WO2004044420A2 - Dynamic micro-positioning and aligning apparatus and method - Google Patents
Dynamic micro-positioning and aligning apparatus and method Download PDFInfo
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- WO2004044420A2 WO2004044420A2 PCT/US2003/032145 US0332145W WO2004044420A2 WO 2004044420 A2 WO2004044420 A2 WO 2004044420A2 US 0332145 W US0332145 W US 0332145W WO 2004044420 A2 WO2004044420 A2 WO 2004044420A2
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
- G02B6/38—Mechanical coupling means having fibre to fibre mating means
- G02B6/3807—Dismountable connectors, i.e. comprising plugs
- G02B6/3833—Details of mounting fibres in ferrules; Assembly methods; Manufacture
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/32—Optical coupling means having lens focusing means positioned between opposed fibre ends
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
- G02B6/38—Mechanical coupling means having fibre to fibre mating means
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/422—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/422—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
- G02B6/4226—Positioning means for moving the elements into alignment, e.g. alignment screws, deformation of the mount
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/422—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
- G02B6/4227—Active alignment methods, e.g. procedures and algorithms
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
- G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
- G02B6/3632—Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means
- G02B6/3644—Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means the coupling means being through-holes or wall apertures
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
- G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
- G02B6/3648—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures
- G02B6/3656—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures the additional structures being micropositioning, with microactuating elements for fine adjustment, or restricting movement, into two dimensions, e.g. cantilevers, beams, tongues or bridges with associated MEMs
Definitions
- the present invention relates to one or a plurality of micro-positioners used to dynamically align, position or move media(s), mass(es), or component(s) and device(s) related thereto.
- Such media include, but are not limited to, one or a plurality of fibers, optical fibers, optical elements, tubes or wires, and such components include, but are not limited to, lenses, nozzles, valves, antenna elements and radio frequency ("rf") stubs.
- the micro-positioners can be positioned and secured inside a jacket or other self-contained housing adapted to receive and hold the media or securely hold the components.
- the micro- positioners may also be used to position materials within an integrated package, such as an optical package.
- the conventional means of aligning a media or component is to statically align the media or component or the mount holding the media or component either passively or actively.
- Static or statically refers to the inability to make adjustments to the media after the media and related elements are anchored.
- To align a media passively small silicon workbenches are etched into a device using semiconductor technology. Piece parts are then placed upon the etched workbench and secured in place.
- the media could consist of optical fiber.
- the passive method requires that the optical fiber be precisely located and aligned to a mechanical feature, which can in turn be located in an etched groove within the workbench. The passive method has had limited alignment success because, in many cases, the relationship between the mechanical feature and the optical fiber is not sufficiently precise.
- the active method of aligning a media or component is more widely used.
- the active method uses complex equipment to move a media, typically an optical fiber, into alignment.
- the equipment then anchors the media, such as an optical fiber, using glue, solder or welding.
- the active method is more precise, successful employment ofthe active method requires complex equipment and precise piece parts with extremely flat and smooth surfaces.
- manufacturing yields using the active method are typically low and rework ofthe assemblies is difficult.
- active alignment is static.
- the present invention comprises a dynamic micro-positioner used to position and/or align media or components and includes a variety of embodiments and applications thereof.
- the present invention can be used to position and/or align a media or components, such media including, but not limited to, one or a plurality of fibers, optical fibers, optical elements, tubes or wires, such components including, but not limited to, lenses and/or nozzles.
- the MEMS actuator disclosed in United States Patent 6,114,794 to Dhuler et. al. uses a silicon substrate upon which a bimetallic material is added.
- the method of fabricating the actuator of Dhuler applies a separate heater to expand the bimetallic member.
- the member of Dhuler is securely attached to the substrate such that only a minimum amount of displacement can be achieved.
- Dhuler further discloses a latch mechanism. However the latch is operable only to lock the optical element in a few discrete positions.
- an embodiment ofthe present invention includes integral heaters to provide expansion and a locking mechanism to allow for a continuum of possible locked positions. Further, the mechanism of an embodiment of the present invention transitions through a sequence of alternating locking positions. This permits large movements, the integrated heaters providing a user defined step size.
- the apparatus and method of optical switching disclosed in United States Patent Number 6,381,382 B2 to Goodman et. al. adds a composition on the sides of a fiber, longitudinally, which contracts or expands with an electrical signal.
- the invention of Goodman et. al. is operable to bend fiber and thus align optics.
- the invention of Goodman et. al. requires continuous electrical power to maintain alignment and uses piezoelectric and other materials. Because of local stresses on the fiber, polarization properties ofthe light signal may be affected.
- An embodiment of the present invention has integral micro- positioners to move media, such as optical elements, to a desired location.
- the present invention does not utilize longitudinal actuators attached to fiber, but rather uses a MEMS thermal actuator perpendicular to the fiber.
- Number 6,487,355 to Flanders discloses a passive alignment and static anchoring structure fine-tuned by flexion.
- the invention of Flanders does not permit dynamic anchoring.
- the present invention permits active alignment of a media without flexion and permits dynamic anchoring ofthe media.
- Patent Number 4,696,062 to LaBudde consists of an optical switch that moves a lens relative to a fixed optical rod between ports to produce a switch wherein alignment is achieved by monitoring a reflection.
