WO2004013911A3 - Thermal management system having porous fluid transfer element - Google Patents

Thermal management system having porous fluid transfer element Download PDF

Info

Publication number
WO2004013911A3
WO2004013911A3 PCT/US2003/024329 US0324329W WO2004013911A3 WO 2004013911 A3 WO2004013911 A3 WO 2004013911A3 US 0324329 W US0324329 W US 0324329W WO 2004013911 A3 WO2004013911 A3 WO 2004013911A3
Authority
WO
WIPO (PCT)
Prior art keywords
thermal management
transfer element
fluid transfer
management system
liquid
Prior art date
Application number
PCT/US2003/024329
Other languages
French (fr)
Other versions
WO2004013911A2 (en
Inventor
Richard M Weber
Kevin W Chen
Original Assignee
Raytheon Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Raytheon Co filed Critical Raytheon Co
Priority to AU2003257159A priority Critical patent/AU2003257159A1/en
Priority to EP03767141.9A priority patent/EP1525617B1/en
Publication of WO2004013911A2 publication Critical patent/WO2004013911A2/en
Publication of WO2004013911A3 publication Critical patent/WO2004013911A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)

Abstract

A thermal management system is provided. The system has a thermal management apparatus which may be disposed adjacent to and connected with a heat source. The thermal management apparatus may include a body having a porous fluid transfer element disposed therein. The body may also have a heat fluid disposed therein. The heat source may create relatively liquid-rich and liquid-poor regions within the thermal management apparatus. The wicking action of the porous fluid transfer element may be used to force heat transfer fluid from liquid-rich regions toward liquid-poor regions.
PCT/US2003/024329 2002-08-02 2003-08-01 Thermal management system having porous fluid transfer element WO2004013911A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
AU2003257159A AU2003257159A1 (en) 2002-08-02 2003-08-01 Thermal management system having porous fluid transfer element
EP03767141.9A EP1525617B1 (en) 2002-08-02 2003-08-01 Thermal management system having porous fluid transfer element

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/211,104 US7161802B2 (en) 2002-08-02 2002-08-02 Thermal management system having porous fluid transfer element
US10/211,104 2002-08-02

Publications (2)

Publication Number Publication Date
WO2004013911A2 WO2004013911A2 (en) 2004-02-12
WO2004013911A3 true WO2004013911A3 (en) 2004-05-13

Family

ID=31187508

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2003/024329 WO2004013911A2 (en) 2002-08-02 2003-08-01 Thermal management system having porous fluid transfer element

Country Status (4)

Country Link
US (1) US7161802B2 (en)
EP (1) EP1525617B1 (en)
AU (1) AU2003257159A1 (en)
WO (1) WO2004013911A2 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6765793B2 (en) * 2002-08-30 2004-07-20 Themis Corporation Ruggedized electronics enclosure
US7044199B2 (en) * 2003-10-20 2006-05-16 Thermal Corp. Porous media cold plate
US20050111188A1 (en) * 2003-11-26 2005-05-26 Anandaroop Bhattacharya Thermal management device for an integrated circuit
US7729287B2 (en) * 2006-11-10 2010-06-01 At&T Intellectual Property I, L.P. Methods of providing simulation for communications systems and related systems and computer program products
US20080174960A1 (en) * 2007-01-22 2008-07-24 Themis Computer Clamshell enclosure for electronic circuit assemblies
US20090008063A1 (en) * 2007-07-03 2009-01-08 Raytheon Company System and Method for Passive Cooling Using a Non-Metallic Wick
US20130206369A1 (en) * 2012-02-13 2013-08-15 Wei-I Lin Heat dissipating device
CN108278581B (en) * 2018-01-28 2019-11-29 陈攀攀 A kind of cooling structure of LED array module
US11300362B2 (en) 2019-01-31 2022-04-12 Toyota Motor Engineering & Manufacturing North America, Inc. Hybrid evaporator-feeding wicks for uniform fluid delivery to multiple heat sources in a vapor chamber

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4047198A (en) * 1976-04-19 1977-09-06 Hughes Aircraft Company Transistor cooling by heat pipes having a wick of dielectric powder
US4770238A (en) * 1987-06-30 1988-09-13 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Capillary heat transport and fluid management device
US5790376A (en) * 1996-11-06 1998-08-04 Compaq Computer Corporation Heat dissipating pad structure for an electronic component
JP2002303494A (en) * 2001-04-02 2002-10-18 Mitsubishi Electric Corp Evaporator and loop type heat pipe employing the same

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4233645A (en) * 1978-10-02 1980-11-11 International Business Machines Corporation Semiconductor package with improved conduction cooling structure
US4833567A (en) * 1986-05-30 1989-05-23 Digital Equipment Corporation Integral heat pipe module
US5046365A (en) * 1990-07-16 1991-09-10 General Dynamics Corporation/Space Systems Div Transducer thermal protection system
US6034875A (en) * 1998-06-17 2000-03-07 International Business Machines Corporation Cooling structure for electronic components
US6382309B1 (en) * 2000-05-16 2002-05-07 Swales Aerospace Loop heat pipe incorporating an evaporator having a wick that is liquid superheat tolerant and is resistant to back-conduction

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4047198A (en) * 1976-04-19 1977-09-06 Hughes Aircraft Company Transistor cooling by heat pipes having a wick of dielectric powder
US4770238A (en) * 1987-06-30 1988-09-13 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Capillary heat transport and fluid management device
US5790376A (en) * 1996-11-06 1998-08-04 Compaq Computer Corporation Heat dissipating pad structure for an electronic component
JP2002303494A (en) * 2001-04-02 2002-10-18 Mitsubishi Electric Corp Evaporator and loop type heat pipe employing the same

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 2003, no. 02 5 February 2003 (2003-02-05) *

Also Published As

Publication number Publication date
US7161802B2 (en) 2007-01-09
EP1525617B1 (en) 2018-05-02
EP1525617A2 (en) 2005-04-27
AU2003257159A1 (en) 2004-02-23
US20040022027A1 (en) 2004-02-05
WO2004013911A2 (en) 2004-02-12

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