WO2003090278A2 - Dual-sided heat removal system - Google Patents

Dual-sided heat removal system Download PDF

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Publication number
WO2003090278A2
WO2003090278A2 PCT/US2003/009681 US0309681W WO03090278A2 WO 2003090278 A2 WO2003090278 A2 WO 2003090278A2 US 0309681 W US0309681 W US 0309681W WO 03090278 A2 WO03090278 A2 WO 03090278A2
Authority
WO
WIPO (PCT)
Prior art keywords
inteφoser
microelectronic device
substrate
accordance
heat
Prior art date
Application number
PCT/US2003/009681
Other languages
French (fr)
Other versions
WO2003090278A3 (en
Inventor
Gilroy Vandentop
Chia-Pin Chiu
Rajendran Nair
Yian-Liang Li
Original Assignee
Intel Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corporation filed Critical Intel Corporation
Priority to EP03726148A priority Critical patent/EP1497860A2/en
Priority to AU2003228399A priority patent/AU2003228399A1/en
Publication of WO2003090278A2 publication Critical patent/WO2003090278A2/en
Publication of WO2003090278A3 publication Critical patent/WO2003090278A3/en

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    • H01L23/367—Cooling facilitated by shape of device
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09054—Raised area or protrusion of metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10409—Screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10477—Inverted
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides

Definitions

  • the present invention relates to heat removal in a computer system.
  • the present invention relates to dual-sided heat sinks for
  • microelectronic devices mounted parallel to a substrate.
  • ASICs application specific integrated circuits
  • chipsets and the like.
  • microelectronic device is used in the singular, it is also intended to
  • microelectronic device is mounted on a substrate which facilitates the distribution of electrical signals, as well as power and ground, between the microelectronic
  • the substrates are often not made
  • substrates include organic land grid arrays (OLGAs), plastic land grid arrays
  • PLGAs printed circuit boards
  • PCBs printed circuit boards
  • the device while eliminating the large thermal barrier of the substrate.
  • Figure 1 depicts a cross section through a microelectronic device
  • heat sink mounted on a substrate using a socket connection.
  • Figure 2 depicts a microelectronic device and heat sink mounted on a
  • Figure 3 shows a microelectronic device and interposer mounted on a
  • Figure 4 shows another dual heat sink assembly in accordance with
  • Figure 5 shows a third dual heat sink assembly in accordance with an
  • the present invention allows double-sided heat sinks in systems with
  • microprocessors mounted parallel to the substrate, allowing up to twice the heat
  • Figure 1 depicts a
  • microelectronic device 4 to substrate 6 is common. Given the relatively poor
  • heat sink 12 The design of heat sinks such as heat sink 12 is known to
  • the present invention uses an interposer device, discussed further
  • microelectronic device 4 is the use of an interposer between microelectronic device 4 and substrate 6.
  • interposer will be used in the
  • socket 8 in Figure 1 is one form of interposer.
  • interposer will preferably have high thermal
  • inte ⁇ oser as is broadly defined, be used with the present invention. With that in
  • socket 8 has been common practice for many years. However, socket 8 is traditionally just
  • microelectronic devices 4 became apparent. For example, IR drops in high current
  • power signals supplied to the processor is providing an inte ⁇ oser, coupled directly
  • microelectronic device 4 containing a voltage regulation (NR) system.
  • NR voltage regulation
  • Figure 2 illustrates one arrangement with a thin inte ⁇ oser 16
  • microelectronic device 4 mounted between microelectronic device 4 and substrate 6, and heat sink 12.
  • microelectronic device 4 and inte ⁇ oser 16 are shown in Figure 2 as
  • the present invention exploits the ability of inte ⁇ oser 16 to distribute
  • Figure 3 shows an embodiment of the present
  • Heat sinks 12 and 18 may be similar, or they may use different materials and/or configurations. Inte ⁇ oser 16 by providing a path for electrical signals
  • microelectronic device 4 between microelectronic device 4 and substrate 6, as well as to providing
  • inventions may use inte ⁇ oser 16 to solve both the "power problem" and the
  • FIG. 4 illustrates another embodiment of the present invention
  • microelectronic device 4 mounted below inte ⁇ oser 16, and through opening 20 in
  • substrate 6 with two heat sinks, 12 and 18, on opposite sides of substrate 6.
  • electrical connections 22 between substrate 6 and inte ⁇ oser 16 are preferably gold
  • sinks 12 and 18 in contact with microelectronic device 4 and inte ⁇ oser 16 are
  • TIM such as a polymer-based, solder-based, or diamond paste.
  • TIMs are polymer-based, solder-based, or diamond paste.
  • FIG. 4 is only one of many possible arrangements of microelectronic device 4
  • inte ⁇ oser 16 is not intended to be limited to aiding in voltage regulation and mechanically bridging opening 20.
  • Other embodiments of inte ⁇ oser 16 are not intended to be limited to aiding in voltage regulation and mechanically bridging opening 20.
  • the present invention might also inco ⁇ orate memory devices, optical signal
  • Figure 5 shows an embodiment of the present invention in which
  • inte ⁇ oser 16 contact power and I/O signals within inte ⁇ oser 16 and between sets
  • connections 22 and 24 The relative sizes of microelectronic device 4, and dies
  • present invention not only provides a thermal path for the heat load from inte ⁇ oser
  • This second heat transfer path may

