 | 富士通株式会社 | Thin film transistor |
JP2888253B2 (en) * | 1989-07-20 | 1999-05-10 | 富士通株式会社 | Chemical vapor deposition and apparatus for its implementation |
US5225366A (en) | 1990-06-22 | 1993-07-06 | The United States Of America As Represented By The Secretary Of The Navy | Apparatus for and a method of growing thin films of elemental semiconductors |
US5483919A (en) | 1990-08-31 | 1996-01-16 | Nippon Telegraph And Telephone Corporation | Atomic layer epitaxy method and apparatus |
US5177327A (en) * | 1990-11-16 | 1993-01-05 | Exzec, Inc. | Acoustic touch position sensor using shear wave propagation |
US5178681A (en) | 1991-01-29 | 1993-01-12 | Applied Materials, Inc. | Suspension system for semiconductor reactors |
US5173327A (en) | 1991-06-18 | 1992-12-22 | Micron Technology, Inc. | LPCVD process for depositing titanium films for semiconductor devices |
US5480818A (en) | 1992-02-10 | 1996-01-02 | Fujitsu Limited | Method for forming a film and method for manufacturing a thin film transistor |
US5368685A (en) * | 1992-03-24 | 1994-11-29 | Hitachi, Ltd. | Dry etching apparatus and method |
US5306666A (en) | 1992-07-24 | 1994-04-26 | Nippon Steel Corporation | Process for forming a thin metal film by chemical vapor deposition |
US5338362A (en) * | 1992-08-29 | 1994-08-16 | Tokyo Electron Limited | Apparatus for processing semiconductor wafer comprising continuously rotating wafer table and plural chamber compartments |
US5567267A (en) * | 1992-11-20 | 1996-10-22 | Tokyo Electron Limited | Method of controlling temperature of susceptor |
US5453124A (en) * | 1992-12-30 | 1995-09-26 | Texas Instruments Incorporated | Programmable multizone gas injector for single-wafer semiconductor processing equipment |
US5607009A (en) | 1993-01-28 | 1997-03-04 | Applied Materials, Inc. | Method of heating and cooling large area substrates and apparatus therefor |
JP3234025B2 (en) | 1993-02-24 | 2001-12-04 | 日本インテック株式会社 | Electrolyzed water generator |
JP3265042B2 (en) | 1993-03-18 | 2002-03-11 | 東京エレクトロン株式会社 | Film formation method |
US5443647A (en) | 1993-04-28 | 1995-08-22 | The United States Of America As Represented By The Secretary Of The Army | Method and apparatus for depositing a refractory thin film by chemical vapor deposition |
US5411703A (en) * | 1993-06-16 | 1995-05-02 | International Business Machines Corporation | Lead-free, tin, antimony, bismtuh, copper solder alloy |
US5484484A (en) * | 1993-07-03 | 1996-01-16 | Tokyo Electron Kabushiki | Thermal processing method and apparatus therefor |
US5578132A (en) * | 1993-07-07 | 1996-11-26 | Tokyo Electron Kabushiki Kaisha | Apparatus for heat treating semiconductors at normal pressure and low pressure |
JP2889098B2 (en) * | 1993-10-13 | 1999-05-10 | 株式会社本山製作所 | Specific gas supply control device |
JP3181171B2 (en) * | 1994-05-20 | 2001-07-03 | シャープ株式会社 | Vapor phase growth apparatus and vapor phase growth method |
GB9410567D0 (en) * | 1994-05-26 | 1994-07-13 | Philips Electronics Uk Ltd | Plasma treatment and apparatus in electronic device manufacture |
US5796116A (en) | 1994-07-27 | 1998-08-18 | Sharp Kabushiki Kaisha | Thin-film semiconductor device including a semiconductor film with high field-effect mobility |
FI100409B (en) * | 1994-11-28 | 1997-11-28 | Asm Int | Method and apparatus for making thin films |
FI97730C (en) | 1994-11-28 | 1997-02-10 | Mikrokemia Oy | Equipment for the production of thin films |
FI97731C (en) | 1994-11-28 | 1997-02-10 | Mikrokemia Oy | Method and apparatus for making thin films |
TW283250B (en) * | 1995-07-10 | 1996-08-11 | Watkins Johnson Co | Plasma enhanced chemical processing reactor and method |
TW356554B (en) * | 1995-10-23 | 1999-04-21 | Watkins Johnson Co | Gas injection system for semiconductor processing |
US6313035B1 (en) * | 1996-05-31 | 2001-11-06 | Micron Technology, Inc. | Chemical vapor deposition using organometallic precursors |
US6342277B1 (en) * | 1996-08-16 | 2002-01-29 | Licensee For Microelectronics: Asm America, Inc. | Sequential chemical vapor deposition |
DE19630522C2 (en) * | 1996-07-29 | 2002-10-02 | Freudenberg Carl Kg | Process for producing a pleatable filter medium and device for carrying out the process |
