WO2004063873A3 - Heat dissipation from a hand-held portable computer - Google Patents

Heat dissipation from a hand-held portable computer Download PDF

Info

Publication number
WO2004063873A3
WO2004063873A3 PCT/US2004/000247 US2004000247W WO2004063873A3 WO 2004063873 A3 WO2004063873 A3 WO 2004063873A3 US 2004000247 W US2004000247 W US 2004000247W WO 2004063873 A3 WO2004063873 A3 WO 2004063873A3
Authority
WO
WIPO (PCT)
Prior art keywords
heat
portable computer
hand
heat dissipation
held
Prior art date
Application number
PCT/US2004/000247
Other languages
French (fr)
Other versions
WO2004063873A2 (en
Inventor
Rod G Fleck
Livius D Chebeleu
Original Assignee
Vulcan Portals Inc
Rod G Fleck
Livius D Chebeleu
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vulcan Portals Inc, Rod G Fleck, Livius D Chebeleu filed Critical Vulcan Portals Inc
Publication of WO2004063873A2 publication Critical patent/WO2004063873A2/en
Publication of WO2004063873A3 publication Critical patent/WO2004063873A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/203—Heat conductive hinge

Abstract

Heat is removed from a small hand-held portable computer (100) by dissipating the heat from surfaces that are not typically held by the user during hand-held operation. The heat is dissipated from fins (200) located at a rear underside casing (202) of the portable computer. Heat-generating internal electronic components or their heat sinks are placed in close proximity to the fins. Heat may also be dissipated from the backside of the display screen. The dissipation of the heat allows the portable computer to operate at higher frequencies.
PCT/US2004/000247 2003-01-07 2004-01-07 Heat dissipation from a hand-held portable computer WO2004063873A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/338,761 US6839231B2 (en) 2003-01-07 2003-01-07 Heat dissipation from a hand-held portable computer
US10/338,761 2003-01-07

Publications (2)

Publication Number Publication Date
WO2004063873A2 WO2004063873A2 (en) 2004-07-29
WO2004063873A3 true WO2004063873A3 (en) 2004-12-09

Family

ID=32681496

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/000247 WO2004063873A2 (en) 2003-01-07 2004-01-07 Heat dissipation from a hand-held portable computer

Country Status (2)

Country Link
US (1) US6839231B2 (en)
WO (1) WO2004063873A2 (en)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2002312676A1 (en) 2001-06-12 2002-12-23 Silicon Optix Inc. System and method for correcting keystone distortion
US7702733B2 (en) * 2003-09-18 2010-04-20 Vulcan Portals Inc. Low power email functionality for an electronic device
JP4363205B2 (en) * 2004-02-05 2009-11-11 株式会社日立製作所 Mobile terminal device
NL1026846C2 (en) * 2004-08-17 2006-02-20 Jakob Roelof Van Den Berg Desktop PC.
US7072179B1 (en) * 2004-09-10 2006-07-04 Micro Industries Corporation Fanless computer with integrated display
US7433185B1 (en) 2004-09-10 2008-10-07 Micro Industries Corporation Integrated display computer stand with integrated peripherals
KR100760509B1 (en) * 2004-12-14 2007-09-20 삼성전자주식회사 Cooling device for folder type portable wireless terminal
US20060193113A1 (en) * 2005-02-28 2006-08-31 International Business Machines Corporation Controlling a surface temperature of a portable computer for user comfort in response to motion detection
US20060191894A1 (en) * 2005-02-28 2006-08-31 Sanyo Electric Co., Ltd. Electronic appliance using heat radiation plate
KR100629517B1 (en) * 2005-03-07 2006-09-28 삼성전자주식회사 Portable apparatus
TWI318338B (en) * 2005-05-19 2009-12-11 Htc Corp Portable electronic device
TWI283806B (en) * 2005-06-07 2007-07-11 Htc Corp Portable electronic device
CN100488345C (en) 2005-06-09 2009-05-13 宏达国际电子股份有限公司 Portable electronic device
US9047066B2 (en) * 2005-09-30 2015-06-02 Intel Corporation Apparatus and method to efficiently cool a computing device
US7595468B2 (en) * 2005-11-07 2009-09-29 Intel Corporation Passive thermal solution for hand-held devices
CN100530037C (en) * 2006-06-02 2009-08-19 富准精密工业(深圳)有限公司 Heat radiating module
EP2075993A4 (en) * 2007-07-02 2009-12-02 Huawei Tech Co Ltd A mobile terminal preventing temperature rising of user-sensitive surface
TWI357556B (en) * 2009-06-04 2012-02-01 Pegatron Corp Industrial computer
CN102113896B (en) * 2009-12-30 2014-11-19 Ge医疗系统环球技术有限公司 Method and device for heating coupling medium
US9268377B2 (en) * 2011-12-28 2016-02-23 Intel Corporation Electronic device having a passive heat exchange device
US9134757B2 (en) 2012-09-28 2015-09-15 Intel Corporation Electronic device having passive cooling
US9148979B2 (en) * 2012-10-08 2015-09-29 Qualcomm Incorporated Heat dissipating apparatus for folding electronic devices
US9436240B2 (en) * 2012-12-27 2016-09-06 Intel Corporation Electronic device having an active edge
CN104516178B (en) * 2013-09-29 2016-08-10 中强光电股份有限公司 Bare engine module
JP6469183B2 (en) * 2017-07-25 2019-02-13 レノボ・シンガポール・プライベート・リミテッド Electronics
CN111970904A (en) * 2020-08-19 2020-11-20 北京小米移动软件有限公司 Supporting component and display device