- the fiber optic embodiment of the present invention uses free space between two collimators and/or connector or combination of collimator and fiber or connector and fiber.
- B 1 to Bergmann et. al. utilizes a lens within the optical path wliich, when moved perpendicular to the optical path, causes a change in its pointing angle.
- the assembly requires external manipulators to move parts to their desired location and incorporates welding, adhesives, or solder to anchor the assembly into position. After anchoring, the elements cannot be further adjusted.
- an embodiment of the present invention utilizes integral micro-positioners to move the elements, such as optical elements, into a desired location.
- the assembly of the present invention is self-locking in that when power is not supplied, the elements are anchored. Further, the present invention is dynamic in that at any point within the life ofthe product, power may be applied to move the media, such as a fiber or optical element, to a new setting.
- the piezoelectric apparatus disclosed in United Patent Number 4,512,036 to Laor uses a piezoelectric component to bend a fiber thus aligning it. With the invention of Laor, if deformation occurs, then the anchoring is static. If not, then voltage must be maintained to secure alignment.
- the use of piezoelectric disadvantageously, requires application and maintenance of high voltages to the piezoelectric element.
- An embodiment of the present invention uses integral micro-positioners to move media, such as optical fiber or optical components, into a desired location. Further, an embodiment ofthe present invention is self- locking such that when power is not supplied, the media, such as optical fiber or optical components, remain anchored.
- Number 09/733,049 by Musk uses silicon machined mechanical parts as a means to locate and move optical elements relative to each other.
- the assembly requires external manipulators to move parts to a desired location and incorporates welding, adhesives, or glass re-flow to anchor the optical elements into position.
- anchoring is static in that after anchoring the alignment, media or elements cannot receive additional adjustment.
- An embodiment ofthe present invention has integral micro-positioners to move the media, such as optical fiber or optical elements, into a desired location. Further, the micro- positioners are self-locking.
- the media such as optical fiber or optical elements
- the present invention remains dynamic in that at any point during the life of the product, power may be applied to move the media to a new setting.
- the method disclosed in United States Patent Number 6,205 ,266 to Palen uses light coupled from the signal path to provide feedback allowing continuous adjustment of a fiber. This method is referred to as active alignment.
- the invention of Palen requires continuous power to maintain the position of the optical element.
- an embodiment of the present invention allows periodic alignment, anchoring, and realignment, without the need for continuous power to the micro-positioner.
- the invention of Palen covers continuous alignment using optical feedback architecture, it does not include an anchoring mechanism, as does the present invention.
- None of the following references disclose a method and apparatus for dynamically aligning a media using integral micro-positioners that permit movement of a media, such as an optical fiber or optical element, into a desired location, the micro-positioner assembly being self locking. Further, none ofthe following disclosed references remain dynamic such that, at any point during the life of the product, power may be applied to implement a new desired setting, such alignment being possible in the field.
- the method and apparatus disclosed in United States Patent Number 6,244,755 Bl to Joyceet. al. utilizes active alignment and static, not dynamic, anchoring using external manipulators and a metal bracket that is deformed to achieve alignment.
- the optical interface disclosed in United States Patent Number 6,477,303 to Witherspoon uses N-groove technology to achieve passive alignment and static anchoring to facilitate optical backplanes.
- the invention of Witherspoon is focused on the optical interface between a circuit board and a main-board using micro-machining techniques to chemically etch paths in the substrate to facilitate self-alignment.
- the method and apparatus for aligning optical components disclosed in United States Patent Number 6,480,651 Bl, to Rabinski uses two stages. One stage is used to align the fiber and the second stage is used to adjust, maintain and lock the optical components about a virtual pivot point.
- the invention of Rabinski is used to align fiber arrays similar to that used in N-groove technology.
- the apparatus disclosed in United States Patent Number 6,240, 119 to Nentrudo uses a partial reflector and fiber grating in series with an optical beam to stabilize laser performance.
- the kinematic mount disclosed in United States Patent Number 5,748,827 to Holl et. al consists of a passive alignment method using a two stage mountable module with a macro-stage and a micro- stage that further includes a fluid flow control channel.
- the coupling elements disclosed in United States Patent Number 4,452,506 to Reeve et. al. consists of an alignment algorithm and method of using light in a fiber buffer to determine the direction of movement of a fiber needed to achieve alignment.
- the method and system for attenuating power in an optical signal disclosed in United States Patent Application Serial Number 09/796,267 by Cao et. al. utilizes MEMS mirrors in a variable optical attenuator.
- the structures disclosed in United States Patent Application Serial Number 10/072,629 by Hsu et. al. provides a means of compensating for thermal effects and stress through flexible symmetry.
- the apparatus and method disclosed in United States Patent Application Serial Number 09/775,867 by Miracky uses an electrostatic actuator that moves a lens-using comb drives for the actuator for optical lens movement.
- the micro-positioner of the present invention can move media, or components, in very small or large steps and can lock the media or component into position when power is not applied.
- the present invention overcomes the disadvantages of the passive and active alignment methods by providing an inexpensive, dynamic means to align media, such as optical fibers or optical elements, or components.
- the present invention permits adjustment and alignment ofthe media or components during subsequent assembly steps and after deployment within a network or apparatus.
- the apparatus disclosed in Umted States Patent Application Serial Number 3,902,084 by May discloses a piezoelectric inchworm motor that provides precision motion in one direction.