US5916365A (en) | 1996-08-16 | 1999-06-29 | Sherman; Arthur | Sequential chemical vapor deposition |
US5835677A (en) | 1996-10-03 | 1998-11-10 | Emcore Corporation | Liquid vaporizer system and method |
US5923056A (en) | 1996-10-10 | 1999-07-13 | Lucent Technologies Inc. | Electronic components with doped metal oxide dielectric materials and a process for making electronic components with doped metal oxide dielectric materials |
US6071572A (en) * | 1996-10-15 | 2000-06-06 | Applied Materials, Inc. | Forming tin thin films using remote activated specie generation |
US5807792A (en) | 1996-12-18 | 1998-09-15 | Siemens Aktiengesellschaft | Uniform distribution of reactants in a device layer |
US6055927A (en) * | 1997-01-14 | 2000-05-02 | Applied Komatsu Technology, Inc. | Apparatus and method for white powder reduction in silicon nitride deposition using remote plasma source cleaning technology |
US6043177A (en) | 1997-01-21 | 2000-03-28 | University Technology Corporation | Modification of zeolite or molecular sieve membranes using atomic layer controlled chemical vapor deposition |
US5879459A (en) | 1997-08-29 | 1999-03-09 | Genus, Inc. | Vertically-stacked process reactor and cluster tool system for atomic layer deposition |
US6174377B1 (en) | 1997-03-03 | 2001-01-16 | Genus, Inc. | Processing chamber for atomic layer deposition processes |
JPH10308283A (en) | 1997-03-04 | 1998-11-17 | Denso Corp | El element and its manufacture |
TW417249B (en) * | 1997-05-14 | 2001-01-01 | Applied Materials Inc | Reliability barrier integration for cu application |
FI972874A0 (en) | 1997-07-04 | 1997-07-04 | Mikrokemia Oy | Foerfarande och anordning Foer framstaellning av tunnfilmer |
US6073366A (en) * | 1997-07-11 | 2000-06-13 | Asm America, Inc. | Substrate cooling system and method |
US6287965B1 (en) * | 1997-07-28 | 2001-09-11 | Samsung Electronics Co, Ltd. | Method of forming metal layer using atomic layer deposition and semiconductor device having the metal layer as barrier metal layer or upper or lower electrode of capacitor |
KR100385946B1 (en) * | 1999-12-08 | 2003-06-02 | 삼성전자주식회사 | Method for forming a metal layer by an atomic layer deposition and a semiconductor device with the metal layer as a barrier metal layer, an upper electrode, or a lower electrode of capacitor |
KR100269306B1 (en) | 1997-07-31 | 2000-10-16 | 윤종용 | Integrate circuit device having buffer layer containing metal oxide stabilized by low temperature treatment and fabricating method thereof |
KR100261017B1 (en) | 1997-08-19 | 2000-08-01 | 윤종용 | Method for forming metal wiring of semiconductor device |
US6197683B1 (en) * | 1997-09-29 | 2001-03-06 | Samsung Electronics Co., Ltd. | Method of forming metal nitride film by chemical vapor deposition and method of forming metal contact of semiconductor device using the same |
KR100274603B1 (en) | 1997-10-01 | 2001-01-15 | 윤종용 | Method and apparatus for fabricating semiconductor device |
KR100252049B1 (en) | 1997-11-18 | 2000-04-15 | 윤종용 | The atomic layer deposition method for fabricating aluminum layer |
US5972430A (en) * | 1997-11-26 | 1999-10-26 | Advanced Technology Materials, Inc. | Digital chemical vapor deposition (CVD) method for forming a multi-component oxide layer |
FI104383B (en) * | 1997-12-09 | 2000-01-14 | Fortum Oil & Gas Oy | Procedure for coating the inside of a plant |
KR100269328B1 (en) | 1997-12-31 | 2000-10-16 | 윤종용 | Method for forming conductive layer using atomic layer deposition process |
KR100275727B1 (en) * | 1998-01-06 | 2001-01-15 | 윤종용 | Capacitor for semiconductor device & manufacturing method |
US6022483A (en) * | 1998-03-10 | 2000-02-08 | Intergrated Systems, Inc. | System and method for controlling pressure |
KR100267885B1 (en) | 1998-05-18 | 2000-11-01 | 서성기 | Deposition apparatus |
KR100282853B1 (en) | 1998-05-18 | 2001-04-02 | 서성기 | Apparatus for thin film deposition using cyclic gas injection |
NL1009327C2 (en) | 1998-06-05 | 1999-12-10 | Asm Int | Method and device for transferring wafers. |
