WO2004013900A3 - System and method for manufacturing embedded conformal electronics - Google Patents

System and method for manufacturing embedded conformal electronics Download PDF

Info

Publication number
WO2004013900A3
WO2004013900A3 PCT/US2003/024584 US0324584W WO2004013900A3 WO 2004013900 A3 WO2004013900 A3 WO 2004013900A3 US 0324584 W US0324584 W US 0324584W WO 2004013900 A3 WO2004013900 A3 WO 2004013900A3
Authority
WO
WIPO (PCT)
Prior art keywords
conformal electronics
manufacturing embedded
embedded conformal
substrate
manufacturing
Prior art date
Application number
PCT/US2003/024584
Other languages
French (fr)
Other versions
WO2004013900A2 (en
Inventor
Richard Gambino
Jon Longtin
Sanjay Sampath
Original Assignee
Univ New York State Res Found
Richard Gambino
Jon Longtin
Sanjay Sampath
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Univ New York State Res Found, Richard Gambino, Jon Longtin, Sanjay Sampath filed Critical Univ New York State Res Found
Priority to AU2003261394A priority Critical patent/AU2003261394A1/en
Priority to EP03767237A priority patent/EP1547126A2/en
Priority to US10/491,609 priority patent/US7709766B2/en
Publication of WO2004013900A2 publication Critical patent/WO2004013900A2/en
Publication of WO2004013900A3 publication Critical patent/WO2004013900A3/en
Priority to US12/724,319 priority patent/US20110171392A1/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76886Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances
    • H01L21/76892Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances modifying the pattern
    • H01L21/76894Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances modifying the pattern using a laser, e.g. laser cutting, laser direct writing, laser repair
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0093Working by laser beam, e.g. welding, cutting or boring combined with mechanical machining or metal-working covered by other subclasses than B23K
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/361Removing material for deburring or mechanical trimming
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C4/00Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
    • C23C4/18After-treatment
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C4/00Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
    • C23C4/18After-treatment
    • C23C4/185Separation of the coating from the substrate
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70383Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/027Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/01Manufacture or treatment
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/36Electric or electronic devices
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1333Deposition techniques, e.g. coating
    • H05K2203/1344Spraying small metal particles or droplets of molten metal
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/043Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a moving tool for milling or cutting the conductive material

Abstract

A method for fabricating an electronic device comprises providing a substrate (501), direct writing a functional material by a thermal spray on the substrate (502) and removing a portion of the function material to form the electronic or sensory device (503).
PCT/US2003/024584 2002-08-05 2003-08-05 System and method for manufacturing embedded conformal electronics WO2004013900A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
AU2003261394A AU2003261394A1 (en) 2002-08-05 2003-08-05 System and method for manufacturing embedded conformal electronics
EP03767237A EP1547126A2 (en) 2002-08-05 2003-08-05 System and method for manufacturing embedded conformal electronics
US10/491,609 US7709766B2 (en) 2002-08-05 2003-08-05 System and method for manufacturing embedded conformal electronics
US12/724,319 US20110171392A1 (en) 2002-08-05 2010-03-15 System and Method for Manufacturing Embedded Conformal Electronics

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US40115002P 2002-08-05 2002-08-05
US60/401,150 2002-08-05

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/724,319 Continuation US20110171392A1 (en) 2002-08-05 2010-03-15 System and Method for Manufacturing Embedded Conformal Electronics

Publications (2)

Publication Number Publication Date
WO2004013900A2 WO2004013900A2 (en) 2004-02-12
WO2004013900A3 true WO2004013900A3 (en) 2004-07-22

Family

ID=31495931

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2003/024584 WO2004013900A2 (en) 2002-08-05 2003-08-05 System and method for manufacturing embedded conformal electronics

Country Status (4)

Country Link
US (2) US7709766B2 (en)
EP (1) EP1547126A2 (en)
AU (1) AU2003261394A1 (en)
WO (1) WO2004013900A2 (en)