- the device does not provide two- dimensional motion, as does the present invention, and is designed to move a cylindrical shaft parallel to piezoelectric actuators.
- Such a configuration is not suitable in size or orientation to perform the function of an in situ dynamic aligner.
- an embodiment ofthe present invention uses internal micro- positioners with dynamic anchoring configured for in-situ applications requiring control in a plurality of dimensions.
- the apparatus disclosed in United States Patent Application Serial Number 6380661 by David A. Henderson also defines a piezoelectric inchworm motor with one dimension operation.
- the invention uses an interdigitated ridges made using MEMS technology and alternating clamping to make linear movements. To maintain a load electrical power must be applied.
- the present invention permits movements in a plurality of dimensions, does not require power when holding a load, and provides a small configuration compatible with in-situ applications.
- An embodiment of the present invention comprises a component that can achieve low alignment tolerances, while accomplishing optical input/output ("I/O") objectives. Further, an embodiment ofthe present invention satisfies a need to dynamically control and tune optical power.
- An embodiment and application ofthe present invention which comprises an optical aligner and collimator provides a dynamic means to achieve precise, low alignment tolerances and further provides a means to power tune an optical fiber during the life ofthe component.
- One embodiment ofthe present invention comprises a micro-positioner to align and manipulate an optical fiber, the entire assembly adapted to be positioned in a self-contained housing or in an integrated assembly.
- a lens and/or jacket including a hermetic jacket, maybe included as part ofthe self-contained housing. Lenses can be used on the end ofthe self-contained housing when an application requires beam conditioning.
- a metal jacket, case, or package can further be used, as necessary to encapsulate the device, facilitate mounting, and/or provide hermetic sealing.
- a micro-positioner moves a media or component, such media including, but not limited to, one or a plurality of fibers, optical fibers, optical elements, tubes or wires, such components including, but not limited to, lenses or nozzles media, in one dimension.
- a micro-positioner moves a media or component, such media including, but not limited to, one or a plurality of fibers, optical fibers, optical elements, tubes or wires, such components including, but not limited to, lenses or nozzles media, in at least two dimensions in the plane ofthe micro-positioner.
- An application ofthe one-dimensional or two-dimensional embodiment of the present invention is as a dynamic collimator.
- Another application ofthe one- dimensional or two-dimensional embodiment of the present invention is as a dynamic fiber aligner.
- a dynamic fiber aligner is similar to a dynamic collimator but the dynamic fiber aligner does not employ a collimating lens.
- a dynamic collimator or dynamic fiber aligner is attached to an optical component package by soldering, welding, epoxy or other means. Unlike with conventional collimators or fiber aligning methods, attachment tolerances ofthe present invention are less critical since the micro-positioner of the present invention is dynamic and may be adjusted electronically to achieve the desired alignment.
- Active adjustment ofthe media or component in the present invention is accomplished by applying electrical signals or pulses comprising current through, or a voltage across, micro- positioner arms in certain control sequences to define the direction and distance ofthe motion of the optic fiber or other media in one or two dimensions.
- the amplitude or duration ofthe electrical signals, or pulses can be used to define the distance traveled.
- the micro-positioner is locked into position to ensure anchoring at the desired location.
- An embodiment ofthe micro-positioner of the present invention is constructed using semiconductor technology. This micro-positioner takes advantage of the measurable thermal expansion characteristics of its expansion bars to cause movement, and hence, positioning and/or alignment, ofthe media or components.
- Each expanding, or contracting, expansion bar(s), has a set of corresponding clamps on the ends thereof, and the operation thereof creates a precision stepping motion. At least one expansion bar is required for each degree of freedom desired. Since power dissipated in an expansion bar is proportional to the square of voltage applied, and since thermal expansion is linearly dependent upon power dissipation, expansion or step size is proportional to the square of applied voltage. Thus, the invention has the ability to make large steps, in micrometers, and small steps, in nanometers.
- Several embodiments ofthe present invention disclosed herein disclose the use of semiconductors to implement the expansion bars, however, the use of thermal expansion bars can be realized using small mechanical parts assembled without using semiconductor technologies.
- micro-positioner ofthe present invention can be implemented using microelectromechanical systems ("MEMS") technology, where in the micro-positioner, the expansion bar is replaced with silicon etched gears and/or racks.
- MEMS microelectromechanical systems
- the present invention can be implemented with piezoelectric or other material that expands with application of electrical current or voltage to effect movement.
- Figure 1 illustrates schematically a cross-section of a single channel dynamic collimator wherein the micro-positioner moves an optical fiber.
- Figure 2 illustrates schematically a cross-section of a single channel dynamic collimator wherein the micro-positioner moves the lens.
- Figure 3(a) illustrates a side view of a multiple channel dynamic aligner/collimator with N x M channels wherein micro-positioners ofthe present invention adjust and/or align optical fibers independently.
- Figure 3(b) illustrates a front view ofthe N x M array of Figure 3(a).
- Figure 4 illustrates schematically a cross-section of a multiple channel dynamic collimator/aligner with N channels in one direction and M in the other wherein the micro-positioner moves the lenses independently.
- Figure 5 illustrates the concept of electrical operation of a one dimensional micro-positioner expansion bar.
