WO2004023522A3 - Power surface mount light emitting die package - Google Patents

Power surface mount light emitting die package Download PDF

Info

Publication number
WO2004023522A3
WO2004023522A3 PCT/US2003/027421 US0327421W WO2004023522A3 WO 2004023522 A3 WO2004023522 A3 WO 2004023522A3 US 0327421 W US0327421 W US 0327421W WO 2004023522 A3 WO2004023522 A3 WO 2004023522A3
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
reflector plate
led
light emitting
die package
Prior art date
Application number
PCT/US2003/027421
Other languages
French (fr)
Other versions
WO2004023522A2 (en
Inventor
Ban P Loh
Original Assignee
Cree Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cree Inc filed Critical Cree Inc
Priority to KR1020117002573A priority Critical patent/KR101088928B1/en
Priority to AU2003276860A priority patent/AU2003276860A1/en
Priority to KR1020117002568A priority patent/KR101082304B1/en
Priority to DE60322074T priority patent/DE60322074D1/en
Priority to KR1020117002566A priority patent/KR101082169B1/en
Priority to KR1020117002567A priority patent/KR101082145B1/en
Priority to JP2004534428A priority patent/JP4731906B2/en
Priority to EP03794564A priority patent/EP1537603B1/en
Priority to CA002496937A priority patent/CA2496937A1/en
Publication of WO2004023522A2 publication Critical patent/WO2004023522A2/en
Publication of WO2004023522A3 publication Critical patent/WO2004023522A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

Abstract

A light emitting die package (10) is disclosed. The die package (10) includes a substrate (20), a reflector plate (40), and a lens (50). The substrate (20) is made from thermally conductive but electrically insulating material. The substrate (20) has traces (22, 24) for connecting an external electrical power source to a light emitting diode (LED) (60) at a mounting pad (28). The reflector plate (40) is coupled to the substrate (20) and substantially surrounds the mounting pad (28). The lens (50) is free to move relative to the reflector plate (40) and is capable of being raised or lowered by the encapsulant (46) that wets and adheres to it and is placed at an optimal distance from the LED chip (s). The lens (50) can be coated with any optical system of chemical that affects the performance of the device (10). Heat generated by the LED (60) during operation is drawn away from the LED (60) by both the substrate (20) (acting as a bottom heat sink) and the reflector plate (40) (acting as a top heat sink). The reflector plate (40) includes a reflective surface (42) to direct light from the LED (60) in a desired direction.
PCT/US2003/027421 2002-09-04 2003-09-02 Power surface mount light emitting die package WO2004023522A2 (en)

Priority Applications (9)

Application Number Priority Date Filing Date Title
KR1020117002573A KR101088928B1 (en) 2002-09-04 2003-09-02 Power surface mount light emitting die package
AU2003276860A AU2003276860A1 (en) 2002-09-04 2003-09-02 Power surface mount light emitting die package
KR1020117002568A KR101082304B1 (en) 2002-09-04 2003-09-02 power surface mount light emitting die package
DE60322074T DE60322074D1 (en) 2002-09-04 2003-09-02 SURFACE MOUNTED HOUSING FOR LIGHT-EMITTING POWER SCISSORS
KR1020117002566A KR101082169B1 (en) 2002-09-04 2003-09-02 power surface mount light emitting die package
KR1020117002567A KR101082145B1 (en) 2002-09-04 2003-09-02 power surface mount light emitting die package
JP2004534428A JP4731906B2 (en) 2002-09-04 2003-09-02 Power surface mounted light emitting die package
EP03794564A EP1537603B1 (en) 2002-09-04 2003-09-02 Power surface mount light emitting die package
CA002496937A CA2496937A1 (en) 2002-09-04 2003-09-02 Power surface mount light emitting die package

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US40825402P 2002-09-04 2002-09-04
US60/408,254 2002-09-04
US10/446,532 US7264378B2 (en) 2002-09-04 2003-05-27 Power surface mount light emitting die package
US10/446,532 2003-05-27

Publications (2)

Publication Number Publication Date
WO2004023522A2 WO2004023522A2 (en) 2004-03-18
WO2004023522A3 true WO2004023522A3 (en) 2004-12-23

Family

ID=31981582

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2003/027421 WO2004023522A2 (en) 2002-09-04 2003-09-02 Power surface mount light emitting die package

Country Status (11)

Country Link
US (1) US7264378B2 (en)
EP (2) EP1537603B1 (en)
JP (8) JP4731906B2 (en)
KR (5) KR101082235B1 (en)
CN (1) CN100414698C (en)
AT (1) ATE400896T1 (en)
AU (1) AU2003276860A1 (en)
CA (1) CA2496937A1 (en)
DE (1) DE60322074D1 (en)
TW (1) TWI331380B (en)
WO (1) WO2004023522A2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
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US8932886B2 (en) 2004-06-04 2015-01-13 Cree, Inc. Power light emitting die package with reflecting lens and the method of making the same

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