WO2004030040A3 - Method and apparatus for shielding an integrated circuit from radiation - Google Patents
Method and apparatus for shielding an integrated circuit from radiation Download PDFInfo
- Publication number
- WO2004030040A3 WO2004030040A3 PCT/US2003/030245 US0330245W WO2004030040A3 WO 2004030040 A3 WO2004030040 A3 WO 2004030040A3 US 0330245 W US0330245 W US 0330245W WO 2004030040 A3 WO2004030040 A3 WO 2004030040A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- circuit device
- radiation
- shielding
- coupled
- electronic circuit
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/05599—Material
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/8538—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/85399—Material
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01077—Iridium [Ir]
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- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/15165—Monolayer substrate
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ES03798732.8T ES2674344T3 (en) | 2002-09-25 | 2003-09-24 | Method and apparatus for shielding an integrated radiation circuit |
EP03798732.8A EP1547128B1 (en) | 2002-09-25 | 2003-09-24 | Method and apparatus for shielding an integrated circuit from radiation |
AU2003276938A AU2003276938A1 (en) | 2002-09-25 | 2003-09-24 | Method and apparatus for shielding an integrated circuit from radiation |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/065,209 US7382043B2 (en) | 2002-09-25 | 2002-09-25 | Method and apparatus for shielding an integrated circuit from radiation |
US10/065,209 | 2002-09-25 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2004030040A2 WO2004030040A2 (en) | 2004-04-08 |
WO2004030040A3 true WO2004030040A3 (en) | 2004-07-01 |
Family
ID=31990010
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2003/030245 WO2004030040A2 (en) | 2002-09-25 | 2003-09-24 | Method and apparatus for shielding an integrated circuit from radiation |
Country Status (5)
Country | Link |
---|---|
US (1) | US7382043B2 (en) |
EP (2) | EP2270486B1 (en) |
AU (1) | AU2003276938A1 (en) |
ES (2) | ES2674344T3 (en) |
WO (1) | WO2004030040A2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8018739B2 (en) | 2003-07-16 | 2011-09-13 | Maxwell Technologies, LLC | Apparatus for shielding integrated circuit devices |
Families Citing this family (18)
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US7327015B2 (en) * | 2004-09-20 | 2008-02-05 | Advanced Semiconductor Engineering, Inc. | Semiconductor device package |
JP2006237390A (en) * | 2005-02-25 | 2006-09-07 | Fuji Photo Film Co Ltd | Ic and wireless ic tag |
US9205182B2 (en) * | 2005-03-31 | 2015-12-08 | Medtronic, Inc. | Methods and apparatus for reducing deleterious effects of x-ray radiation upon implantable medical device circuitry |
DE102005025693B4 (en) | 2005-06-04 | 2009-06-18 | Forschungszentrum Karlsruhe Gmbh | Process for producing an organometallic layer |
KR100782774B1 (en) * | 2006-05-25 | 2007-12-05 | 삼성전기주식회사 | System in package module |
US8154881B2 (en) * | 2006-11-13 | 2012-04-10 | Telecommunication Systems, Inc. | Radiation-shielded semiconductor assembly |
US7528790B2 (en) * | 2007-06-12 | 2009-05-05 | Ethertronics, Inc. | System and method for preventing copying of electronic component designs |
US8533853B2 (en) | 2009-06-12 | 2013-09-10 | Telecommunication Systems, Inc. | Location sensitive solid state drive |
EP2790132A3 (en) * | 2009-09-24 | 2014-10-29 | Terrara Code Research Institute, Inc. | RFID tag |
TWM409527U (en) * | 2011-02-23 | 2011-08-11 | Azurewave Technologies Inc | Forming integrated circuit module |
US9209138B2 (en) * | 2013-12-09 | 2015-12-08 | Aeroflex Colorado Springs, Inc. | Integrated circuit shielding technique utilizing stacked die technology incorporating top and bottom nickel-iron alloy shields having a low coefficient of thermal expansion |
CN105047648B (en) * | 2015-06-23 | 2017-09-15 | 上海航天电子通讯设备研究所 | A kind of system-in-package structure and method for packing |
JP6829259B2 (en) * | 2016-02-18 | 2021-02-10 | ニンボー サニー オプテック カンパニー,リミテッド | Integrated packaging process-based camera module, its integrated base parts, and how to manufacture them |
WO2018236902A1 (en) | 2017-06-20 | 2018-12-27 | Viasat, Inc. | Antenna array radiation shielding |
KR102487841B1 (en) * | 2018-03-14 | 2023-01-11 | 삼성전자주식회사 | Semiconductor package |
EP3891793A4 (en) | 2018-12-06 | 2022-10-05 | Analog Devices, Inc. | Integrated device packages with passive device assemblies |
US11664340B2 (en) | 2020-07-13 | 2023-05-30 | Analog Devices, Inc. | Negative fillet for mounting an integrated device die to a carrier |
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Publication number | Priority date | Publication date | Assignee | Title |
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US8018739B2 (en) | 2003-07-16 | 2011-09-13 | Maxwell Technologies, LLC | Apparatus for shielding integrated circuit devices |
Also Published As
Publication number | Publication date |
---|---|
AU2003276938A1 (en) | 2004-04-19 |
ES2586036T3 (en) | 2016-10-11 |
AU2003276938A8 (en) | 2004-04-19 |
EP2270486B1 (en) | 2016-05-04 |
US7382043B2 (en) | 2008-06-03 |
EP2270486A3 (en) | 2012-05-02 |
ES2674344T3 (en) | 2018-06-29 |
EP1547128A2 (en) | 2005-06-29 |
EP2270486A2 (en) | 2011-01-05 |
EP1547128A4 (en) | 2006-10-18 |
EP1547128B1 (en) | 2018-03-28 |
WO2004030040A2 (en) | 2004-04-08 |
US20040056334A1 (en) | 2004-03-25 |
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