WO2003106582A8 - Adhesive for sealing organic electroluminescent element and use thereof - Google Patents
Adhesive for sealing organic electroluminescent element and use thereofInfo
- Publication number
- WO2003106582A8 WO2003106582A8 PCT/JP2003/007637 JP0307637W WO03106582A8 WO 2003106582 A8 WO2003106582 A8 WO 2003106582A8 JP 0307637 W JP0307637 W JP 0307637W WO 03106582 A8 WO03106582 A8 WO 03106582A8
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- organic electroluminescent
- electroluminescent element
- sealing
- light
- adhesive
- Prior art date
Links
- 238000007789 sealing Methods 0.000 title abstract 6
- 239000000853 adhesive Substances 0.000 title abstract 3
- 230000001070 adhesive effect Effects 0.000 title abstract 3
- 239000004820 Pressure-sensitive adhesive Substances 0.000 abstract 2
- 238000010538 cationic polymerization reaction Methods 0.000 abstract 2
- 238000006243 chemical reaction Methods 0.000 abstract 2
- 150000001875 compounds Chemical class 0.000 abstract 1
- 230000006866 deterioration Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 239000003505 polymerization initiator Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/517,206 US20050227082A1 (en) | 2002-06-17 | 2003-06-17 | Adhesive for sealing organic electroluminescent element and use thereof |
JP2004513397A JP3798417B2 (ja) | 2002-06-17 | 2003-06-17 | 有機エレクトロルミネッセンス素子封止用接着剤、有機エレクトロルミネッセンス素子封止用粘着テープ、有機エレクトロルミネッセンス素子封止用両面粘着テープ、有機エレクトロルミネッセンス素子の封止方法、及び、有機エレクトロルミネッセンス素子 |
CNB038138743A CN1320076C (zh) | 2002-06-17 | 2003-06-17 | 有机电致发光元件密封用粘接剂及其应用 |
EP03733459A EP1518912A4 (en) | 2002-06-17 | 2003-06-17 | ADHESIVE FOR SEALING AN ORGANIC ELECTROLUMINESCENT TELEPHONE AND USE THEREOF |
KR1020047020419A KR101028649B1 (ko) | 2002-06-17 | 2003-06-17 | 유기 전계 발광 소자 밀봉용 접착제 및 그의 응용 |
Applications Claiming Priority (16)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002-175965 | 2002-06-17 | ||
JP2002175965 | 2002-06-17 | ||
JP2002-213909 | 2002-07-23 | ||
JP2002213909 | 2002-07-23 | ||
JP2002-244204 | 2002-08-23 | ||
JP2002244204 | 2002-08-23 | ||
JP2002-269069 | 2002-09-13 | ||
JP2002269069 | 2002-09-13 | ||
JP2002307393 | 2002-10-22 | ||
JP2002-307393 | 2002-10-22 | ||
JP2002344510 | 2002-11-27 | ||
JP2002-344510 | 2002-11-27 | ||
JP2002-362714 | 2002-12-13 | ||
JP2002362714 | 2002-12-13 | ||
JP2003003572 | 2003-01-09 | ||
JP2003-3572 | 2003-01-09 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2003106582A1 WO2003106582A1 (ja) | 2003-12-24 |
WO2003106582A8 true WO2003106582A8 (en) | 2005-03-17 |
Family
ID=29741243
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2003/007637 WO2003106582A1 (ja) | 2002-01-10 | 2003-06-17 | 有機エレクトロルミネッセンス素子封止用接着剤及びその応用 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20050227082A1 (ja) |
EP (1) | EP1518912A4 (ja) |
JP (1) | JP3798417B2 (ja) |
KR (3) | KR20100080632A (ja) |
CN (1) | CN1320076C (ja) |
TW (1) | TW200402456A (ja) |
WO (1) | WO2003106582A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7348165B2 (ja) | 2018-03-28 | 2023-09-20 | リンテック株式会社 | 電子デバイス封止体、シート状接着剤、電子デバイス封止用接着フィルム、及び電子デバイス封止体の製造方法 |
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-
2003
- 2003-06-17 WO PCT/JP2003/007637 patent/WO2003106582A1/ja not_active Application Discontinuation
- 2003-06-17 US US10/517,206 patent/US20050227082A1/en not_active Abandoned
- 2003-06-17 CN CNB038138743A patent/CN1320076C/zh not_active Expired - Lifetime
- 2003-06-17 KR KR1020107013752A patent/KR20100080632A/ko not_active Application Discontinuation
- 2003-06-17 TW TW92116327A patent/TW200402456A/zh not_active IP Right Cessation
- 2003-06-17 KR KR1020047020419A patent/KR101028649B1/ko active IP Right Grant
- 2003-06-17 JP JP2004513397A patent/JP3798417B2/ja not_active Expired - Fee Related
- 2003-06-17 KR KR1020107013751A patent/KR101028603B1/ko active IP Right Grant
- 2003-06-17 EP EP03733459A patent/EP1518912A4/en not_active Withdrawn
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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JP7348165B2 (ja) | 2018-03-28 | 2023-09-20 | リンテック株式会社 | 電子デバイス封止体、シート状接着剤、電子デバイス封止用接着フィルム、及び電子デバイス封止体の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
KR101028649B1 (ko) | 2011-04-11 |
EP1518912A1 (en) | 2005-03-30 |
WO2003106582A1 (ja) | 2003-12-24 |
KR20050014007A (ko) | 2005-02-05 |
CN1662625A (zh) | 2005-08-31 |
KR101028603B1 (ko) | 2011-04-11 |
JP3798417B2 (ja) | 2006-07-19 |
KR20100080631A (ko) | 2010-07-09 |
EP1518912A4 (en) | 2006-03-01 |
TWI304834B (ja) | 2009-01-01 |
TW200402456A (en) | 2004-02-16 |
US20050227082A1 (en) | 2005-10-13 |
KR20100080632A (ko) | 2010-07-09 |
CN1320076C (zh) | 2007-06-06 |
JPWO2003106582A1 (ja) | 2005-10-13 |
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