- Figure 6 illustrates a pulse train showing typical control signals to the micro-positioner expansion bar for right movement.
- Figure 7 illustrates a pulse train showing typical control signals to the micro-positioner expansion bar for left movement.
- Figure 8(a) is a top view of a first embodiment of the micro-positioner assembly of the present invention.
- Figure 8(b) is an exploded view of a spring, clamp, expansion bar subassembly of the first embodiment of the micro-positioner of the present invention.
- Figure 9 is a schematic ofthe electrical operation of a two-dimensional micro-positioner ofthe present invention.
- Figure 10 is a top view of a MEMS-based stepping and clamping mechanism for the X-translation stage of a micro-positioner of the present invention.
- Figure 11 is a top view of a MEMS-based stepping and clamping mechamsm for the Y-translation stage of a micro-positioner of the present invention.
- Figure 12 is a top view of the integrated stepping and clamping mechanism for the X-Y precision translation stages of a micro-positioner of the present invention.
- Figure 13 is a side view of an integrated stepping and clamping mechanism for the X-Y precision translation stages of a micro-positioner ofthe present invention.
- Figure 14 is a top view of a second embodiment of a micro-positioner of the present invention, specifically, a MEMS based mechanism that uses step and clamp motion and slide retainers.
- Figure 15 illustrates the use of a pair of micro-positioners ofthe present invention in self-contained housings used to align optical fibers.
- Figure 1 is a schematic diagram that illustrates the electrical operation of a two dimensional micro-positioner expansion bar.
- Figure 17 is a logic diagram ofthe electrical schematic of Figure 15.
- Figures 18 and 19 set forth performance and maximum fiber force calculation for an optical fiber embodiment ofthe present invention.
- Figure 20 is a graph illustrating range of control, performance as a variable optical attenuator ("NO A") as a function of fiber displacement.
- NO A variable optical attenuator
- Figure 21(a) is a side view of a lens illustrating a light ray angles from an optical fiber.
- Figure 21(b) is a graph illustrating optical control and collimator performance as a function of fiber displacement.
- Figure 22(a) and 22(b) are graphs illustrating constraints on performance of fiber optics.
- each media or component such as an optical fiber or lens
- the present invention is operable to permit independent optimization ofthe throughput light.
- the j acket or other outer housing ofthe present invention can be constructed using conventional microelectronic and optical packaging technology and standard sizes.
- the embodiment ofthe present invention used with optical fiber can be enclosed such that the fiber guide and micro-positioner are positioned in a jacket. Control, or electrical leads pass through apertures in the jacket or housing so that the micro-positioner therein may be adjusted electrically.
- Embodiments ofthe present invention used in optical fiber applications may also utilize a lens or lens assembly. Lenses are used when beam conditioning of the light is desired. Such embodiments of the present invention may be enclosed in jackets or housings. In each optical fiber embodiment, a micro- positioner that adjusts the fiber or other media or lens in at least one dimension is required. In optical applications, critical tolerances are required between the optical fiber and lens or, as in the case where lenses are not required, between the optical fiber and other optical elements such as planar components. Optical fibers and fiber guide are enclosed within the jacket or housing using adhesives or other suitable attachment means. The optical fiber embodiments of the present invention can be constructed such that the optical fiber or other media is stationary and the component, such as the lens, is adjusted by the micro- positioner.
- the fiber does not pass through the micro-positioner, but the component, such as the lens, is mounted on the micro-positioner.
- the appearance and size of the jacket or housing enclosing the present invention are similar to collimators or connectors conventionally available, although, as noted, the present invention has control or electrical leads extending through the jacket or housing.
- the micro-positioner is a multi-dimensional device, which, when electrically activated, moves the media or component in steps of variable step size from a few micrometers to a few nanometers in the desired direction.
- an exposed end of the optical fiber is threaded through a movable mount located on a shuttle subassembly ofthe micro- positioner. As the movable mount moves in an X-Y direction, the exposed end of the optical fiber bends. The optical fiber sheath proximate to the exposed end of the optical fiber is firmly attached to a fiber guide within the jacket or housing.
- a computer algorithm is used to compute and send control signals to the micro-positioner to achieve the desired positioning and/or alignment ofthe optical fiber.
- movement in the X-Y direction shall be deemed to include movement measured in a polar coordinate system, such as (r, theta) e.g., radius from an origin, and degrees of rotation from an axis.
- the optical fiber embodiment of the present invention is operable to define a collimating light path.
- the present invention adds no optical elements through which the light must traverse.
- micro- positioner requires no additional surface area or volume within a conventional collimator package.
- the device enclosing the micro-positioner appears as a collimator with leads.
- Employment of the present invention only requires replacement of a conventional collimator or fiber anchor apparatus.
- Figure 1 illustrates a single channel dynamic collimator 10 embodiment and application ofthe present invention.
- the device consists of a conventional buffered fiber that has been stripped ofthe buffer 11 exposing the optical fiber 12.
- the buffered fiber 11 and optical fiber 12 are inserted into fiber guide 13 that aligns the bare optical fiber 12 so it may be inserted into the movable mount of micro-positioner 14.
- the micro-positioner 14 is operable to move the optical fiber 12 with precision in two dimensions, Y, wliich is vertically, and X, which is in and out of the plane of the paper, and lock the optical fiber 12 in place after movement.
