WO2004008245A3 - Method and system for context-specific mask inspection - Google Patents

Method and system for context-specific mask inspection Download PDF

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Publication number
WO2004008245A3
WO2004008245A3 PCT/US2003/021995 US0321995W WO2004008245A3 WO 2004008245 A3 WO2004008245 A3 WO 2004008245A3 US 0321995 W US0321995 W US 0321995W WO 2004008245 A3 WO2004008245 A3 WO 2004008245A3
Authority
WO
WIPO (PCT)
Prior art keywords
context
mask inspection
specific mask
integrated circuit
circuit design
Prior art date
Application number
PCT/US2003/021995
Other languages
French (fr)
Other versions
WO2004008245A2 (en
Inventor
Robert C Pack
Louis K Sheffer
Original Assignee
Cadence Design Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cadence Design Systems Inc filed Critical Cadence Design Systems Inc
Priority to EP03764633A priority Critical patent/EP1579274A4/en
Priority to AU2003256530A priority patent/AU2003256530A1/en
Priority to JP2004521802A priority patent/JP2006502422A/en
Publication of WO2004008245A2 publication Critical patent/WO2004008245A2/en
Publication of WO2004008245A3 publication Critical patent/WO2004008245A3/en

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
    • G03F1/84—Inspecting

Abstract

A method for inspecting lithography masks (108) includes generating integrated circuit design data (102) and using context information from the integrated circuit design data to inspect a mask.
PCT/US2003/021995 2002-07-12 2003-07-14 Method and system for context-specific mask inspection WO2004008245A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP03764633A EP1579274A4 (en) 2002-07-12 2003-07-14 Method and system for context-specific mask inspection
AU2003256530A AU2003256530A1 (en) 2002-07-12 2003-07-14 Method and system for context-specific mask inspection
JP2004521802A JP2006502422A (en) 2002-07-12 2003-07-14 Method and system for context-specific mask inspection

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US39546702P 2002-07-12 2002-07-12
US60/395,467 2002-07-12

Publications (2)

Publication Number Publication Date
WO2004008245A2 WO2004008245A2 (en) 2004-01-22
WO2004008245A3 true WO2004008245A3 (en) 2005-08-25

Family

ID=30115879

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2003/021995 WO2004008245A2 (en) 2002-07-12 2003-07-14 Method and system for context-specific mask inspection

Country Status (5)

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US (2) US7231628B2 (en)
EP (1) EP1579274A4 (en)
JP (1) JP2006502422A (en)
AU (1) AU2003256530A1 (en)
WO (1) WO2004008245A2 (en)