Families Citing this family (86)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2003261394A1 (en) * 2002-08-05 2004-02-23 Research Foundation Of The State University Of New York System and method for manufacturing embedded conformal electronics
WO2005086331A2 (en) * 2004-03-02 2005-09-15 Rosemount, Inc. Process device with improved power generation
US8538560B2 (en) * 2004-04-29 2013-09-17 Rosemount Inc. Wireless power and communication unit for process field devices
US8145180B2 (en) * 2004-05-21 2012-03-27 Rosemount Inc. Power generation for process devices
US8160535B2 (en) * 2004-06-28 2012-04-17 Rosemount Inc. RF adapter for field device
US7262693B2 (en) * 2004-06-28 2007-08-28 Rosemount Inc. Process field device with radio frequency communication
US20060020415A1 (en) * 2004-07-23 2006-01-26 Hardwicke Canan U Sensor and method for making same
US9184364B2 (en) * 2005-03-02 2015-11-10 Rosemount Inc. Pipeline thermoelectric generator assembly
US7360437B2 (en) * 2005-06-28 2008-04-22 General Electric Company Devices for evaluating material properties, and related processes
US7906722B2 (en) * 2005-04-19 2011-03-15 Palo Alto Research Center Incorporated Concentrating solar collector with solid optical element
US7799371B2 (en) 2005-11-17 2010-09-21 Palo Alto Research Center Incorporated Extruding/dispensing multiple materials to form high-aspect ratio extruded structures
US20070169806A1 (en) * 2006-01-20 2007-07-26 Palo Alto Research Center Incorporated Solar cell production using non-contact patterning and direct-write metallization
US20070107773A1 (en) * 2005-11-17 2007-05-17 Palo Alto Research Center Incorporated Bifacial cell with extruded gridline metallization
US7765949B2 (en) * 2005-11-17 2010-08-03 Palo Alto Research Center Incorporated Extrusion/dispensing systems and methods
US7855335B2 (en) * 2006-04-26 2010-12-21 Palo Alto Research Center Incorporated Beam integration for concentrating solar collector
US7851693B2 (en) * 2006-05-05 2010-12-14 Palo Alto Research Center Incorporated Passively cooled solar concentrating photovoltaic device
US7638708B2 (en) * 2006-05-05 2009-12-29 Palo Alto Research Center Incorporated Laminated solar concentrating photovoltaic device
US7913566B2 (en) * 2006-05-23 2011-03-29 Rosemount Inc. Industrial process device utilizing magnetic induction
US8188359B2 (en) * 2006-09-28 2012-05-29 Rosemount Inc. Thermoelectric generator assembly for field process devices
EP1906161A1 (en) * 2006-09-28 2008-04-02 General Electric Company Devices for evaluating material properties, and related processes
US7780812B2 (en) * 2006-11-01 2010-08-24 Palo Alto Research Center Incorporated Extrusion head with planarized edge surface
US8226391B2 (en) * 2006-11-01 2012-07-24 Solarworld Innovations Gmbh Micro-extrusion printhead nozzle with tapered cross-section
US7922471B2 (en) * 2006-11-01 2011-04-12 Palo Alto Research Center Incorporated Extruded structure with equilibrium shape
US8322025B2 (en) * 2006-11-01 2012-12-04 Solarworld Innovations Gmbh Apparatus for forming a plurality of high-aspect ratio gridline structures
US20080116182A1 (en) * 2006-11-21 2008-05-22 Palo Alto Research Center Incorporated Multiple Station Scan Displacement Invariant Laser Ablation Apparatus
US20080116183A1 (en) * 2006-11-21 2008-05-22 Palo Alto Research Center Incorporated Light Scanning Mechanism For Scan Displacement Invariant Laser Ablation Apparatus
JP5248518B2 (en) * 2006-11-24 2013-07-31 フラウンホッファー−ゲゼルシャフト・ツァー・フォデラング・デル・アンゲワンテン・フォーシュング・エー.ファウ. Electronic, especially fine electronic functional group and its manufacturing method
US7928015B2 (en) * 2006-12-12 2011-04-19 Palo Alto Research Center Incorporated Solar cell fabrication using extruded dopant-bearing materials
US7638438B2 (en) * 2006-12-12 2009-12-29 Palo Alto Research Center Incorporated Solar cell fabrication using extrusion mask
US20080186593A1 (en) 2007-02-02 2008-08-07 Sol Focus, Inc. Metal trace fabrication for optical element
