WO2003073474A3 - Modular semiconductor die package and method of manufacturing thereof - Google Patents

Modular semiconductor die package and method of manufacturing thereof Download PDF

Info

Publication number
WO2003073474A3
WO2003073474A3 PCT/US2003/005534 US0305534W WO03073474A3 WO 2003073474 A3 WO2003073474 A3 WO 2003073474A3 US 0305534 W US0305534 W US 0305534W WO 03073474 A3 WO03073474 A3 WO 03073474A3
Authority
WO
WIPO (PCT)
Prior art keywords
semiconductor die
die package
manufacturing
base
modular semiconductor
Prior art date
Application number
PCT/US2003/005534
Other languages
French (fr)
Other versions
WO2003073474A2 (en
WO2003073474A8 (en
Inventor
Stanford W Crane Jr
Jennifer Colegrove
Zsolt Horvath
Myoung-Soo Jeon
Joshua Nickel
Lei-Ming Yang
Original Assignee
Silicon Bandwidth Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Silicon Bandwidth Inc filed Critical Silicon Bandwidth Inc
Priority to AU2003219865A priority Critical patent/AU2003219865A1/en
Priority to JP2003572072A priority patent/JP2005518673A/en
Publication of WO2003073474A2 publication Critical patent/WO2003073474A2/en
Publication of WO2003073474A3 publication Critical patent/WO2003073474A3/en
Publication of WO2003073474A8 publication Critical patent/WO2003073474A8/en

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4244—Mounting of the optical elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4245—Mounting of the opto-electronic elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4256—Details of housings
    • G02B6/4262—Details of housings characterised by the shape of the housing
    • G02B6/4263—Details of housings characterised by the shape of the housing of the transisitor outline [TO] can type
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4286—Optical modules with optical power monitoring

Abstract

A modular semiconductor die package is provided. The semiconductor die package includes a polymer base for mounting at least one semiconductor die. A polymer cap is operatively secured over the base forming a cavity. The cap includes a light transmissive member operatively positioned to allow light of predetermined wavelengths to pass between at least a portion of the surface of the die and the light transmissive member. A plurality of conductive leads extend through the base to form connections with the semiconductor die(s) positioned in the cavity.
PCT/US2003/005534 2002-02-25 2003-02-25 Modular semiconductor die package and method of manufacturing thereof WO2003073474A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
AU2003219865A AU2003219865A1 (en) 2002-02-25 2003-02-25 Modular semiconductor die package and method of manufacturing thereof
JP2003572072A JP2005518673A (en) 2002-02-25 2003-02-25 Module type semiconductor die package and manufacturing method thereof

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/081,146 US6700138B2 (en) 2002-02-25 2002-02-25 Modular semiconductor die package and method of manufacturing thereof
US10/081,146 2002-02-25

Publications (3)

Publication Number Publication Date
WO2003073474A2 WO2003073474A2 (en) 2003-09-04
WO2003073474A3 true WO2003073474A3 (en) 2004-06-03
WO2003073474A8 WO2003073474A8 (en) 2004-10-14

Family

ID=27752916

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2003/005534 WO2003073474A2 (en) 2002-02-25 2003-02-25 Modular semiconductor die package and method of manufacturing thereof

Country Status (4)

Country Link
US (2) US6700138B2 (en)
JP (1) JP2005518673A (en)
AU (1) AU2003219865A1 (en)
WO (1) WO2003073474A2 (en)