Families Citing this family (146)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW362222B (en) * 1995-11-27 1999-06-21 Matsushita Electric Ind Co Ltd Coiled component and its production method
US7093229B2 (en) * 1997-09-17 2006-08-15 Synopsys, Inc. System and method for providing defect printability analysis of photolithographic masks with job-based automation
US7107571B2 (en) * 1997-09-17 2006-09-12 Synopsys, Inc. Visual analysis and verification system using advanced tools
US7617474B2 (en) * 1997-09-17 2009-11-10 Synopsys, Inc. System and method for providing defect printability analysis of photolithographic masks with job-based automation
KR100850201B1 (en) * 2002-06-04 2008-08-04 삼성전자주식회사 Method for making the optical proximity correction mask and OPC mask made by the same
AU2003256530A1 (en) 2002-07-12 2004-02-02 Cadence Design Systems, Inc. Method and system for context-specific mask inspection
US7302672B2 (en) * 2002-07-12 2007-11-27 Cadence Design Systems, Inc. Method and system for context-specific mask writing
JP2005533283A (en) * 2002-07-12 2005-11-04 ケイデンス デザイン システムズ インコーポレイテッド Method and system for context specific mask writing
US7231624B2 (en) * 2002-11-19 2007-06-12 Cadence Design Systems, Inc. Method, system, and article of manufacture for implementing metal-fill with power or ground connection
US7328419B2 (en) * 2002-11-19 2008-02-05 Cadence Design Systems, Inc. Place and route tool that incorporates a metal-fill mechanism
US7114144B2 (en) * 2002-11-26 2006-09-26 Matsushita Electric Industrial Co., Ltd. Mask pattern inspecting method, inspection apparatus, inspecting data used therein and inspecting data generating method
US7093228B2 (en) * 2002-12-20 2006-08-15 Lsi Logic Corporation Method and system for classifying an integrated circuit for optical proximity correction
US7069533B2 (en) * 2003-03-14 2006-06-27 Chatered Semiconductor Manufacturing, Ltd System, apparatus and method for automated tapeout support
US7698665B2 (en) * 2003-04-06 2010-04-13 Luminescent Technologies, Inc. Systems, masks, and methods for manufacturable masks using a functional representation of polygon pattern
US7480889B2 (en) * 2003-04-06 2009-01-20 Luminescent Technologies, Inc. Optimized photomasks for photolithography
US7124394B1 (en) 2003-04-06 2006-10-17 Luminescent Technologies, Inc. Method for time-evolving rectilinear contours representing photo masks
US7135344B2 (en) * 2003-07-11 2006-11-14 Applied Materials, Israel, Ltd. Design-based monitoring
US7024638B2 (en) * 2003-07-14 2006-04-04 Cadence Design Systems, Inc. Method for creating patterns for producing integrated circuits
US7234128B2 (en) * 2003-10-03 2007-06-19 Taiwan Semiconductor Manufacturing Company, Ltd. Method for improving the critical dimension uniformity of patterned features on wafers
US8151220B2 (en) * 2003-12-04 2012-04-03 Kla-Tencor Technologies Corp. Methods for simulating reticle layout data, inspecting reticle layout data, and generating a process for inspecting reticle layout data
JP2005209850A (en) * 2004-01-22 2005-08-04 Toshiba Corp Design system and manufacturing system of semiconductor device
US7646906B2 (en) 2004-01-29 2010-01-12 Kla-Tencor Technologies Corp. Computer-implemented methods for detecting defects in reticle design data
US9188974B1 (en) 2004-02-13 2015-11-17 Kla-Tencor Technologies Corp. Methods for improved monitor and control of lithography processes
US7313781B2 (en) * 2004-05-28 2007-12-25 Kabushiki Kaisha Toshiba Image data correction method, lithography simulation method, image data correction system, program, mask and method of manufacturing a semiconductor device
JP2006039059A (en) * 2004-07-23 2006-02-09 Toshiba Corp Method for producing photomask data and method for manufacturing photomask
JP4904034B2 (en) 2004-09-14 2012-03-28 ケーエルエー−テンカー コーポレイション Method, system and carrier medium for evaluating reticle layout data
JP2006098151A (en) * 2004-09-29 2006-04-13 Dainippon Screen Mfg Co Ltd Pattern inspection device and pattern inspection method