WO2008097688A1 (en) * 2007-02-02 2008-08-14 Solfocus, Inc. Thermal spray for solar concentrator fabrication
US7954449B2 (en) * 2007-05-08 2011-06-07 Palo Alto Research Center Incorporated Wiring-free, plumbing-free, cooled, vacuum chuck
US8250924B2 (en) 2008-04-22 2012-08-28 Rosemount Inc. Industrial process device utilizing piezoelectric transducer
JP5232299B2 (en) * 2008-06-17 2013-07-10 ローズマウント インコーポレイテッド RF adapter for field devices with loop current bypass
US8694060B2 (en) * 2008-06-17 2014-04-08 Rosemount Inc. Form factor and electromagnetic interference protection for process device wireless adapters
JP5255698B2 (en) 2008-06-17 2013-08-07 ローズマウント インコーポレイテッド Wireless adapter for field devices with variable voltage drop
US8929948B2 (en) * 2008-06-17 2015-01-06 Rosemount Inc. Wireless communication adapter for field devices
CA2726707C (en) * 2008-06-17 2016-01-19 Rosemount Inc. Rf adapter for field device with low voltage intrinsic safety clamping
DE102008036837A1 (en) 2008-08-07 2010-02-18 Epcos Ag Sensor device and method of manufacture
US7999175B2 (en) * 2008-09-09 2011-08-16 Palo Alto Research Center Incorporated Interdigitated back contact silicon solar cells with laser ablated grooves
US7977924B2 (en) * 2008-11-03 2011-07-12 Rosemount Inc. Industrial process power scavenging device and method of deriving process device power from an industrial process
US20100221435A1 (en) * 2008-11-07 2010-09-02 Palo Alto Research Center Incorporated Micro-Extrusion System With Airjet Assisted Bead Deflection
US20100118081A1 (en) * 2008-11-07 2010-05-13 Palo Alto Research Center Incorporated Dead Volume Removal From An Extrusion Printhead
US8117983B2 (en) * 2008-11-07 2012-02-21 Solarworld Innovations Gmbh Directional extruded bead control
US8080729B2 (en) * 2008-11-24 2011-12-20 Palo Alto Research Center Incorporated Melt planarization of solar cell bus bars
US20100130014A1 (en) * 2008-11-26 2010-05-27 Palo Alto Research Center Incorporated Texturing multicrystalline silicon
US20100139754A1 (en) * 2008-12-09 2010-06-10 Palo Alto Research Center Incorporated Solar Cell With Co-Planar Backside Metallization
US8960120B2 (en) * 2008-12-09 2015-02-24 Palo Alto Research Center Incorporated Micro-extrusion printhead with nozzle valves
US20100139756A1 (en) * 2008-12-10 2010-06-10 Palo Alto Research Center Incorporated Simultaneously Writing Bus Bars And Gridlines For Solar Cell
US20100206356A1 (en) * 2009-02-18 2010-08-19 Palo Alto Research Center Incorporated Rotational Trough Reflector Array For Solar-Electricity Generation
US20100206302A1 (en) * 2009-02-18 2010-08-19 Palo Alto Research Center Incorporated Rotational Trough Reflector Array For Solar-Electricity Generation
US20100206379A1 (en) * 2009-02-18 2010-08-19 Palo Alto Research Center Incorporated Rotational Trough Reflector Array With Solid Optical Element For Solar-Electricity Generation
US20100206357A1 (en) * 2009-02-18 2010-08-19 Palo Alto Research Center Incorporated Two-Part Solar Energy Collection System With Replaceable Solar Collector Component
US9674976B2 (en) 2009-06-16 2017-06-06 Rosemount Inc. Wireless process communication adapter with improved encapsulation
US8626087B2 (en) * 2009-06-16 2014-01-07 Rosemount Inc. Wire harness for field devices used in a hazardous locations
US8444377B2 (en) * 2009-10-07 2013-05-21 General Electric Company Method for attaching a connector to deposited material
US20110083728A1 (en) * 2009-10-14 2011-04-14 Palo Alto Research Center Incorporated Disordered Nanowire Solar Cell
US20110100419A1 (en) * 2009-11-03 2011-05-05 Palo Alto Research Center Incorporated Linear Concentrating Solar Collector With Decentered Trough-Type Relectors
US9490975B1 (en) * 2009-12-22 2016-11-08 The Boeing Company Information assurance for networked systems
US10761524B2 (en) 2010-08-12 2020-09-01 Rosemount Inc. Wireless adapter with process diagnostics
US8040609B1 (en) 2010-11-29 2011-10-18 Palo Alto Research Center Incorporated Self-adjusting solar light transmission apparatus