Families Citing this family (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4074419B2 (en) * 2000-03-14 2008-04-09 シャープ株式会社 Wire bonding method for semiconductor laser device
TW528279U (en) * 2002-04-18 2003-04-11 Hon Hai Prec Ind Co Ltd Can for optical module
JP2004288674A (en) * 2003-03-19 2004-10-14 Fuji Xerox Co Ltd Surface-emitting semiconductor laser and optical communication system using it
US7010013B2 (en) * 2003-05-02 2006-03-07 Applied Optoelectronics, Inc. Assembly with tapered, threaded ferrule housing for improved alignment of fiber with laser
US20050018994A1 (en) * 2003-07-24 2005-01-27 Oepic, Inc. Active and passive to-can extension boards
JP4194918B2 (en) * 2003-10-31 2008-12-10 シャープ株式会社 Manufacturing method of light receiving device
DE102004004779B4 (en) * 2004-01-30 2015-09-03 Osram Opto Semiconductors Gmbh Light-emitting diode illumination module with optical device for beam shaping
US6849876B1 (en) * 2004-05-31 2005-02-01 Excel Cell Electronic Co., Ltd. Light emitting device
US7256922B2 (en) * 2004-07-02 2007-08-14 Idc, Llc Interferometric modulators with thin film transistors
DE102004051379A1 (en) * 2004-08-23 2006-03-23 Osram Opto Semiconductors Gmbh Device for an optoelectronic component and component with an optoelectronic component and a device
US8310441B2 (en) 2004-09-27 2012-11-13 Qualcomm Mems Technologies, Inc. Method and system for writing data to MEMS display elements
US7843410B2 (en) 2004-09-27 2010-11-30 Qualcomm Mems Technologies, Inc. Method and device for electrically programmable display
US7170376B2 (en) * 2004-12-09 2007-01-30 Eaton Corporation Electrical switching apparatus including a housing and a trip circuit forming a composite structure
US20060246615A1 (en) * 2005-04-27 2006-11-02 Unity Opto Technology Co., Ltd. Method of manufacturing vertical cavity surface emitting laser
WO2006121784A1 (en) 2005-05-05 2006-11-16 Qualcomm Incorporated, Inc. Dynamic driver ic and display panel configuration
CN101405878A (en) * 2006-03-21 2009-04-08 皇家飞利浦电子股份有限公司 Light emitting diode module and method for the manufacturing of such an LED module
US7358836B2 (en) * 2006-03-29 2008-04-15 Eaton Corporation Shield, and printed circuit board and electrical apparatus employing the same
US7439487B2 (en) * 2006-03-31 2008-10-21 Avago Technologies General Ip (Singapore) Pte Ltd Optical encoder apparatus for removable connection with a printed circuit board and methods of assembling optical encoder apparatus.
JP2007281021A (en) * 2006-04-03 2007-10-25 Shinko Electric Ind Co Ltd Electronic component device
US8084731B2 (en) * 2006-09-09 2011-12-27 Johnson Douglas M Sensor system for liquid detection with lens component having an apex
US7556981B2 (en) 2006-12-29 2009-07-07 Qualcomm Mems Technologies, Inc. Switches for shorting during MEMS etch release
US7957589B2 (en) * 2007-01-25 2011-06-07 Qualcomm Mems Technologies, Inc. Arbitrary power function using logarithm lookup table
TWI378580B (en) * 2007-03-07 2012-12-01 Everlight Electronics Co Ltd Socket led device