US20060123381A1 (en) * 2004-12-07 2006-06-08 Dainippon Screen Mfg. Co., Ltd. Data generating system, patterning data generating apparatus, method of generating patterning data and storage medium carrying patterning data
JP2006235327A (en) * 2005-02-25 2006-09-07 Toshiba Corp Method for generating mask pattern data/mask inspection data, and method for manufacturing/inspecting photomask
US20060238732A1 (en) * 2005-04-21 2006-10-26 Mercado Romeo I High-NA unit-magnification projection optical system having a beamsplitter
JP4679243B2 (en) * 2005-05-25 2011-04-27 株式会社東芝 Mask making method and semiconductor device manufacturing method
US7251015B2 (en) * 2005-06-27 2007-07-31 Taiwan Semiconductor Manufacturing Company, Ltd. Photolithography mask critical dimension metrology system and method
US7769225B2 (en) * 2005-08-02 2010-08-03 Kla-Tencor Technologies Corp. Methods and systems for detecting defects in a reticle design pattern
CN101305320B (en) * 2005-09-09 2012-07-04 Asml荷兰有限公司 System and method for mask verification using an individual mask error model
US7707541B2 (en) * 2005-09-13 2010-04-27 Luminescent Technologies, Inc. Systems, masks, and methods for photolithography
WO2007041600A2 (en) * 2005-10-03 2007-04-12 Luminescent Technologies, Inc. Mask-pattern determination using topology types
US7788627B2 (en) * 2005-10-03 2010-08-31 Luminescent Technologies, Inc. Lithography verification using guard bands
WO2007041701A2 (en) * 2005-10-04 2007-04-12 Luminescent Technologies, Inc. Mask-patterns including intentional breaks
WO2007044557A2 (en) 2005-10-06 2007-04-19 Luminescent Technologies, Inc. System, masks, and methods for photomasks optimized with approximate and accurate merit functions
US7570796B2 (en) 2005-11-18 2009-08-04 Kla-Tencor Technologies Corp. Methods and systems for utilizing design data in combination with inspection data
US8041103B2 (en) 2005-11-18 2011-10-18 Kla-Tencor Technologies Corp. Methods and systems for determining a position of inspection data in design data space
US7676077B2 (en) 2005-11-18 2010-03-09 Kla-Tencor Technologies Corp. Methods and systems for utilizing design data in combination with inspection data
US7640522B2 (en) * 2006-01-14 2009-12-29 Tela Innovations, Inc. Method and system for placing layout objects in a standard-cell layout
US8225239B2 (en) 2006-03-09 2012-07-17 Tela Innovations, Inc. Methods for defining and utilizing sub-resolution features in linear topology
US7763534B2 (en) 2007-10-26 2010-07-27 Tela Innovations, Inc. Methods, structures and designs for self-aligning local interconnects used in integrated circuits
US8653857B2 (en) 2006-03-09 2014-02-18 Tela Innovations, Inc. Circuitry and layouts for XOR and XNOR logic
US7446352B2 (en) 2006-03-09 2008-11-04 Tela Innovations, Inc. Dynamic array architecture
US8245180B2 (en) 2006-03-09 2012-08-14 Tela Innovations, Inc. Methods for defining and using co-optimized nanopatterns for integrated circuit design and apparatus implementing same
US8541879B2 (en) 2007-12-13 2013-09-24 Tela Innovations, Inc. Super-self-aligned contacts and method for making the same
US9563733B2 (en) 2009-05-06 2017-02-07 Tela Innovations, Inc. Cell circuit and layout with linear finfet structures
US8839175B2 (en) 2006-03-09 2014-09-16 Tela Innovations, Inc. Scalable meta-data objects
US9035359B2 (en) 2006-03-09 2015-05-19 Tela Innovations, Inc. Semiconductor chip including region including linear-shaped conductive structures forming gate electrodes and having electrical connection areas arranged relative to inner region between transistors of different types and associated methods
US7943967B2 (en) 2006-03-09 2011-05-17 Tela Innovations, Inc. Semiconductor device and associated layouts including diffusion contact placement restriction based on relation to linear conductive segments
US8225261B2 (en) 2006-03-09 2012-07-17 Tela Innovations, Inc. Methods for defining contact grid in dynamic array architecture