Abstract

The present invention describes a method and apparatus for mounting a microelectronic device parallel to a substrate with an interposer and two heat sinks, one on each side of the substrate.

Description

DUAL-SIDED HEAT REMOVAL SYSTEM
Related Applications
[0001] This application is related to Serial No. 10/026,145, filed on
December 21, 2001.
Field of the Invention
[0002] The present invention relates to heat removal in a computer system.
More particularly, the present invention relates to dual-sided heat sinks for
microelectronic devices mounted parallel to a substrate.
Background of the Invention
[0003] As the speed and component density of modern microelectronic
devices continues to increase, the heat generated by them also generally increases.
Techniques for better dissipating the heat from microelectronic devices are thus
desirable, especially with higher performance devices. The term microelectronic
device, as used in this disclosure, is intended to be broad and include, but not be
limited to, electronic and opto-electronic devices such as microprocessors,
application specific integrated circuits (ASICs), chipsets, and the like. Although for
clarity, the term microelectronic device is used in the singular, it is also intended to
include a plurality of individual devices.
[0004] In virtually all systems using electronic components, the
microelectronic device is mounted on a substrate which facilitates the distribution of electrical signals, as well as power and ground, between the microelectronic
device and other system components. However, the substrates are often not made
of material that is a particularly good thermal conductor. Examples of such
substrates include organic land grid arrays (OLGAs), plastic land grid arrays
(PLGAs), and printed circuit boards (PCBs). The present invention is not, however,
intended to be limited to embodiments using any particular substrate material or
device mounting configuration.
[0005] It would be desirable to be able to provide cooling on both sides of
the device while eliminating the large thermal barrier of the substrate.
Brief Description of the Drawings
[0006] Figure 1 depicts a cross section through a microelectronic device and
heat sink mounted on a substrate using a socket connection.
[0007] Figure 2 depicts a microelectronic device and heat sink mounted on a
substrate using an interposer.
[0008] Figure 3 shows a microelectronic device and interposer mounted on a
substrate with two heat sinks in accordance with an embodiment of the present
invention.
[0009] Figure 4 shows another dual heat sink assembly in accordance with
an embodiment of the present invention.
[0010] Figure 5 shows a third dual heat sink assembly in accordance with an
embodiment of the present invention.
Detailed Description
[0011] The present invention allows double-sided heat sinks in systems with
microprocessors mounted parallel to the substrate, allowing up to twice the heat
dissipation of the prior art. Substrates are often poor thermal conductors so, heat
cannot easily be dissipated in the direction of the substrate. Figure 1 depicts a
cross section of one configuration 2 used to mount a microelectronic device 4 on a
substrate 6. Use of a socket 8 to electrically and mechanically couple
microelectronic device 4 to substrate 6 is common. Given the relatively poor
thermal conductivity of substrate 6, one can easily see that most of the heat
generated in configuration 2 by microelectronic device 10 will be dissipated
through heat sink 12. The design of heat sinks such as heat sink 12 is known to
those of ordinary skill in the art, and the present invention is not intended to be
limited to any particular heat sink design details such as, but not limited to, the
material or geometry used for the heat sink.
[0012] The present invention uses an interposer device, discussed further
below, for mounting the microelectronic device, with an opening in the substrate
that allows a second heat sink to be included on the substrate side of the
microelectronic device.
[0013] A recent development in the art of mounting microelectronic devices
is the use of an interposer between microelectronic device 4 and substrate 6. For