- the buffered fiber 11, optical fiber 12, and fiber guide 13 are securely fastened either mechanically, with epoxy, or with other adhesives into the collimator jacket 17 to provide strain relief.
- a collimating lens 15, as is required for optical properties, is attached using a hermetic material such as solder and electrical leads 16 are passed through the jacket 17 to permit control or electrical connections to the micro-positioner 14.
- Figure 2 also illustrates a single channel dynamic collimator 20 embodiment and application ofthe present invention, however, the optical fiber
- the device consists of a conventional buffered fiber 21 that has been stripped ofthe buffer exposing the optical fiber 22.
- the optical fiber 22 is inserted into a fiber guide 23 that aligns the bare optical fiber 22.
- the micro-positioner 24 moves the lens 25 with precision in two dimensions, Y, which is vertically, and X, which is in and out of the plane of the paper, and locks the lens 25 in place after movement.
- the buffered fiber 21, optical fiber 22, and fiber guide 23 are securely fastened either mechanically, with epoxy, or with other adhesives into the collimator jacket 27 to provide strain relief.
- a collimating lens 25 is attached as is required for optical properties to the micro-positioner 24 and electrical leads 26 are passed through the jacket 27 to permit control or electrical connections to the micro-positioner 24.
- Figure 3(a) illustrates a side view of a multiple channel dynamic aligner/collimator with N x M channels wherein micro-positioners ofthe present invention adjust and/or align the optical fibers.
- the device consists of a conventional buffered optical fiber ribbon 31 that has been stripped ofthe buffer exposing a plurality of optical fibers 32.
- the optical fibers 32 are inserted into a fiber guide 33 that aligns the bare optical fibers 32 so they may be inserted into the NxM micro-positioners 34.
- the micro-positioners 34 can individually move the optical fibers 32 with precision in two dimensions, Y, which is vertically, and X, which is in and out of the plane of the paper, and individually lock the optical fibers 32 or component positions in place after movement.
- Glass seal 39 maybe added to provide a fiber seal.
- the buffered optical fiber ribbon 31, optical fibers 32, and guide 33 are securely coupled either mechanically or with epoxy 38 into the collimator jacket 37 to provide strain relief.
- a collimating lens array panel 35 is attached as is required for optical properties and electrical control leads 36 are passed through the jacket 37 to permit electrical connections to the micro-positioner 34.
- Figure 3(b) illustrates a front view of an N x M array of Figure 3(a). More specifically, Figure 3(b) illustrates an 8 x 8 optical fiber array embodiment ofthe present invention. As seen therein control leads 36 extend from jacket 37. Light from the terminating end of each individual optical fiber traverses its correlating lens of lens array panel 35.
- Figure 4 shows a multi-optical fiber configuration similar to that of Figure 3, however the embodiment comprises a plurality of collimators arranged in an array and an array of single lenses.
- the device consists of a conventional buffered optical fiber ribbon 41 that has been stripped ofthe buffer exposing a plurality of optical fibers 42.
- the optical fibers 42 are inserted into optical fiber guide 43 that aligns the bare optical fibers 42.
- Each micro-positioner 44 of a NxM micro-positioner array adjusts and/or aligns an individual lens 45 with precision in two dimensions Y, which is vertically, and X, which is in and out of the plane ofthe paper and individually locks each lens 45 in place after movement.
- FIG. 5 illustrates the electrical operation of a one-dimensional micro- positioner 50. As seen therein, when a positive voltage is applied to the direction terminal 56, the right clamp 53 opens as current flow is determined by diodes 55.
- Equation 1 Equation 1 below.
- the micro-positioner will make large steps for high voltages and small or fine adjustments for low voltages. This allows for minimum alignment times as well as fine resolution.
- the constant of proportionality is a function of material properties and configuation.
- T Thickness of expansion bar
- ⁇ Thermal Resistance
- Equations 1 and 2 predict the step length versus voltage and time.
- expansion bar motion may be defined as follows for the heating cycle and for the cooling cycle as follows: During heating:
- step size Sc is cooling step size
- K thermal conductivity
- p electrical
- FIG. 8(a) is a top view of a first embodiment ofthe micro-positioner 80 ofthe present invention.
- micro-positioner 80 is comprised of the following subassemblies, components and elements: shuttle 81, shuttle springs 82, x-axis expansion bars 83(a) and 83(b), x-axis bond pads 84(a) and 84(b), x-axis clamps 85(a) and 85(b), x-axis expansion springs 86(a) and 86(b), y- axis expansion bars 87(a) and 87(b), y-axis bond pads 88(a) and 88(b), y-axis clamps 89(a) and 89(b), y-axis expansion springs 810(a) and 810(b), movable mount 811, and movable mount aperature 812.
- the foregoing components and elements are comprised of semiconductor material.
- the shuttle 81 of micro-positioner 80 is adapted to move in the X direction.
- Shuttle 81 is attached to micropositioner 80 with eight shuttle springs 82 and the shuttle 81 is adjusted or aligned in the X direction by two expansion subassemblies figure 8(b).
- two expansion subassemblies one for movement in the positive Y direction and one for movement in the negativeY direction.
- the X direction expansion subassembly consists of x-axis expansion bars 83(a) and 83(b), two sets of thermal actuated x- axis clamps 85(a) and 85(b) and two sets of x-axis expansion springs 86(a) and 86(b).