JP2000031387A (en) | 1998-07-14 | 2000-01-28 | Fuji Electric Co Ltd | Manufacture of dielectric thin film capacitor |
KR100275738B1 (en) | 1998-08-07 | 2000-12-15 | 윤종용 | Method for producing thin film using atomatic layer deposition |
KR20000013654A (en) | 1998-08-12 | 2000-03-06 | 윤종용 | Capacitor having an al2o3/aln mixed dielectric layer by using an atomic layer deposition and a manufacturing method thereof |
KR100287180B1 (en) * | 1998-09-17 | 2001-04-16 | 윤종용 | Method for manufacturing semiconductor device including metal interconnection formed using interface control layer |
KR100327328B1 (en) | 1998-10-13 | 2002-05-09 | 윤종용 | Method for forming dielectric layer of capacitor having partially different thickness in the layer |
KR100297719B1 (en) * | 1998-10-16 | 2001-08-07 | 윤종용 | Method for manufacturing thin film |
US20030101938A1 (en) | 1998-10-27 | 2003-06-05 | Applied Materials, Inc. | Apparatus for the deposition of high dielectric constant films |
US6200893B1 (en) | 1999-03-11 | 2001-03-13 | Genus, Inc | Radical-assisted sequential CVD |
US6305314B1 (en) * | 1999-03-11 | 2001-10-23 | Genvs, Inc. | Apparatus and concept for minimizing parasitic chemical vapor deposition during atomic layer deposition |
JP2000306884A (en) * | 1999-04-22 | 2000-11-02 | Mitsubishi Electric Corp | Apparatus and method for plasma treatment |
KR100347379B1 (en) | 1999-05-01 | 2002-08-07 | 주식회사 피케이엘 | Atomic layer deposition apparatus for depositing multi substrate |
US20030232554A1 (en) | 1999-05-04 | 2003-12-18 | Blum Ronald D. | Multi-layer tacky and water-absorbing shoe-cleaning product |
FI118342B (en) | 1999-05-10 | 2007-10-15 | Asm Int | Apparatus for making thin films |
JP4291916B2 (en) | 1999-05-24 | 2009-07-08 | プレス工業株式会社 | Toothed ring and method for forming convex teeth thereof |
US6124158A (en) | 1999-06-08 | 2000-09-26 | Lucent Technologies Inc. | Method of reducing carbon contamination of a thin dielectric film by using gaseous organic precursors, inert gas, and ozone to react with carbon contaminants |
KR100319494B1 (en) * | 1999-07-15 | 2002-01-09 | 김용일 | Apparatus for Deposition of thin films on wafers through atomic layer epitaxial process |
KR20010017820A (en) | 1999-08-14 | 2001-03-05 | 윤종용 | Semiconductor device and manufacturing method thereof |
US6984415B2 (en) * | 1999-08-20 | 2006-01-10 | International Business Machines Corporation | Delivery systems for gases for gases via the sublimation of solid precursors |
US6511539B1 (en) * | 1999-09-08 | 2003-01-28 | Asm America, Inc. | Apparatus and method for growth of a thin film |
TW515032B (en) | 1999-10-06 | 2002-12-21 | Samsung Electronics Co Ltd | Method of forming thin film using atomic layer deposition method |
FI117942B (en) | 1999-10-14 | 2007-04-30 | Asm Int | Process for making oxide thin films |
US6203613B1 (en) | 1999-10-19 | 2001-03-20 | International Business Machines Corporation | Atomic layer deposition with nitrate containing precursors |
JP4523094B2 (en) * | 1999-10-19 | 2010-08-11 | 東京エレクトロン株式会社 | Plasma processing method |
US6780704B1 (en) | 1999-12-03 | 2004-08-24 | Asm International Nv | Conformal thin films over textured capacitor electrodes |
KR100330749B1 (en) | 1999-12-17 | 2002-04-03 | 서성기 | Thin film deposition apparatus for semiconductor |
FI118343B (en) * | 1999-12-28 | 2007-10-15 | Asm Int | Apparatus for making thin films |
FI118474B (en) * | 1999-12-28 | 2007-11-30 | Asm Int | Apparatus for making thin films |
JP4362919B2 (en) | 2000-02-04 | 2009-11-11 | 株式会社デンソー | Deposition method by atomic layer epitaxial growth method |
KR100378871B1 (en) | 2000-02-16 | 2003-04-07 | 주식회사 아펙스 | showerhead apparatus for radical assisted deposition |
KR100803770B1 (en) | 2000-03-07 | 2008-02-15 | 에이에스엠 인터내셔널 엔.브이. | Graded thin films |
FI117978B (en) | 2000-04-14 | 2007-05-15 | Asm Int | Method and apparatus for constructing a thin film on a substrate |
US7060132B2 (en) | 2000-04-14 | 2006-06-13 | Asm International N.V. | Method and apparatus of growing a thin film |
FI117980B (en) | 2000-04-14 | 2007-05-15 | Asm Int | A method of constructing a thin film on a substrate |