the purposes of the present disclosure the term interposer will be used in the
broadest sense: a device interposed, or located between microelectronic device 4 and substrate 6. In this sense, socket 8 in Figure 1 is one form of interposer. For
use with the present invention the interposer will preferably have high thermal
conductivity, for reasons that will be explained below. Note that for purposes of the
present invention, the internal design details of the particular interposer are not
important. Furthermore, the present invention is not intended to be limited to use
with any particular inteφoser design, providing it is thermally conductive. Neither
is the design of the inteφoser the subject of the present invention, only that an
inteφoser, as is broadly defined, be used with the present invention. With that in
mind, the present disclosure will functionally describe a few of the many possible
inteφoser designs to better appreciate the context of the present invention, and in
no way intends to limit the scope of the invention to use with the described
inteφosers.
[0014] Connecting a microelectronic device 4 and a substrate 6 using socket
8 has been common practice for many years. However, socket 8 is traditionally just
a means of mechanical and electrical connection, it is not a component in which the
electrical signals or power were processed or transformed, but rather one where
signals are "passed through." As microelectronic devices 4 progressed in terms of
speed and general processing power, while operating at lower voltages, the need to
better control the quality of power as well as input and output (I/O) signals of
microelectronic devices 4 became apparent. For example, IR drops in high current
Figure imgf000006_0001
and low voltage situations, particularly in the context of high signals, are dT
undesirable and degrade processor performance. Prior art solutions to such "power problems" often used techniques such as land side capacitors located directly on
substrate 6 for power decoupling.
[0015] One solution to the power which will improve the quality of the
power signals supplied to the processor is providing an inteφoser, coupled directly
to microelectronic device 4, containing a voltage regulation (NR) system. In this
way, relatively high voltages can be supplied to the inteφoser device, which is
immediately adjacent to the processor, and the voltage is reduced within the
inteφoser and distributed to microelectronic device 4.
[0016] Figure 2 illustrates one arrangement with a thin inteφoser 16
mounted between microelectronic device 4 and substrate 6, and heat sink 12.
Although microelectronic device 4 and inteφoser 16 are shown in Figure 2 as
being approximately the same size, there is no requirement that they be so. Signals
travelling between substrate 6 and microelectronic device 4 might be routed within
the plane of inteφoser 16, or "horizontally" in Figure 2, such as to or from the NR
system as well as "vertically" through vias in inteφoser 16.
[0017] The present invention exploits the ability of inteφoser 16 to distribute
electrical signals within its plane, and allows an opening in subtrate 6 which may
also facilitate a second heat sink. Figure 3 shows an embodiment of the present
invention with a second heat sink 18 mounted through an opening 20 in substrate 6.
In this embodiment there are two major heat transfer paths to two heat sinks, 12
and 18, significantly increasing the ability to dissipate heat from microelectronic
device 4. Heat sinks 12 and 18 may be similar, or they may use different materials and/or configurations. Inteφoser 16 by providing a path for electrical signals
between microelectronic device 4 and substrate 6, as well as to providing
mechanical support for microelectronic device 4, allows opening 20 to be created in
substrate 6 for the second heat transfer path through substrate 6. Thus, the present
invention may use inteφoser 16 to solve both the "power problem" and the
"thermal problem."
[0018] Figure 4 illustrates another embodiment of the present invention with
microelectronic device 4 mounted below inteφoser 16, and through opening 20 in