US7932545B2 (en) 2006-03-09 2011-04-26 Tela Innovations, Inc. Semiconductor device and associated layouts including gate electrode level region having arrangement of six linear conductive segments with side-to-side spacing less than 360 nanometers
US8658542B2 (en) 2006-03-09 2014-02-25 Tela Innovations, Inc. Coarse grid design methods and structures
US7956421B2 (en) 2008-03-13 2011-06-07 Tela Innovations, Inc. Cross-coupled transistor layouts in restricted gate level layout architecture
US9009641B2 (en) 2006-03-09 2015-04-14 Tela Innovations, Inc. Circuits with linear finfet structures
US8247846B2 (en) 2006-03-09 2012-08-21 Tela Innovations, Inc. Oversized contacts and vias in semiconductor chip defined by linearly constrained topology
US8448102B2 (en) 2006-03-09 2013-05-21 Tela Innovations, Inc. Optimizing layout of irregular structures in regular layout context
US9230910B2 (en) 2006-03-09 2016-01-05 Tela Innovations, Inc. Oversized contacts and vias in layout defined by linearly constrained topology
JP4791267B2 (en) * 2006-06-23 2011-10-12 株式会社日立ハイテクノロジーズ Defect inspection system
WO2008010017A1 (en) * 2006-07-19 2008-01-24 Freescale Semiconductor, Inc. Method and apparatus for designing an integrated circuit
US7510960B2 (en) * 2006-08-29 2009-03-31 International Business Machines Corporation Bridge for semiconductor internal node
US8331645B2 (en) * 2006-09-20 2012-12-11 Luminescent Technologies, Inc. Photo-mask and wafer image reconstruction
US8644588B2 (en) 2006-09-20 2014-02-04 Luminescent Technologies, Inc. Photo-mask and wafer image reconstruction
US7694244B2 (en) 2006-12-18 2010-04-06 Cadence Design Systems, Inc. Modeling and cross correlation of design predicted criticalities for optimization of semiconductor manufacturing
US8146024B2 (en) * 2006-12-18 2012-03-27 Cadence Design Systems, Inc. Method and system for process optimization
US7665048B2 (en) * 2006-12-18 2010-02-16 Cadence Design Systems, Inc. Method and system for inspection optimization in design and production of integrated circuits
US8156450B2 (en) * 2006-12-18 2012-04-10 Cadence Design Systems, Inc. Method and system for mask optimization
WO2008077100A2 (en) * 2006-12-19 2008-06-26 Kla-Tencor Corporation Systems and methods for creating inspection recipes
WO2008086282A2 (en) 2007-01-05 2008-07-17 Kla-Tencor Corporation Methods and systems for using electrical information for a device being fabricated on a wafer to perform one or more defect-related functions
WO2008094257A1 (en) * 2007-01-29 2008-08-07 Toppan Photomasks, Inc. Method and system for dispositioning defects in a photomask
US7979829B2 (en) 2007-02-20 2011-07-12 Tela Innovations, Inc. Integrated circuit cell library with cell-level process compensation technique (PCT) application and associated methods
US8286107B2 (en) 2007-02-20 2012-10-09 Tela Innovations, Inc. Methods and systems for process compensation technique acceleration
US7888705B2 (en) 2007-08-02 2011-02-15 Tela Innovations, Inc. Methods for defining dynamic array section with manufacturing assurance halo and apparatus implementing the same
US8667443B2 (en) 2007-03-05 2014-03-04 Tela Innovations, Inc. Integrated circuit cell library for multiple patterning
US7564545B2 (en) * 2007-03-15 2009-07-21 Kla-Tencor Technologies Corp. Inspection methods and systems for lithographic masks
US7962863B2 (en) 2007-05-07 2011-06-14 Kla-Tencor Corp. Computer-implemented methods, systems, and computer-readable media for determining a model for predicting printability of reticle features on a wafer
US7738093B2 (en) 2007-05-07 2010-06-15 Kla-Tencor Corp. Methods for detecting and classifying defects on a reticle
US8213704B2 (en) 2007-05-09 2012-07-03 Kla-Tencor Corp. Methods and systems for detecting defects in a reticle design pattern
US7796804B2 (en) 2007-07-20 2010-09-14 Kla-Tencor Corp. Methods for generating a standard reference die for use in a die to standard reference die inspection and methods for inspecting a wafer
US7711514B2 (en) 2007-08-10 2010-05-04 Kla-Tencor Technologies Corp. Computer-implemented methods, carrier media, and systems for generating a metrology sampling plan