KR100363088B1 (en) * | 2000-04-20 | 2002-12-02 | 삼성전자 주식회사 | Method of manufacturing barrier metal layer using atomic layer deposition method |
JP2001328900A (en) | 2000-05-15 | 2001-11-27 | Denso Corp | Method for forming thin film |
FI118805B (en) | 2000-05-15 | 2008-03-31 | Asm Int | A method and configuration for introducing a gas phase reactant into a reaction chamber |
KR100427423B1 (en) * | 2000-05-25 | 2004-04-13 | 가부시키가이샤 고베 세이코쇼 | Inner tube for cvd apparatus |
KR100403611B1 (en) | 2000-06-07 | 2003-11-01 | 삼성전자주식회사 | Metal-insulator-metal capacitor and manufacturing method thereof |
KR100647442B1 (en) | 2000-06-07 | 2006-11-17 | 주성엔지니어링(주) | Method of forming a thin film using atomic layer deposition |
EP2293322A1 (en) * | 2000-06-08 | 2011-03-09 | Genitech, Inc. | Method for forming a metal nitride layer |
US6863019B2 (en) * | 2000-06-13 | 2005-03-08 | Applied Materials, Inc. | Semiconductor device fabrication chamber cleaning method and apparatus with recirculation of cleaning gas |
KR100332314B1 (en) * | 2000-06-24 | 2002-04-12 | 서성기 | Reactor for depositing thin film on wafer |
FI20001694A0 (en) | 2000-07-20 | 2000-07-20 | Asm Microchemistry Oy | A method for growing a thin film on a substrate |
KR100444149B1 (en) * | 2000-07-22 | 2004-08-09 | 주식회사 아이피에스 | ALD thin film depositin equipment cleaning method |
KR100396879B1 (en) * | 2000-08-11 | 2003-09-02 | 삼성전자주식회사 | Semiconductor memory device having capacitor encapsulated by multi-layer which includes double layeres being made of same material and method of manufacturing thereof |
US6302965B1 (en) * | 2000-08-15 | 2001-10-16 | Applied Materials, Inc. | Dispersion plate for flowing vaporizes compounds used in chemical vapor deposition of films onto semiconductor surfaces |
US6446572B1 (en) * | 2000-08-18 | 2002-09-10 | Tokyo Electron Limited | Embedded plasma source for plasma density improvement |
US6660660B2 (en) | 2000-10-10 | 2003-12-09 | Asm International, Nv. | Methods for making a dielectric stack in an integrated circuit |
TW548239B (en) | 2000-10-23 | 2003-08-21 | Asm Microchemistry Oy | Process for producing aluminium oxide films at low temperatures |
KR100436941B1 (en) | 2000-11-07 | 2004-06-23 | 주성엔지니어링(주) | apparatus and method for depositing thin film |
US6613695B2 (en) | 2000-11-24 | 2003-09-02 | Asm America, Inc. | Surface preparation prior to deposition |
JP4333900B2 (en) | 2000-11-30 | 2009-09-16 | エーエスエム インターナショナル エヌ.ヴェー. | Magnetic memory cell, method for manufacturing magnetic structure and magnetic element, and method for growing metal layer for magnetic structure |
US6878402B2 (en) * | 2000-12-06 | 2005-04-12 | Novellus Systems, Inc. | Method and apparatus for improved temperature control in atomic layer deposition |
US20020104481A1 (en) | 2000-12-06 | 2002-08-08 | Chiang Tony P. | System and method for modulated ion-induced atomic layer deposition (MII-ALD) |
KR100385947B1 (en) * | 2000-12-06 | 2003-06-02 | 삼성전자주식회사 | Method of forming thin film by atomic layer deposition |
KR100386034B1 (en) | 2000-12-06 | 2003-06-02 | 에이에스엠 마이크로케미스트리 리미티드 | Method of Fabricating Semiconductor Device Employing Copper Interconnect Structure Having Diffusion Barrier Stuffed with Metal Oxide |
JP2002172835A (en) * | 2000-12-08 | 2002-06-18 | Fuji Photo Film Co Ltd | Image recorder and shading collecting method using it |
US6630201B2 (en) * | 2001-04-05 | 2003-10-07 | Angstron Systems, Inc. | Adsorption process for atomic layer deposition |
US20020076507A1 (en) * | 2000-12-15 | 2002-06-20 | Chiang Tony P. | Process sequence for atomic layer deposition |
US20020073924A1 (en) * | 2000-12-15 | 2002-06-20 | Chiang Tony P. | Gas introduction system for a reactor |
US20020076481A1 (en) * | 2000-12-15 | 2002-06-20 | Chiang Tony P. | Chamber pressure state-based control for a reactor |
KR20020049875A (en) * | 2000-12-20 | 2002-06-26 | 윤종용 | Ferroelectric capacitor in semiconductor memory device and method for manufacturing the same |
JP3963078B2 (en) * | 2000-12-25 | 2007-08-22 | 株式会社高純度化学研究所 | Tertiary amylimidotris (dimethylamido) tantalum, method for producing the same, raw material solution for MOCVD using the same, and method for forming a tantalum nitride film using the same |