US8884156B2 (en) 2010-11-29 2014-11-11 Palo Alto Research Center Incorporated Solar energy harvesting device using stimuli-responsive material
US8635767B2 (en) 2011-01-05 2014-01-28 Thoe Boeing Company System for depositing microwire
US9297742B2 (en) * 2011-01-06 2016-03-29 General Electric Company Method for manufacturing a corrosion sensor
WO2013019714A1 (en) 2011-07-29 2013-02-07 The Trustees Of Columbia University In The City Of New York Mems affinity sensor for continuous monitoring of analytes
US20140296095A1 (en) * 2011-09-23 2014-10-02 The Trustees Of Columbia University In The City Of New York Spatially Selective Release of Aptamer-Captured Cells by Temperature Mediation
US9310794B2 (en) 2011-10-27 2016-04-12 Rosemount Inc. Power supply for industrial process field device
US8752380B2 (en) 2012-05-22 2014-06-17 Palo Alto Research Center Incorporated Collapsible solar-thermal concentrator for renewable, sustainable expeditionary power generator system
US9346550B2 (en) * 2012-12-05 2016-05-24 Mesoscribe Technologies, Inc. Ice detection and mitigation device
EP2917944B1 (en) 2013-01-24 2016-12-07 O-Flexx Technologies GmbH Thermoelectric element and method for the production thereof
WO2016022696A1 (en) 2014-08-05 2016-02-11 The Trustees Of Columbia University In The City Of New York Method of isolating aptamers for minimal residual disease detection
US20170008125A1 (en) * 2014-10-15 2017-01-12 Siemens Energy, Inc. Flux-assisted device encapsulation
WO2016113651A2 (en) * 2015-01-13 2016-07-21 Director General, Centre For Materials For Electronics Technology A non-conductive substrate with tracks formed by sand blasting
US20180067003A1 (en) * 2015-03-31 2018-03-08 NejiLaw inc. Conduction-path-equipped member, method for patterning conduction path, and method for measuring changes in member
DE102015212444A1 (en) * 2015-06-12 2016-12-15 Schuler Automation Gmbh & Co. Kg Method and device for producing a sheet metal blank
US10801097B2 (en) * 2015-12-23 2020-10-13 Praxair S.T. Technology, Inc. Thermal spray coatings onto non-smooth surfaces
US10595417B2 (en) 2016-07-18 2020-03-17 Verily Life Sciences Llc Method of manufacturing flexible electronic circuits having conformal material coatings
EP3328168A1 (en) * 2016-11-24 2018-05-30 Valeo Iluminacion Method for creating an electronic assembly and electronic assembly
EP3328169A1 (en) * 2016-11-24 2018-05-30 Valeo Iluminacion Method for providing electrical continuity in a circuit and electronical assembly
WO2018187377A1 (en) * 2017-04-03 2018-10-11 Board Of Trustees Of The University Of Arkansas Selective resistive sintering - a new additive manufacturing method
US10794220B2 (en) 2017-05-08 2020-10-06 Raytheon Technologies Corporation Temperature sensor array for a gas turbine engine
TWI631236B (en) * 2017-07-17 2018-08-01 國立臺灣師範大學 Method for producing film electrode of normal temperature gas detecting wafer by ultra-fast laser
DE102017213339A1 (en) 2017-08-02 2018-08-23 Continental Automotive Gmbh Circuit arrangement and method for producing a circuit arrangement
WO2019066994A1 (en) * 2017-09-30 2019-04-04 Intel Corporation Substrate integrated inductors using high throughput additive deposition of hybrid magnetic materials
JP7434187B2 (en) * 2018-06-04 2024-02-20 ブレイクスルー・テクノロジーズ・エルエルシー Energy recovery from waste heat
WO2024017494A1 (en) * 2022-07-19 2024-01-25 Oerlikon Metco Ag, Wohlen Electric heating element production method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6274412B1 (en) * 1998-12-21 2001-08-14 Parelec, Inc. Material and method for printing high conductivity electrical conductors and other components on thin film transistor arrays
US6545291B1 (en) * 1999-08-31 2003-04-08 E Ink Corporation Transistor design for use in the construction of an electronically driven display
US6555411B1 (en) * 2001-12-18 2003-04-29 Lucent Technologies Inc. Thin film transistors
US6697694B2 (en) * 1998-08-26 2004-02-24 Electronic Materials, L.L.C. Apparatus and method for creating flexible circuits