TWI469235B (en) 2007-08-20 2015-01-11 Kla Tencor Corp Computer-implemented methods for determining if actual defects are potentially systematic defects or potentially random defects
US20090119357A1 (en) * 2007-11-05 2009-05-07 International Business Machines Corporation Advanced correlation and process window evaluation application
US8063908B1 (en) * 2007-11-08 2011-11-22 Nvidia Corporation System, method, and computer program product for validating a graphics processor design
US7873936B2 (en) * 2008-01-04 2011-01-18 International Business Machines Corporation Method for quantifying the manufactoring complexity of electrical designs
US8453094B2 (en) 2008-01-31 2013-05-28 Tela Innovations, Inc. Enforcement of semiconductor structure regularity for localized transistors and interconnect
US7939443B2 (en) 2008-03-27 2011-05-10 Tela Innovations, Inc. Methods for multi-wire routing and apparatus implementing same
US8139844B2 (en) 2008-04-14 2012-03-20 Kla-Tencor Corp. Methods and systems for determining a defect criticality index for defects on wafers
US8572517B2 (en) 2008-06-10 2013-10-29 Cadence Design Systems, Inc. System and method for modifying a data set of a photomask
MY152456A (en) 2008-07-16 2014-09-30 Tela Innovations Inc Methods for cell phasing and placement in dynamic array architecture and implementation of the same
KR101841897B1 (en) 2008-07-28 2018-03-23 케이엘에이-텐코어 코오포레이션 Computer-implemented methods, computer-readable media, and systems for classifying defects detected in a memory device area on a wafer
US9122832B2 (en) 2008-08-01 2015-09-01 Tela Innovations, Inc. Methods for controlling microloading variation in semiconductor wafer layout and fabrication
US10089432B2 (en) * 2008-11-03 2018-10-02 Mentor Graphics Corporation Rule-check waiver
US8775101B2 (en) 2009-02-13 2014-07-08 Kla-Tencor Corp. Detecting defects on a wafer
US8204297B1 (en) 2009-02-27 2012-06-19 Kla-Tencor Corp. Methods and systems for classifying defects detected on a reticle
US8112241B2 (en) 2009-03-13 2012-02-07 Kla-Tencor Corp. Methods and systems for generating an inspection process for a wafer
TWI386642B (en) * 2009-06-29 2013-02-21 Century Display Shenzhen Co Glass substrate, inspection method using the same, and array mask for fabricating the same
US8984470B2 (en) * 2009-08-31 2015-03-17 Synopsys, Inc. Method and apparatus for performing redundant via insertion during circuit design
US8661392B2 (en) 2009-10-13 2014-02-25 Tela Innovations, Inc. Methods for cell boundary encroachment and layouts implementing the Same
US9232670B2 (en) 2010-02-02 2016-01-05 Apple Inc. Protection and assembly of outer glass surfaces of an electronic device housing
US8463016B2 (en) * 2010-02-05 2013-06-11 Luminescent Technologies, Inc. Extending the field of view of a mask-inspection image
US8781781B2 (en) 2010-07-30 2014-07-15 Kla-Tencor Corp. Dynamic care areas
US9043296B2 (en) * 2010-07-30 2015-05-26 Microsoft Technology Licensing, Llc System of providing suggestions based on accessible and contextual information
US8555214B2 (en) 2010-09-14 2013-10-08 Luminescent Technologies, Inc. Technique for analyzing a reflective photo-mask
US8612903B2 (en) 2010-09-14 2013-12-17 Luminescent Technologies, Inc. Technique for repairing a reflective photo-mask
US9159627B2 (en) 2010-11-12 2015-10-13 Tela Innovations, Inc. Methods for linewidth modification and apparatus implementing the same
US8458622B2 (en) 2010-11-29 2013-06-04 Luminescent Technologies, Inc. Photo-mask acceptance technique
US8386968B2 (en) 2010-11-29 2013-02-26 Luminescent Technologies, Inc. Virtual photo-mask critical-dimension measurement
US9005852B2 (en) 2012-09-10 2015-04-14 Dino Technology Acquisition Llc Technique for repairing a reflective photo-mask
US8448120B2 (en) 2011-05-09 2013-05-21 Taiwan Semiconductor Manufacturing Co., Ltd. RC extraction for single patterning spacer technique
US9170211B2 (en) 2011-03-25 2015-10-27 Kla-Tencor Corp. Design-based inspection using repeating structures
