WO2003089368A3 - Low temperature method for forming a microcavity on a substrate and article having same - Google Patents

Low temperature method for forming a microcavity on a substrate and article having same Download PDF

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Publication number
WO2003089368A3
WO2003089368A3 PCT/US2003/011848 US0311848W WO03089368A3 WO 2003089368 A3 WO2003089368 A3 WO 2003089368A3 US 0311848 W US0311848 W US 0311848W WO 03089368 A3 WO03089368 A3 WO 03089368A3
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
package
microcavity
article
low temperature
Prior art date
Application number
PCT/US2003/011848
Other languages
French (fr)
Other versions
WO2003089368A2 (en
Inventor
Khalil Najafi
Brian H Stark
Original Assignee
Univ Michigan
Khalil Najafi
Brian H Stark
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Univ Michigan, Khalil Najafi, Brian H Stark filed Critical Univ Michigan
Priority to AU2003234121A priority Critical patent/AU2003234121A1/en
Publication of WO2003089368A2 publication Critical patent/WO2003089368A2/en
Publication of WO2003089368A3 publication Critical patent/WO2003089368A3/en

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261Processes for packaging MEMS devices
    • B81C1/00333Aspects relating to packaging of MEMS devices, not covered by groups B81C1/00269 - B81C1/00325
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00Forming microstructural systems
    • B81C2203/01Packaging MEMS
    • B81C2203/0136Growing or depositing of a covering layer
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00Forming microstructural systems
    • B81C2203/01Packaging MEMS
    • B81C2203/0145Hermetically sealing an opening in the lid
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/13Hollow or container type article [e.g., tube, vase, etc.]

Abstract

A low temperature method for forming a microcavity on a substrate and article having same are provided which utilize electroplated films. The method is particularly useful to package microelectromechanical systems (MEMS) in vacuum on the wafer level and provide sealed feedthroughs to the outside world. The method may be performed in a batch process to substantially reduce cost and to form metal diaphragms. Furthermore, the method is performed at near room temperature, which provides more flexibility in the manufacturing process. The method enables substantial cost savings in the production of vacuum-sealed MEMS. Many feedthroughs can be incorporated into the package to transfer signals in and out of the package. One significant advantage of this method is that it does not require bonding of a second substrate, which reduces the system cost.
PCT/US2003/011848 2002-04-18 2003-04-17 Low temperature method for forming a microcavity on a substrate and article having same WO2003089368A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2003234121A AU2003234121A1 (en) 2002-04-18 2003-04-17 Low temperature method for forming a microcavity on a substrate and article having same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US37342602P 2002-04-18 2002-04-18
US60/373,426 2002-04-18

Publications (2)

Publication Number Publication Date
WO2003089368A2 WO2003089368A2 (en) 2003-10-30
WO2003089368A3 true WO2003089368A3 (en) 2004-05-13

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2003/011848 WO2003089368A2 (en) 2002-04-18 2003-04-17 Low temperature method for forming a microcavity on a substrate and article having same

Country Status (3)

Country Link
US (1) US7029829B2 (en)
AU (1) AU2003234121A1 (en)
WO (1) WO2003089368A2 (en)

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Also Published As

Publication number Publication date
AU2003234121A1 (en) 2003-11-03
US20040028849A1 (en) 2004-02-12
WO2003089368A2 (en) 2003-10-30
US7029829B2 (en) 2006-04-18

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