- the Y direction expansion subassembly consists of y-axis expansion bars 87(a) and 87(b), two sets of thermal actuated y-axis clamps 89(a) and 89(b) and two sets of y-axis expansion springs 810(a) and 810(b).
- Associated with each expansion assembly are a set of bond pads to which electrical connections can be made to the expansion bars and clamps.
- these comprise bond pads 84(a) and 84(b) and in the Y direction these comprise bond pads 88(a) and 88(b).
- External analog or logic circuitry (not shown) are coupled to micro- positioner 80 via these bond pads.
- the micro-positioner 80 can be manufactured as a silicon chip and can be implemented in one or two-dimensional arrays. Alternating the clamping and unclamping of directional clamps as associated expansion bars are powered by the drive stepping motion.
- Figure 8(b) is an exploded view of x-axis expansion assembly consisting of springs 86(b), x-axis clamps 85(b), legs 851(b) ofx-axis clamps 85 (b), andx- axis expansion bars 83(b) ofthe micro-positioner 80 of Figure 8(a).
- the other x- axis expansion subassembly and the y-axis subassemblies are substantively similar to the subassembly of Figure 8(a), except for their directional orientation.
- a voltage differential is introduced across bond pads 84(a). This causes a current to flow through leg 851 (b) and leg 852(b) ofx-axis clamp 85(b).
- leg 852(b) Due to the size difference in the two legs, leg 852(b) has more resistance than leg 851 (b), causing leg 852(b) to heat up more and thus expand. This in turn causes the x-axis clamp 85(b) to bend and open up. This effect is characteristic of any homogeneous material such as silicon of which the x-axis clamp 85(b) is made. Pressure between the clamp 85 (b) and the outer edge ofx-axis expansion bars 83(b) disengage when x-axis clamp 85 (b) bends outward. Similar effects can be caused by introducing voltage potentials at the bond pads ofthe other expansion subassemblies of micro-positioner 80.
- Clamp 85(a) is opened as is claim 85(b) and the current through expansion bar 83(a) is stopped. After expansion bar 83(a) cools, current to clamp 85(b) is removed and the shuttle 81 is locked into place. Similar operation and timing of this procedure on x-axis clamps 85(a), 85(b) and x-axis expansion bars 83(b) causes movement of shuttle 81 to the right. Operation and timing of this procedure on y-axis clamps 89(a), and 89(b) and y-axis expansion bars 87(a) and 87(b) causes movement of movable mount 811 downward.
- Figure 9 is a schematic ofthe electrical operation ofthe two-dimensional micro-positioner ofthe present invention.
- the direction and axis of motion are determined.
- step size is determined and the number of voltage pulse determines distance moved. If a positive voltage is applied at 99, current flows through Y-up 91 and X-right 92 to ground 98. In other words, current is directed through the up clamps and the right clamps, so those clamps open up. If, then a positive voltage is applied at 90, current flows through the X-axis expansion bar 93 and causes movement along the X right direction.
- Another embodiment ofthe present invention uses heaters attached to the expansion bar to cause the adjustment ofthe micro-positioner.
- the step size is controlled by the thermal expansion, thermal conductance and electrical resistivity properties of the expansion bar.
- Application of a heater to the expansion bar increases the types of material that can be used as the expansion bar.
- titanium carbide can be used as it has expansion and thermal conductivity advantages over other types of materials.
- Tantalum nitride resistor elements can be used to provide heat. This combination provides similar step size control and significantly increases micro-positioner speed.
- Figures 10 to 13 illustrate the micro-positioner ofthe present invention also implemented using MEMS technology.
- This implementation illustrated in Figures 10 to 13 uses differential expansion thermal actuators that are conventionally known in the art to perform the precision translation, through the scanning mechanism, and the precision clamping, through the clamping mechanism.
- Figure 10 shows a layout of the MEMS-based clamping X-translation stage.
- Figure 11 shows a layout for a MEMS-based clamping Y-translation stage.
- Figure 12 shows the X-translation stage mounted to the Y-translation stage to form the assembly for a X-Y translation stage.
- Figure 13 shows the cross section ofthe X-Y stage assembly.
- Micro-positioner 100 is shown in Figure 10.
- the direction and magnitude of scan by scanning mechanism 102 can be controlled in steps for gross positioning or in sub-step distances for fine positioning. This is accomplished by moving the scanner bar 103 to engage the gears with the gears on the scanning mechanism, deflecting the scanner bar 103 in the direction of desired scan, then disengaging the scanner bar 103.
- the clamp can be released for X stage motion and reengaged to hold the X scanning mechanism in a fixed position.
- the clamp mechanism 104 is used to hold the translation stage in place whenever it is not being moved by the scanning mechanism 102.
- the retainers 105 are sleeves that are over-the-edge clamps that restrain the motion ofthe translating component in one direction while allowing it to move freely in the other.
- the retainers 105 are not physically attached to the translation stages or the clamp mechanisms, but there is a small space between the retainers and the translation stage.
- Thermal actuators 106 perform translation through scanning mechanism 102 and precision clamping through clamp mechanism 104. Voltage is varied on the expansion actuators to set the step size. Motions less than a gear step can be made. While gears are shown on the scanning mechanism 102 in Figure 10 as the means of moving and then locking the scanner bar 103, they may be removed for finer resolution.