US9201022B2 (en) * 2011-06-02 2015-12-01 Taiwan Semiconductor Manufacturing Company, Ltd. Extraction of systematic defects
US8653454B2 (en) 2011-07-13 2014-02-18 Luminescent Technologies, Inc. Electron-beam image reconstruction
US9087367B2 (en) 2011-09-13 2015-07-21 Kla-Tencor Corp. Determining design coordinates for wafer defects
US8831334B2 (en) 2012-01-20 2014-09-09 Kla-Tencor Corp. Segmentation for wafer inspection
US8656318B2 (en) * 2012-05-04 2014-02-18 Taiwan Semiconductor Manufacturing Company, Ltd. System and method for combined intraoverlay metrology and defect inspection
US8826200B2 (en) 2012-05-25 2014-09-02 Kla-Tencor Corp. Alteration for wafer inspection
US9305346B2 (en) * 2012-05-31 2016-04-05 Taiwan Semiconductor Manufacturing Company, Ltd. Method and apparatus for efficient defect inspection
US9189844B2 (en) 2012-10-15 2015-11-17 Kla-Tencor Corp. Detecting defects on a wafer using defect-specific information
US9053527B2 (en) 2013-01-02 2015-06-09 Kla-Tencor Corp. Detecting defects on a wafer
US9134254B2 (en) 2013-01-07 2015-09-15 Kla-Tencor Corp. Determining a position of inspection system output in design data space
US9311698B2 (en) 2013-01-09 2016-04-12 Kla-Tencor Corp. Detecting defects on a wafer using template image matching
KR102019534B1 (en) 2013-02-01 2019-09-09 케이엘에이 코포레이션 Detecting defects on a wafer using defect-specific and multi-channel information
US8726212B1 (en) 2013-02-21 2014-05-13 Taiwan Semiconductor Manufacturing Company, Ltd. Streamlined parasitic modeling with common device profile
US8912489B2 (en) * 2013-03-04 2014-12-16 Globalfoundries Inc. Defect removal process
US9091935B2 (en) 2013-03-11 2015-07-28 Kla-Tencor Corporation Multistage extreme ultra-violet mask qualification
US9494854B2 (en) 2013-03-14 2016-11-15 Kla-Tencor Corporation Technique for repairing an EUV photo-mask
US9865512B2 (en) 2013-04-08 2018-01-09 Kla-Tencor Corp. Dynamic design attributes for wafer inspection
US9310320B2 (en) 2013-04-15 2016-04-12 Kla-Tencor Corp. Based sampling and binning for yield critical defects
US9529255B2 (en) 2013-12-04 2016-12-27 Taiwan Semiconductor Manufacturing Co., Ltd. Image process method to improve mask inspection performance
US9747518B2 (en) 2014-05-06 2017-08-29 Kla-Tencor Corporation Automatic calibration sample selection for die-to-database photomask inspection
US9401016B2 (en) * 2014-05-12 2016-07-26 Kla-Tencor Corp. Using high resolution full die image data for inspection
US9262821B2 (en) 2014-05-12 2016-02-16 Kla-Tencor Corp. Inspection recipe setup from reference image variation
WO2016050584A1 (en) 2014-10-02 2016-04-07 Asml Netherlands B.V. Rule-based deployment of assist features
US9355211B2 (en) * 2014-10-10 2016-05-31 Oracle International Corporation Unified tool for automatic design constraints generation and verification
US10074036B2 (en) * 2014-10-21 2018-09-11 Kla-Tencor Corporation Critical dimension uniformity enhancement techniques and apparatus
DE102015204800B3 (en) * 2015-03-17 2016-12-01 MTU Aero Engines AG Method and device for quality evaluation of a component produced by means of an additive manufacturing method
US10304177B2 (en) 2016-06-29 2019-05-28 Kla-Tencor Corporation Systems and methods of using z-layer context in logic and hot spot inspection for sensitivity improvement and nuisance suppression
US11023648B2 (en) 2017-12-12 2021-06-01 Siemens Industry Software Inc. Puzzle-based pattern analysis and classification
CN111801623B (en) * 2018-02-23 2023-10-13 Asml荷兰有限公司 Inspection of guided patterning device
CN110727170B (en) * 2018-07-16 2023-12-01 中芯国际集成电路制造(上海)有限公司 Method for repairing defects of photomask and photomask
US10631036B1 (en) * 2018-10-24 2020-04-21 Gfycat, Inc. Identifying altered digital video content
US10753882B1 (en) * 2019-04-10 2020-08-25 Griffyn Robotech Private Ltd. Inspection and cosmetic grading through image processing system and method
US11531802B2 (en) * 2019-10-18 2022-12-20 Taiwan Semiconductor Manufacturing Company Ltd. Layout context-based cell timing characterization