Family Cites Families (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4072768A (en) * 1976-01-23 1978-02-07 Bell Telephone Laboratories, Incorporated Method for making patterned gold metallization
JPS59119701A (en) 1982-12-27 1984-07-11 株式会社東芝 Method of forming resistance material
FR2559960B1 (en) * 1984-02-20 1987-03-06 Solems Sa METHOD FOR FORMING THIN-FILM ELECTRIC CIRCUITS AND PRODUCTS OBTAINED
US4801352A (en) * 1986-12-30 1989-01-31 Image Micro Systems, Inc. Flowing gas seal enclosure for processing workpiece surface with controlled gas environment and intense laser irradiation
US4909895A (en) * 1989-04-11 1990-03-20 Pacific Bell System and method for providing a conductive circuit pattern utilizing thermal oxidation
JPH02308291A (en) * 1989-05-24 1990-12-21 Onoda Cement Co Ltd Heat fixing roll for copying machine and its manufacture
DE4000372A1 (en) 1990-01-09 1991-07-11 Aei Gmbh Conductive path prodn. on insulating plate - by selectively cutting away conductive coating on insulating base using scanning laser or sand jet
JP2861368B2 (en) 1990-11-05 1999-02-24 住友電気工業株式会社 Circuit board processing method
US5126529A (en) * 1990-12-03 1992-06-30 Weiss Lee E Method and apparatus for fabrication of three-dimensional articles by thermal spray deposition
US5286573A (en) * 1990-12-03 1994-02-15 Fritz Prinz Method and support structures for creation of objects by layer deposition
US5278442A (en) * 1991-07-15 1994-01-11 Prinz Fritz B Electronic packages and smart structures formed by thermal spray deposition
US5203944A (en) * 1991-10-10 1993-04-20 Prinz Fritz B Method for fabrication of three-dimensional articles by thermal spray deposition using masks as support structures
GB9122010D0 (en) * 1991-10-15 1991-12-04 British Aerospace An apparatus for laser processing of composite structures
US5247278A (en) * 1991-11-26 1993-09-21 Honeywell Inc. Magnetic field sensing device
TW218430B (en) 1992-01-30 1994-01-01 Motorola Inc
JPH06179092A (en) * 1992-12-14 1994-06-28 Fanuc Ltd Method and device for laser beam machining by laser robot
JPH06350153A (en) * 1993-06-10 1994-12-22 Kokusai Chodendo Sangyo Gijutsu Kenkyu Center Manufacture of superconducting device
US5656186A (en) * 1994-04-08 1997-08-12 The Regents Of The University Of Michigan Method for controlling configuration of laser induced breakdown and ablation
US5575932A (en) * 1994-05-13 1996-11-19 Performance Controls, Inc. Method of making densely-packed electrical conductors
DE19502044A1 (en) * 1995-01-12 1996-07-18 Lars Ickert Manufacturing multiple layer two=dimensional and three=dimensional circuit boards
JPH08193804A (en) 1995-01-18 1996-07-30 Mitsubishi Heavy Ind Ltd Thin type strain gage for high temperature
US5824374A (en) * 1996-07-22 1998-10-20 Optical Coating Laboratory, Inc. In-situ laser patterning of thin film layers during sequential depositing
US6331680B1 (en) * 1996-08-07 2001-12-18 Visteon Global Technologies, Inc. Multilayer electrical interconnection device and method of making same
US5762711A (en) * 1996-11-15 1998-06-09 Honeywell Inc. Coating delicate circuits
CA2240235A1 (en) * 1997-07-08 1999-01-08 Oludele Olusegun Popoola Multilayer electrical interconnection device and method of making same
US6180446B1 (en) * 1997-12-17 2001-01-30 Texas Instruments Incorporated Method of fabricating an oxygen-stable layer/diffusion barrier/poly bottom electrode structure for high-K DRAMS using disposable-oxide processing
US20020170890A1 (en) * 2001-04-27 2002-11-21 Keicher David M. Precision spray processes for direct write electronic components
JP2000244100A (en) * 1999-02-24 2000-09-08 Yazaki Corp Flame spray circuit body and its manufacture
US6388230B1 (en) * 1999-10-13 2002-05-14 Morton International, Inc. Laser imaging of thin layer electronic circuitry material
JP4249359B2 (en) * 2000-01-20 2009-04-02 独立行政法人理化学研究所 Manufacturing method of ACM sensor
US6552301B2 (en) * 2000-01-25 2003-04-22 Peter R. Herman Burst-ultrafast laser machining method
US7157038B2 (en) * 2000-09-20 2007-01-02 Electro Scientific Industries, Inc. Ultraviolet laser ablative patterning of microstructures in semiconductors
JP4035981B2 (en) * 2001-10-26 2008-01-23 松下電工株式会社 Circuit formation method using ultrashort pulse laser
US20030136769A1 (en) * 2002-01-23 2003-07-24 Yue-Yeh Lin Laser ablation technique using in IC etching process
AU2003261394A1 (en) * 2002-08-05 2004-02-23 Research Foundation Of The State University Of New York System and method for manufacturing embedded conformal electronics