- Figure 11 illustrates a micro-positioner 110 ofthe present invention that is adapted as a Y translation stage.
- movable mount aperture 112 of movable mount 111 is moved in the Y direction by scanning mechanism 113 through the expansion and contraction ofthe geared scanner bar 114, opening and closing of clamp mechanism 115 and retainers 116.
- Thermal actuators described earlier in the discussion of Figure 8(b) move the scanner bar. While gears are shown in Figure 11 as the means of moving and then locking the movable mount
- Figure 12 is a top view ofthe integrated clamping mechanism 120 for the X-Y precision translation stages ofthe micro-positioner ofthe present invention.
- the X-translation stage 100 and the Y-translation stage 110 are fabricated separately and the X-translation stage is physically attached to the Y-translation stage using standard techniques such as epoxy bonding, atomic bonding, solder reflow, eutectic bonding, or others.
- Standard silicon-based MEMS fabrication techniques may be used for the fabrication among other methods.
- standard silicon-on-silicon and/or multi-level fabrication may be used to create the multilevel structure.
- the fiber relief cavity can be formed using deep reactive ion etching, among other techniques.
- Other methods of micro-positioner fabrication such as micro machining and LIGA fabricated parts would also provide a multi-dimensional device that when properly electrically activated will step the fiber to the desired position.
- Figure 13 is a side view of an integrated clamping mechanism 120 for the X-Y precision translation stages ofthe micro-positioner ofthe present invention.
- X stage 100 is mounted or formed on x-stage substrate 134, which is mounted on Y stage 110.
- the terminated end of a media, such as optical fiber 132, is threaded through fiber relief cavity 133 of Y stage substrate 131.
- Retainers 135 hold the various assemblies and subassemblies of micro-positioner 120 in position.
- the stages may be retained by other means, such as springs.
- FIG 14 is a top view of a second embodiment ofthe micro-positioner 140 ofthe present invention.
- micro-positioner 140 is comprised of the following subassemblies, components and elements: pinion actuators 141(a) and 141(b), pinion drives 142(a) and 142(b), pinion release 143(a) and 143(b), axis hold actuator 144(a) and 144(b), x-axis and y-axis interconnection bond pads 145(a) and 145(b), x-axis slides and y-axis slides 146(a) and 146(b), axis setup actuators 147(a) and 147(b), and a movable aperture 148.
- the apparatus of Figure 14 provides for both X and Y motion without using retention springs as seen in the first embodiment ofthe micro-positioner.
- the moving aperture 148 slides and is guided by x-axis slides and y-axis slides
- the pinions 141(a) and 141(b), provide motion as follows: at rest all pinion actuators, 142(a), 142(b), 143(a), 143(b), 144(a) and 144(b) are in contact with and are clamping movable aperture 148 such that the movable aperture is locked into position.
- a voltage is applied to holding actuators 144(a) wliich expand and release the aperture 148.
- An additional voltage is applied to pinion drive actuators 142(a) which expand and push the aperture to the left. After the movement, voltage is removed from holding actuators 144(a) and they contract clamping the aperture.
- the pin release 143(a) is actuated moving it from movable aperture 148
- the pinion drive 142(a) is actuated moving it to the left
- voltage is removed for the pinion release 143(a) and the pinion clamps movable aperture 148
- voltage is applied to the pinion hold 144(a) releasing movable aperture 148
- voltage is removed from the pinion drive and movable aperture 148 is pulled to the right
- voltage is removed from the pinion release 143(a) and movable aperture 148 is in its rest state. Additional application of this voltage sequence causes the movable aperture (148) to move in steps to the right.
- Movement in the y-direction is achieved by performing the operation and timing of this procedure on Y-axis actuators 142(b), 143(b), and 144(b) which moves movable aperture 148 downward or upward.
- Y-axis actuators 142(b), 143(b), and 144(b) Prior to using micro-positioner 140, it may need to be set up.
- the setup is required for devices that are fabricated using chemical etching procedures. Machining by etching creates gaps between features. As in the case for actuators 143(a), 143(b), 144(a), and 144(b), these gaps prevent firm clamping in the rest case with no voltages applied.
- the expansion mechanism 147(a) and 147(b) are provided to achieve setup.
- Expansion mechanism 147(a) and 147(b) consist of four arms, two wide for low electrical resistance and two narrow for much greater electrical resistance, all electrically connected such that when voltage is applied at the corresponding bond pads, current flows through all four arms. Appling voltage to expansion mechanisms 147(a) or 147(b), results in the narrow arm heating and expanding more than the wide arm and the expansion mechanism 147(a) or 147(b) bow. When the expansion mechanism 147(a) and 147(b) bow, they physically contract and move slides 146(a) and 146(b). Slides 146(a) and 146(b) are then moved to place actuators 144(a), 144(b), 143(a), and 143(b) into firm contact with movable aperture 148.
- the micro-positioner 140 can be manufactured as a silicon chip and can be implemented in one or two dimensions. A sequence of voltage or current pulse applied to the bond pads ofthe mechanism drives stepping motion in the desired direction.
- Figure 15 illustrates one use of aligner 151 and aligner 152 of the present invention to achieve alignment of light paths through optical components 153. Optical components 153 are housed in case 154.