substrate 6, with two heat sinks, 12 and 18, on opposite sides of substrate 6. The
electrical connections 22 between substrate 6 and inteφoser 16 are preferably gold
plated copper pads, with copper to copper connections 24 between microelectronic
device 4 and inteφoser 16. The use of spring plates 26 and connecting rods 28 in
this embodiment allow for a socket-less pressure mated assembly of the
components, while providing secure electrical connections. The surfaces of heat
sinks 12 and 18 in contact with microelectronic device 4 and inteφoser 16 are
preferably prepared with a highly thermally conductive thermal interface material
(TIM) such as a polymer-based, solder-based, or diamond paste. Such TIMs are
known to those of ordinary skill in the art. Note that the embodiment shown in
Figure 4 is only one of many possible arrangements of microelectronic device 4
and inteφoser 16 which permits heat sinks on both sides of substrate 6, and the
present invention is not intended to be limited to any particular design details.
[0019] The design of inteφoser 16 is not intended to be limited to aiding in voltage regulation and mechanically bridging opening 20. Other embodiments of
the present invention might also incoφorate memory devices, optical signal
propagation devices, as well as components such as capacitors and inductors within
inteφoser 16. Figure 5 shows an embodiment of the present invention in which
two silicon dice, 30 and 32, are embedded within inteφoser 16. Embedded dice 30
and 32 are preferably surrounded by, and held in place by, encapsulation material
34 within a core 38. Build up layers 36 on the microelectronic device 4 side of
inteφoser 16 contact power and I/O signals within inteφoser 16 and between sets
of connections 22 and 24. The relative sizes of microelectronic device 4, and dies
30 and 32 embedded in the inteφoser may vary and can be selected to optimize
both the electrical and thermal performance of inteφoser 16. Figure 5 is shown
with two different configurations of contacts 22 between substrate 6 and inteφoser
16, pins and contact pads, to illustrate two of the many possible ways of electrically
coupling the two components. However, the present invention is not intended to be
limited to any particular electrical connection, or any other design detail, except as
limited by the terms of claims.
[0020] Unlike an inactive socket 8, an inteφoser 16 with active components
generates heat, although, typically much less than is generated by microelectronic
device 4. The thermal solution provided by the dual heat sinks (12 and 18) of the
present invention not only provides a thermal path for the heat load from inteφoser
16, but also typically dissipates a portion of the heat from microelectronic device 4
through inteφoser 16 to the second heat sink. Tests using thermal loads of 120 watts and 30 watts for microelectronic device 4 and inteφoser 16, respectively,
show that about 40% of the heat from microelectronic device 4 is dissipated
through the heat sink attached to inteφoser 16. This second heat transfer path may
significantly reduce the operating temperature of both microelectronic device 4 and
inteφoser 16, thereby increasing the performance of both.
[0021] Although the above disclosure provides various embodiments and
examples of the present invention for the puφoses of illustration, these
embodiments and examples are not intended to be an exhaustive list of all possible
implementations of the present invention and should not be construed in limiting
the present invention. Those of ordinary skill in the art should recognize, with the
benefit of the present disclosure, that the present invention may be practiced with
many modifications and variations to the specific details of the present disclosure.
Similarly, not all the specific details, well-known structures, devices, and
techniques that are known to those of ordinary skill in the art have been shown in
order to avoid observing the present invention. The present invention is, however,
intended to cover a broad range of techniques, devices, and well-known structures.
The invention, therefore, is intended to be limited in scope only by the purview of
the appended claims.