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5313362A (en) * 1991-05-31 1994-05-17 Hitachi, Ltd. Packaging structure of small-sized computer
JP2001125683A (en) * 1999-10-28 2001-05-11 Inoac Corp Housing for information equipment
US20020051339A1 (en) * 1997-04-14 2002-05-02 Shigeo Ohashi Electronic equipment
US6414844B1 (en) * 1999-09-03 2002-07-02 Matsushita Electric Industrial Co., Ltd. Portable information processing apparatus
US20020105781A1 (en) * 2001-02-06 2002-08-08 Shigeo Ohashi Electronic apparatus

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Publication number Priority date Publication date Assignee Title
US5787976A (en) 1996-07-01 1998-08-04 Digital Equipment Corporation Interleaved-fin thermal connector
US5910883A (en) * 1997-08-06 1999-06-08 International Business Machines Corporation Hinge incorporating a helically coiled heat pipe for a laptop computer
US5995367A (en) 1997-12-18 1999-11-30 Eastman Kodak Company Heat exchanger having an extruded, tiered heat sink
US6038128A (en) * 1998-07-14 2000-03-14 Dell U.S.A., L.P. Computer and computer/docking assembly with improved internal cooling
US6525934B1 (en) * 1999-04-15 2003-02-25 International Business Machines Corporation Thermal controller for computer, thermal control method for computer and computer equipped with thermal controller
JP2001091174A (en) 1999-09-22 2001-04-06 Kel Corp Heat transfer connector
US6266241B1 (en) * 1999-09-29 2001-07-24 Hewlett-Packard Company Notebook computer with ergonomic stand
JP3581318B2 (en) 2001-02-06 2004-10-27 株式会社東芝 Cooling device used for electronic equipment system and portable electronic equipment
US6646874B2 (en) 2001-06-12 2003-11-11 Intel Corporation Mobile computer system with detachable thermoelectric module for enhanced cooling capability in a docking station
US6604575B1 (en) 2002-08-30 2003-08-12 Southeastern Univer. Research Assn. Inc. Heat exchange apparatus

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5313362A (en) * 1991-05-31 1994-05-17 Hitachi, Ltd. Packaging structure of small-sized computer
US20020051339A1 (en) * 1997-04-14 2002-05-02 Shigeo Ohashi Electronic equipment
US6414844B1 (en) * 1999-09-03 2002-07-02 Matsushita Electric Industrial Co., Ltd. Portable information processing apparatus
JP2001125683A (en) * 1999-10-28 2001-05-11 Inoac Corp Housing for information equipment
US20020105781A1 (en) * 2001-02-06 2002-08-08 Shigeo Ohashi Electronic apparatus

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 22 9 March 2001 (2001-03-09) *

Also Published As

Publication number Publication date
WO2004063873A2 (en) 2004-07-29
US20040130869A1 (en) 2004-07-08
US6839231B2 (en) 2005-01-04

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