WO2003088140A1 - Module for a data carrier with improved bump counterparts - Google Patents
Module for a data carrier with improved bump counterparts Download PDFInfo
- Publication number
- WO2003088140A1 WO2003088140A1 PCT/IB2003/001356 IB0301356W WO03088140A1 WO 2003088140 A1 WO2003088140 A1 WO 2003088140A1 IB 0301356 W IB0301356 W IB 0301356W WO 03088140 A1 WO03088140 A1 WO 03088140A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- remnants
- raised portions
- connecting parts
- module
- data carrier
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L23/00—Apparatus or local circuits for systems other than those covered by groups H04L15/00 - H04L21/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8138—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/81385—Shape, e.g. interlocking features
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Wire Bonding (AREA)
- Credit Cards Or The Like (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
Claims
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AT03710126T ATE515000T1 (en) | 2002-04-16 | 2003-04-03 | MODULE FOR A DISK CARRIER WITH IMPROVED BUMP MATCH |
AU2003214547A AU2003214547A1 (en) | 2002-04-16 | 2003-04-03 | Module for a data carrier with improved bump counterparts |
JP2003585003A JP2005520261A (en) | 2002-04-16 | 2003-04-03 | Module for data storage media with improved bump counterpart |
EP03710126A EP1500041B1 (en) | 2002-04-16 | 2003-04-03 | Module for a data carrier with improved bump counterparts |
KR10-2003-7015608A KR20040103744A (en) | 2002-04-16 | 2003-04-03 | Module for a data carrier with improved bump counterparts |
CN038083477A CN1647105B (en) | 2002-04-16 | 2003-04-03 | Module for a data carrier and data carrier provided with the module |
US10/511,460 US7045711B2 (en) | 2002-04-16 | 2003-04-03 | Module for a data carrier with improved bump counterparts |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP02100383 | 2002-04-16 | ||
EP02100383.5 | 2002-04-16 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2003088140A1 true WO2003088140A1 (en) | 2003-10-23 |
Family
ID=29225712
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/IB2003/001356 WO2003088140A1 (en) | 2002-04-16 | 2003-04-03 | Module for a data carrier with improved bump counterparts |
Country Status (9)
Country | Link |
---|---|
US (1) | US7045711B2 (en) |
EP (1) | EP1500041B1 (en) |
JP (1) | JP2005520261A (en) |
KR (1) | KR20040103744A (en) |
CN (1) | CN1647105B (en) |
AT (1) | ATE515000T1 (en) |
AU (1) | AU2003214547A1 (en) |
TW (1) | TWI280508B (en) |
WO (1) | WO2003088140A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110099314A (en) * | 2019-04-30 | 2019-08-06 | 广东省广播电视网络股份有限公司中山分公司 | Network system and its control method based on optical fiber and coaxial cable |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4851981B2 (en) * | 2007-04-11 | 2012-01-11 | 日精樹脂工業株式会社 | Wiring board manufacturing method and apparatus |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5483741A (en) * | 1993-09-03 | 1996-01-16 | Micron Technology, Inc. | Method for fabricating a self limiting silicon based interconnect for testing bare semiconductor dice |
DE19831565C1 (en) * | 1998-07-14 | 1999-10-28 | Muehlbauer Ag | Connection surface area exposure for antenna embedded in chip card |
US6297562B1 (en) * | 1999-09-20 | 2001-10-02 | Telefonaktieboalget Lm Ericsson (Publ) | Semiconductive chip having a bond pad located on an active device |
US6365967B1 (en) * | 1999-05-25 | 2002-04-02 | Micron Technology, Inc. | Interconnect structure |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0513419A (en) * | 1991-07-03 | 1993-01-22 | Rohm Co Ltd | Bump forming method for semiconductor element |
US5326428A (en) * | 1993-09-03 | 1994-07-05 | Micron Semiconductor, Inc. | Method for testing semiconductor circuitry for operability and method of forming apparatus for testing semiconductor circuitry for operability |
EP0851724B1 (en) * | 1996-12-26 | 2003-10-22 | Matsushita Electric Industrial Co., Ltd. | Printed circuit board and electric components |
JP2000114314A (en) * | 1998-09-29 | 2000-04-21 | Hitachi Ltd | Semiconductor element mounting structure, its manufacture, and ic card |
US6465879B1 (en) * | 1999-10-19 | 2002-10-15 | Citizen Watch Co., Ltd. | Structure for mounting semiconductor device, method of mounting same, semiconductor device, and method of fabricating same |
JP2001274323A (en) * | 2000-03-24 | 2001-10-05 | Hitachi Ltd | Semiconductor device and semiconductor module mounted therewith, and method of manufacturing the same |
US6864423B2 (en) * | 2000-12-15 | 2005-03-08 | Semiconductor Component Industries, L.L.C. | Bump chip lead frame and package |
-
2003
- 2003-04-03 US US10/511,460 patent/US7045711B2/en not_active Expired - Fee Related
- 2003-04-03 AU AU2003214547A patent/AU2003214547A1/en not_active Abandoned
- 2003-04-03 WO PCT/IB2003/001356 patent/WO2003088140A1/en active Application Filing
- 2003-04-03 AT AT03710126T patent/ATE515000T1/en not_active IP Right Cessation
- 2003-04-03 EP EP03710126A patent/EP1500041B1/en not_active Expired - Lifetime
- 2003-04-03 CN CN038083477A patent/CN1647105B/en not_active Expired - Fee Related
- 2003-04-03 KR KR10-2003-7015608A patent/KR20040103744A/en not_active Application Discontinuation
- 2003-04-03 JP JP2003585003A patent/JP2005520261A/en active Pending
- 2003-04-11 TW TW092108387A patent/TWI280508B/en not_active IP Right Cessation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5483741A (en) * | 1993-09-03 | 1996-01-16 | Micron Technology, Inc. | Method for fabricating a self limiting silicon based interconnect for testing bare semiconductor dice |
DE19831565C1 (en) * | 1998-07-14 | 1999-10-28 | Muehlbauer Ag | Connection surface area exposure for antenna embedded in chip card |
US6365967B1 (en) * | 1999-05-25 | 2002-04-02 | Micron Technology, Inc. | Interconnect structure |
US6297562B1 (en) * | 1999-09-20 | 2001-10-02 | Telefonaktieboalget Lm Ericsson (Publ) | Semiconductive chip having a bond pad located on an active device |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110099314A (en) * | 2019-04-30 | 2019-08-06 | 广东省广播电视网络股份有限公司中山分公司 | Network system and its control method based on optical fiber and coaxial cable |
Also Published As
Publication number | Publication date |
---|---|
CN1647105A (en) | 2005-07-27 |
TW200405215A (en) | 2004-04-01 |
EP1500041A1 (en) | 2005-01-26 |
ATE515000T1 (en) | 2011-07-15 |
US20050230482A1 (en) | 2005-10-20 |
EP1500041B1 (en) | 2011-06-29 |
AU2003214547A8 (en) | 2003-10-27 |
KR20040103744A (en) | 2004-12-09 |
CN1647105B (en) | 2010-05-05 |
TWI280508B (en) | 2007-05-01 |
JP2005520261A (en) | 2005-07-07 |
AU2003214547A1 (en) | 2003-10-27 |
US7045711B2 (en) | 2006-05-16 |
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