WO2004020704A8 - Apparatus and method for deposition of an electrophoretic emulsion - Google Patents

Apparatus and method for deposition of an electrophoretic emulsion

Info

Publication number
WO2004020704A8
WO2004020704A8 PCT/US2002/028165 US0228165W WO2004020704A8 WO 2004020704 A8 WO2004020704 A8 WO 2004020704A8 US 0228165 W US0228165 W US 0228165W WO 2004020704 A8 WO2004020704 A8 WO 2004020704A8
Authority
WO
WIPO (PCT)
Prior art keywords
electrophoretic
microelectronic
workpiece
deposition
microfabrication
Prior art date
Application number
PCT/US2002/028165
Other languages
French (fr)
Other versions
WO2004020704A1 (en
Inventor
John Klocke
Kyle M Hanson
Original Assignee
Semitool Inc
John Klocke
Kyle M Hanson
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semitool Inc, John Klocke, Kyle M Hanson filed Critical Semitool Inc
Priority to JP2004532544A priority Critical patent/JP2006517004A/en
Priority to EP02768797A priority patent/EP1563119A4/en
Priority to AU2002331809A priority patent/AU2002331809A1/en
Publication of WO2004020704A1 publication Critical patent/WO2004020704A1/en
Publication of WO2004020704A8 publication Critical patent/WO2004020704A8/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/164—Coating processes; Apparatus therefor using electric, electrostatic or magnetic means; powder coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D13/00—Electrophoretic coating characterised by the process
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D13/00—Electrophoretic coating characterised by the process
    • C25D13/12—Electrophoretic coating characterised by the process characterised by the article coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D13/00—Electrophoretic coating characterised by the process
    • C25D13/22—Servicing or operating apparatus or multistep processes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer

Abstract

The present invention provides a system that enables the use of electrophoretic resists in the microfabrication industry for the production of microelectronic devices and is of sufficiently high quality to be used as a replacement for, or supplement to, current photoresist deposition technology. This system enables the application of electrophoretic resists in automated equipment that meets the standards for cleanliness and production throughput desired by the microelectronic fabrication industry. The system, apparatus and method, for providing electrophoretic resist layers on microelectronic workpieces for the microfabrication of microelectronic devices comprises a deposition station (11) for receiving a microelectronic workpiece and depositing a layer of electrophoretic photoresist thereon, a workpiece handling apparatus (26), and a control unit (46) coupled to the workpiece handling apparatus (26) and the deposition station (11) for coordinating the processing of the workpiece in accordance with a predetermined sequence and set of processing parameters.
PCT/US2002/028165 2001-08-31 2002-09-03 Apparatus and method for deposition of an electrophoretic emulsion WO2004020704A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2004532544A JP2006517004A (en) 2001-08-31 2002-09-03 Electrophoretic emulsion deposition apparatus and method
EP02768797A EP1563119A4 (en) 2001-08-31 2002-09-03 Apparatus and method for deposition of an electrophoretic emulsion
AU2002331809A AU2002331809A1 (en) 2001-08-31 2002-09-03 Apparatus and method for deposition of an electrophoretic emulsion

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US31646101P 2001-08-31 2001-08-31
US60/316,461 2002-08-31

Publications (2)

Publication Number Publication Date
WO2004020704A1 WO2004020704A1 (en) 2004-03-11
WO2004020704A8 true WO2004020704A8 (en) 2006-03-30

Family

ID=36091351

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2002/028165 WO2004020704A1 (en) 2001-08-31 2002-09-03 Apparatus and method for deposition of an electrophoretic emulsion

Country Status (5)

Country Link
US (4) US7169280B2 (en)
EP (1) EP1563119A4 (en)
JP (1) JP2006517004A (en)
AU (1) AU2002331809A1 (en)
WO (1) WO2004020704A1 (en)

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US8878219B2 (en) 2008-01-11 2014-11-04 Cree, Inc. Flip-chip phosphor coating method and devices fabricated utilizing method
US9024349B2 (en) 2007-01-22 2015-05-05 Cree, Inc. Wafer level phosphor coating method and devices fabricated utilizing method
US9105817B2 (en) 2003-09-18 2015-08-11 Cree, Inc. Molded chip fabrication method and apparatus
US9159888B2 (en) 2007-01-22 2015-10-13 Cree, Inc. Wafer level phosphor coating method and devices fabricated utilizing method
US9166126B2 (en) 2011-01-31 2015-10-20 Cree, Inc. Conformally coated light emitting devices and methods for providing the same

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Publication number Priority date Publication date Assignee Title
US9105817B2 (en) 2003-09-18 2015-08-11 Cree, Inc. Molded chip fabrication method and apparatus
US9024349B2 (en) 2007-01-22 2015-05-05 Cree, Inc. Wafer level phosphor coating method and devices fabricated utilizing method
US9159888B2 (en) 2007-01-22 2015-10-13 Cree, Inc. Wafer level phosphor coating method and devices fabricated utilizing method
US8878219B2 (en) 2008-01-11 2014-11-04 Cree, Inc. Flip-chip phosphor coating method and devices fabricated utilizing method
US9166126B2 (en) 2011-01-31 2015-10-20 Cree, Inc. Conformally coated light emitting devices and methods for providing the same

Also Published As

Publication number Publication date
US7169280B2 (en) 2007-01-30
EP1563119A4 (en) 2006-03-22
AU2002331809A8 (en) 2004-03-19
US20030079989A1 (en) 2003-05-01
US20030057093A1 (en) 2003-03-27
WO2004020704A1 (en) 2004-03-11
AU2002331809A1 (en) 2004-03-19
US20070175759A1 (en) 2007-08-02
US7150816B2 (en) 2006-12-19
JP2006517004A (en) 2006-07-13
US20030068837A1 (en) 2003-04-10
US7147765B2 (en) 2006-12-12
EP1563119A1 (en) 2005-08-17

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