KR20020056260A (en) | 2000-12-29 | 2002-07-10 | 박종섭 | Method for forming metal gate of semiconductor devoie |
KR100434487B1 (en) | 2001-01-17 | 2004-06-05 | 삼성전자주식회사 | Shower head & film forming apparatus having the same |
US6844604B2 (en) | 2001-02-02 | 2005-01-18 | Samsung Electronics Co., Ltd. | Dielectric layer for semiconductor device and method of manufacturing the same |
US7026219B2 (en) | 2001-02-12 | 2006-04-11 | Asm America, Inc. | Integration of high k gate dielectric |
US6613656B2 (en) * | 2001-02-13 | 2003-09-02 | Micron Technology, Inc. | Sequential pulse deposition |
US20020117399A1 (en) * | 2001-02-23 | 2002-08-29 | Applied Materials, Inc. | Atomically thin highly resistive barrier layer in a copper via |
US6660126B2 (en) | 2001-03-02 | 2003-12-09 | Applied Materials, Inc. | Lid assembly for a processing system to facilitate sequential deposition techniques |
US6878206B2 (en) * | 2001-07-16 | 2005-04-12 | Applied Materials, Inc. | Lid assembly for a processing system to facilitate sequential deposition techniques |
US20020121241A1 (en) | 2001-03-02 | 2002-09-05 | Nguyen Anh N. | Processing chamber and method of distributing process fluids therein to facilitate sequential deposition of films |
US6734020B2 (en) * | 2001-03-07 | 2004-05-11 | Applied Materials, Inc. | Valve control system for atomic layer deposition chamber |
US6812101B2 (en) * | 2001-04-02 | 2004-11-02 | Matsushita Electric Industrial Co., Ltd. | Semiconductor device and method for manufacture thereof |
US20020144655A1 (en) * | 2001-04-05 | 2002-10-10 | Chiang Tony P. | Gas valve system for a reactor |
US20020144657A1 (en) | 2001-04-05 | 2002-10-10 | Chiang Tony P. | ALD reactor employing electrostatic chuck |
US20030019428A1 (en) * | 2001-04-28 | 2003-01-30 | Applied Materials, Inc. | Chemical vapor deposition chamber |
US6759081B2 (en) | 2001-05-11 | 2004-07-06 | Asm International, N.V. | Method of depositing thin films for magnetic heads |
KR100363332B1 (en) | 2001-05-23 | 2002-12-05 | Samsung Electronics Co Ltd | Method for forming semiconductor device having gate all-around type transistor |
US6828218B2 (en) * | 2001-05-31 | 2004-12-07 | Samsung Electronics Co., Ltd. | Method of forming a thin film using atomic layer deposition |
US6709989B2 (en) | 2001-06-21 | 2004-03-23 | Motorola, Inc. | Method for fabricating a semiconductor structure including a metal oxide interface with silicon |
US6861334B2 (en) * | 2001-06-21 | 2005-03-01 | Asm International, N.V. | Method of fabricating trench isolation structures for integrated circuits using atomic layer deposition |
JP4680429B2 (en) * | 2001-06-26 | 2011-05-11 | Okiセミコンダクタ株式会社 | High speed reading control method in text-to-speech converter |
US7049049B2 (en) * | 2001-06-27 | 2006-05-23 | University Of South Florida | Maskless photolithography for using photoreactive agents |
TW539822B (en) * | 2001-07-03 | 2003-07-01 | Asm Inc | Source chemical container assembly |
US20030198754A1 (en) * | 2001-07-16 | 2003-10-23 | Ming Xi | Aluminum oxide chamber and process |
US20030017697A1 (en) * | 2001-07-19 | 2003-01-23 | Kyung-In Choi | Methods of forming metal layers using metallic precursors |
US7098131B2 (en) | 2001-07-19 | 2006-08-29 | Samsung Electronics Co., Ltd. | Methods for forming atomic layers and thin films including tantalum nitride and devices including the same |
US7105444B2 (en) * | 2001-07-19 | 2006-09-12 | Samsung Electronics Co., Ltd. | Method for forming a wiring of a semiconductor device, method for forming a metal layer of a semiconductor device and apparatus for performing the same |
US7085616B2 (en) * | 2001-07-27 | 2006-08-01 | Applied Materials, Inc. | Atomic layer deposition apparatus |
US6820570B2 (en) * | 2001-08-15 | 2004-11-23 | Nobel Biocare Services Ag | Atomic layer deposition reactor |
US6806145B2 (en) * | 2001-08-31 | 2004-10-19 | Asm International, N.V. | Low temperature method of forming a gate stack with a high k layer deposited over an interfacial oxide layer |
US20030042630A1 (en) * | 2001-09-05 | 2003-03-06 | Babcoke Jason E. | Bubbler for gas delivery |