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5879866A (en) * 1994-12-19 1999-03-09 International Business Machines Corporation Image recording process with improved image tolerances using embedded AR coatings
US5932377A (en) * 1998-02-24 1999-08-03 International Business Machines Corporation Exact transmission balanced alternating phase-shifting mask for photolithography
US6282696B1 (en) * 1997-08-15 2001-08-28 Lsi Logic Corporation Performing optical proximity correction with the aid of design rule checkers

Family Cites Families (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4247203A (en) * 1978-04-03 1981-01-27 Kla Instrument Corporation Automatic photomask inspection system and apparatus
JPS6381570A (en) 1986-09-25 1988-04-12 Sony Corp Method and equipment used for data processing in electron beam device
US5354695A (en) 1992-04-08 1994-10-11 Leedy Glenn J Membrane dielectric isolation IC fabrication
JP3095475B2 (en) * 1991-09-27 2000-10-03 株式会社東芝 Inspection method of mask pattern
US5567550A (en) 1993-03-25 1996-10-22 Texas Instruments Incorporated Method of making a mask for making integrated circuits
JPH0887101A (en) * 1994-09-14 1996-04-02 Toshiba Mach Co Ltd Inspection device for mask
US5553273A (en) 1995-04-17 1996-09-03 International Business Machines Corporation Vertex minimization in a smart optical proximity correction system
US5740068A (en) 1996-05-30 1998-04-14 International Business Machines Corporation Fidelity enhancement of lithographic and reactive-ion-etched images by optical proximity correction
US5821014A (en) 1997-02-28 1998-10-13 Microunity Systems Engineering, Inc. Optical proximity correction method for intermediate-pitch features using sub-resolution scattering bars on a mask
US6578188B1 (en) 1997-09-17 2003-06-10 Numerical Technologies, Inc. Method and apparatus for a network-based mask defect printability analysis system
US6453452B1 (en) 1997-12-12 2002-09-17 Numerical Technologies, Inc. Method and apparatus for data hierarchy maintenance in a system for mask description
US7107571B2 (en) 1997-09-17 2006-09-12 Synopsys, Inc. Visual analysis and verification system using advanced tools
US5965306A (en) 1997-10-15 1999-10-12 International Business Machines Corporation Method of determining the printability of photomask defects
SE9800665D0 (en) 1998-03-02 1998-03-02 Micronic Laser Systems Ab Improved method for projection printing using a micromirror SLM
JP2000162758A (en) 1998-11-30 2000-06-16 Matsushita Electric Ind Co Ltd Method for correcting optical proximity effect
US6529621B1 (en) 1998-12-17 2003-03-04 Kla-Tencor Mechanisms for making and inspecting reticles
US6363296B1 (en) 1999-02-24 2002-03-26 Infineon Technologies Ag System and method for automated defect inspection of photomasks
US6051347A (en) 1999-03-18 2000-04-18 Taiwan Semiconductor Manufacturing Company Application of e-beam proximity over-correction to compensate optical proximity effect in optical lithography process
US6301697B1 (en) 1999-04-30 2001-10-09 Nicolas B. Cobb Streamlined IC mask layout optical and process correction through correction reuse
US6654488B1 (en) 1999-07-01 2003-11-25 International Business Machines Corporation Fill pattern inspection
US6535774B1 (en) 1999-08-12 2003-03-18 Advanced Micro Devices, Inc. Incorporation of critical dimension measurements as disturbances to lithography overlay run to run controller
US6456899B1 (en) 1999-12-07 2002-09-24 Ut-Battelle, Llc Context-based automated defect classification system using multiple morphological masks
US6421820B1 (en) 1999-12-13 2002-07-16 Infineon Technologies Ag Semiconductor device fabrication using a photomask with assist features
JP3431567B2 (en) * 2000-03-30 2003-07-28 株式会社東芝 Defect inspection device and inspection method
US6571383B1 (en) 2000-04-28 2003-05-27 Infineon Technologies, Ag Semiconductor device fabrication using a photomask designed using modeling and empirical testing
TW512424B (en) * 2000-05-01 2002-12-01 Asml Masktools Bv Hybrid phase-shift mask
EP1164432A1 (en) * 2000-06-13 2001-12-19 ASML Masktools Netherlands B.V. Optical proximity correction method utilizing serifs having variable dimensions