US20090015579A1 (en) * 2007-07-12 2009-01-15 Qualcomm Incorporated Mechanical relaxation tracking and responding in a mems driver
US7729036B2 (en) * 2007-11-12 2010-06-01 Qualcomm Mems Technologies, Inc. Capacitive MEMS device with programmable offset voltage control
DE102009005547A1 (en) * 2009-01-20 2010-07-29 R. Stahl Schaltgeräte GmbH Encapsulated light-emitting diode arrangement
US8736590B2 (en) * 2009-03-27 2014-05-27 Qualcomm Mems Technologies, Inc. Low voltage driver scheme for interferometric modulators
US20150022226A1 (en) * 2009-11-30 2015-01-22 Essai, Inc. Systems and methods for conforming test tooling to integrated circuit device profiles with coaxial socket
US20110164027A1 (en) * 2010-01-06 2011-07-07 Qualcomm Mems Technologies, Inc. Method of detecting change in display data
US8884940B2 (en) * 2010-01-06 2014-11-11 Qualcomm Mems Technologies, Inc. Charge pump for producing display driver output
JP5664248B2 (en) * 2010-03-17 2015-02-04 株式会社リコー Surface emitting laser module, optical scanning device, and image forming apparatus
US8659611B2 (en) * 2010-03-17 2014-02-25 Qualcomm Mems Technologies, Inc. System and method for frame buffer storage and retrieval in alternating orientations
DE102010062118B4 (en) 2010-11-29 2018-09-27 Robert Bosch Gmbh Manufacturing method for a covering device for a micro-opto-mechanical component
US8294184B2 (en) 2011-02-23 2012-10-23 Qualcomm Mems Technologies, Inc. EMS tunable transistor
DE102011012511A1 (en) * 2011-02-25 2012-08-30 Limo Patentverwaltung Gmbh & Co. Kg Device for superposing laser beams of a plurality of laser light sources in a working plane
US8345030B2 (en) 2011-03-18 2013-01-01 Qualcomm Mems Technologies, Inc. System and method for providing positive and negative voltages from a single inductor
WO2012135406A2 (en) * 2011-04-01 2012-10-04 Schlumberger Canada Limited High density microelectronics packaging
US20130258474A1 (en) * 2012-04-03 2013-10-03 Cheng-Ta Chen Optoelectronic device with improved lens cap
DE102012024977A1 (en) * 2012-12-20 2014-06-26 GM Global Technology Operations LLC (n. d. Ges. d. Staates Delaware) Luminaire, in particular outdoor lamp for a motor vehicle, and method for producing such a lamp
US20150147034A1 (en) * 2013-11-27 2015-05-28 Texas Instruments Incorporated Optical Connector
JP2015225974A (en) * 2014-05-28 2015-12-14 日立金属株式会社 Jig for can package semiconductor laser
KR101654801B1 (en) * 2014-08-08 2016-09-07 서울대학교산학협력단 Microelectrode array and package for liquid crystal polymer based neuroprostheses and manufacturing method thereof
JP5994885B2 (en) * 2015-03-10 2016-09-21 カシオ計算機株式会社 Light source device and projector
CN108387979A (en) * 2018-02-11 2018-08-10 青岛海信宽带多媒体技术有限公司 optical secondary module
DE102018211548A1 (en) * 2018-07-11 2020-01-16 Robert Bosch Gmbh Manufacturing method for a micromechanical device with inclined optical windows and a micromechanical device with inclined optical windows
JP2022179073A (en) * 2021-05-21 2022-12-02 株式会社エンプラス Optical receptacle and optical module