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6697694B2 (en) * 1998-08-26 2004-02-24 Electronic Materials, L.L.C. Apparatus and method for creating flexible circuits
US6274412B1 (en) * 1998-12-21 2001-08-14 Parelec, Inc. Material and method for printing high conductivity electrical conductors and other components on thin film transistor arrays
US6545291B1 (en) * 1999-08-31 2003-04-08 E Ink Corporation Transistor design for use in the construction of an electronically driven display
US6555411B1 (en) * 2001-12-18 2003-04-29 Lucent Technologies Inc. Thin film transistors

Also Published As

Publication number Publication date
US20050029236A1 (en) 2005-02-10
WO2004013900A2 (en) 2004-02-12
US7709766B2 (en) 2010-05-04
US20110171392A1 (en) 2011-07-14
AU2003261394A1 (en) 2004-02-23
AU2003261394A8 (en) 2004-02-23
EP1547126A2 (en) 2005-06-29

Similar Documents

Publication Publication Date Title
WO2004013900A3 (en) System and method for manufacturing embedded conformal electronics
WO2004061954A3 (en) Electronic unit integrated into a flexible polymer body
WO2003088371A3 (en) Protected organic electronic devices and methods for making the same
AU2003303968A1 (en) An interconnection device for a printed circuit board, a method of manufacturing the same, and an interconnection assembly having the same
AU2003219354A1 (en) Carrier, method of manufacturing a carrier and an electronic device
EP1173047A4 (en) Composite substrate, thin-film light-emitting device comprising the same, and method for producing the same
WO2005001422A3 (en) Sensor chip and apparatus for tactile and/or flow
WO2005021156A3 (en) Capillary imprinting technique
AU2003231301A1 (en) Method and system for producing a wood substrate having an image on at least one surface and the resulting wood product
WO2003067657A3 (en) Semiconductor component comprising a sensor surface or an actuator surface, and method for producing the same
EP1609173A4 (en) Electronic device including a self-assembled monolayer, and a method of fabricating the same
WO2004075604A3 (en) Organic electroluminescent device and method for fabricating the same
WO2004076230A3 (en) Method and device for producing a light-emitting device
HK1060158A1 (en) A method of depositing a thin film on a substrate,a substrate and a diamond film produced by the me thod
GB0325748D0 (en) A method of forming a patterned layer on a substrate
AU2003296081A1 (en) Pattern forming method, electronic device manufacturing method, electronic device, and photomask
AU2003304218A8 (en) Method and system for fabricating multi layer devices on a substrate
AU2003285771A1 (en) Nanostructure, electronic device and method of manufacturing the same
AU2003221222A1 (en) The control method of arranging carbon nanotubes selectively orientationally on the surface of a substrate
WO2006068741A3 (en) Flexible electronic circuit articles and methods of making thereof
AU2003216588A1 (en) Method of manufacturing an electronic device in a cavity with a cover
WO2006064003A3 (en) Devices and method for monitoring the form of three-dimensional objects
AU2002241810A1 (en) Method of patterning a mask on the surface of a substrate and product manufactured thereby
WO2006036751A3 (en) Integrated circuit and method for manufacturing
AU2003215669A1 (en) Method for coating a substrate and device for carrying out the method

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ OM PH PL PT RO RU SD SE SG SK SL TJ TM TN TR TT TZ UA UG US UZ VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

WWE Wipo information: entry into national phase

Ref document number: 10491609

Country of ref document: US

121 Ep: the epo has been informed by wipo that ep was designated in this application
WWE Wipo information: entry into national phase

Ref document number: 2003767237

Country of ref document: EP

WWP Wipo information: published in national office

Ref document number: 2003767237

Country of ref document: EP

NENP Non-entry into the national phase

Ref country code: JP

WWW Wipo information: withdrawn in national office

Country of ref document: JP