Claims

What is Claimed is:
1. In an assembly with a microelectronic device mounted parallel to a substrate,
a dual-sided heat removal apparatus, comprising:
an inteφoser electrically coupled to both the microelectronic device and the
substrate for passing electrical signals between the microelectronic device and the
substrate;
a first heat sink thermally coupled to the microelectronic device and
extending through an opening in the substrate for dissipating heat; and
a second heat sink thermally coupled to said inteφoser for dissipating heat.
2. An apparatus in accordance with claim 1, wherein:
at least one of said first and second heat sinks are made substantially of
aluminum.
3. An apparatus in accordance with claim 1, wherein:
at least one of said first and second heat sinks are made substantially from
copper.
4. An apparatus in accordance with claim 1, wherein:
at least one of said first and second heat sinks are made substantially from an
aluminum-copper composite.
5. An apparatus in accordance with claim 1, wherein:
said first and second heat sinks are made substantially from a thermally
conductive composite material.
6. An apparatus in accordance with claim 1, wherein:
said inteφoser includes a voltage regulation (NR) system.
7. An apparatus in accordance with claim 1, wherein:
said inteφoser includes memory.
8. An apparatus in accordance with claim 1, wherein:
said inteφoser includes an optical signaling system.
9. An apparatus in accordance with claim 1, wherein:
said inteφoser and said microelectronic device are coupled by a socket-less
electrical connection.
10. An apparatus in accordance with claim 9, wherein:
said inteφoser and said substrate are coupled by a socket-less electrical
connection.
11. An apparatus in accordance with claim 1, wherein: said inteφoser contains electrically active components.
12. In an assembly with a microelectronic device mounted parallel to a substrate,
a dual sided heat removal apparatus, comprising:
an inteφoser electrically coupled to both the microelectronic device and the
substrate for passing electrical signals between the microelectronic device and the
substrate;
a first heat sink thermally coupled to said inteφoser and extending through
an opening in the substrate for dissipating heat; and
a second heat sink thermally coupled to the microelectronic device for
dissipating heat.
13. An apparatus in accordance with claim 12, wherein:
at least one of said first and second heat sinks are made substantially of
aluminum.
14. An apparatus in accordance with claim 12, wherein:
at least one of said first and second heat sinks are made substantially from
copper.
15. An apparatus in accordance with claim 12, wherein:
at least one of said first and second heat sinks are made substantially from an aluminum-copper composite.
16. An apparatus in accordance with claim 12, wherein:
said first and second heat sinks are made substantially from a thermally
conductive composite material.
17. An apparatus in accordance with claim 12, wherein:
said inteφoser includes a voltage regulation (VR) system.
18. An apparatus in accordance with claim 12, wherein:
said inteφoser includes memory.
19. An apparatus in accordance with claim 12, wherein:
said inteφoser includes an optical signaling system.
20. An apparatus in accordance with claim 12, wherein:
said inteφoser and the microelectronic device are coupled by a socket-less
electrical connection.
21. An apparatus in accordance with claim 20, wherein:
said inteφoser and said substrate are coupled by a socket-less electrical
connection.
22. An apparatus in accordance with claim 12, wherein:
said inteφoser contains electrically active components.
23. An apparatus for dissipating heat from a microelectronic device mounted on
a substrate, comprising:
a first heat sink thermally coupled to the microelectronic device, on the
substrate side of the microelectronic device, for dissipating heat from the
microelectronic device; and
wherein said first heat sink extends through an opening in the substrate.
24. An apparatus in accordance with claim 23, further comprising:
a second heat sink thermally coupled to an inteφoser for dissipating heat.
25. An apparatus for dissipating heat from a microelectronic device connected to
a substrate through an inteφoser, comprising:
a first heat sink thermally coupled to the inteφoser, on the substrate side of
the silicon-inteφoser.
26. An apparatus in accordance with claim 25, further comprising:
a second heat sink thermally coupled to the microelectronic device for
dissipating heat.
27. A method of cooling a microelectronic device, comprising: electrically connecting the microelectronic device to a substrate with an
inteφoser;
mounting the microelectronic device and said inteφoser over an opening in
said substrate;
thermally connecting the microelectronic device and said inteφoser to a pair
of heat sinks; and
wherein one of said pair of heat sinks extends through an opening in the
substrate.
28. A method in accordance with claim 27, further comprising:
regulating the electrical power supplied to the microelectronic device with
said inteφoser.
29. A method of cooling a microelectronic device, comprising:
dissipating heat from a microelectronic device and inteφoser unit through a
pair of heat sinks located on opposite sides of plane defined by a substrate; and
connecting first of said pair of heat sinks to said microelectronic device and
inteφoser unit through an opening in said substrate.
30. A method in accordance with claim 29, further comprising:
connecting second of said pair of heat sinks to said microelectronic
device and inteφoser unit on the side opposite the substrate.
PCT/US2003/009681 2002-04-19 2003-03-27 Dual-sided heat removal system WO2003090278A2 (en)

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US6580611B1 (en) 2003-06-17
WO2003090278A3 (en) 2003-12-18
AU2003228399A1 (en) 2003-11-03
EP2450950A3 (en) 2012-09-26
EP2450950A2 (en) 2012-05-09

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