US6718126B2 (en) * | 2001-09-14 | 2004-04-06 | Applied Materials, Inc. | Apparatus and method for vaporizing solid precursor for CVD or atomic layer deposition |
US6936906B2 (en) * | 2001-09-26 | 2005-08-30 | Applied Materials, Inc. | Integration of barrier layer and seed layer |
US7049226B2 (en) * | 2001-09-26 | 2006-05-23 | Applied Materials, Inc. | Integration of ALD tantalum nitride for copper metallization |
US6960537B2 (en) * | 2001-10-02 | 2005-11-01 | Asm America, Inc. | Incorporation of nitrogen into high k dielectric film |
TW512504B (en) * | 2001-10-12 | 2002-12-01 | Advanced Semiconductor Eng | Package substrate having protruded and recessed side edge |
TW540222B (en) * | 2001-10-16 | 2003-07-01 | Benq Corp | Scanner simultaneously using external power supply and USB bus power |
US6916398B2 (en) * | 2001-10-26 | 2005-07-12 | Applied Materials, Inc. | Gas delivery apparatus and method for atomic layer deposition |
US7204886B2 (en) * | 2002-11-14 | 2007-04-17 | Applied Materials, Inc. | Apparatus and method for hybrid chemical processing |
US7780785B2 (en) * | 2001-10-26 | 2010-08-24 | Applied Materials, Inc. | Gas delivery apparatus for atomic layer deposition |
US6679199B2 (en) * | 2001-10-30 | 2004-01-20 | Parker Bankston | Tag and release device |
US6743681B2 (en) * | 2001-11-09 | 2004-06-01 | Micron Technology, Inc. | Methods of Fabricating Gate and Storage Dielectric Stacks having Silicon-Rich-Nitride |
JP2003158080A (en) * | 2001-11-22 | 2003-05-30 | Mitsubishi Electric Corp | Semiconductor manufacturing device, deposit removing method therein and manufacturing method for semiconductor device |
US6773507B2 (en) * | 2001-12-06 | 2004-08-10 | Applied Materials, Inc. | Apparatus and method for fast-cycle atomic layer deposition |
US6729824B2 (en) * | 2001-12-14 | 2004-05-04 | Applied Materials, Inc. | Dual robot processing system |
US20030116087A1 (en) * | 2001-12-21 | 2003-06-26 | Nguyen Anh N. | Chamber hardware design for titanium nitride atomic layer deposition |
US6696332B2 (en) * | 2001-12-26 | 2004-02-24 | Texas Instruments Incorporated | Bilayer deposition to avoid unwanted interfacial reactions during high K gate dielectric processing |
US6620670B2 (en) | 2002-01-18 | 2003-09-16 | Applied Materials, Inc. | Process conditions and precursors for atomic layer deposition (ALD) of AL2O3 |
AU2003238853A1 (en) * | 2002-01-25 | 2003-09-02 | Applied Materials, Inc. | Apparatus for cyclical deposition of thin films |
US6866746B2 (en) * | 2002-01-26 | 2005-03-15 | Applied Materials, Inc. | Clamshell and small volume chamber with fixed substrate support |
US6998014B2 (en) * | 2002-01-26 | 2006-02-14 | Applied Materials, Inc. | Apparatus and method for plasma assisted deposition |
US6824816B2 (en) | 2002-01-29 | 2004-11-30 | Asm International N.V. | Process for producing metal thin films by ALD |
US7063981B2 (en) | 2002-01-30 | 2006-06-20 | Asm International N.V. | Active pulse monitoring in a chemical reactor |
US6777352B2 (en) * | 2002-02-11 | 2004-08-17 | Applied Materials, Inc. | Variable flow deposition apparatus and method in semiconductor substrate processing |
US6753618B2 (en) | 2002-03-11 | 2004-06-22 | Micron Technology, Inc. | MIM capacitor with metal nitride electrode materials and method of formation |
US20030216981A1 (en) | 2002-03-12 | 2003-11-20 | Michael Tillman | Method and system for hosting centralized online point-of-sale activities for a plurality of distributed customers and vendors |
JP3937892B2 (en) * | 2002-04-01 | 2007-06-27 | 日本電気株式会社 | Thin film forming method and semiconductor device manufacturing method |
US6846516B2 (en) * | 2002-04-08 | 2005-01-25 | Applied Materials, Inc. | Multiple precursor cyclical deposition system |
US6875271B2 (en) * | 2002-04-09 | 2005-04-05 | Applied Materials, Inc. | Simultaneous cyclical deposition in different processing regions |
US6932871B2 (en) * | 2002-04-16 | 2005-08-23 | Applied Materials, Inc. | Multi-station deposition apparatus and method |
US6778762B1 (en) * | 2002-04-17 | 2004-08-17 | Novellus Systems, Inc. | Sloped chamber top for substrate processing |