- An in situ dynamic aligner application and embodiment of the present invention utilizing the micro- positioner 80 of Figure 8(a), is illustrated wherein aligner 151 is inserted into case
- FIG. 16 is a schematic diagram that illustrates the electrical operation of a two-dimensional micro-positioner 160.
- the clamp/expansion bar expansion and contraction operation ofthe X-Y micro-positioner 160 is similar to that ofthe one-dimensional micro-positioner 50 of Figure 5. As seen in Figure 16, when a positive voltage is applied to axis terminal 161 , X movement is enabled and when a negative voltage is applied to axis terminal 162, Y movement is enabled.
- Figure 17 is a logic diagram ofthe electrical schematic of Figure 16.
- Figures 18 and 19 set forth optical performance and maximum fiber force required for an exemplary embodiment ofthe present invention.
- Figures 18 lists the governing equations relating change in beam pointing angle and lateral displacement as the media, such as an optical fiber, is displaced by a micro-positioner, where b is defined as the fiber displacement, d the beam displacement and ⁇ 0 is the beam-pointing angle.
- the equations apply for conventional lenses although gradient index and spherical lenses among others may be used.
- the formulas of Figure 19 represent a media, such as an optical fiber, treated as a cantilever beam. One end of an optical fiber is attached and held rigid. The other, terminated end is fitted with the micro-positioner ofthe present invention that positions and adjusts the optical fiber. That causes a slight arc into the optical fiber, thus a certain amount of force is required to hold it in position.
- W represents the formula for the force required to hold the optical fiber in position
- I is the moment of inertia
- a is the length ofthe optical fiber from the point it is in contact with the micro-positioner to the point where it is held or the length to the cantilever beam.
- Box 2 of Figure 18 is the formula for I, the moment of inertia, where r is the radius ofthe optical fiber.
- the formulas of box 1 and 2 lead to the equation of box 3, which is the equation that describes the forces necessary to hold the optical fiber in position using the representative parameters of box 4.
- the micro-positioner must exert a force of approximately 2.0 milli-newton to hold an optical fiber in place.
- Figure 20 is a graph illustrating performance of a VOA, with range of control as a function of fiber displacement. As seen therein, when an optical fiber is moved to one side, insertion loss takes place, and thus the device is acting as an attenuator. In operation, typically there are two such devices, thus, there would be twice the attenuation performance.
- Figure 21(a) is a side view of a lens illustrating light ray output pointing angles and output beam displacement as the fiber is displaced radially.
- Figure 21(b) is a graph illustrating optical control and collimator performance as a function of fiber displacement. As seen therein, Figure 21(b) illustrates several optical results of moving an optical fiber using the present invention.
- the working distance is shown as a line with boxes.
- working distance changes very little as the optical fiber is displaced.
- the pointing angle refers to when the light leaves the lens. It is shown as a line with diamonds on Figure 21(b). It changes over a range as much as five degrees of point and angle changes.
- Beam displacement shown as a line with circles, advantageously tracks substantially linearly as it changes up to about 700 microns.
- Figure 22(a) and 22(b) are graphs illustrating typical mechanical constraints on design and manufacturing ofthe in situ fiber aligner embodiment and application of the present invention. These constraints apply to typical applications but they may be violated as an application may require.
- Advantages ofthe present invention include (i) substantial cost reduction and improved performance; (ii) during application no human intervention and no specialized equipment are required.
- the small form factor of the present invention allows several devices per semiconductor wafer in the semiconductor embodiment of the present invention.
- the present invention is remotely configurable, can be utilized in active and passive network components and meets industry requirements for maintaining alignment during mechanical and thermal stresses.
- a variety of components can be manipulated by the micropositioner arrangement. These include lenses, prisms, detectors, diodes, laser diodes, sensors, antenna elements, rf stubs, valves or nozzles.
- the optical embodiment of the present invention can be used in any device requiring an optical interface, such as variable optical attenuators ("VOAs"), demultiplexers, multiplexers, switches, optical amplifiers, filters, transmitters, receivers, modulators and for gain flattening or tilting.
- VOAs variable optical attenuators
Abstract
Description
Claims
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EP03776276A EP1595172A2 (en) | 2002-11-08 | 2003-10-10 | Dynamic micro-positioning and aligning apparatus and method |
AU2003284046A AU2003284046A1 (en) | 2002-11-08 | 2003-10-10 | Dynamic micro-positioning and aligning apparatus and method |
JP2004551514A JP2006510923A (en) | 2002-11-08 | 2003-10-10 | Dynamic micropositioner and aligner |
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Also Published As
Publication number | Publication date |
---|---|
US6935042B2 (en) | 2005-08-30 |
CN1711491A (en) | 2005-12-21 |
KR20050057686A (en) | 2005-06-16 |
WO2004044420B1 (en) | 2004-12-29 |
US20050147357A1 (en) | 2005-07-07 |
AU2003284046A1 (en) | 2004-06-03 |
WO2004044420A3 (en) | 2004-07-29 |
US7069667B2 (en) | 2006-07-04 |
EP1595172A2 (en) | 2005-11-16 |
AU2003284046A8 (en) | 2004-06-03 |
JP2006510923A (en) | 2006-03-30 |
US20050081397A1 (en) | 2005-04-21 |
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