WO2004008244A3 - Defect inspection methods that include acquiring aerial images of a reticle for different lithographic process variables - Google Patents
Defect inspection methods that include acquiring aerial images of a reticle for different lithographic process variables Download PDFInfo
- Publication number
- WO2004008244A3 WO2004008244A3 PCT/US2003/021907 US0321907W WO2004008244A3 WO 2004008244 A3 WO2004008244 A3 WO 2004008244A3 US 0321907 W US0321907 W US 0321907W WO 2004008244 A3 WO2004008244 A3 WO 2004008244A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- reticle
- aerial images
- include acquiring
- defect inspection
- process variables
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract 6
- 230000007547 defect Effects 0.000 title abstract 3
- 238000007689 inspection Methods 0.000 title 1
- 230000001052 transient effect Effects 0.000 abstract 2
- 238000001459 lithography Methods 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
- G03F1/84—Inspecting
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
- G03F7/7065—Defects, e.g. optical inspection of patterned layer for defects
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70653—Metrology techniques
- G03F7/70666—Aerial image, i.e. measuring the image of the patterned exposure light at the image plane of the projection system
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP03764592.6A EP1523696B1 (en) | 2002-07-15 | 2003-07-15 | Defect inspection methods that include acquiring aerial images of a reticle for different lithographic process variables |
AU2003247868A AU2003247868A1 (en) | 2002-07-15 | 2003-07-15 | Defect inspection methods that include acquiring aerial images of a reticle for different lithographic process variables |
JP2005505128A JP4597859B2 (en) | 2002-07-15 | 2003-07-15 | Pattern qualification, pattern formation process, or pattern formation apparatus in the production of microlithographic patterns |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US39619702P | 2002-07-15 | 2002-07-15 | |
US60/396,197 | 2002-07-15 | ||
US48523303P | 2003-07-07 | 2003-07-07 | |
US60/485,233 | 2003-07-07 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2004008244A2 WO2004008244A2 (en) | 2004-01-22 |
WO2004008244A3 true WO2004008244A3 (en) | 2004-07-29 |
Family
ID=30118572
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2003/021907 WO2004008244A2 (en) | 2002-07-15 | 2003-07-15 | Defect inspection methods that include acquiring aerial images of a reticle for different lithographic process variables |
Country Status (6)
Country | Link |
---|---|
US (1) | US7418124B2 (en) |
EP (1) | EP1523696B1 (en) |
JP (1) | JP4597859B2 (en) |
KR (1) | KR100979484B1 (en) |
AU (1) | AU2003247868A1 (en) |
WO (1) | WO2004008244A2 (en) |
Families Citing this family (91)
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JP4904034B2 (en) | 2004-09-14 | 2012-03-28 | ケーエルエー−テンカー コーポレイション | Method, system and carrier medium for evaluating reticle layout data |
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US7297453B2 (en) * | 2005-04-13 | 2007-11-20 | Kla-Tencor Technologies Corporation | Systems and methods for mitigating variances on a patterned wafer using a prediction model |
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US9916965B2 (en) | 2015-12-31 | 2018-03-13 | Kla-Tencor Corp. | Hybrid inspectors |
US9915625B2 (en) | 2016-01-04 | 2018-03-13 | Kla-Tencor Corp. | Optical die to database inspection |
US10043261B2 (en) | 2016-01-11 | 2018-08-07 | Kla-Tencor Corp. | Generating simulated output for a specimen |
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US10551827B2 (en) | 2017-07-25 | 2020-02-04 | Kla-Tencor Corporation | Hybrid inspection system for efficient process window discovery |
US10503078B2 (en) | 2017-09-01 | 2019-12-10 | Kla-Tencor Corporation | Criticality analysis augmented process window qualification sampling |
WO2019121486A1 (en) * | 2017-12-22 | 2019-06-27 | Asml Netherlands B.V. | Process window based on defect probability |
US10599951B2 (en) | 2018-03-28 | 2020-03-24 | Kla-Tencor Corp. | Training a neural network for defect detection in low resolution images |
US11551348B2 (en) | 2019-04-09 | 2023-01-10 | KLA Corp. | Learnable defect detection for semiconductor applications |
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Also Published As
Publication number | Publication date |
---|---|
US7418124B2 (en) | 2008-08-26 |
AU2003247868A8 (en) | 2004-02-02 |
WO2004008244A2 (en) | 2004-01-22 |
JP4597859B2 (en) | 2010-12-15 |
KR100979484B1 (en) | 2010-09-02 |
JP2005533292A (en) | 2005-11-04 |
KR20050048587A (en) | 2005-05-24 |
AU2003247868A1 (en) | 2004-02-02 |
US20040091142A1 (en) | 2004-05-13 |
EP1523696B1 (en) | 2016-12-21 |
EP1523696A2 (en) | 2005-04-20 |
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