US20030235961A1 (en) | 2002-04-17 | 2003-12-25 | Applied Materials, Inc. | Cyclical sequential deposition of multicomponent films |
US7164165B2 (en) * | 2002-05-16 | 2007-01-16 | Micron Technology, Inc. | MIS capacitor |
US20030213560A1 (en) * | 2002-05-16 | 2003-11-20 | Yaxin Wang | Tandem wafer processing system and process |
KR100505043B1 (en) | 2002-05-25 | 2005-07-29 | 삼성전자주식회사 | Method for forming a capacitor |
US7910165B2 (en) * | 2002-06-04 | 2011-03-22 | Applied Materials, Inc. | Ruthenium layer formation for copper film deposition |
US7041335B2 (en) * | 2002-06-04 | 2006-05-09 | Applied Materials, Inc. | Titanium tantalum nitride silicide layer |
US7135421B2 (en) | 2002-06-05 | 2006-11-14 | Micron Technology, Inc. | Atomic layer-deposited hafnium aluminum oxide |
DE60321271D1 (en) * | 2002-06-10 | 2008-07-10 | Imec Inter Uni Micro Electr | Transistors and storage capacitors containing a HfO 2 composition with increased dielectric constant |
KR100476926B1 (en) * | 2002-07-02 | 2005-03-17 | 삼성전자주식회사 | Method for forming dual gate of semiconductor device |
US20040011464A1 (en) * | 2002-07-16 | 2004-01-22 | Applied Materials, Inc. | Promotion of independence between degree of dissociation of reactive gas and the amount of ionization of dilutant gas via diverse gas injection |
US7186385B2 (en) * | 2002-07-17 | 2007-03-06 | Applied Materials, Inc. | Apparatus for providing gas to a processing chamber |
US7081409B2 (en) | 2002-07-17 | 2006-07-25 | Samsung Electronics Co., Ltd. | Methods of producing integrated circuit devices utilizing tantalum amine derivatives |
US6955211B2 (en) * | 2002-07-17 | 2005-10-18 | Applied Materials, Inc. | Method and apparatus for gas temperature control in a semiconductor processing system |
US7066194B2 (en) * | 2002-07-19 | 2006-06-27 | Applied Materials, Inc. | Valve design and configuration for fast delivery system |
KR100468852B1 (en) * | 2002-07-20 | 2005-01-29 | 삼성전자주식회사 | Manufacturing method of Capacitor Structure |
US6772072B2 (en) * | 2002-07-22 | 2004-08-03 | Applied Materials, Inc. | Method and apparatus for monitoring solid precursor delivery |
US6921062B2 (en) * | 2002-07-23 | 2005-07-26 | Advanced Technology Materials, Inc. | Vaporizer delivery ampoule |
US7300038B2 (en) * | 2002-07-23 | 2007-11-27 | Advanced Technology Materials, Inc. | Method and apparatus to help promote contact of gas with vaporized material |
US6915592B2 (en) * | 2002-07-29 | 2005-07-12 | Applied Materials, Inc. | Method and apparatus for generating gas to a processing chamber |
JP3861036B2 (en) * | 2002-08-09 | 2006-12-20 | 三菱重工業株式会社 | Plasma CVD equipment |
KR100542736B1 (en) * | 2002-08-17 | 2006-01-11 | 삼성전자주식회사 | Method of forming oxide layer using atomic layer deposition method and method of forming capacitor of semiconductor device using the same |
US6958300B2 (en) * | 2002-08-28 | 2005-10-25 | Micron Technology, Inc. | Systems and methods for forming metal oxides using metal organo-amines and metal organo-oxides |
US6875678B2 (en) * | 2002-09-10 | 2005-04-05 | Samsung Electronics Co., Ltd. | Post thermal treatment methods of forming high dielectric layers in integrated circuit devices |
US6784096B2 (en) * | 2002-09-11 | 2004-08-31 | Applied Materials, Inc. | Methods and apparatus for forming barrier layers in high aspect ratio vias |
JP2004111447A (en) * | 2002-09-13 | 2004-04-08 | Handotai Rikougaku Kenkyu Center:Kk | Semiconductor device and method for manufacturing the same |
US6759286B2 (en) * | 2002-09-16 | 2004-07-06 | Ajay Kumar | Method of fabricating a gate structure of a field effect transistor using a hard mask |
US6821563B2 (en) | 2002-10-02 | 2004-11-23 | Applied Materials, Inc. | Gas distribution system for cyclical layer deposition |
US20040065255A1 (en) * | 2002-10-02 | 2004-04-08 | Applied Materials, Inc. | Cyclical layer deposition system |
US20040069227A1 (en) * | 2002-10-09 | 2004-04-15 | Applied Materials, Inc. | Processing chamber configured for uniform gas flow |
US6905737B2 (en) * | 2002-10-11 | 2005-06-14 | Applied Materials, Inc. | Method of delivering activated species for rapid cyclical deposition |