US6444373B1 (en) 2000-06-16 2002-09-03 Advanced Micro Devices, Inc. Modification of mask layout data to improve mask fidelity
US6787271B2 (en) 2000-07-05 2004-09-07 Numerical Technologies, Inc. Design and layout of phase shifting photolithographic masks
US6634018B2 (en) * 2000-08-24 2003-10-14 Texas Instruments Incorporated Optical proximity correction
US6526550B1 (en) 2000-09-29 2003-02-25 General Electric Company Analyzing characteristics of geometries
US6625801B1 (en) 2000-09-29 2003-09-23 Numerical Technologies, Inc. Dissection of printed edges from a fabrication layout for correcting proximity effects
JP2002196470A (en) 2000-12-26 2002-07-12 Hitachi Ltd Method of manufacturing photomask and method of manufacturing semiconductor integrated circuit device
US6901574B2 (en) 2001-02-09 2005-05-31 Lacour Patrick J. Data management method for mask writing
US6703167B2 (en) 2001-04-18 2004-03-09 Lacour Patrick Joseph Prioritizing the application of resolution enhancement techniques
US6523165B2 (en) * 2001-07-13 2003-02-18 Numerical Technologies, Inc. Alternating phase shift mask design conflict resolution
US6560766B2 (en) 2001-07-26 2003-05-06 Numerical Technologies, Inc. Method and apparatus for analyzing a layout using an instance-based representation
US7302111B2 (en) 2001-09-12 2007-11-27 Micronic Laser Systems A.B. Graphics engine for high precision lithography
JP3708858B2 (en) 2001-09-20 2005-10-19 株式会社東芝 Pattern drawing method and drawing apparatus
US6670082B2 (en) 2001-10-09 2003-12-30 Numerical Technologies, Inc. System and method for correcting 3D effects in an alternating phase-shifting mask
US20030121021A1 (en) * 2001-12-26 2003-06-26 Numerical Technologies, Inc. System and method for determining manufacturing error enhancement factor
US6658640B2 (en) 2001-12-26 2003-12-02 Numerical Technologies, Inc. Simulation-based feed forward process control
US6868537B1 (en) 2002-02-25 2005-03-15 Xilinx, Inc. Method of generating an IC mask using a reduced database
US6884551B2 (en) * 2002-03-04 2005-04-26 Massachusetts Institute Of Technology Method and system of lithography using masks having gray-tone features
JP2003315973A (en) 2002-04-19 2003-11-06 Fujitsu Ltd Mask design device, mask design method, program, and method of manufacturing semiconductor device
DE10228546B4 (en) 2002-06-26 2006-08-10 Infineon Technologies Ag Process for structuring a lithography mask
US7302672B2 (en) 2002-07-12 2007-11-27 Cadence Design Systems, Inc. Method and system for context-specific mask writing
AU2003256530A1 (en) 2002-07-12 2004-02-02 Cadence Design Systems, Inc. Method and system for context-specific mask inspection
JP2005533283A (en) 2002-07-12 2005-11-04 ケイデンス デザイン システムズ インコーポレイテッド Method and system for context specific mask writing
US6792592B2 (en) 2002-08-30 2004-09-14 Numerical Technologies, Inc. Considering mask writer properties during the optical proximity correction process
US6964032B2 (en) 2003-02-28 2005-11-08 International Business Machines Corporation Pitch-based subresolution assist feature design
US7024638B2 (en) 2003-07-14 2006-04-04 Cadence Design Systems, Inc. Method for creating patterns for producing integrated circuits

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5879866A (en) * 1994-12-19 1999-03-09 International Business Machines Corporation Image recording process with improved image tolerances using embedded AR coatings
US6282696B1 (en) * 1997-08-15 2001-08-28 Lsi Logic Corporation Performing optical proximity correction with the aid of design rule checkers
US5932377A (en) * 1998-02-24 1999-08-03 International Business Machines Corporation Exact transmission balanced alternating phase-shifting mask for photolithography

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP1579274A4 *

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US20070233419A1 (en) 2007-10-04
US8407627B2 (en) 2013-03-26
WO2004008245A2 (en) 2004-01-22
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AU2003256530A1 (en) 2004-02-02
US7231628B2 (en) 2007-06-12
JP2006502422A (en) 2006-01-19
US20040133369A1 (en) 2004-07-08
EP1579274A4 (en) 2006-06-07
EP1579274A2 (en) 2005-09-28

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