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5692083A (en) * 1996-03-13 1997-11-25 The Whitaker Corporation In-line unitary optical device mount and package therefor
EP0869590A1 (en) * 1997-04-02 1998-10-07 Motorola, Inc. Semiconductor laser package with power monitoring system
US5825054A (en) * 1995-12-29 1998-10-20 Industrial Technology Research Institute Plastic-molded apparatus of a semiconductor laser
US5857050A (en) * 1996-02-28 1999-01-05 The Whitaker Corporation Packaging for optoelectronic device
WO2000057522A1 (en) * 1999-03-19 2000-09-28 Cielo Communications, Inc. Vcsel power monitoring system using plastic encapsulation techniques
US20010021287A1 (en) * 1999-06-01 2001-09-13 Jack Jewell Electro-opto mechanical assembly for coupling a light source or receiver to an optical waveguide
US6302596B1 (en) * 1999-07-07 2001-10-16 International Business Machines Corporation Small form factor optoelectronic transceivers

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5323025A (en) * 1989-05-18 1994-06-21 Murata Mfg. Co., Ltd. Pyroelectric IR-sensor having a low thermal conductive ceramic substrate
US6541800B2 (en) * 2001-02-22 2003-04-01 Weldon Technologies, Inc. High power LED

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5825054A (en) * 1995-12-29 1998-10-20 Industrial Technology Research Institute Plastic-molded apparatus of a semiconductor laser
US5857050A (en) * 1996-02-28 1999-01-05 The Whitaker Corporation Packaging for optoelectronic device
US5692083A (en) * 1996-03-13 1997-11-25 The Whitaker Corporation In-line unitary optical device mount and package therefor
EP0869590A1 (en) * 1997-04-02 1998-10-07 Motorola, Inc. Semiconductor laser package with power monitoring system
WO2000057522A1 (en) * 1999-03-19 2000-09-28 Cielo Communications, Inc. Vcsel power monitoring system using plastic encapsulation techniques
US20010021287A1 (en) * 1999-06-01 2001-09-13 Jack Jewell Electro-opto mechanical assembly for coupling a light source or receiver to an optical waveguide
US6302596B1 (en) * 1999-07-07 2001-10-16 International Business Machines Corporation Small form factor optoelectronic transceivers

Also Published As

Publication number Publication date
AU2003219865A1 (en) 2003-09-09
AU2003219865A8 (en) 2003-09-09
US20040026757A1 (en) 2004-02-12
WO2003073474A2 (en) 2003-09-04
US6700138B2 (en) 2004-03-02
WO2003073474A8 (en) 2004-10-14
JP2005518673A (en) 2005-06-23
US20030160314A1 (en) 2003-08-28

Similar Documents

Publication Publication Date Title
WO2003073474A3 (en) Modular semiconductor die package and method of manufacturing thereof
WO2005006433A3 (en) Mold compound cap in a flip chip multi-matrix array package and process of making same
WO2007120282A3 (en) Stackable molded packages and methods of making the same
WO2004034433A3 (en) Semiconductor stacked multi-package module having inverted second package
JP2005094009A5 (en)
WO2002091489A3 (en) Surface mount light emitting device package and fabrication method
WO2004073031A3 (en) Alternative flip chip in leaded molded package design and method for manufacture
JP6442504B2 (en) Conversion element and method of manufacturing optoelectronic component
WO2005059967A3 (en) Multiple chip package module having inverted package stacked over die
WO2004021400A3 (en) Substrate based unmolded package
EP2075856A3 (en) Power Light Emitting Die Package With Reflecting Lens And The Method Of Making The Same
WO2005060619A3 (en) Optical display systems and methods
WO2003085737A3 (en) Method and apparatus for stacking multiple die in a flip chip semiconductor package
EP1939939A3 (en) A lamp and method of producing a lamp
EP2015359A3 (en) Process for manufacturing a semiconductor package and circuit board aggregation
TW200631188A (en) Optoelectronic package with wire-protection lid
EP1189291A3 (en) Chip type light emitting diode and method of manufacture thereof
CN101740599A (en) Light-emitting diode devices and methods for fabricating the same
WO2004027823A3 (en) Semiconductor multi-package module having wire bond interconnection between stacked packages
EP1583160A3 (en) Microelectronic assembly with underchip optical window, and method for forming same
WO2004070792A3 (en) Thin multiple semiconductor die package
EP1630728A4 (en) Radio recognition semiconductor device and its manufacturing method
WO2007058781A3 (en) Method of fabricating an exposed die package
JP2004095580A (en) Method for manufacturing semiconductor device
EP1530234A3 (en) Heat sinkable power device package

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ OM PH PL PT RO RU SC SD SE SG SK SL TJ TM TN TR TT TZ UA UG UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PT SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
WWE Wipo information: entry into national phase

Ref document number: 2003572072

Country of ref document: JP

CFP Corrected version of a pamphlet front page
CR1 Correction of entry in section i

Free format text: IN PCT GAZETTE 36/2003 UNDER (72) THE NAME SHOULD READ "CRANE, STANFORD, W., JR."

122 Ep: pct application non-entry in european phase