US6716287B1 (en) * | 2002-10-18 | 2004-04-06 | Applied Materials Inc. | Processing chamber with flow-restricting ring |
WO2004064147A2 (en) * | 2003-01-07 | 2004-07-29 | Applied Materials, Inc. | Integration of ald/cvd barriers with porous low k materials |
US7262133B2 (en) * | 2003-01-07 | 2007-08-28 | Applied Materials, Inc. | Enhancement of copper line reliability using thin ALD tan film to cap the copper line |
US6868859B2 (en) * | 2003-01-29 | 2005-03-22 | Applied Materials, Inc. | Rotary gas valve for pulsing a gas |
US6994319B2 (en) * | 2003-01-29 | 2006-02-07 | Applied Materials, Inc. | Membrane gas valve for pulsing a gas |
US6818094B2 (en) | 2003-01-29 | 2004-11-16 | Applied Materials, Inc. | Reciprocating gas valve for pulsing a gas |
JP2007523994A (en) * | 2003-06-18 | 2007-08-23 | アプライド マテリアルズ インコーポレイテッド | Atomic layer deposition of barrier materials |
US20050095859A1 (en) * | 2003-11-03 | 2005-05-05 | Applied Materials, Inc. | Precursor delivery system with rate control |
US20050104142A1 (en) * | 2003-11-13 | 2005-05-19 | Vijav Narayanan | CVD tantalum compounds for FET get electrodes |
US7323230B2 (en) * | 2004-08-02 | 2008-01-29 | Applied Materials, Inc. | Coating for aluminum component |
-
2003
- 2003-01-27 AU AU2003238853A patent/AU2003238853A1/en not_active Abandoned
- 2003-01-27 WO PCT/US2003/002408 patent/WO2003065424A2/en not_active Application Discontinuation
- 2003-01-27 US US10/352,257 patent/US7175713B2/en not_active Expired - Fee Related
-
2006
- 2006-12-19 US US11/612,931 patent/US20070095285A1/en not_active Abandoned
-
2008
- 2008-10-30 US US12/261,487 patent/US8123860B2/en not_active Expired - Fee Related
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3854443A (en) * | 1973-12-19 | 1974-12-17 | Intel Corp | Gas reactor for depositing thin films |
US5976261A (en) * | 1996-07-11 | 1999-11-02 | Cvc Products, Inc. | Multi-zone gas injection apparatus and method for microelectronics manufacturing equipment |
WO1998023788A1 (en) * | 1996-11-27 | 1998-06-04 | Emcore Corporation | Chemical vapor deposition apparatus |
US6176198B1 (en) * | 1998-11-02 | 2001-01-23 | Applied Materials, Inc. | Apparatus and method for depositing low K dielectric materials |
JP2000212752A (en) * | 1999-01-18 | 2000-08-02 | Samsung Electronics Co Ltd | Reaction chamber gas flowing method and shower head used therefor |
EP1167569A1 (en) * | 2000-06-24 | 2002-01-02 | IPS Limited | Apparatus and method for depositing thin film on wafer using atomic layer deposition |
Non-Patent Citations (1)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 11, 3 January 2001 (2001-01-03) & JP 2000 212752 A (SAMSUNG ELECTRONICS CO LTD), 2 August 2000 (2000-08-02) -& US 6 478 872 B1 (CHAE YUN-SOOK ET AL) 12 November 2002 (2002-11-12) * |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005119733A1 (en) * | 2004-05-26 | 2005-12-15 | Applied Materials, Inc. | Blocker plate bypass to distribute gases in a chemical vapor deposition system |
US7572337B2 (en) | 2004-05-26 | 2009-08-11 | Applied Materials, Inc. | Blocker plate bypass to distribute gases in a chemical vapor deposition system |
US7622005B2 (en) | 2004-05-26 | 2009-11-24 | Applied Materials, Inc. | Uniformity control for low flow process and chamber to chamber matching |
US7829145B2 (en) | 2004-05-26 | 2010-11-09 | Applied Materials, Inc. | Methods of uniformity control for low flow process and chamber to chamber matching |
WO2007109346A2 (en) * | 2006-03-21 | 2007-09-27 | Ultra Clean Holdings, Incorporated | Mass pulse sensor and process-gas system and mehthod |
WO2007109346A3 (en) * | 2006-03-21 | 2008-11-13 | Ultra Clean Holdings Inc | Mass pulse sensor and process-gas system and mehthod |
Also Published As
Publication number | Publication date |
---|---|
AU2003238853A1 (en) | 2003-09-02 |
WO2003065424A3 (en) | 2004-03-11 |
US20070095285A1 (en) | 2007-05-03 |
US7175713B2 (en) | 2007-02-13 |
US20030172872A1 (en) | 2003-09-18 |
US8123860B2 (en) | 2012-02-28 |
US20090056626A1 (en) | 2009-03-05 |
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